CN101879758A - Crystal bar installation method in multi-wire cutter - Google Patents
Crystal bar installation method in multi-wire cutter Download PDFInfo
- Publication number
- CN101879758A CN101879758A CN 201010139895 CN201010139895A CN101879758A CN 101879758 A CN101879758 A CN 101879758A CN 201010139895 CN201010139895 CN 201010139895 CN 201010139895 A CN201010139895 A CN 201010139895A CN 101879758 A CN101879758 A CN 101879758A
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- CN
- China
- Prior art keywords
- crystal
- crystal bars
- installation method
- bar installation
- wire cutter
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a crystal bar installation method in a multi-wire cutter. In the method, two crystal bars are arranged in the wire cutter in parallel. Seen from the sections of the two crystal bars, the adjacent inner sides of the two crystal bars incline inwards and are at a lower position and the distant outer sides thereof rise upwards and are at an upper position. After the method of the invention is adopted, when a steel wire cuts a silicon slice back and forth, mortar flows into the crystal bars and can not be thrown out so that the entry hemming phenomenon is avoided and the finished product rate is improved.
Description
Technical field
The present invention relates to the crystal bar installation method in a kind of multi-line cutting machine.
Background technology
At present, in the production process of multiline cut silicon chips, we are general to be installed on same horizontal level with two crystal bars earlier, but owing to can become arc behind the steel wire pressurized, make cut surface produce angle, mortar is thrown away, and can not flow in the crystal bar of cutting, cause being prone to feed mouth edge-curl phenomenon, cause product rejection, bring loss to enterprise.
Summary of the invention
The purpose of this invention is to provide the crystal bar installation method in a kind of multi-line cutting machine that to eliminate multi-line cutting machine feed mouth edge-curl phenomenon.
The technical scheme that the present invention takes is: the crystal bar installation method in a kind of multi-line cutting machine, it is characterized in that two crystal bars are packed in the wire cutting machine side by side, and cross section from two crystal bars, the mutually close inboard of two crystal bars is all sloped inwardly be in low level, away from the outside then upwards rise and be in a high position.
Adopt the inventive method, still can become arc behind the steel wire pressurized, though make cut surface produce angle, but because that the position of two crystal bars mediates is low, the two ends height is when steel wire cuts silicon chip back and forth, mortar can flow in the crystal bar, just feed mouth edge-curl phenomenon can not occur, thereby improve yield rate.
The specific embodiment
The invention will be further described below in conjunction with specific embodiment.
1, is ready to two crystal bars, it is connected on the connecting plate mutually side by side.
2, adopt the method for cushioning, the position of adjusting two crystal bars is to the cross section from two crystal bars, and the mutually close inboard of two crystal bars slopes inwardly, and is in low level, and away from the lateral on rise, be in a high position.
3, then, two crystal bars are packed into together with connecting plate get final product in the multi-line cutting machine.
Claims (1)
1. the crystal bar installation method in the multi-line cutting machine, it is characterized in that two crystal bars are packed in the wire cutting machine side by side, and from the cross section of two crystal bars, the mutually close inboard of two crystal bars is all sloped inwardly be in low level, away from the outside then upwards rise and be in a high position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010139895 CN101879758A (en) | 2010-04-01 | 2010-04-01 | Crystal bar installation method in multi-wire cutter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010139895 CN101879758A (en) | 2010-04-01 | 2010-04-01 | Crystal bar installation method in multi-wire cutter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101879758A true CN101879758A (en) | 2010-11-10 |
Family
ID=43051958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010139895 Pending CN101879758A (en) | 2010-04-01 | 2010-04-01 | Crystal bar installation method in multi-wire cutter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101879758A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107464A (en) * | 2010-11-29 | 2011-06-29 | 上海申和热磁电子有限公司 | Silicon ingot cutting device and cutting method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004082282A (en) * | 2002-08-27 | 2004-03-18 | Kyocera Corp | Method for slicing semiconductor block |
| CN101554757A (en) * | 2009-05-14 | 2009-10-14 | 浙江昱辉阳光能源有限公司 | Cutting method of crystalline silicon blocks |
-
2010
- 2010-04-01 CN CN 201010139895 patent/CN101879758A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004082282A (en) * | 2002-08-27 | 2004-03-18 | Kyocera Corp | Method for slicing semiconductor block |
| CN101554757A (en) * | 2009-05-14 | 2009-10-14 | 浙江昱辉阳光能源有限公司 | Cutting method of crystalline silicon blocks |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107464A (en) * | 2010-11-29 | 2011-06-29 | 上海申和热磁电子有限公司 | Silicon ingot cutting device and cutting method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20101110 |