CN101861635A - Capacitive switch module - Google Patents
Capacitive switch module Download PDFInfo
- Publication number
- CN101861635A CN101861635A CN200880112926A CN200880112926A CN101861635A CN 101861635 A CN101861635 A CN 101861635A CN 200880112926 A CN200880112926 A CN 200880112926A CN 200880112926 A CN200880112926 A CN 200880112926A CN 101861635 A CN101861635 A CN 101861635A
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- China
- Prior art keywords
- switch module
- capacitive switch
- chip
- capacitance sensor
- pin
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H3/00—Mechanisms for operating contacts
- H01H3/60—Mechanical arrangements for preventing or damping vibration or shock
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
- H01H2036/0093—Micromechanical switches actuated by a change of the magnetic field
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2239/00—Miscellaneous
- H01H2239/03—Avoiding erroneous switching
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/96015—Constructional details for touch switches
- H03K2217/96023—Details of electro-mechanic connections between different elements, e.g.: sensing plate and integrated circuit containing electronics
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960755—Constructional details of capacitive touch and proximity switches
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960785—Capacitive touch switches with illumination
- H03K2217/96079—Capacitive touch switches with illumination using a single or more light guides
Abstract
A capacitive switch module is disclosed, which is capable of achieving simplification of fabricating process and miniaturization, preventing deterioration of sensitivity and reducing the possibility of malfunction, and further capable of reducing inferior goods caused by impacts applied during the transportation. The most distinctive feature of the capacitive switch module according to the present invention is in an integrated structure of a metal plate serving as a sensing electrode, a base serving as a bracket, and a capacitive sensor IC chip. Also, a lower cover capable of relieving an impact applied from a lower part to the capacitive sensor IC chip is optionally mounted.
Description
Technical field
The present invention relates to a kind of capacitive switch module, and be particularly related to a kind of like this capacitive switch module, it can be realized the simplification of preparation process and miniaturization, avoids sensitivity deterioration and reduces the possibility that fault takes place, and can also reduce because of the substandard products that collision caused in the process of transporting.
Background technology
Recently, along with the increasing mobile device such as mobile phone adopts touch sensor, the universal popularity degree of this type of mobile device increases severely in surprising mode.Because the widespread usage of touch sensor in mobile device market, as the market of the assembly capacitive switch module partly of touch sensor also thereby grow up, and it is used and is not restricted to household appliance technical field.With traditional mechanical switch system in comparison, capacitance switch has its many-sided advantage, comprises vision design, good structure, semipermanent life-span, durability etc.Active along with capacitance switch market, also grow up in the market of capacitive switch module thereupon, and the consumer also has growth for the technical demand of capacitive switch module.For the requirement of answering capacitance sensor integrated circuit (IC) consumer improves the convenience and the reliability of product, need to realize modularization.Yet,, therefore must drop into a large amount of time and cost for modularization because it need comprise surface mounted device (SMD) technology of other additional technique and various parts.
More specifically, traditional modularization has comprised following process: printed circuit board (PCB) (PCB) SMD of (1) touch sensor IC and RC parts, (2) insert the pin that power supply and signal are exported, (3) molding of the plastic covered of touch sensor IC outside and touch sensor IC, and (4) insert frame and liner.Herein, needed parts have comprised touch sensor IC and RC parts, pin, vinyl cover and frame.To client's supply part (herein by the manufacturer of touch sensor parts, the client is corresponding to such as the final manufacturer of the product of mobile phone) and this client utilize the touch sensor parts to make in the situation of final products, said process must both carry out respectively by touch sensor component manufacturer and final products manufacturer.Especially, the plant of framework should be carried out by final products manufacturer.Therefore, processing time that is increased and cost are just by in addition in final products manufacturer (corresponding to the client).
Be head it off, the touch sensor component manufacturer be just by will being applied to the capacitive switch moduleization in the touch sensor, and make great efforts to be final products manufacturer saving processing time and manufacturing cost.The capacitive switch module that mode developed example is disclosed in the Korean patent registration No. 528680 according to this.
Fig. 1 is the decomposition diagram of the capacitance sensing switch that disclosed in the Korean patent registration No. 528680.With reference to figure 1, though wherein do not show, but be used to respond to according to contact the bottom surface that the capacitance sensor IC that changes and active and passive component are installed in PCB 20 with human body, constituted capacitance sensing switch 10, these parts and a plurality of inputs and output 23a, 23b and 23C are connected.Be formed at the upper surface of PCB20 by the sensing surface 21 of conductor composition.In addition, on the upper surface of PCB20, one or more light-emitting diodes (LED) 25 are installed, are used to the user luminous, with the mode of operation of identification capacitance sensing switch 10.The PCB20 of above-mentioned structure is installed in the shell 50 of upward opening.The diffusion epoxy material (not shown) filling that the light that LED 25 is produced evenly spreads is in the top of PCB 20.In addition, sensing plate 60 has the housing form, and its opening and is formed with the light-emitting area 62 of tool light transmission thereon on the surface down.A plurality of fixtures 61 are formed at the lower end of sensing plate 60, so that sensing plate 60 is fixed on the PCB 20.Corresponding to fixture 61, a plurality of installing holes 26 are formed on the PCB 20.According to this kind structure, sensing plate 60 can insert in the installing hole 26 of PCB 20 by the fixture 61 with sensing plate 60, and fixture 61 is electrically connected with PCB 20 with installing hole 26 (for example, by welding) fastened to each other.
In addition, the capacitance sensing switch module of the above-mentioned structure of tool has some following shortcoming.At first, if between the lid of sensing plate 60 and the product that adopts this capacitance sensing switch module, have the space, then owing to the air gap, sensitivity meeting deterioration, thereby cause the possibility that breaks down.
Secondly, the capacitance sensing switch module is collided by some may during it transports.When PCB 20 is installed on the shell 50 with globality structure and by the epoxy resin (not shown) fixedly the time, outside collision may directly put on the fragile electronic component such as sensing IC, active and passive component that is installed on the PCB 20.In such cases, though, when this capacitance sensing switch module can really be used, just may cause substandard products after the process of transporting with the normal condition manufacturing.
The 3rd, because comprised touch sensor IC, required component active and passive component is installed on the PCB 20 all separatedly, therefore must carry out pin insertion process and epoxy molding process, thereby make that whole manufacturing process is complicated, and thereby make the microminiaturization of element become difficult.
Summary of the invention
Technical problem
Therefore, the present invention is conceived to the problems referred to above, and one object of the present invention is to provide a kind of capacitive switch module, even at the sensing plate of capacitive switch module and use between the lid of product of this capacitive switch module and have the space, it also can prevent the deterioration of sensitivity that causes because of the air gap and the generation of fault.
Another object of the present invention is to provide a kind of capacitive switch module, it can reduce because of colliding the substandard products that caused in the outside that is applied thereto during transporting.
Another purpose of the present invention is to provide a kind of capacitive switch module, and it can simplify preparation technology by omitting pin insertion process and molding process, and realizes its compact size.Technical scheme
According to one aspect of the present invention, can realize above-mentioned and other purpose by a kind of capacitive switch module is provided, this capacitive switch module comprises: pedestal, form housing, described housing has the space of hollow and opens towards its upside and downside; Capacitance sensor IC chip, form by molded, thereby comprise integratedly being used for sensor IC, active element, passive component, signal input pin and signal output pin that electric capacity is responded to that described capacitance sensor IC chip is contained in the space of described hollow of described pedestal; And metallic plate, be installed on the top of described capacitance sensor IC chip, and be electrically connected with the signal input pin of described capacitance sensor IC chip, thereby as sensor ends.
Preferably, this capacitive switch module also can comprise lower cover, and lower cover is connected to described pedestal, and supports the bottom of described capacitance sensor IC chip, thereby can remain in the predetermined gap mobile with respect to described pedestal.
This capacitive switch module also can comprise mounting panel, and mounting panel is crossed over the space level of the hollow of described pedestal and installed, and wherein said metallic plate is positioned on the described mounting panel.
Conductive pads can be installed as with the upper surface of described metallic plate and contact, transfer to described metallic plate will touch input signal.Herein, conductive pads is preferably made by elastomeric material.
This capacitive switch module also can comprise a plurality of extension protuberances, is extended by the bottom of described pedestal.
One in described lower cover and the described pedestal has the protuberance of connection, and another has the depression that forms along a vertical direction, to be used for and the described protuberance that is connected engages.
This capacitive switch module also can comprise insulating tape, and insulating tape places between described metallic plate and the described conductive pads, thereby strengthens ESD and to the meticulous adjustment of sensitivity.Herein, described insulating tape can be the form of double-stick tape.
Beneficial effect
As mentioned above, the capacitive switch module according to embodiment of the present invention can save the framework insertion process that has put on final products manufacturer (that is the client of capacitive switch module).In addition, the preparation technology who produces the sensor element manufacturer of capacitive switch module is also simplified.Also that is to say that the preparation technology of simplification is favourable to manufacturer and client both.More particularly, because as the metallic plate of sensing electrode, constitute as the pedestal and the capacitance sensor IC chip one of framework, so can simplify preparation technology and structure to a great extent, thereby increased the market acceptance.Moreover, by being that sensor element manufacturer and client realize the miniaturization of products and simplify technology, can satisfy more clients' demand.At this, the simplification of technology not only means the improvement of technology, and also meaning can be by saving many less important technologies that comprise external resource and manual work, and makes the manufacturing machineization and the automation of capacitive switch module.Therefore, in addition, microminiaturized product allows more substantial design, and allows to enter more new various industrial fields.
Recently, IC industry and other industrial field become more competitive.Although thereby have the more continuous competition of low price, the client then requires increasing technological innovation.Really possessed competitiveness according to capacitive switch module of the present invention, with structure and technology and the last more convenient various demands that satisfy the client of use by its lower price, simplification.In addition, microminiaturization helps to enter various markets.
In addition, according to the present invention, can prevent the capacitive switch module deterioration of sensitivity, thereby reduce failure rate.In addition, can prevent the substandard products that collide generation by the outside.
Description of drawings
Thereby will being described in conjunction with the accompanying drawings, above-mentioned and other purpose of the present invention, feature and other advantage be easier to understanding: wherein
Fig. 1 is the decomposition diagram of the traditional capacitance sensitive switch that disclosed in the Korean patent registration No. 528680;
Fig. 2 is the decomposition diagram according to the capacitive switch module of first embodiment of the invention; And
Fig. 3 is the decomposition diagram according to the capacitive switch module of second embodiment of the invention.
Embodiment
Describe illustrative embodiments of the present invention in detail below with reference to accompanying drawing.In the following description, because in institute's drawings attached, identical label is represented components identical, so the explanation of similar elements will not repeat.
Fig. 2 is the decomposition diagram according to the capacitive switch module of first embodiment of the invention.With reference to figure 2, in the prior art as the substrate 140 of framework for upwards and to the hollow cube housing form of under shed.Mounting panel 144 levels are installed in the hollow space of pedestal 140.Be formed with depression on two relative edges in mounting panel 144 four edges, thereby formed the notch 143 that can pass jointly with the inwall of pedestal 140.The prodger 132 of metallic plate 130 with sensing electrode is by the notch 143 that can pass and be fixed.Therefore, metallic plate 130 is installed as and places on the mounting panel 144.Capacitance sensor integrated circuit (IC) chip 150 inserts in the lower space of pedestal 140 with respect to mounting panel 144.At this, the prodger 132 of metallic plate 130 is electrically connected with the input pin of capacitance sensor IC chip 150.According to this execution mode, capacitance sensor IC chip 150 is realized by the dual row package that comprises 8 pins (DIP) IC chip, its 8 pins comprise, for example, voltage supply (VDD) pin, ground connection (GND) pin, output pin, the sensitivity adjustment pin, and by four input pins 155 of brachymemma to be used for effectively contacting with the prodger of metallic plate.But, the present invention is not limited to this execution mode.When capacitance sensor IC chip 150 is mounted and is fixed in metallic plate 130, four input pins 155 be electrically connected towards input pin 155 prodgers 132 that extend, metallic plate 130.Because capacitance sensor IC chip 150 by molded sensor IC, active element, passive component and the signal input and output pin of having comprised integratedly, therefore can save the pin insertion process and the epoxy molding process of having been undertaken by traditional approach.Therefore, whole preparation process is simplified, and the reduction of component size is achieved.Simultaneously, a plurality of extension protuberances 149 are extended by the bottom of pedestal 140.At this, extension protuberance 149 has the essentially identical length of lead-in wire with capacitance sensor IC chip 150.Therefore, when the capacitive switch module of foundation embodiment of the present invention is applied to product and is inserted in the printed circuit board (PCB) (PCB), combining and can before welding lead, be enhanced between capacitive switch module and the PCB, thereby promoted user's convenience.In addition,, lower cover 160 is installed, with encapsulation capacitance sensor IC chip 150 in the bottom of capacitance sensor IC chip 150.Be respectively arranged with connector 162 on two relative limits in lower cover 160 four edges.Vertically form notch 164 at each connector 162 place, so that the locking protuberance 148 that forms is hooked in the notch 164 on the outer wall of pedestal 140.The connector 162 of lower cover 160 has and the guiding that forms on the outer wall of the pedestal 140 146 corresponding shapes that cave in.According to accompanying drawing, chamfering is carried out in the bottom 166 of lower cover 160, so that the lead-in wire of capacitance sensor IC chip 150 by chamfering partly.Yet lower cover 160 of the present invention is not limited to this kind structure, its depend on capacitance sensor IC chip 150 lead-in wire the position and can have other various types of bottoms 166.Herein, the notch 164 that is formed on the connector 162 is slightly longer than locking protuberance 148.With this kind structure, even along the bottom 166 of lower cover 160 being applied collision towards the direction of capacitance sensor IC chip 150, owing to lower cover 160 moves the little gap of keeping with respect to pedestal 140, so collision can be absorbed in the gap and directly is not sent on the capacitance sensor IC chip 150.So, can alleviate during transporting collision to capacitive switch module applied.
In addition, conductive pads 110 is installed in the inner space 142 of pedestal 140 on the metallic plate 130, is delivered to metallic plate 130 as the sensing electrode cap safely will touch input signal.In view of the above, even have the air gap between the enclosing cover of the metallic plate 130 of capacitive switch module and product, metallic plate 130 still can closely contact mutually with enclosing cover, thereby avoids the deterioration of sensitivity and the fault that can be caused by the air gap.Conductive pads 110 can be made by elastomeric material, for example, and by being dispersed in such as the conductive particles of carbon black on the rubber to have the conductive rubber that conductivity forms.Generally speaking, the installation of liner is carried out by the client who is provided with capacitive switch module.Therefore, according to embodiments of the present invention, by having saved the installation process of liner, client's satisfaction can significantly promote.
Alternatively, insulating tape 120 can place between metallic plate 130 and the conductive pads 110.The major function of insulating tape 120 is to improve ESD (static discharge), and is independent of the sensitivity adjustment pin in the capacitance sensor IC chip 150, and insulating tape 120 can be used for adjusting subtly sensitivity by adjusting its thickness.At insulating tape 120 is under the situation of two-sided adhesive tape form, can strengthen combining between metallic plate 130 and the conductive pads 110.
Therefore, according to embodiments of the present invention, because the metallic plate 130 with electrode cap function also as sensor ends, therefore need not special-purpose sensing electrode.In addition, pedestal 140 is by integrally formed with metallic plate 130 and capacitance sensor IC chip 150, and the required framework of conduct guiding capacitive switch module of the prior art.In traditional capacitive switch module, be formed on the blank PCB as the parts of electrode cap.Yet, according to embodiments of the present invention, by conductive plates 130 being arranged at the top of capacitance sensor IC chip 150, and metallic plate 130 is electrically connected to the short input pin 155 of capacitance sensor IC chip 150, and make improved capacitance sensor IC chip 150 can play the effect of sensor ends by prodger 132.
As aforementioned, traditional capacitive switch module prepares by following steps: the PCB SMD of (1) touch sensor IC and RC parts, (2) insert the pin that is used for power supply and signal output, (3) plastic covered of touch sensor IC outside and touch sensor IC's is molded, and (4) insert framework and liner.At this, required parts comprise touch sensor IC and RC parts, pin, vinyl cover and framework.Yet according to embodiments of the present invention, the main technique of conventional method and parts can be simplified.At first, can save first and second process by utilizing improved capacitance sensor IC chip 150, i.e. the PCB SMD of (1) touch sensor IC and RC parts, and (2) insert the pin that is used for power supply and signal output.In other words, owing to traditional PCB process, insert pin, covering and moldedly all finish, so do not need extra technology by the capacitance sensor IC chip 150 of application enhancements.In addition, can be by metallic plate 130, pedestal 140 and capacitance sensor IC chip 150 be configured to the 3rd and the 4th process that one realizes prior art, that is, the plastic covered of (3) touch sensor IC outside and touch sensor IC's is molded, and (4) insert framework and liner.The metallic plate of being made by conductive material 130 has also promoted capacitance sensor IC chip 150 and pedestal 140 by being connected in the upper space that is inserted into pedestal 140 and with pedestal 140 not only as the function of sensing electrode.Moreover, by being performed to alleviate collision that puts on the capacitance sensor IC chip part and the molding process that improves reliability, the hole or the hole that are formed in the pedestal 140 can be designed to help in the short input pin 155 of the middle part of IC chip 150 formation and the more effective connection between the metallic plate 130.
Fig. 3 is the decomposition diagram according to the capacitive switch module of second embodiment of the invention.Fig. 3 is compared with Fig. 2, and the maximum distinguishing characteristics of this second execution mode has been to save the lower cover that adopts in first execution mode.Can omit under the more favourable situation of lower cover at the surface texture that depends on product and consider this kind structure.In view of the above, among Fig. 2 passed notch 143, guiding depression 146 and the locking protuberance 148 that must be provided with all be not shown among Fig. 3.Therefore, according to second execution mode shown in Figure 3, mounting panel 144 need be set at relatively low position.And, the through hole 200 that is formed for making the pin of capacitance sensor IC chip 150 to pass in four corners of mounting panel 144.
Though below disclose preferred implementation of the present invention for the purpose of example, but obviously under the situation that does not deviate from scope and spirit of the present invention, those skilled in the art can carry out various modifications, interpolation and replacement, and still are in the scope of claim.
Claims (11)
1. capacitive switch module comprises:
Pedestal forms housing, and described housing has the space of hollow and opens towards its upside and downside;
Capacitance sensor IC chip, form by molded, thereby comprise integratedly being used for sensor IC, active element, passive component, signal input pin and signal output pin that electric capacity is responded to that described capacitance sensor IC chip is contained in the space of described hollow of described pedestal; And
Metallic plate is installed on the top of described capacitance sensor IC chip, and is electrically connected with the signal input pin of described capacitance sensor IC chip, thereby as sensor ends.
2. capacitive switch module as claimed in claim 1 further comprises:
Lower cover is connected to described pedestal, and supports the bottom of described capacitance sensor IC chip, thereby can remain in the predetermined gap mobile with respect to described pedestal.
3. capacitive switch module as claimed in claim 1 further comprises:
Mounting panel is crossed over the space level of the hollow of described pedestal and is installed, and wherein said metallic plate is positioned on the described mounting panel.
4. capacitive switch module as claimed in claim 1 wherein is installed as conductive pads with the upper surface of described metallic plate and contacts, and transfers to described metallic plate will touch input signal.
5. capacitive switch module as claimed in claim 4, wherein said conductive pads is made by elastomeric material.
6. capacitive switch module as claimed in claim 1 further comprises:
A plurality of extension protuberances are extended by the bottom of described pedestal.
7. one in the capacitive switch module as claimed in claim 1, wherein said lower cover and described pedestal has the protuberance of connection, and another has the depression that forms along a vertical direction, to be used for and the described protuberance that is connected engages.
8. capacitive switch module as claimed in claim 4 further comprises:
Insulating tape places between described metallic plate and the described conductive pads, thereby strengthens ESD and to the meticulous adjustment of sensitivity.
9. capacitive switch module as claimed in claim 8, wherein said insulating tape are the form of double-stick tape.
10. capacitive switch module as claimed in claim 1, wherein said metallic plate comprises prodger, described prodger extends and is electrically connected to the input pin of described capacitance sensor IC chip towards the input pin of described capacitance sensor IC chip.
11. capacitive switch module as claimed in claim 10, wherein said capacitance sensor IC chip is realized by 8 pin dual row package (DIP) IC chips, it comprises voltage supply (VDD) pin, ground connection (GND) pin, sensitivity adjustment pin, output pin and four input pins, described four input pins are by brachymemma, effectively contact with the prodger of described metallic plate being used for.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070106756A KR100952905B1 (en) | 2007-10-23 | 2007-10-23 | Capacitive switch module |
| KR10-2007-0106756 | 2007-10-23 | ||
| PCT/KR2008/003640 WO2009054592A1 (en) | 2007-10-23 | 2008-06-25 | Capacitive switch module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101861635A true CN101861635A (en) | 2010-10-13 |
| CN101861635B CN101861635B (en) | 2013-02-13 |
Family
ID=40579677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801129262A Active CN101861635B (en) | 2007-10-23 | 2008-06-25 | Capacitive switch module |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100952905B1 (en) |
| CN (1) | CN101861635B (en) |
| TW (1) | TWI352504B (en) |
| WO (1) | WO2009054592A1 (en) |
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| US10038443B2 (en) | 2014-10-20 | 2018-07-31 | Ford Global Technologies, Llc | Directional proximity switch assembly |
| US9654103B2 (en) | 2015-03-18 | 2017-05-16 | Ford Global Technologies, Llc | Proximity switch assembly having haptic feedback and method |
| US9548733B2 (en) | 2015-05-20 | 2017-01-17 | Ford Global Technologies, Llc | Proximity sensor assembly having interleaved electrode configuration |
| AU2019428370A1 (en) * | 2019-02-05 | 2021-09-30 | Johnson Controls Fire Protection LP | Optical switch detector addressing solution |
| CN211180797U (en) | 2020-06-23 | 2020-08-04 | 深圳市汇顶科技股份有限公司 | Capacitance detection device and electronic apparatus |
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| DE3119495A1 (en) * | 1980-05-27 | 1982-02-25 | Playmont AG, St. Gallen | "APPROACH SWITCH" |
| CN2240808Y (en) * | 1995-08-04 | 1996-11-20 | 河北省衡水地区科学技术情报研究所 | Piezo-electric sensing contact switch |
| JPH0992107A (en) * | 1995-09-28 | 1997-04-04 | Seikosha Co Ltd | Electrostatic capacity type switch |
| CN2273922Y (en) * | 1996-07-02 | 1998-02-04 | 张思伟 | Multi-purpose electric appliance touching switch |
| ATE216541T1 (en) * | 1997-02-17 | 2002-05-15 | Ego Elektro Geraetebau Gmbh | TOUCH SWITCH WITH SENSOR BUTTON |
| JP2001057126A (en) | 1999-08-16 | 2001-02-27 | San Miyuuron:Kk | Touch switch |
| JP2004022356A (en) | 2002-06-17 | 2004-01-22 | Omron Corp | Touch switch |
| KR100699407B1 (en) * | 2004-12-14 | 2007-03-26 | 에이디반도체(주) | Capacitance switch module having light emitting device |
-
2007
- 2007-10-23 KR KR1020070106756A patent/KR100952905B1/en active IP Right Grant
-
2008
- 2008-06-24 TW TW097123488A patent/TWI352504B/en active
- 2008-06-25 WO PCT/KR2008/003640 patent/WO2009054592A1/en active Application Filing
- 2008-06-25 CN CN2008801129262A patent/CN101861635B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101771407B (en) * | 2009-01-06 | 2014-05-28 | 三星电子株式会社 | Switch assembly and air conditioner having the same |
| WO2012146130A1 (en) * | 2011-04-25 | 2012-11-01 | 机智创新股份有限公司 | Switch and method for forming same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009054592A1 (en) | 2009-04-30 |
| TW200919964A (en) | 2009-05-01 |
| CN101861635B (en) | 2013-02-13 |
| KR100952905B1 (en) | 2010-04-16 |
| KR20090041176A (en) | 2009-04-28 |
| TWI352504B (en) | 2011-11-11 |
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