CN101888571A - Integrated talkback chip and integrated talkback system comprising same - Google Patents
Integrated talkback chip and integrated talkback system comprising same Download PDFInfo
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- CN101888571A CN101888571A CN2010102252920A CN201010225292A CN101888571A CN 101888571 A CN101888571 A CN 101888571A CN 2010102252920 A CN2010102252920 A CN 2010102252920A CN 201010225292 A CN201010225292 A CN 201010225292A CN 101888571 A CN101888571 A CN 101888571A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M11/00—Telephonic communication systems specially adapted for combination with other electrical systems
- H04M11/02—Telephonic communication systems specially adapted for combination with other electrical systems with bell or annunciator systems
- H04M11/025—Door telephones
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
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- G06F30/30—Circuit design
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M11/00—Telephonic communication systems specially adapted for combination with other electrical systems
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Abstract
The invention discloses an integrated talkback chip and an integrated talkback system comprising same. The integrated talkback chip comprises a central processing part, a talkback processing part and a digital interface control part, wherein the talkback processing part is used for transceiving talkback signals; the central processing part is connected with the digital interface control part which is connected with the talkback processing part; the central processing part controls the working state and parameters of the talkback processing part through the digital interface control part; and the central processing part, the talkback processing part and the digital interface control part are integrated on the same chip through the digital signal technology and a CMOS process. The integrated talkback chip has the advantages of high integration level and low cost of a complete machine, solves the problem that the circuit by the traditional intercom simulation technology has complicated structural differentiations, a plurality of separate elements and high production cost, and greatly improves the technical parameters and reliability of the product.
Description
Technical field
The present invention relates to field of wireless communication, relate in particular to a kind of integrated intercommunication chip and comprise the integrated intercom system of this chip.
Background technology
Existing intercom is divided into professional machine and civil aircraft (public's intercom) two big classes.The specialty machine is meant the machine of transmitting power greater than 4W, the main satisfied application far away to speech range, as: public security, security personnel and professional mountaineer etc.; Civil aircraft is meant that transmitting power is not more than the machine of 0.5W, and is main satisfied with the not tight application of speech range requirement, as: restaurant, hotel, exhibition and out on tours etc.; On the present intercom market, no matter be professional machine or civil aircraft, dominant technology all is based on pll frequency synthesizer and receives the superhet analog signal processing technology of double conversion; Its advantage is that technology maturation, entry threshold are lower, thereby is widely used.But along with intercom is little to volume, cost is low, function is strong, reliability is high, more commercial trend development, this traditional analog signal processing technology also shows increasing problem., discrete component complicated as the differentiation of: circuit structure reaches thousands of of hundreds of, serious restriction the research and development innovation of intercom product; Its production debugging is complicated in addition, poor, the cost height of consistency of stability and technical parameter.
Summary of the invention
In view of this, the invention provides a kind of integrated intercommunication chip and comprise the integrated intercom system of this chip, volume is little, cost is low, good reliability.
For solving the problems of the technologies described above, integrated intercommunication chip of the present invention adopts following technical scheme:
A kind of integrated intercommunication chip, comprise central processing portion, intercommunication processing section and digital interface control section, described intercommunication processing section is used to realize the processing of intercommunication signal transmitting and receiving, described central processing portion links to each other with described digital interface control section, described digital interface control section links to each other with described intercommunication processing section, and described central processing portion is controlled the operating state and the parameter of described intercommunication processing section by described digital interface control section; Described central processing portion, intercommunication processing section and digital interface control section adopt digital signal technique and are integrated on a slice chip by CMOS technology.
In a kind of embodiment of described integrated intercommunication chip, the shared crystal oscillator in described central processing portion and intercommunication processing section.
In a kind of embodiment of described integrated intercommunication chip, described intercommunication processing section comprises radio frequency receiving unit, radio-frequency transmissions part and base band signal process part; Described radio frequency receiving unit is used for received RF signal and demodulation output voice signal and signaling-information to the base band signal process part; Described base band signal process partly is used for the voice signal and the signaling-information of described demodulation output are carried out exporting after the Base-Band Processing, also is used for carrying out being input to described radio-frequency transmissions part after the Base-Band Processing sending voice signal and signaling-information; Described radio-frequency transmissions partly is the radiating circuit of direct phase-locked loop frequency comprehensive form, this circuit comprises: warble rate adjuster, fractional phase lock loop frequency synthesizer and power amplifier, described warble rate adjuster are used for the voice signal of input and signaling-information are carried out the warble rate adjusting; Described fractional phase lock loop frequency synthesizer is used for that the frequency modulation depth adjuster is regulated the signal of exporting the back and finishes digital direct frequency modulation modulation, produces the rf modulations carrier signal; Described power amplifier is used for described rf modulations carrier signal is carried out exporting after the power amplification; Described radio frequency receiving unit, radio-frequency transmissions part and base band signal process partly adopt Digital Signal Processing and are integrated on the chip piece by CMOS technology.
Described radio frequency receiving unit is the receiving circuit of low-if version.
The receiving circuit of described low-if version comprises: low noise amplifier, orthogonal mixer, two-way intermediate-freuqncy signal processing unit, digital FM demodulator; Described low noise amplifier is used for the radiofrequency signal that receives is carried out the low noise amplification and divided two-way to output to described orthogonal mixer; Described orthogonal mixer is used for the mixing conversion and goes out two-way quadrature intermediate-freuqncy signal and output to two-way intermediate-freuqncy signal processing unit respectively; Described two-way intermediate-freuqncy signal processing unit is handled the intermediate-freuqncy signal of input respectively, the output digital intermediate frequency signal; Described digital FM demodulator is used for the two-way digital intermediate frequency signal of input is carried out demodulation, exports voice signal and signaling-information respectively.
Described base band signal process partly comprises the reception Audio Processing Unit, sends Audio Processing Unit, signaling-information processing unit; Described signaling-information processing unit is used for that the signaling-information that receives or send is carried out filter shape to be handled; Described reception Audio Processing Unit is used for the voice signal of described radio frequency receiving unit output is carried out exporting after digital-to-analogue conversion and the filter amplifying processing; The transmission voice signal that described transmission Audio Processing Unit is used for importing to external world carries out outputing to the radio-frequency transmissions part after filtering, digital-to-analogue conversion and the amplification successively.
Described central processing department is divided into the DSP kernel.
The present invention also provides a kind of integrated intercom system that comprises above-mentioned integrated intercommunication chip.
Described integrated intercom system also comprises the GPS module, and described GPS module links to each other with described integrated intercommunication chip.
Integrated intercommunication chip of the present invention adopts Digital Signal Processing and by CMOS technology circuit such as intercommunication transmitting-receiving, central authorities' control all is integrated in a slice chip, and only the few peripheral components of need can be finished intercommunication function, the integrated level height, and complete machine is with low cost; Not only solve the problem that the differentiation of traditional analog intercom system technology circuit structure is complicated, discrete component is many, production cost is high, and greatly improved the technical parameter and the stability of product.
Description of drawings
Fig. 1 is the circuit structure block diagram of the integrated intercommunication chip of the embodiment of the invention;
Fig. 2 is the structural representation of the integrated intercom system of the embodiment of the invention;
Fig. 3 is the structural representation of the another kind of integrated intercom system of the embodiment of the invention.
Embodiment
The invention will be further described in conjunction with embodiment for the contrast accompanying drawing below.
As shown in Figure 1, the integrated intercommunication chip of the specific embodiment of the invention, comprise central processing portion (MCU), intercommunication processing section and digital interface control section, described intercommunication processing section is used to realize the processing of intercommunication signal transmitting and receiving, described central processing portion links to each other with described digital interface control section, described digital interface control section links to each other with described intercommunication processing section, and described central processing portion is controlled the operating state and the parameter of described intercommunication processing section by described digital interface control section; Described central processing portion, intercommunication processing section and digital interface control section adopt digital signal technique and are integrated on a slice chip by CMOS technology.Wherein, intercommunication processing section and central processing portion can shared crystal oscillators, thereby avoid the intermodulation distortion of a plurality of signal sources.
The intercommunication processing section comprises radio frequency receiving unit 1, radio-frequency transmissions part 2, base band signal process part 3.Radio frequency receiving unit 1 comprises low noise amplifier 11, frequency mixer 12, low pass filter 13, programmable amplifier 14, first analog to digital converter 15, digital processing element 16, digital FM demodulator 17.Radio-frequency transmissions part 2 comprises warble rate adjuster 21, phase-locked loop frequency integrator 22 and power amplifier 23.Base band signal process part 3 comprises filter shape device 331, first voice filter 311, digital to analog converter 312, speech amplifier 313, second analog to digital converter 321, second digital filter 322, second voice filter 323.Reception path when respectively integrated intercommunication chip being carried out radio-frequency receiving-transmitting below and emission path are done a description:
Radio frequency receives path: radio frequency receiving unit 1 adopts the receiving circuit form of Low Medium Frequency structure.The input radio frequency signal at first arrives low noise amplifier 11, and low noise amplifier 11 is a differential low noise amplifier, is divided into two-way after amplifying through the low noise difference and is sent to orthogonal mixer 12, can directly radiofrequency signal be converted to Low Medium Frequency.For traditional secondary superhet converter technique, frequency mixer is typically carries out the upper sideband mixing, local oscillation signal exceeds (or being lower than) intermediate frequency than rf frequency, the picture frequency that this kind mode makes frequency exceed (or being lower than) rf frequency twice intermediate frequency also is converted to intermediate frequency, thereby has brought the picture frequency interference.And the Low Medium Frequency structure that present embodiment adopts not only can realize high integration, and can effectively reduce the outer discrete component of sheet, avoids using external radio frequency image-reject filter, reduces overall cost.
The intermediate-freuqncy signal of orthogonal mixer 12 output two-way quadratures, promptly I road signal and Q road signal are sent into two-way intermediate-freuqncy signal processing unit respectively.The intermediate-freuqncy signal processing unit comprises low pass filter 13, programmable amplifier 14, first analog to digital converter 15, digital signal processing unit 16.
I road signal and Q road signal at first enter the low pass filter 13 on the path separately, and this low pass filter 13 is three rank Chebyshev filters, and major function is the adjacentchannel selectivity of increase system, and improve the block resistance of system.Filtered intermediate-freuqncy signal is amplified by programmable amplifier 14, and the gain of programmable amplifier 14 is set by its inner register or digital AGC (Automatic Gain Control, automatic gain control) circuit.Afterwards, intermediate-freuqncy signal is input to first analog to digital converter 15 and is converted to digital intermediate frequency signal.Digital intermediate frequency signal is input to digital processing element 16 again and carries out digital processing, wherein digital processing element 16 comprises first digital filter 161, sampler 162, finite impulse response filter 163 and digital controlled oscillator 164, digital controlled oscillator 164 is used for providing the numerical control local oscillation signal in when sampling to sampler 162, first digital filter 161, sampler 162, finite impulse response (FIR) filter 163 carry out filtering, sampling to digital signal successively, filter out all bands by finite impulse response filter 163 again and disturb outward.Arrive digital FM demodulator 17 at last through the two-way quadrature digital intermediate frequency signal after the digital processing and demodulate signaling-information and voice signal respectively.
Radio-frequency transmissions path: after the transmission voice signal of extraneous input and signaling-information are handled through base band signal process part 3, the warble rate adjuster 21 that at first arrives in the radio-frequency transmissions part 2 carries out the warble rate adjusting, be admitted to phase-locked loop frequency integrator 22 then, finish digital direct frequency modulation modulation, produce stable modulated RF carrier signal, the modulated RF carrier signal is gone out by power amplifier 23 amplifying emission.Whole radio-frequency transmissions part 2 is the radiating circuit of direct phase-locked loop frequency comprehensive form.
Base band signal process: base band signal process part 3 mainly is divided into three unit: receive Audio Processing Unit, send Audio Processing Unit, signaling-information processing unit.Wherein the signaling-information processing unit is a filter shape device 331, is used for that the signaling-information that receives (receiving from digital FM demodulator 17) or transmission (by external world's input, will deliver to warble rate adjuster 21) is carried out filter shape and handles.Receive Audio Processing Unit and comprise first voice filter 311, digital to analog converter 312 and speech amplifier 313.Carry out successively exporting after filtering, digital-to-analogue conversion and the amplification by first voice filter 311, digital to analog converter 312 and speech amplifier 313 from the voice signal of digital FM demodulator 17 outputs.Send Audio Processing Unit and comprise second analog to digital converter 321, second digital filter 322, second voice filter 323.By the transmission voice signal of external world input at first by second analog to digital converter 321 be converted to digital signal, again by second digital filter, 322 filtering out of band signals, at last by outputing to radio-frequency transmissions part 2 after 323 filtering of second voice filter.
Second analog to digital converter 321 adopts high performance Delta-Sigma analog to digital converter, and sample frequency can be consistent with the clock frequency of whole integrated intercommunication chip, and such selection can make front end not need frequency overlapped-resistable filter.Voltage controlled oscillator (not shown) in the phase-locked loop frequency integrator 22 is operated in 1.4GHz to 2GHz, produces drageffect to avoid power amplifier 23.Voltage controlled oscillator is through the needed frequency range of frequency division output intercommunication module.Simultaneously, phase-locked loop frequency integrator 22 also offers frequency mixer 12 simultaneously with local oscillation signal, also needs to adopt in addition other devices to obtain local oscillation signal to avoid frequency mixer.Phase-locked loop frequency integrator 22 adopts high performance fractional phase lock loop frequency synthesizer, thereby has realized high-performance, the low-cost design that low phase noise, the phase-locked time that is exceedingly fast and any frequency are adjustable.
Digital interface control section 4: above-mentioned radio frequency receiving unit 1, radio-frequency transmissions part 2 and base band signal process part 3 all can be by MCU by 4 controls of digital interface control section, operating state and parameter to above-mentioned three parts are adjusted, and comprise each parameters such as loop characteristics of receiving gain, the gain of emission frequency modulation, frequency, radio-frequency receiving-transmitting control and phase-locked loop frequency integrator.Digital interface control section 4 for example adopts, and the I2C bus realizes the mutual and control with MCU as two-way control bus.Perhaps also can realize mutual and control by three-way or four line spi bus as control bus with MCU.For example for the I2C bus, according to the form of I2C, MCU produces the control corresponding word, and addressing digital interface control section is determined read/write mode, then carries out reading or writing of data.MCU can be the processor of DSP kernel, and is same, also can be the control device of other types.
The power management of integrated intercommunication chip is by built-in chip type low-dropout linear voltage-regulating circuit and control circuit, for each function element in the chip provides the galvanic current source.
Fig. 2 shows a kind of integrated intercom system that contains above-mentioned integrated intercommunication chip, during this integrated intercom system work, MCU5 mainly by with finish mutual with intercommunication processing section (comprising radio frequency receiving unit 1, radio-frequency transmissions part 2, base band signal process part 3) being connected of the digital interface control section 4 of integrated intercommunication chip.During reception, radiofrequency signal is input to integrated intercommunication chip through duplexer and filter successively, aforementioned processing is carried out to radiofrequency signal in the intercommunication processing section, the output voice signal is to loud speaker (loudspeaker), and signaling-information outputed to MCU5, MCU5 controls the output state of voice signal according to signaling-information: the preset value among signaling-information and the MCU5 compares, if it is identical with preset value, central processing portion 5 controls are opened loud speaker and are discharged voice signal, if it is different, then mute speaker does not discharge voice signal.During emission, send voice and convert audio electrical signal to by receiver (microphone), launch by antenna through duplexer after after output frequency-shift keying modulation signal is handled in the intercommunication processing section, producing specified radio-frequency power through power amplifier, MCU5 produces signaling-information simultaneously and sends into the intercommunication processing section, handles the back by the intercommunication processing section and launches together with voice signal.
This integrated intercom system comprises that the keyboard input unit is to carry out for example control command input and display unit for example to show output, to make things convenient for the use of this integrated intercom system.
As shown in Figure 3, the integrated intercom system of the embodiment of the invention can also comprise the GPS module, and described GPS module links to each other with integrated intercommunication chip.
By this set, can be by integrated intercommunication chip, the GPS locating information that the GPS module is obtained sends, thereby in rescue action for example, intercom system holder's positional information is offered the aid worker.
Integrated intercommunication chip of the present invention and integrated intercom system have solved traditional complicated, problems such as discrete component is many, poor stability of analog signal processing technology circuit structure differentiation well.Simplify product design greatly and reduced cost, improved the technology content and the intelligentized design of product.
Should be embedded in the products such as mobile phone by integrated intercommunication chip, can also realize having mobile phone or other products of intercommunication function.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (9)
1. integrated intercommunication chip, it is characterized in that, comprise central processing portion, intercommunication processing section and digital interface control section, described intercommunication processing section is used to realize the processing of intercommunication signal transmitting and receiving, described central processing portion links to each other with described digital interface control section, described digital interface control section links to each other with described intercommunication processing section, and described central processing portion is controlled the operating state and the parameter of described intercommunication processing section by described digital interface control section; Described central processing portion, intercommunication processing section and digital interface control section adopt digital signal technique and are integrated on a slice chip by CMOS technology.
2. integrated intercommunication chip as claimed in claim 1 is characterized in that, the shared crystal oscillator in described central processing portion and intercommunication processing section.
3. integrated intercommunication chip as claimed in claim 2 is characterized in that, described intercommunication processing section comprises radio frequency receiving unit, radio-frequency transmissions part and base band signal process part; Described radio frequency receiving unit is used for received RF signal and demodulation output voice signal and signaling-information to the base band signal process part; Described base band signal process partly is used for the voice signal and the signaling-information of described demodulation output are carried out exporting after the Base-Band Processing, also is used for carrying out outputing to described radio-frequency transmissions part after the Base-Band Processing sending voice signal and signaling-information; Described radio-frequency transmissions partly is the radiating circuit of direct phase-locked loop frequency comprehensive form, this circuit comprises: warble rate adjuster, fractional phase lock loop frequency synthesizer and power amplifier, described warble rate adjuster are used for the voice signal of input and signaling-information are carried out the warble rate adjusting; Described fractional phase lock loop frequency synthesizer is used for that the frequency modulation depth adjuster is regulated the signal of exporting the back and finishes digital direct frequency modulation modulation, produces the rf modulations carrier signal; Described power amplifier is used for described rf modulations carrier signal is carried out exporting after the power amplification.
4. integrated intercommunication chip as claimed in claim 3 is characterized in that described radio frequency receiving unit is the receiving circuit of low-if version.
5. integrated intercommunication chip as claimed in claim 4 is characterized in that the receiving circuit of described low-if version comprises: low noise amplifier, orthogonal mixer, two-way intermediate-freuqncy signal processing unit, digital FM demodulator; Described low noise amplifier is used for the radiofrequency signal that receives is carried out the low noise amplification and divided two-way to output to described orthogonal mixer; Described orthogonal mixer is used for the mixing conversion and goes out two-way quadrature intermediate-freuqncy signal and output to two-way intermediate-freuqncy signal processing unit respectively; Described two-way intermediate-freuqncy signal processing unit is handled the intermediate-freuqncy signal of input respectively, the output digital intermediate frequency signal; Described digital FM demodulator is used for the two-way digital intermediate frequency signal of input is carried out demodulation, exports voice signal and signaling-information respectively.
6. integrated intercommunication chip as claimed in claim 3 is characterized in that, described base band signal process partly comprises the reception Audio Processing Unit, sends Audio Processing Unit, signaling-information processing unit; Described signaling-information processing unit is used for that the signaling-information that receives or send is carried out filter shape to be handled; Described reception Audio Processing Unit is used for the voice signal of described radio frequency receiving unit output is carried out exporting after digital-to-analogue conversion and the filter amplifying processing; The transmission voice signal that described transmission Audio Processing Unit is used for importing to external world carries out outputing to the radio-frequency transmissions part after filtering, digital-to-analogue conversion and the amplification successively.
7. as the arbitrary described integrated intercommunication chip of claim 1-6, it is characterized in that described central processing department is divided into the DSP kernel.
8. an integrated intercom system is characterized in that, comprises arbitrary described integrated intercommunication chip as claim 1-7.
9. integrated intercom system as claimed in claim 8 is characterized in that, also comprises the GPS module, and described GPS module links to each other with described integrated intercommunication chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN2010102252920A CN101888571A (en) | 2010-07-13 | 2010-07-13 | Integrated talkback chip and integrated talkback system comprising same |
| PCT/CN2010/080308 WO2012006857A1 (en) | 2010-07-13 | 2010-12-27 | Integrated talkback chip and integrated talkback system including the chip |
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| CN2010102252920A CN101888571A (en) | 2010-07-13 | 2010-07-13 | Integrated talkback chip and integrated talkback system comprising same |
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| WO2012006857A1 (en) * | 2010-07-13 | 2012-01-19 | 深圳市力同亚太科技有限公司 | Integrated talkback chip and integrated talkback system including the chip |
| CN102595255A (en) * | 2011-12-20 | 2012-07-18 | 天津七一二通信广播有限公司 | Shortwave-channel digital interphone |
| CN106899321A (en) * | 2017-01-04 | 2017-06-27 | 力同科技股份有限公司 | A kind of digital intercom terminal and its impedance matching methods |
| CN106911341A (en) * | 2017-03-30 | 2017-06-30 | 天津中兴智联科技有限公司 | A kind of superhet for ETC |
| CN106911347A (en) * | 2017-01-12 | 2017-06-30 | 力同科技股份有限公司 | A kind of integrated talkback chip and radio frequency carrier frequency production method |
| CN116643513A (en) * | 2023-03-16 | 2023-08-25 | 深圳瑞德创新科技有限公司 | Data processing method, device, equipment and computer readable storage medium |
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| WO2012006857A1 (en) | 2012-01-19 |
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