CN101872932A - Thermal compression connection method and device of circuit component - Google Patents
Thermal compression connection method and device of circuit component Download PDFInfo
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- CN101872932A CN101872932A CN200910138557A CN200910138557A CN101872932A CN 101872932 A CN101872932 A CN 101872932A CN 200910138557 A CN200910138557 A CN 200910138557A CN 200910138557 A CN200910138557 A CN 200910138557A CN 101872932 A CN101872932 A CN 101872932A
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Abstract
The invention relates to thermal compression connection method and device of a circuit component. The thermal compression connection method comprises the following steps of: setting a buffer compression bar with ferromagnetic materials between a compression component and the circuit component to be compressed by setting the compression component of an electromagnetic induction coil; compressing by using the compression component; electrifying when the electromagnetic induction coil of the compression component is compressed so that the buffer compression bar contacted with the circuit component to be compressed is heated. The invention overcomes the defect of the traditional thermal compression method and device, has reasonable design, can effectively reduce the energy consumption of thermal compression, improves the heat energy utilization ratio, reduces the environment temperature and improves the operation condition.
Description
Technical field
The invention belongs to the hot pressing technology of circuit element, be specifically related between a kind of LCD of being used for circuit element with hot pressing method of attachment and circuit element hot pressing device after the anisotropic conducting rubber bonding.
Background technology
In the processing procedure process of display panels, when connecting by Anisotropically conductive glue ACF between circuit element, need through hot pressing mode.As depicted in figs. 1 and 2, the general hot pressing device that adopts is finished in the prior art, this hot pressing device comprises a heat pressing connection head 11, be provided with electrical heating elements in this heat pressing connection head 11, make heat pressing connection head keep the constant condition of high temperature by power supply, heat pressing connection head moves up and down and does the pressing action under driving, and circuit element is pressed together on the hot adduction seat 12.After heat pressing connection head presses down, circuit element 20 to be laminated is exerted pressure and by heat conduction, make the last circuit element 21 of circuit element to be laminated and the Anisotropically conductive glue in following circuit element spare 22 pressing zones meet the requirements of heat-seal temperature.Heat pressing connection head is removed then, waits for the in place of next circuit element to be laminated.There are the too high defective of energy consumption in this hot pressing mode and hot pressing device, because only at heat pressing connection head and circuit element to be laminated in contacted blink, the heat that is delivered to the pressing zone can be used effectively, and the heat of all the other most of the time heat pressing connection heads all is lost in the surrounding environment.
Summary of the invention
The present invention is directed to the above-mentioned defective that existing hot pressing mode and hot pressing device exist, proposed a kind of reasonable in design, can effectively reduce the hot pressing energy consumption, and improve the method for attachment of circuit element hot pressing and the circuit element hot pressing device of utilization efficiency of heat energy, it can reduce ambient temperature, improves operating condition.
The technical solution adopted in the present invention is as follows:
The method of attachment of a kind of circuit element hot pressing is characterized in that this hot pressing method of attachment comprises: employing one is provided with the pressing part of electromagnetic induction coil, a buffering with ferromagnetic material is set between this pressing part and circuit element to be laminated presses material; And carry out pressing by the pressing part; The electromagnetic induction coil of described pressing part is switched on when pressing and is made the buffering that contacts with circuit element to be laminated press the material heating.
Concretely, described circuit element is the LCD circuit element by the Anisotropically conductive glue bond, and described hot pressing method of attachment further comprises: before circuit element to be laminated is placed into described pressing part, Anisotropically conductive glue is set between circuit element to be laminated.
The method of attachment of a kind of circuit element hot pressing is characterized in that this hot pressing method of attachment specifically comprises:
In the pressing head of a pressing part, electromagnetic induction coil is set, in circuit element to be laminated is placed into the pressing part before, Anisotropically conductive glue is set between circuit element to be laminated;
One buffering with ferromagnetic material is set between pressing head and circuit element to be laminated presses material;
When the pressing head presses down circuit element to be laminated, to the electromagnetic induction coil power supply, electromagnetic induction coil makes buffering press material to produce heat energy, makes the thermalization of Anisotropically conductive glue and circuit element is bondd.
The method of attachment of a kind of circuit element hot pressing is characterized in that this hot pressing method of attachment comprises:
In the pressing head of a pressing part, electromagnetic induction coil is set, in circuit element to be laminated is placed into the pressing part before, Anisotropically conductive glue is set between circuit element to be laminated;
Be mixed with ferromagnetic substance in this Anisotropically conductive glue;
When the pressing head presses down circuit element to be laminated, to the electromagnetic induction coil power supply, electromagnetic induction coil heats Anisotropically conductive glue, makes the thermalization of Anisotropically conductive glue and circuit element is bondd.
A kind of circuit element hot pressing device, comprise a pressing head, it is characterized in that being provided with electromagnetic induction coil in the described pressing head, the pressing end face of described pressing head is adjacent to be provided with one and to press material with the contacted buffering of circuit element to be laminated, this buffering is pressed in the material and is provided with ferromagnetic material, when described pressing head was pressed the indirect pressing of material circuit element to be laminated by buffering, the electromagnetic induction coil in it made buffering press material to be heated.
Among one embodiment, described pressing head comprises a saturating magnetic insulation obturator, and this saturating magnetic insulation obturator distributes and is provided with electromagnetic induction coil.
Described electromagnetic induction coil array packages is in described magnetic insulation obturator, and described electromagnetic induction coil connection is provided with a temperature control circuit.
The pressing end face of described pressing head is a saturating magnetic thermal baffle, and described magnetic thermal baffle is fitted fixing with saturating magnetic insulation obturator.
Among one embodiment, it is a sheet material that described buffering is pressed material, and this buffering is pressed and disperseed to be filled with ferromagnetic particle in the material.
Among another embodiment, described hot pressing device comprises that further one is used to place the pressing base of circuit element to be laminated.
For a nearly step is done detailed elaboration to the present invention, describe with embodiment in conjunction with the accompanying drawings down.
Description of drawings
Fig. 1 is the pressing schematic diagram of the existing hot pressing device of the present invention;
Fig. 2 is another view of hot pressing device in the prior art of the present invention.
Fig. 3 is the application structure schematic diagram of circuit element hot pressing device in the specific embodiment of the invention.
Embodiment
Circuit element heat seal method of attachment of the present invention, the circuit element that needing mainly to be suitable for heat seal to connect for example adopts tropism's conducting resinl ACF to carry out circuit board and connects technology in the liquid crystal panel manufacture process, and it can be finished by hot pressing device.Be provided with electromagnetic induction coil in the pressing part of this hot pressing device, this electromagnetic induction coil can generate electromagnetic waves under the situation of energising.At first will Anisotropically conductive glue be set between circuit element to be laminated, and two circuit elements to be laminated stacks are put together, Anisotropically conductive glue is positioned at the pressing zone of this circuit element to be laminated, between pressing part and circuit element to be laminated, also be provided with a buffering and press material, it is the sheet material with ferromagnetic material that this buffering is pressed material, and this buffering presses material to produce heat energy under the effect of electromagnetic induction coil and Anisotropically conductive glue is given in conduction.The thermalization that so can realize Anisotropically conductive glue connects.
This heat seal connection side genealogy of law only presses down the back at the pressing part and switches in electromagnetic induction coil, and heat energy is to be pressed material to produce and conducted by buffering to give Anisotropically conductive glue, and it can effectively improve conduction efficiency, and reduces the conduction time of electromagnetic induction coil, cut down the consumption of energy, and improve utilization efficiency of heat energy.
Another kind of circuit element heat seal method of attachment provided by the invention is by implant electromagnetic induction coil in the pressing head of pressing part, and employing is mixed with the connection medium of the Anisotropically conductive glue of ferromagnetic substance as circuit element, Anisotropically conductive glue is placed the pressing zone of two circuit elements to be laminated, when being pressed down, the pressing head of pressing part switches on to electromagnetic induction coil, ferromagnetic substance in the Anisotropically conductive glue for example ferromagnetic microparticles produces heat under the electromagnetic wave effect, make Anisotropically conductive glue be warming up to pressing-in temp.So, can realize high efficiency heat energy utilization, reduce ambient temperature rising factor.
As described in Figure 3, this circuit element hot pressing device mainly presses material 40 and pressing base 51 to form by pressing 30, buffering, be provided with solenoid 32 in the pressing 30, the pressing end face of pressing head is adjacent to be provided with one and to press material 40 with the contacted buffering of circuit element to be laminated, this buffering is pressed and is provided with ferromagnetic material in the material 40 for example is ferromagnetic particle, when pressing 30 is pressed material 40 indirect pressings circuit element to be laminated by buffering, electromagnetic induction coil 32 in it makes buffering press material 40 to be heated, Anisotropically conductive glue 23 is given in conduction then, finishes hot pressing and connects.
Concretely, this pressing 30 has a saturating magnetic insulation obturator 31 and a saturating magnetic thermal baffle 33, this saturating magnetic insulation obturator 31 and saturating 33 applyings of magnetic thermal baffle fixedly install the pressing assembly that forms the pressing head, and saturating magnetic thermal baffle 33 is positioned on the pressing end face of pressing head.Electromagnetic induction coil 32 is conductive coil independently, and its array packages is in saturating magnetic insulation obturator 31, and each electromagnetic induction coil all is connected setting with a temperature control circuit 52.Temperature control circuit 52 can be realized independent control to each electromagnetic induction coil.
It is a sheet material that buffering is pressed material 40, disperses in it to be filled with ferromagnetic particle, can prepare by the mode of doping ferromagnetic particle.
When adopting the circuit element hot pressing device to carry out the pressing operation, earlier the pressing location of circuit element 21,22 to be laminated is inserted Anisotropically conductive glue 23, then circuit element to be laminated is placed on the pressing base, make its pressing zone be positioned at pressing place of pressing head, between pressing head and circuit element to be laminated, put into buffering and press material.When the pressing head carries out pressing, can provide the adaptation electric current by temperature control circuit 52 to electromagnetic induction coil earlier, make buffering press material under electromagnetic effect, to produce heat energy and the temperature rising.Buffering presses material to give Anisotropically conductive glue with thermal energy conduction, and Anisotropically conductive glue is under the heat-seal temperature of requirement, realizes that heat seal connects.
Claims (10)
1. circuit element hot pressing method of attachment is characterized in that this hot pressing method of attachment comprises: employing one is provided with the pressing part of electromagnetic induction coil, a buffering with ferromagnetic material is set between this pressing part and circuit element to be laminated presses material; And carry out pressing by the pressing part; The electromagnetic induction coil of described pressing part is switched on when pressing and is made the buffering that contacts with circuit element to be laminated press the material heating.
2. circuit element hot pressing according to claim 1 method of attachment, it is characterized in that described circuit element is the LCD circuit element by the Anisotropically conductive glue bond, described hot pressing method of attachment further comprises: before circuit element to be laminated is placed into described pressing part, Anisotropically conductive glue is set between circuit element to be laminated.
3. circuit element hot pressing method of attachment is characterized in that this hot pressing method of attachment specifically comprises:
In the pressing head of a pressing part, electromagnetic induction coil is set, in circuit element to be laminated is placed into the pressing part before, Anisotropically conductive glue is set between circuit element to be laminated;
One buffering with ferromagnetic material is set between pressing head and circuit element to be laminated presses material;
When the pressing head presses down circuit element to be laminated, to the electromagnetic induction coil power supply, electromagnetic induction coil makes buffering press material to produce heat energy, makes the thermalization of Anisotropically conductive glue and circuit element is bondd.
4. circuit element hot pressing method of attachment is characterized in that this hot pressing method of attachment comprises:
In the pressing head of a pressing part, electromagnetic induction coil is set, in circuit element to be laminated is placed into the pressing part before, Anisotropically conductive glue is set between circuit element to be laminated;
Be mixed with ferromagnetic substance in this Anisotropically conductive glue;
When the pressing head presses down circuit element to be laminated, to the electromagnetic induction coil power supply, electromagnetic induction coil heats Anisotropically conductive glue, makes the thermalization of Anisotropically conductive glue and circuit element is bondd.
5. circuit element hot pressing device, comprise a pressing head, it is characterized in that being provided with electromagnetic induction coil in the described pressing head, the pressing end face of described pressing head is adjacent to be provided with one and to press material with the contacted buffering of circuit element to be laminated, this buffering is pressed in the material and is provided with ferromagnetic material, when described pressing head was pressed the indirect pressing of material circuit element to be laminated by buffering, the electromagnetic induction coil in it made buffering press material to be heated.
6. circuit element hot pressing device according to claim 5 is characterized in that described pressing head comprises a saturating magnetic insulation obturator, and this saturating magnetic insulation obturator distributes and is provided with electromagnetic induction coil.
7. circuit element hot pressing device according to claim 6 is characterized in that described electromagnetic induction coil array packages in described magnetic insulation obturator, and described electromagnetic induction coil connection is provided with a temperature control circuit.
8. circuit element hot pressing device according to claim 6, the pressing end face that it is characterized in that described pressing head are a saturating magnetic thermal baffle, and described magnetic thermal baffle is fitted fixing with saturating magnetic insulation obturator.
9. circuit element hot pressing device according to claim 5 is characterized in that it is a sheet material that described buffering is pressed material, and this buffering is pressed and disperseed to be filled with ferromagnetic particle in the material.
10. circuit element hot pressing device according to claim 5 is characterized in that described hot pressing device comprises that further one is used to place the pressing base of circuit element to be laminated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910138557A CN101872932A (en) | 2009-04-26 | 2009-04-26 | Thermal compression connection method and device of circuit component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910138557A CN101872932A (en) | 2009-04-26 | 2009-04-26 | Thermal compression connection method and device of circuit component |
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| Publication Number | Publication Date |
|---|---|
| CN101872932A true CN101872932A (en) | 2010-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200910138557A Pending CN101872932A (en) | 2009-04-26 | 2009-04-26 | Thermal compression connection method and device of circuit component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106200214A (en) * | 2014-09-26 | 2016-12-07 | 德尔福技术有限公司 | With local window except the vehicle imager assembly of mist |
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2009
- 2009-04-26 CN CN200910138557A patent/CN101872932A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106200214A (en) * | 2014-09-26 | 2016-12-07 | 德尔福技术有限公司 | With local window except the vehicle imager assembly of mist |
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Application publication date: 20101027 |