CN101880517A - Low-temperature resistant hot melt glue - Google Patents
Low-temperature resistant hot melt glue Download PDFInfo
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- CN101880517A CN101880517A CN 201010233746 CN201010233746A CN101880517A CN 101880517 A CN101880517 A CN 101880517A CN 201010233746 CN201010233746 CN 201010233746 CN 201010233746 A CN201010233746 A CN 201010233746A CN 101880517 A CN101880517 A CN 101880517A
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- hot melt
- melt adhesive
- vinyl acetate
- copolymer
- ethylene
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Abstract
The invention relates to low-temperature resistant hot melt glue. The low-temperature resistant hot melt glue comprises ethylene-vinyl acetate copolymer, thermoplastic styrene block copolymer, viscosity increasing resin, wax, plasticizer and antioxidant. The hot melt glue is mainly applied to adhesion and fixation of articles used in certain low-temperature places and packing and manufacture of certain food needing low-temperature storage.
Description
Technical field
The present invention relates to a kind of low temperature resistant hot melt adhesive, the main application and some low temperature places, as object on compound, the ski of ski cap internally buffered layer fixing, some need the making of cryopreservation outer package of food.
Background technology
CN101298548A, title " a kind of epoxy modified polyurethane cryogenic adhesive ", the component of this tackiness agent and mass percent thereof are: polyurethane-modified prepolymer 30%-50%, Resins, epoxy 5%～15%, solvent 10%-20%, chainextender 1%-15% and filler 30%-50%.Earlier above-mentioned all liquid ingredients are mixed, add solid ingredient then and stir, after grinding on the shredder, pack again.Its weak point: the one, curing speed is slow; The 2nd, easy embrittlement directly influences bonding strength under low temperature environment.
Summary of the invention
Purpose of design: avoid the weak point in the background technology, design a kind of under low temperature environment, neither can embrittlement, brittle a kind of low temperature resistant hot melt adhesive that can not show again.
Design: in order to realize above-mentioned purpose of design.1, adopting ethylene-vinyl acetate copolymer as one of major ingredient of the application, is one of technical characterictic of the present invention.The purpose of doing like this is: ethylene-vinyl acetate copolymer is a kind of solid meltability polymkeric substance that does not need solvent, moisture-free 100%, it is solid at normal temperatures, heating and melting becomes and can flow to certain temperature, and the liquid of certain viscosity is arranged, and the present invention utilizes this viscosity just.2, adopting the thermoplastic styrene segmented copolymer as two of the application's major ingredient, is two of technical characterictic of the present invention.The purpose of doing like this is: styrene series thermoplastic elastomer (is called styrene block copolymer again, be called for short SBCs), be a kind of thermoplastic elastomer the most similar to rubber performance, can contact with water, weak acid, alkali etc., has good tensile strength, skin friction coefficient is big, and low-temperature performance is good, modifier, tackiness agent; As modifier, adopt thermoplastic styrene segmented copolymer and ethylene-vinyl acetate copolymer blend not only can obviously improve the low-temperature performance and the shock strength of goods, and have high solid substances content, fast dried, low temperature resistant characteristics.3, adopting tackifying resin as three of the application's major ingredient, is three of technical characterictic of the present invention.The purpose of doing like this is: tackifying resin has good polymer phase capacitive, and it and ethylene-vinyl acetate copolymer, thermoplastic styrene segmented copolymer etc. are compatible, have good viscosity, and inner cohesive force has good thermotolerance.
The low temperature resistant hot melt adhesive that the present invention proposes by weight percentage, comprises following component:
Ethylene-vinyl acetate copolymer 30-40%,
Thermoplastic styrene segmented copolymer 10-20%,
Tackifying resin 30-50%,
Wax 5-10%,
Softening agent 3-8%,
Oxidation inhibitor 0.2-1.5%.
The present invention compares with background technology, and the one, softening temperature: 85 ± 5 ℃; The 2nd, melting viscosity: 9000 ± 500cps, bonding force is strong; The 3rd, second-order transition temperature :-17 ± 3 ℃, temperature range is wide; The 4th, color: faint yellow; The 5th, shape: shape as the mung bean; Smell: free from extraneous odour during fusion, environment friendly and pollution-free.
Embodiment
Embodiment 1:
Ethylene-vinyl acetate copolymer 40%,
Thermoplastic styrene segmented copolymer 5%,
Tackifying resin closes 42%,
Wax 4.7%,
Softening agent 8%,
Oxidation inhibitor 0.3%.
Embodiment 2:
Ethylene-vinyl acetate copolymer 38%,
Thermoplastic styrene segmented copolymer 12%,
Tackifying resin 40%,
Wax 4%,
Softening agent 5.7%,
Oxidation inhibitor 0.3%.
Embodiment 3:
Ethylene-vinyl acetate copolymer 35%,
Thermoplastic styrene segmented copolymer 17%,
Tackifying resin 37%,
Wax 6%,
Softening agent 4.7%,
Oxidation inhibitor 0.3%.
Embodiment 4:
Ethylene-vinyl acetate copolymer 30%,
Thermoplastic styrene segmented copolymer 20%,
Tackifying resin 45%,
Softening agent 4.7%,
Oxidation inhibitor 0.3%.
Embodiment 5: on the basis of the foregoing description, the preparation process of the low temperature resistant hot melt adhesive of the present invention is as follows:
1, material preparation: take by weighing each component materials in proportion;
2, blend: each component materials is mixed;
3, melting mixing: with all materials melting mixing in twin screw extruder, extruder temperature is controlled at below 160 ℃;
4, back mixing: will carry out once mixing again through the material after the process 3 under the same conditions;
5, extrusion moulding;
6, granulation, pelletizing.
The raw material of above-mentioned example is produced the hot melt adhesive of gained in proportion with previously described preparation technology, after tested, technical indicator is as follows:
What need understand is: though the foregoing description is to the mentality of designing of the present invention detailed text description of contrasting; but these text descriptions; just the simple text of mentality of designing of the present invention is described; rather than to the restriction of mentality of designing of the present invention; any combination, increase or modification that does not exceed mentality of designing of the present invention all should fall within the scope of protection of the present invention.
Claims (12)
1. low temperature resistant hot melt adhesive is characterized in that its component and weight percent thereof are:
Ethylene-vinyl acetate copolymer 20-50%,
Thermoplastic styrene segmented copolymer 10-30%,
Tackifying resin 30-60%,
Wax 0-20%,
Softening agent 0-10%,
Oxidation inhibitor 0-2%,
Above all components adds up to 100%.
2. low temperature resistant hot melt adhesive is characterized in that the preferred prescription of weight percent is:
Ethylene-vinyl acetate copolymer 30-40%,
Thermoplastic styrene segmented copolymer 10-20%,
Tackifying resin 30-50%,
Wax 5-10%,
Softening agent 3-8%,
Oxidation inhibitor 0.2-1.5%,
Above all components adds up to 100%.
3. according to claim 1 or the described hot melt adhesive of claim 2, it is characterized in that containing by weight in the described ethylene-vinyl acetate copolymer vinyl acetate of 18-40%.
4. according to claim 1 or the described hot melt adhesive of claim 2, the melting index that it is characterized in that described ethylene-vinyl acetate copolymer is at 5-800g/10min.
5. according to the described hot melt adhesive of claim 3, it is characterized in that containing by weight in the described ethylene-vinyl acetate copolymer vinyl acetate of 25-33%.
6. according to the described hot melt adhesive of claim 4, the melting index that it is characterized in that described ethylene-vinyl acetate copolymer is at 20-400g/10min.
7. according to claim 1 or the described hot melt adhesive of claim 2, one or more that it is characterized in that described thermoplastic styrene segmented copolymer is following product: structural formula is triblock copolymer, A-B Synthetic rubber, isoprene-styrene, hydrogenated, block, diblock, A-B-A-B-A segmented copolymer, star block copolymer and their the graft modification product of A-B-A, and these mixture of polymers.
8. described according to claim 1 or claim 7, it is characterized in that described thermoplastic styrene segmented copolymer has a kind of block content of product at least greater than 20%.
9. according to claim 1 or the described hot melt adhesive of claim 2, one or more that it is characterized in that described tackifying resin is following product: petroleum resin and hydrogenated products, terpenes and the hydrogenated derivatives thereof of rosin and Abietyl modified derivative, carbon five or carbon nine hydrocarbon.
10. require described hot melt adhesive according to claim 1 or right 2, it is characterized in that described wax is selected from: paraffin, Microcrystalline Wax, synthetic wax with and composition thereof.
11. require described hot melt adhesive according to claim 1 or right 2, it is characterized in that described softening agent is following product one or more: mineral base hydrocarbon-type oil, petroleum base hydrocarbon-type oil, polybutene, liquid tackifying resin, fatty oil.
12. require described hot melt adhesive according to claim 1 or right 2, it is characterized in that described oxidation inhibitor be hindered phenol or with aid anti-oxidants bonded hindered phenol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010233746 CN101880517A (en) | 2010-07-19 | 2010-07-19 | Low-temperature resistant hot melt glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010233746 CN101880517A (en) | 2010-07-19 | 2010-07-19 | Low-temperature resistant hot melt glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101880517A true CN101880517A (en) | 2010-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010233746 Pending CN101880517A (en) | 2010-07-19 | 2010-07-19 | Low-temperature resistant hot melt glue |
Country Status (1)
| Country | Link |
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| CN (1) | CN101880517A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103013389A (en) * | 2012-11-22 | 2013-04-03 | 芜湖众力部件有限公司 | Special bonding agent containing rice hull ash for surface composite woven shell fabric of automotive upholstery |
| CN103275649A (en) * | 2013-05-07 | 2013-09-04 | 安徽金门工贸有限公司 | Hot-melt adhesive for glass and preparation method for same |
| CN104087207A (en) * | 2014-06-26 | 2014-10-08 | 滁州市光威化工有限公司 | Hot melt adhesive for medical dialyzing paper |
| CN106189933A (en) * | 2016-08-23 | 2016-12-07 | 安徽永大胶业科技发展有限公司 | A kind of low form PUR for glue stick |
| CN106833512A (en) * | 2015-12-04 | 2017-06-13 | 中国石油化工股份有限公司 | It is a kind of for silicon steel sheet process in bond containing Wax composition |
| CN109082250A (en) * | 2018-07-11 | 2018-12-25 | 昆山太田新材料有限公司 | A kind of preparation method of harsh thermosol formula |
| CN109266269A (en) * | 2018-09-30 | 2019-01-25 | 深圳市美信电子有限公司 | It is a kind of to position hot melt adhesive adhesive, preparation method and the preparation method that hot melt adhesive adhesive tape be positioned |
| CN113072736A (en) * | 2021-03-31 | 2021-07-06 | 袁胜凡 | Rubber foaming particles and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996003470A1 (en) * | 1994-07-26 | 1996-02-08 | Exxon Chemical Patents Inc. | Hot melt adhesive based on eva and styrene block polymers |
-
2010
- 2010-07-19 CN CN 201010233746 patent/CN101880517A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996003470A1 (en) * | 1994-07-26 | 1996-02-08 | Exxon Chemical Patents Inc. | Hot melt adhesive based on eva and styrene block polymers |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103013389A (en) * | 2012-11-22 | 2013-04-03 | 芜湖众力部件有限公司 | Special bonding agent containing rice hull ash for surface composite woven shell fabric of automotive upholstery |
| CN103013389B (en) * | 2012-11-22 | 2014-07-16 | 芜湖众力部件有限公司 | Special bonding agent containing rice hull ash for surface composite woven shell fabric of automotive upholstery |
| CN103275649A (en) * | 2013-05-07 | 2013-09-04 | 安徽金门工贸有限公司 | Hot-melt adhesive for glass and preparation method for same |
| CN103275649B (en) * | 2013-05-07 | 2016-01-06 | 安徽金门工贸有限公司 | A kind of glass hot melt adhesive and preparation method thereof |
| CN104087207A (en) * | 2014-06-26 | 2014-10-08 | 滁州市光威化工有限公司 | Hot melt adhesive for medical dialyzing paper |
| CN106833512A (en) * | 2015-12-04 | 2017-06-13 | 中国石油化工股份有限公司 | It is a kind of for silicon steel sheet process in bond containing Wax composition |
| CN106833512B (en) * | 2015-12-04 | 2019-01-25 | 中国石油化工股份有限公司 | It is a kind of to contain Wax composition for what is bonded in silicon steel sheet processing |
| CN106189933A (en) * | 2016-08-23 | 2016-12-07 | 安徽永大胶业科技发展有限公司 | A kind of low form PUR for glue stick |
| CN109082250A (en) * | 2018-07-11 | 2018-12-25 | 昆山太田新材料有限公司 | A kind of preparation method of harsh thermosol formula |
| CN109266269A (en) * | 2018-09-30 | 2019-01-25 | 深圳市美信电子有限公司 | It is a kind of to position hot melt adhesive adhesive, preparation method and the preparation method that hot melt adhesive adhesive tape be positioned |
| CN113072736A (en) * | 2021-03-31 | 2021-07-06 | 袁胜凡 | Rubber foaming particles and preparation method thereof |
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Open date: 20101110 |