CN101867311B - Power system - Google Patents
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- CN101867311B CN101867311B CN2010101647203A CN201010164720A CN101867311B CN 101867311 B CN101867311 B CN 101867311B CN 2010101647203 A CN2010101647203 A CN 2010101647203A CN 201010164720 A CN201010164720 A CN 201010164720A CN 101867311 B CN101867311 B CN 101867311B
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- 238000005538 encapsulation Methods 0.000 claims description 16
- 238000005516 engineering process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 18
- 230000009977 dual effect Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 238000003466 welding Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 229920000297 Rayon Polymers 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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Abstract
The present invention discloses a power system, including a switching circuit, a resonant tank, a feedback circuit, and controller circuitry. The switching circuit including a first switch and a second switch provides a first AC signal. The resonant tank coupled to the switching circuit receives the first AC signal and generating a second AC signal for powering a load. The feedback circuit coupled to the load monitors an electrical condition of the load and provides a feedback signal. The controller circuitry coupled to the converter controls the switching circuit according to the feedback signal so as to control the power to the load. The controller circuitry is integrated in a first die. The first switch is integrated in a second die, and the second switch is integrated in a third die. The first die, said second die and said third die are mounted on and electrically interconnected to a platform compatible with through-hole technology. The platform and the resonant tank are further assembled on a printed circuit board. The power system is integrated with a control circuit, the switching circuit and the feedback circuit on a platform so as to improve the flexibility of design and application and the reliability of the power system.
Description
Technical field
The present invention relates to a kind of power-supply system.
Background technology
Power-supply system, for example, the inverter system of conversion direct current to alternating current comprises control circuit, feedback circuit, switch element resonant loop.The traditional structure of inverter system is based on the structure of chip (dice) or based on integrated circuit (integrated circuit; IC) structure.
In the structure based on chip, discrete chip is packaged into discrete integrated circuit respectively, is installed on the printed circuit board (PCB) then.Control circuit is integrated in the integrated circuit encapsulation (IC package) of surface-assembled (surface-mounted).Switch element is an active semi-conductor equipment, and each switch element is integrated in the integrated circuit encapsulation of surface-assembled independently.Feedback circuit comprises discrete elements, and for example resistance, electric capacity and diode also are integrated in the integrated circuit encapsulation of surface-assembled independently.The integrated circuit encapsulation of surface-assembled typically refers to the electronic circuit that element is directly installed on printed circuit board surface.Resonant tank comprises transformer and electric capacity, and this transformer and electric capacity are in through hole encapsulation (through-hole package).Through hole encapsulation is meant that pin is inserted into the hole of printed circuit board (PCB) and the element that is welded at the another side of circuit board.In the framework based on chip, each element is installed on the printed circuit board (PCB), and interconnects through wire.Printed circuit board (PCB) possibly comprise that other by inverter system and element or equipment that other subsystems use, for example are used to change the AC-DC electric power system of alternating voltage to direct voltage.Because the characteristic of power source conversion, the AC-DC electric power system generally includes through hole equipment.
As shown in Figure 1; A plurality of integrated circuits 102 and 104 (for example; The integrated circuit of integrated control circuit and other integrated integrated circuits of switch) and other discrete elements 110 (for example, resistance, electric capacity and diode) be assembled on the same printed circuit board (PCB) 120 through assembling process.Yet on the structure based on chip, because element, for example control circuit and switch packedly advance independently integrated circuit, and the gross area of printed circuit board (PCB) is bigger, so increased the cost of printed circuit board (PCB).In addition, because the equipment of surface-assembled and through hole equipment is on same printed circuit board (PCB), printed circuit board (PCB) need stand welding process twice, and for example, once for through hole equipment, another time is for the equipment of surface-assembled.Repeat to bear high temperature in the welding process and can reduce the reliability of system.So owing to need manage surface-assembled and through hole mounting technology simultaneously, production cost can further increase.And the welding process of repetition has prolonged the production time.
In the framework based on integrated circuit, control circuit and switch element are integrated in the same IC chip.For example, as shown in Figure 2, the integrated circuit 202 of integrated control circuit, switch and other discrete elements 210 (for example, resistance, electric capacity and diode) is installed on the printed circuit board (PCB) 220 through assembling process.Yet this structure based on integrated circuit receives the power grade restriction of integrated switch element.In order to support the application of more high-power grade, the integrated circuit 202 of integrated control circuit and switch possibly be redesigned and flow.If design and flow again, the size of pin assignment (pin-out) and integrated circuit encapsulation possibly be changed.In addition, because the equipment of surface-assembled and through hole equipment is on same printed circuit board (PCB), above-mentioned problem about surface-assembled and through hole mounting technology is still unresolved.
Summary of the invention
The technical problem that the present invention will solve is to provide a kind of power-supply system, can improve the reliability of design and application flexibility and power-supply system.
For solving the problems of the technologies described above, the invention provides a kind of power-supply system.This power-supply system comprises switching circuit, resonant tank, feedback circuit and control circuit.Said switching circuit provides first AC signal and comprises first switch and second switch.Said resonant tank is coupled to said switching circuit, is used to receive said first AC signal and produces second AC signal with powering load.Said feedback circuit is coupled to said load, is used to monitor the electric condition of said load and feedback signal is provided.Said control circuit is coupled to said switching circuit; Be used for controlling said switching circuit and the electric energy to said load be provided with control according to said feedback signal; Wherein, Said control circuit is integrated in first chip, and said first switch is integrated in second chip, and said second switch is integrated in the 3rd chip; Platform is directly installed and be electrically connected to said first chip, said second chip and said the 3rd chip; Said switching circuit, said feedback circuit and said control circuit are integrated into one independently based on the controller of said platform, and said controller and said resonant tank based on platform all has the encapsulation with the through hole technical compatibility, and wherein said controller and said resonant tank based on platform is installed on the printed circuit board (PCB).
Compared with prior art; Power-supply system of the present invention is integrated on the same platform control circuit, switch and feedback circuit to constitute the controller based on platform; Thereby improved design and application flexibility, reduced the area and the cost of printed circuit board (PCB), and improved the reliability of power-supply system.
Below in conjunction with accompanying drawing and specific embodiment technical scheme of the present invention is carried out detailed explanation, so that characteristic of the present invention and advantage are more obvious.
Description of drawings
Fig. 1 is the block diagram based on the structure of chip of traditional power-supply system.
Fig. 2 is the block diagram based on the structure of integrated circuit of traditional power-supply system.
Fig. 3 is the load of giving according to an embodiment of the invention, for example, and cold cathode fluorescent lamp pipe (cold cathode fluorescent lamp; CCFL) block diagram of the inverter system of power supply.
Fig. 4 is the load of giving according to an embodiment of the invention, for example, and light-emitting diode (light-emitting diode; LED) block diagram of the power-supply system of power supply.
Fig. 5 is the block diagram based on the structure of platform of power-supply system according to an embodiment of the invention.
Fig. 6 is the block diagram of employing according to an embodiment of the invention based on the inverter system of the controller of platform.
Fig. 7 is the block diagram of employing according to an embodiment of the invention based on the power-supply system of the controller of platform.
Fig. 8 A is employing according to an embodiment of the invention based on the block diagram based on the controller of platform of the platform of printed circuit board (PCB).
Fig. 8 B is that according to another embodiment of the invention employing is based on the block diagram based on the controller of platform of the platform of printed circuit board (PCB).
Fig. 8 C is employing according to an embodiment of the invention based on the block diagram based on the controller of platform of the platform of bottom (substrate).
Fig. 9 is the flow chart of production according to an embodiment of the invention based on the controller of platform.
Embodiment
Though the present invention will combine following examples to set forth, being interpreted as this is not to mean the present invention is defined in these embodiment.On the contrary, the present invention is intended to contain defined various options in the spirit and scope of the invention that is defined by the appended claim item, can revises item and equivalents.
In addition, in following detailed description of the present invention, understand completely, illustrated a large amount of details in order to provide to of the present invention.Yet it will be understood by those skilled in the art that does not have these details, and the present invention can implement equally.In some other instances, describe in detail for scheme, flow process, element and the circuit of known, so that highlight the present invention's purport.
Embodiments of the invention provide a kind of power-supply system, for example, and inverter system.Power-supply system comprises the controller based on platform; A plurality of chips (for example; The chip of integrated control circuit or the integrated chip of switch) and other discrete elements (the for example resistance of feedback circuit, electric capacity and diode) be installed on the platform; For example, based on the platform of printed circuit board (PCB) or based on the platform of bottom.The flexibility of power-supply system is strengthened.In addition, the controller based on platform is installed on the printed circuit board (PCB) with littler volume with more element (for example, resonant tank).Because based on the controller resonant loop of platform all with the through hole technical compatibility, so can omit surface installation technique.In addition, because the element of power-supply system need not to bear excessive flowing back to (reflow) and welding process, the reliability of power-supply system is improved.
Fig. 3 is the load of giving according to an embodiment of the invention, for example, and cold cathode fluorescent lamp pipe (cold cathode fluorescent lamp; CCFL) inverter system 300 of power supply.In the example of Fig. 3, inverter system 300 comprises control circuit 310 and DC-AC power-supply converter 304.DC-AC power-supply converter 304 comprises switching circuit 302, resonant tank 330, feedback circuit 320 and light source 308 (for example, CCFL).Inverter system 300 is converted to alternating voltage to give light source 308 power supplies with direct voltage.Switching circuit 302 comprises one or more switches.Switching circuit 302 is used to provide AC signal to resonant tank 330.Resonant tank 330 comprises transformer and electric capacity.Resonant tank 330 receives from the AC signal of switching circuit 302 and produces AC signal that voltage raises to give light source 308 power supplies.
Be coupling in feedback circuit 320 between light source 308 and the control circuit 310 and be used to monitor the electric condition of load, for example, the electric current of light source 308 and/or voltage, and send feedback signal to the control circuit 310 of expression electric condition.Feedback circuit 320 is the non-expectation or the improper mistake of detection light source 308 also, and for example, overvoltage, overcurrent, short circuit and open circuit are with protection starting.Control circuit 310 receives the feedback signal of self-feedback ciucuit 320, and supplies with the electric energy of light source 308 with control according to the switch of feedback signal control switch circuit 302.Control circuit 310 can comprise the element of control integrated circuit and other related application.Switching circuit 302 can be half-bridge structure, full bridge structure etc.310 conductings of switch Be Controlled circuit or shutoff in the switching circuit 302.
Fig. 4 is the load of giving according to an embodiment of the invention, for example, and light-emitting diode (light-emitting diode; LED) power-supply system 400 of power supply.Because LED can directly be supplied power by direct current, power-supply system 400 does not need resonant tank.
In the example of Fig. 4, power-supply system 400 comprises control circuit 410, DC-to-dc converter 402, feedback circuit 420 and one or more LED 408.Feedback circuit 420 is used to monitor the electric condition of LED408, for example, and the electric current of LED 408 and/or voltage, and feedback signal to the control circuit 410 of the electric condition of transmission expression LED 408.Feedback circuit 420 also detects non-expectation or the improper mistake of LED 408, and for example, overvoltage, overcurrent, short circuit and open circuit are with protection starting.Control circuit 410 receives the feedback signal of self-feedback ciucuit 420, and correspondingly controls one or more switches in the DC-to-dc converter 402 are supplied with LED 408 with control electric energy.
Fig. 5 is the structure 500 based on platform according to an embodiment of the invention.In conjunction with Fig. 3 and Fig. 4 Fig. 5 is described.Structure 500 based on platform can be used in inverter system 300 or the power-supply system 400.Yet the present invention is not limited only to this, also is applicable to other power-supply systems or electronic system in scope of the present invention based on the structure 500 of platform.
As shown in Figure 5, a plurality of chips, for example platform 560 is directly installed and be electrically connected to chip 502,504 and 506, for example, based on the platform of printed circuit board (PCB) or based on the platform of bottom (substrate).Platform based on printed circuit board (PCB) can be the printed circuit board (PCB) of industrial standard, and one or more chips are directly installed on this printed circuit board (PCB).Platform based on bottom can be bottom, for example pottery, glass ceramics or flexible bottom layer, and one or more chips are directly installed on this bottom.For platform based on printed circuit board (PCB), discrete elements 540, for example, resistance, electric capacity and diode also can be directly installed on the platform.For platform based on bottom, discrete elements 540, for example resistance, electric capacity and diode can be embedded into platform, for example, are embedded into bottom.
For instance, for the inverter system among Fig. 3 300, chip 502 is integrated control circuit 310, chip 504 is integrated first switch, the MOSFET in the switching circuit 302 for example, chip 506 is integrated second switch, the for example MOSFET in the switching circuit 302.In one embodiment, each switch in the switching circuit 302 is integrated in the chip.Other discrete elements for example, come resistance, electric capacity and the diode of self-feedback ciucuit 320, also can be installed on the platform or the embedding platform.Advantageously, control circuit 310, feedback circuit 320 and switching circuit 302 are integrated on the same platform to constitute the controller based on platform.
Similar, for the power-supply system among Fig. 4 400, chip 502 can integral control circuit 410, and chip 504 can integrated first switch, the MOSFET in the power supply changeover device 402 for example, chip 506 integrated second switches, the for example MOSFET in the power supply changeover device 402.Each switch in the power supply changeover device 402 is integrated in the chip.Other discrete elements for example, come resistance, electric capacity and the diode of self-feedback ciucuit 420 or power supply changeover device 402, also can be installed on the platform or the embedding platform.Advantageously, control circuit 410, feedback circuit 420 and power supply changeover device 402 are integrated on the same platform to constitute the controller based on platform.
Advantageously, through on platform, for example based on the platform of printed circuit board (PCB) or based on the platform of bottom, additional a plurality of chips (for example, the chip of integrated control circuit and the integrated chip of switch) have a plurality of advantages.The first, the flexibility that has improved power-supply system.For example, if need design control circuit again to realize new function, the chip that can replace control circuit integrated but constant moving platform.In order to support the application of different capacity grade, the chip of integrated switch element can be replaced and adjusted in welding (bonding) stage based on client's demand.In other words, different applicable cases can be suitable for well,, different demands can be realized through replacing one or more chips based on the controller of platform, and constant moving platform.
The second, because can being integrated into one, control circuit, switch and feedback circuit compare with structure with traditional structure based on integrated circuit based on chip independently based on the controller of platform, integrated level is higher.In one embodiment, compatible mutually based on the controller of platform with the through hole technology.
Get back to Fig. 5,,, can be installed on the printed circuit board (PCB) 550 with other customized elements 570 (for example, resonant tank 330) based on the controller of platform through assembling process 560 in case be designed and produce based on the controller of platform.Because integrated level has increased, with traditional structure based on chip with compare based on the printed circuit board (PCB) in the structure of integrated circuit, the area of printed circuit board (PCB) 550 is littler, thereby cost is reduced.
Like this, finished product for example, has assembled controller and other elements based on platform, is transported to the client.Perhaps, be transported to the client based on the controller of platform, the client can be further on printed circuit board (PCB) assembling based on the controller and other customized elements (for example, resonant tank) of platform.
Advantageously because based on the controller of platform can with the through hole technical compatibility, the client can be in themselves system/product, for example, display system, LCD TV or notebook computer will use as through hole equipment based on the controller of platform.In addition, based on the controller of platform and the compatible mutually production procedure (for example, the client can use the production line of only supporting the through hole technology) that can simplify the client of through hole technology.The surface-assembled process can be omitted.In addition, because power-supply system need not born excessive flowing back to and welding process, the reliability of power-supply system is improved.
For example, in Fig. 6, the controller 610 based on platform of integrated control circuit 310, feedback circuit 320 and switching circuit 302 is used to change direct current to alternating current.In the controller 610 based on platform, platform directly installed and be electrically connected to microchip (microchip) or chip can, for example, and based on the platform of printed circuit board (PCB) or based on the platform of bottom.Advantageously, the controller 610 resonant loops 330 based on platform in the inverter system 600 are assembled on the printed circuit board (PCB) to give load 308 power supplies.The gross area of printed circuit board (PCB) reduces.Because based on the controller 610 resonant loops 330 of platform all with the through hole technical compatibility, the surface-assembled process can be omitted.In addition, because the printed circuit board (PCB) that has assembled based on the controller 610 resonant loops 330 of platform need not bear excessive flowing back to and welding process, the reliability of inverter system 600 is improved.
Fig. 7 is a power-supply system 700 according to an embodiment of the invention.Similar, in one embodiment, the control circuit 410 among Fig. 4, feedback circuit 420 and power supply changeover device 402 can be integrated into the controller 710 based on platform shown in Figure 7.Controller 710 based on platform is used to change direct current to direct current.In the controller 710 based on platform, platform is directly installed and be electrically connected to microchip or chip, for example, and based on the platform of printed circuit board (PCB) or based on the platform of bottom.In the example of Fig. 7, can directly give load 408 power supplies based on the controller 710 of platform.
The different examples of the controller that is based on platform shown in Fig. 8 A to Fig. 8 C.Structure based on the controller of platform is not limited only to the example among Fig. 8 A to Fig. 8 C.Fig. 8 A is the controller 800A based on platform of employing according to an embodiment of the invention based on the platform of printed circuit board (PCB).Controller 800A based on platform comprises chip 502,504 and 506, the platform 560A based on printed circuit board (PCB), through-hole pins 840 and 842.Control circuit can be integrated in the chip 502.First switch, for example, MOSFET can be integrated in the chip 504.Second switch, for example, MOSFET can be integrated in the chip 506.For the sake of clarity, Fig. 8 A does not show all chips.The platform 560A based on printed circuit board (PCB) can directly installed and be electrically connected to chip.In addition, comprise discrete elements, for example, the feedback circuit of resistance, electric capacity and/or diode also can be directly installed on the platform 560A based on printed circuit board (PCB).
Fig. 8 B is that according to another embodiment of the invention employing is based on the controller 800B based on platform of the platform of printed circuit board (PCB).Fig. 8 B has similar function with the identical part of Fig. 8 A label.Except the place-exchange of chip and feedback circuit, Fig. 8 B is similar with Fig. 8 A.
Fig. 8 C is the controller 800C based on platform of employing according to an embodiment of the invention based on the platform of bottom.Has similar function with Fig. 8 A with the identical part of Fig. 8 B label among Fig. 8 C.In the example of Fig. 8 C, the platform 560B based on bottom is directly installed and be electrically connected to chip.Comprise discrete elements, for example the feedback circuit of resistance, electric capacity and/or diode is embedded into the platform 560 based on bottom.
Fig. 9 is the flow chart 900 of production according to an embodiment of the invention based on the controller of platform.In conjunction with Fig. 8 A, Fig. 8 B and Fig. 8 C Fig. 9 is described.In step 902, prepare and form platform.With the multiple encapsulation standard and the method for through hole technical compatibility, for example dual in-line package (dual in-line package) can be used to the controller based on platform of the present invention.The particular type of encapsulation can be selected according to user's request.In one embodiment; Dual in-line package, for example plastics dual in-line package (plastic dual in-line package), ceramic dual in-line package (ceramic dual in-line package) and dwindle plastics dual in-line package (shrink plastic dual in-line package) and can be used to encapsulate controller based on platform.
When preparing platform, confirm the size (package dimension) of encapsulation.In one embodiment, the user confirms the encapsulation with the through hole technical compatibility.Therefore, the size of encapsulation is confirmed in the encapsulation of selecting based on the user.Like this, confirm the dimensional parameters of platform (based on the platform of printed circuit board (PCB) or based on the platform of bottom), for example the height of platform, length, lead-in wire (lead) thickness, wire widths and wire length etc. based on the controller of platform.If use dual in-line package, confirm dimensional parameters according to the standard of dual in-line package.
Next step, the configuration of employing configuration (layout) tool making platform.Can adopt other configuration technology, for example thermal conductance through hole and thermal conductance track (thermal trace) also strengthen the performance based on the controller of platform to reduce power consumption.If platform is the platform based on bottom, some discrete elements, resistance, electric capacity and the diode in the feedback circuit 320 for example is with the platform that is embedded into based on bottom.After platform is produced, platform is monitored, to carry out quality control.
In step 904, chip is added or is installed on the platform or the platform based on bottom based on printed circuit board (PCB).As what describe in the step 902, if platform is the platform based on bottom, the discrete elements in the feedback circuit is structured in the platform.Yet, if platform is the platform based on printed circuit board (PCB), in step 904, discrete elements, for example resistance, electric capacity and the diode in the feedback circuit 320 added or is installed on the platform based on printed circuit board (PCB).
In one embodiment, confirm welding region with the chip of prepare control circuit and switch.Chip viscose (attach adhesive) is applied on the platform or the platform based on bottom based on printed circuit board (PCB).Through the chip viscose, the chip of the chip of integrated control circuit and integrated switch can be additional or be installed on the platform or the platform based on bottom based on printed circuit board (PCB) by respectively.It can be configuration (dispensing), mould printing (stencil printing) or pin type transfer technique (pin transfer) etc. that viscose is used.Can use solidification process (curing process) (for example being exposed in heat or the ultraviolet ray) so that viscose obtains its final machinery, heat and electrical characteristic.
In step 906, accomplish the connection between platform and the chip/element in the wire bond stage.Connection between the chip also is done.For example, can adopt weldering of hot ultrasonic gold or copper ball or ultrasonic aluminium wedge bonding (wedge bounding) with the connection chip with based on the platform of printed circuit board (PCB) or based on the line between the platform of bottom.
In step 908, chip and welding wire can be packed to protect them not receive the influence (moulding) of machinery and chemistry.Can be through accomplishing encapsulation at the surface arrangement liquid lapping of chip and line (wires) or through transfer formation (transferring molding).In addition, through-hole pins is installed on the controller based on platform.
In step 910, test to filter out defective parts.Advantageously, in one embodiment, based on the size of the controller of platform can with the size compatibility of dual in-line package.So, can adopt the controller of the testing equipment test of existing dual in-line package based on platform.
Like this, the controller based on platform can be designed and produce according to user's request.Production process based on the controller of platform is transparent to the user, and it possibly comprise dust-free sterile chamber 100K (there is controlled pollution level in a clean room, and this degree is embodied by every cubic metre amounts of particles in a certain size space).
Accordingly, embodiments of the invention provide a kind of controller based on platform that can be applicable to power-supply system (for example, inverter system).Though embodiment describes with the electric power system of light source, the present invention is not limited only to this and can be used to various types of power-supply systems.Advantage of the present invention include but not limited to, the minimizing of raising, area and the cost of design and application flexibility and the raising of system reliability.
Preceding text embodiment and accompanying drawing are merely the present invention's embodiment commonly used.Obviously, under the prerequisite that does not break away from the present invention's spirit that the appended claim book defined and protection range, can have and variously augment, revise and replace.It should be appreciated by those skilled in the art that the present invention can change not deviating under the prerequisite of inventing criterion aspect form, structure, layout, ratio, material, element, assembly and other according to concrete environment and job requirement to some extent in practical application.Therefore, only be illustrative rather than definitive thereof at the embodiment of this disclosure, the present invention's scope is defined by appended claim and legal equivalents thereof, and is not limited thereto preceding description.
Claims (7)
1. a power-supply system is characterized in that, this power-supply system comprises:
Switching circuit, this switching circuit provide first AC signal and comprise first switch and second switch;
Resonant tank is coupled to said switching circuit, is used to receive said first AC signal and produces second AC signal with powering load;
Feedback circuit is coupled to said load, is used to monitor the electric condition of said load and feedback signal is provided; And
Control circuit is coupled to said switching circuit, and being used for controlling said switching circuit according to said feedback signal provides the electric energy to said load with control,
Wherein, Said control circuit is integrated in first chip; Said first switch is integrated in second chip; Said second switch is integrated in the 3rd chip, and platform is directly installed and be electrically connected to said first chip, said second chip and said the 3rd chip, and said switching circuit, said feedback circuit and said control circuit are integrated into one independently based on the controller of said platform; Said controller and said resonant tank based on platform all has the encapsulation with the through hole technical compatibility, and said controller and said resonant tank based on platform is installed on the printed circuit board (PCB).
2. power-supply system according to claim 1 is characterized in that said platform comprises the platform based on printed circuit board (PCB).
3. power-supply system according to claim 2 is characterized in that, said feedback circuit comprises one group of discrete elements, and said discrete elements is installed on the said platform based on printed circuit board (PCB).
4. power-supply system according to claim 1 is characterized in that said platform comprises the platform based on bottom.
5. power-supply system according to claim 4 is characterized in that, said feedback circuit comprises one group of discrete elements, and said discrete elements embeds said platform based on bottom.
6. power-supply system according to claim 1 is characterized in that said load comprises the cold cathode fluorescent lamp pipe.
7. power-supply system according to claim 1 is characterized in that said resonant tank comprises the transformer that is used to produce said second AC signal.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17027409P | 2009-04-17 | 2009-04-17 | |
| US61/170,274 | 2009-04-17 | ||
| US12/757,239 US8456101B2 (en) | 2009-04-17 | 2010-04-09 | Power systems with platform-based controllers |
| US12/757,239 | 2010-04-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101867311A CN101867311A (en) | 2010-10-20 |
| CN101867311B true CN101867311B (en) | 2012-03-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010101647203A Expired - Fee Related CN101867311B (en) | 2009-04-17 | 2010-04-16 | Power system |
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| EP1040554A1 (en) * | 1997-12-18 | 2000-10-04 | Sarnoff Corporation | Miniature power supply |
| JP2000245170A (en) * | 1999-02-22 | 2000-09-08 | Hitachi Ltd | Semiconductor module, power conversion device using the same and manufacture thereof |
| CN1306385A (en) * | 2000-01-19 | 2001-08-01 | Lg电子株式会社 | Single module system for electrical and electronic device |
| CN1384590A (en) * | 2001-04-26 | 2002-12-11 | 蒂科电子公司 | Power sourc system for microprocessor |
| CN1356764A (en) * | 2001-12-28 | 2002-07-03 | 西安交通大学 | Process for preparing integrated electric and electronic module based on discrete elements |
| JP2007318954A (en) * | 2006-05-29 | 2007-12-06 | Fuji Electric Device Technology Co Ltd | Micro dc-dc converter module |
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| CN101867311A (en) | 2010-10-20 |
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