CN101885114A - 激光切割脆性材料基板的曲线路径切割方法 - Google Patents
激光切割脆性材料基板的曲线路径切割方法 Download PDFInfo
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102179635A (zh) * | 2011-04-26 | 2011-09-14 | 哈尔滨工业大学 | 脆性材料微波切割的加工方法及加工装置 |
TWI508809B (zh) * | 2012-09-11 | 2015-11-21 | Rorze Systems Corp | 沿曲線切割非金屬材料之方法 |
CN107907059A (zh) * | 2017-11-27 | 2018-04-13 | 京东方科技集团股份有限公司 | 一种板层剥离的检测方法和检测装置、激光检测设备 |
CN109311726A (zh) * | 2016-06-03 | 2019-02-05 | 康宁股份有限公司 | 管理分离挠性玻璃带时裂纹尖端上的机械引发应力的设备和方法 |
CN116564453A (zh) * | 2023-06-01 | 2023-08-08 | 哈尔滨工业大学 | 面向激光辐照第一壁材料温度场分布的激光参数优化方法及其优化系统 |
CN117283638A (zh) * | 2023-11-27 | 2023-12-26 | 四川职业技术学院 | 一种用于中药的切割系统 |
CN118023657B (zh) * | 2024-04-11 | 2024-06-07 | 四川显为智能装备有限公司 | 一种维修气刨机器人的控制方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007055000A (ja) * | 2005-08-23 | 2007-03-08 | Japan Steel Works Ltd:The | 非金属材料製の被加工物の切断方法及びその装置 |
CN101121220A (zh) * | 2006-08-11 | 2008-02-13 | 富士迈半导体精密工业(上海)有限公司 | 脆性材料基板切割方法 |
CN101444875A (zh) * | 2008-12-08 | 2009-06-03 | 浙江工业大学 | 一种脆性材料基板的切割方法 |
WO2009132760A1 (de) * | 2008-05-02 | 2009-11-05 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Vorrichtung zur analyse des strahlprofils eines laserstrahls |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007055000A (ja) * | 2005-08-23 | 2007-03-08 | Japan Steel Works Ltd:The | 非金属材料製の被加工物の切断方法及びその装置 |
CN101121220A (zh) * | 2006-08-11 | 2008-02-13 | 富士迈半导体精密工业(上海)有限公司 | 脆性材料基板切割方法 |
WO2009132760A1 (de) * | 2008-05-02 | 2009-11-05 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Vorrichtung zur analyse des strahlprofils eines laserstrahls |
CN101444875A (zh) * | 2008-12-08 | 2009-06-03 | 浙江工业大学 | 一种脆性材料基板的切割方法 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102179635A (zh) * | 2011-04-26 | 2011-09-14 | 哈尔滨工业大学 | 脆性材料微波切割的加工方法及加工装置 |
CN102179635B (zh) * | 2011-04-26 | 2014-07-16 | 哈尔滨工业大学 | 脆性材料微波切割的加工方法及加工装置 |
TWI508809B (zh) * | 2012-09-11 | 2015-11-21 | Rorze Systems Corp | 沿曲線切割非金屬材料之方法 |
CN109311726A (zh) * | 2016-06-03 | 2019-02-05 | 康宁股份有限公司 | 管理分离挠性玻璃带时裂纹尖端上的机械引发应力的设备和方法 |
CN109311726B (zh) * | 2016-06-03 | 2021-10-15 | 康宁股份有限公司 | 管理分离挠性玻璃带时裂纹尖端上的机械引发应力的设备和方法 |
CN107907059A (zh) * | 2017-11-27 | 2018-04-13 | 京东方科技集团股份有限公司 | 一种板层剥离的检测方法和检测装置、激光检测设备 |
CN116564453A (zh) * | 2023-06-01 | 2023-08-08 | 哈尔滨工业大学 | 面向激光辐照第一壁材料温度场分布的激光参数优化方法及其优化系统 |
CN116564453B (zh) * | 2023-06-01 | 2024-02-02 | 哈尔滨工业大学 | 面向激光辐照壁材料温度分布的激光参数优化方法及系统 |
CN117283638A (zh) * | 2023-11-27 | 2023-12-26 | 四川职业技术学院 | 一种用于中药的切割系统 |
CN117283638B (zh) * | 2023-11-27 | 2024-02-09 | 四川职业技术学院 | 一种用于中药的切割系统 |
CN118023657B (zh) * | 2024-04-11 | 2024-06-07 | 四川显为智能装备有限公司 | 一种维修气刨机器人的控制方法 |
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Effective date of registration: 20200731 Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: 310014 Hangzhou city in the lower reaches of the city of Zhejiang Wang Road, No. 18 Patentee before: ZHEJIANG University OF TECHNOLOGY Effective date of registration: 20200731 Address after: 768 Maopeng Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: SUZHOU JINSHENG CERAMIC INDUSTRY Co.,Ltd. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. |