CN101894923B - Packaging method of organic luminous semiconductor device - Google Patents
Packaging method of organic luminous semiconductor device Download PDFInfo
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- CN101894923B CN101894923B CN2009100515524A CN200910051552A CN101894923B CN 101894923 B CN101894923 B CN 101894923B CN 2009100515524 A CN2009100515524 A CN 2009100515524A CN 200910051552 A CN200910051552 A CN 200910051552A CN 101894923 B CN101894923 B CN 101894923B
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Abstract
The invention relates to a packaging method of an organic luminous semiconductor device, which comprises the following steps of: firstly, coating an organic photosemiconductor compound layer and an absorption layer on the same side of a substrate layer; secondly, adhering a protective layer to the substrate layer to form a first sealing space and aging the first sealing space by the absorption layer to absorb interfering substances such as water vapor, oxygen and the like in the first sealing space; and thirdly, carrying out pressure sealing to the first sealing space to divide the first sealing space into a sealing space which contains the organic photosemiconductor compound layer and a sealing space which contains the absorption layer; and finally, separating the sealing space containing the organic photosemiconductor compound layer from the sealing space containing the absorption layer to complete the package of the organic luminous semiconductor device. The packaging method finally separates the absorption layer out, thereby improving the work performance of the packaged organic luminous semiconductor device, and increasing the light transmission property and the flexibility of the packaged organic luminous semiconductor device at the same time.
Description
Technical field
The present invention relates to the organic luminous semiconductor field, relate in particular to a kind of packaging method of organic luminous semiconductor device.
Background technology
Whole world every year is the electric energy of consume significant quantity all.In whole electric energy consumptions, electric consumption on lighting can account for 20% of total electric energy production.Fluorescent lamp and incandescent lamp are to use the most general traditional lighting light source at present, occupy electric consumption on lighting and can consume 40% of ability.But incandescent lamp has only become luminous energy to 10% electric energy, and fluorescent lamp has also just converted 70% of electric energy to luminous energy.So in order to save the energy in the world, people are in the substitute of seeking conventional light source all the time.
Recently, a kind of new light source is just more and more paid attention to by people, it just be based on organic semiconducting materials light-emitting diode (Organic Light-Emitting Diode, OLED).OLED has self-luminous, durable, efficient, power saving, light and can be prepared into the advantage on the flexible substrate, and for example OLED can be prepared into the surface of plastics or paper, and the display screen of preparing can be bent or roll.Therefore, OLED will bring the huge leap forward of lighting field as a kind of new light sources.
But organic substance among the OLED and negative electrode are very responsive to steam and oxygen, and organic substance or negative electrode absorption steam or oxygen will cause OLED to lose efficacy, and get into device inside for preventing steam and oxygen, need encapsulate OLED.The method for packing of prior art is; On substrate, make OLED, one cover plate and substrate are binded, so just between substrate and cover plate, formed a cover with epoxy resin; Separate OLED and air; For preventing that steam and oxygen from penetrating into device inside through epoxy resin, between OLED and cover plate, add drying layer residual moisture when being used for being absorbed in when being coated with epoxy resin with encapsulation, whole encapsulation process is accomplished in the glove box that fills protective gas (like inert gases such as nitrogen, argon gas).The shortcoming of the method for packing of prior art is will influence the organic luminous semiconductor working performance of devices after the drying layer suction between cover plate and the organic luminous semiconductor device.
Summary of the invention
The object of the present invention is to provide a kind of packaging method of organic luminous semiconductor device, the adsorption layer with functions/drying separates with organic function layer, has improved the organic luminous semiconductor working performance of devices.
In order to reach above-mentioned purpose; The present invention provides a kind of packaging method of organic luminous semiconductor device; May further comprise the steps: (1), on the same side of substrate layer, apply organic luminous semiconductor composite bed and adsorption layer, the power circuit that will be connected with the organic luminous semiconductor composite bed is fitted on the substrate layer; (2), protective layer is binded on substrate layer, form first seal cavity with adhesive; Protective layer covers the organic luminous semiconductor composite bed and above the adsorption layer, comprises organic luminous semiconductor composite bed and adsorption layer in first seal cavity of formation; (3), adsorption layer carries out ageing to first seal cavity and handles, and promptly stays for some time, and lets adsorption layer fully adsorb the interfering material in first seal cavity; (4), treat that abundant ageing is handled after, the first seal cavity press seal is isolated into seal cavity that comprises the organic luminous semiconductor composite bed and the seal cavity that comprises adsorption layer; Press seal is carried out at interval at organic luminous semiconductor composite bed and adsorption layer, forms a potted line at the interval, and the sealing line is separated into seal cavity that comprises the organic luminous semiconductor composite bed and the seal cavity that comprises adsorption layer with first seal cavity; (5), separate the seal cavity that comprises the seal cavity of organic luminous semiconductor composite bed and comprise adsorption layer.
Above-mentioned packaging method of organic luminous semiconductor device, wherein, said organic luminous semiconductor composite bed comprises anode conductive layer, luminescent layer and cathode conductive layer, above-mentioned anode conductive layer, luminescent layer and cathode conductive layer stack gradually.
Above-mentioned packaging method of organic luminous semiconductor device; Wherein, Said organic luminous semiconductor composite bed also comprises hole transmission layer and electron transfer layer, and above-mentioned hole transmission layer is superimposed upon between anode conductive layer and the luminescent layer, and above-mentioned electron transfer layer is superimposed upon between luminescent layer and the cathode conductive layer.
Above-mentioned packaging method of organic luminous semiconductor device; Wherein, Said power circuit is connected with cathode conductive layer with the anode conductive layer of organic luminous semiconductor composite bed respectively, and this power circuit is connected with external power source through its both positive and negative polarity, for the organic luminous semiconductor composite bed provides driving voltage; An above-mentioned power circuit part is fitted on substrate layer, and remainder extends substrate layer.
Above-mentioned packaging method of organic luminous semiconductor device, wherein, said adsorption layer is a multi-layer film structure, adsorbs steam and oxygen in first seal cavity through this adsorption layer.
Above-mentioned packaging method of organic luminous semiconductor device, wherein, said substrate layer is organic film or inorganic substrate.
Above-mentioned packaging method of organic luminous semiconductor device, wherein, said protective layer is organic film or inorganic substrate.
Above-mentioned packaging method of organic luminous semiconductor device, wherein, said substrate layer and protective layer have at least one to be hyaline layer.
Packaging method of organic luminous semiconductor device of the present invention is coated in adsorption layer on the substrate; And in encapsulation process; This adsorption layer carries out ageing to first seal cavity to be handled; Therefore, can when encapsulation, fully adsorb moisture and the oxygen that remains in first seal cavity, prevent the organic luminous semiconductor component failure; Again above-mentioned adsorption layer is separated at last, made this adsorption layer not influence the task performance of encapsulation back organic luminous semiconductor device; Above-mentioned adsorption layer is a multi-layer film structure; Different thin layers can adsorb different materials, and therefore, this adsorption layer can not only adsorb steam and oxygen; Can also adsorb the harmful substance that other diminish the organic luminous semiconductor device; For the organic luminous semiconductor device provides a good working environment, improved the organic luminous semiconductor working performance of devices, prolonged the useful life of organic luminous semiconductor device; In the encapsulation, protective layer and substrate layer can be transparent membrane simultaneously, have improved the light transmission of the organic luminous semiconductor device after the encapsulation greatly; And protective layer and substrate layer all can be flexible material, makes the organic luminous semiconductor device after the encapsulation can be crooked or enclose.
Packaging method of organic luminous semiconductor device of the present invention is provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of organic luminous semiconductor composite bed among the present invention.
Description of drawings
Fig. 2 is the sketch map that first seal cavity forms among the present invention.
Fig. 3 is the sketch map that forms second seal cavity and the 3rd seal cavity among the present invention.
Fig. 4 is the sketch map that second seal cavity separates with the 3rd seal cavity among the present invention.
Below will combine Fig. 1～Fig. 4 that packaging method of organic luminous semiconductor device of the present invention is done further to describe in detail.
Embodiment
Packaging method of organic luminous semiconductor device of the present invention may further comprise the steps:
As shown in Figure 1; Said organic luminous semiconductor composite bed 3 comprises anode conductive layer 31, hole transmission layer 32, luminescent layer 33, electron transfer layer 34 and cathode conductive layer 35, and said anode conductive layer 31, hole transmission layer 32, luminescent layer 33, electron transfer layer 34 and cathode conductive layer 35 are arranged in order;
Said power circuit 4 is connected with cathode conductive layer 35 with the anode conductive layer 31 of organic luminous semiconductor composite bed 3 respectively, and this power circuit 4 is connected with external power source through its both positive and negative polarity, for organic luminous semiconductor composite bed 3 provides driving voltage;
Above-mentioned anode conductive layer 31 selects high work function, light transmission material good, bottom surface resistance to process, as, tin indium oxide (ITO) the nesa coating anode conductive layer 31 of making said organic luminous semiconductor composite bed 3 commonly used; The metal of low work function or the composition metal of low work function like Ag, Al, Ca, In, Li, Mg or Mg-Ag, can be used as the material of the above-mentioned cathode conductive layer 35 of preparation; Aromatic amine fluorescent compounds Chang Zuowei prepares the material of above-mentioned hole transmission layer 32, like organic materials such as TPD, TDATA; It is high, thermally-stabilised and electron-transporting is good that the material for preparing above-mentioned electron transfer layer 34 must be made the film stability, adopts the fluorescent dye compound usually, like Alq, Znq, Gaq, Bebq, Balq, DPVBi, ZnSPB, PBD, OXD, BBOT; And the material of above-mentioned luminescent layer 33 must possess solid-stately have down that strong fluorescent, carrier transmission performance are good, thermal stability, chemical stability is good, quantum efficiency is high and characteristic that can vacuum evaporation; Common above-mentioned luminescent layer 33 is identical with the material that electron transfer layer 34 or hole transmission layer 32 are adopted; Be widely used in green glow like Alq, Balq and DPVBi then are widely used in blue light;
Said adsorption layer 5 is a multi-layer film structure, is used to adsorb interfering materials such as steam, oxygen;
As shown in Figure 2, the anode conductive layer 31 of above-mentioned organic luminous semiconductor composite bed 3 (or cathode conductive layer 35) is coated on the substrate layer 1; Power circuit 4 parts that are connected with organic luminous semiconductor composite bed 3 are fitted on the substrate layer 1, and remainder extends substrate layer 1; Said adsorption layer 5 is adjacent with organic luminous semiconductor composite bed 3;
As shown in Figure 2, said protective layer 2 binds with substrate layer 1, forms first seal cavity 6, and above-mentioned organic luminous semiconductor composite bed 3, adsorption layer 5 and a part of power circuit 4 are sealed in said first seal cavity 6;
Said substrate layer 1 can be organic film or inorganic substrate (like glass, pottery), and said protective layer 2 can be organic film or inorganic substrate (like glass, pottery), and said substrate layer 1 has at least one to be transparent with protective layer 2;
Said substrate layer 1 can effectively prevent all that with protective layer 2 extraneous steam and oxygen from penetrating into first seal cavity; In order more effectively to prevent the infiltration of extraneous steam and oxygen, can be respectively apply and prevent steam and oxygen permeable barrier at the outer surface of substrate layer 1 and protective layer 2 or inner surface;
As shown in Figure 3; Carry out press seal at the organic luminous semiconductor composite bed 3 and the interval of adsorption layer 5, form a potted line 7 at the interval, sealing line 7 is separated into two seal cavities with first seal cavity 6; I.e. second seal cavity 8 and the 3rd seal cavity 9; Only comprise organic luminous semiconductor composite bed 3 in said second seal cavity 8, only comprise adsorption layer 5 in said the 3rd seal cavity 9, organic luminous semiconductor composite bed 3 is isolated with adsorption layer 5 like this;
As shown in Figure 4, along potted line 7 second seal cavity is separated with the 3rd seal cavity, second seal cavity that comprises organic luminous semiconductor composite bed 3 is the organic luminous semiconductor device that can be used for using.
The adsorption layer that packaging method of organic luminous semiconductor device of the present invention will have functions/drying is coated on the substrate; When encapsulation, can adsorb moisture and the oxygen that remains in first seal cavity; Prevent the organic luminous semiconductor component failure, can this adsorption layer be separated again at last, therefore; Packaging method of organic luminous semiconductor device of the present invention lost efficacy in the time of can preventing the organic luminous semiconductor device package, did not influence the task performance of encapsulation back organic luminous semiconductor device again; And this adsorption layer is a multi-layer film structure; Can not only adsorb steam and oxygen; Can also adsorb the harmful substance that other diminish the organic luminous semiconductor device; For the organic luminous semiconductor device provides a good working environment, improved the organic luminous semiconductor working performance of devices, prolonged the useful life of organic luminous semiconductor device.
Claims (8)
1. a packaging method of organic luminous semiconductor device is characterized in that, may further comprise the steps:
(1), on the same side of substrate layer, apply organic luminous semiconductor composite bed and adsorption layer, the power circuit that will be connected with the organic luminous semiconductor composite bed is fitted on the substrate layer;
(2), protective layer is binded on substrate layer, form first seal cavity with adhesive;
Protective layer covers the organic luminous semiconductor composite bed and above the adsorption layer, comprises organic luminous semiconductor composite bed and adsorption layer in first seal cavity of formation;
(3), adsorption layer carries out ageing to first seal cavity and handles, and promptly stays for some time, and lets adsorption layer fully adsorb the interfering material in first seal cavity;
(4), treat that abundant ageing is handled after, the first seal cavity press seal is isolated into seal cavity that comprises the organic luminous semiconductor composite bed and the seal cavity that comprises adsorption layer;
Press seal is carried out at interval at organic luminous semiconductor composite bed and adsorption layer, forms a potted line at the interval, and the sealing line is separated into seal cavity that comprises the organic luminous semiconductor composite bed and the seal cavity that comprises adsorption layer with first seal cavity;
(5), separate the seal cavity that comprises the seal cavity of organic luminous semiconductor composite bed and comprise adsorption layer.
2. packaging method of organic luminous semiconductor device as claimed in claim 1; It is characterized in that; Said organic luminous semiconductor composite bed comprises anode conductive layer, luminescent layer and cathode conductive layer, and above-mentioned anode conductive layer, luminescent layer and cathode conductive layer stack gradually.
3. packaging method of organic luminous semiconductor device as claimed in claim 2; It is characterized in that; Said organic luminous semiconductor composite bed also comprises hole transmission layer and electron transfer layer; Above-mentioned hole transmission layer is superimposed upon between anode conductive layer and the luminescent layer, and above-mentioned electron transfer layer is superimposed upon between luminescent layer and the cathode conductive layer.
4. like claim 2 or 3 described packaging method of organic luminous semiconductor device; It is characterized in that; Said power circuit is connected with cathode conductive layer with the anode conductive layer of organic luminous semiconductor composite bed respectively; This power circuit is connected with external power source through its both positive and negative polarity, for the organic luminous semiconductor composite bed provides driving voltage; An above-mentioned power circuit part is fitted on substrate layer, and remainder extends substrate layer.
5. packaging method of organic luminous semiconductor device as claimed in claim 1 is characterized in that, said adsorption layer is a multi-layer film structure, adsorbs steam and oxygen in first seal cavity through this adsorption layer.
6. packaging method of organic luminous semiconductor device as claimed in claim 1 is characterized in that, said substrate layer is organic film or inorganic substrate.
7. packaging method of organic luminous semiconductor device as claimed in claim 1 is characterized in that, said protective layer is organic film or inorganic substrate.
8. packaging method of organic luminous semiconductor device as claimed in claim 1 is characterized in that, said substrate layer and protective layer have at least one to be hyaline layer.
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| CN2009100515524A CN101894923B (en) | 2009-05-19 | 2009-05-19 | Packaging method of organic luminous semiconductor device |
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| CN2009100515524A CN101894923B (en) | 2009-05-19 | 2009-05-19 | Packaging method of organic luminous semiconductor device |
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| CN101894923B true CN101894923B (en) | 2012-03-21 |
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| CN102651453B (en) * | 2011-02-25 | 2015-03-25 | 苏州大学 | Organic light-emitting diode sealed by thin film and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147549A (en) * | 2004-10-19 | 2006-06-08 | Showa Denko Kk | Surface light-emitter, its manufacturing method and intended use |
| JP2008109061A (en) * | 2006-09-29 | 2008-05-08 | Matsushita Electric Ind Co Ltd | Lead, wiring member, package component, metal component with resin and resin sealing semiconductor device, and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147549A (en) * | 2004-10-19 | 2006-06-08 | Showa Denko Kk | Surface light-emitter, its manufacturing method and intended use |
| JP2008109061A (en) * | 2006-09-29 | 2008-05-08 | Matsushita Electric Ind Co Ltd | Lead, wiring member, package component, metal component with resin and resin sealing semiconductor device, and manufacturing method thereof |
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