CN101853316B - Display method of contact condition in thin plate punching emulation - Google Patents
Display method of contact condition in thin plate punching emulation Download PDFInfo
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- CN101853316B CN101853316B CN2010101503476A CN201010150347A CN101853316B CN 101853316 B CN101853316 B CN 101853316B CN 2010101503476 A CN2010101503476 A CN 2010101503476A CN 201010150347 A CN201010150347 A CN 201010150347A CN 101853316 B CN101853316 B CN 101853316B
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- workpiece
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- bias
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/26—Programme control arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
The invention relates to a display method of the actual contact condition in thin plate punching emulation. Through the lattices and the thickness of a work piece, the method of the invention obtains the upper surface lattices and the lower surface lattices of the work piece through polarization. Through the comparison on the mold lattices and the upper surface and the lower surface of the work piece, the contact range of the work piece and the mold can be displayed. A cross section line analysis method is adopted, and the contact condition of the work piece and the mold can be analyzed. The display of the contact condition of the work piece and the mold can provide more information in the aspect of the punching process to be used for handling the mold gap problem and providing the guide for the mold repair.
Description
Technical field
The invention belongs to the Metal Forming field, in the simulation analysis field of sheet stamping.Be specially the display packing of the actual contact situation in a kind of thin plate punching emulation.
Background technology
Sheet stamping forming simulation technology is comparative maturity, can predict the drawing crack in the moulding, wrinkling position accurately, and the resilience after the workpiece punching press is also had certain precision of prediction.In the industry member, widespread use impact briquetting emulation technology is carried out industrial analysis to impact briquetting, revises the technology of workpiece and replenishes, and the adjustment pressure-pad-force is through the mouldability problem of virtual die trial solution workpiece.
Along with the development and the maturation of emulation technology, sheet stamping moulding analytical technology can be used for the field of other precise forming, the area distortion problem that the surface behind the processing Workpiece shaping occurs.So-called area distortion is meant the local unstability that takes place of workpiece, trickle bulge or pit (height or the degree of depth are below 0.1mm) occur at surface of the work.The appearance of these area distortions and actual mould contact condition have much relations, but all softwares all do not demonstrate the function of workpiece contact condition at present.
Stamped workpieces has generally only been calculated middle veil lattice in the emulation, in order to reflect truth, need calculate the upper surface and the lower surface of workpiece, does not possess this function in all present simulation analysis softwares.
The present invention proposes to demonstrate the workpiece contact condition in the stamping simulation result, and is significant with the die clearance analysis to the position of rationally confirming to repair a die.This invention is used for stamping simulation software, can the more information of multiplex's skill aspect be provided for emulation person, can play the certain guidance effect to improving workpiece surface quality.
Summary of the invention
The present invention proposes and in emulation, demonstrate the method that this is a contact condition.This method is following:
(1) determines the position of workpiece upper and lower surfaces.According to unit grid, node and the thickness of plate, adopt grid node biasing algorithm to determine the position of workpiece upper and lower surfaces.Here the grid node biasing algorithm that adopts is following:
In business software, all have the profile bias capability how much, in the regular software, the geometry profile of die and punch all is to setover according to the geometry profile of workpiece to obtain.The bias capability that in business software, also has unit grid through the die grid, can obtain the die grid through normal bias.But in the document, seldom introduce the biasing algorithm of grid node.Be the grid biasing algorithm that the present invention proposes below.
The key of grid biasing algorithm is to handle the problem of biased direction and amount of bias well.
Grid node biasing algorithm is that node is setovered one by one, the grid after obtaining setovering.Same node possibly appear in a plurality of unit.To certain node on the independent unit, its biased direction is exactly its normal direction.Amount of bias is exactly the amount of bias of individual unit.To the same node of a plurality of unit, elements method is to difference, and biased direction is also different, as shown in Figure 2.In this case; There are a plurality of bias points a plurality of unit, and biased direction is the vector
of the center M of the some A before squinting and these bias points.Amount of bias is the mean value of a plurality of unit biasing amounts.
Fig. 2 is the processing that two limits are arranged, B
1, B
2Be respectively two bias points on the limit, amount of bias is distributed as D
1, D
2, M is a B
1With a B
2Mid point, obtain vectorial AM, be treated to the unit vector, the length of AB equals D
1And D
2Mean value.Can calculate the position that B is ordered like this.More limits also can be handled by same principle.
(2) in analysis result, demonstrate the actual profile of die, the actual profile of punch and workpiece surface and lower surface, from these results, can analyze workpiece and mould contact range.Adopt the penalty function Contact Algorithm to allow to penetrate in the finite element simulation, after occurring penetrating, surface of the work can be in the die surface outside, also can be in the die surface the inside.Surface of the work outside die surface can show, and the workpiece in die surface can not show, and what just occurred occurring between workpiece upper and lower surfaces shown in Fig. 3 and the mould penetrates.In fact these positions that occur penetrating are exactly the contact site.
(3) through the section line analytical approach, obtain the parting line of workpiece upper and lower surfaces, and generate a cross section.Take out the parting line of mould, can demonstrate the contact amount on the workpiece cross section.
The present invention proposes to demonstrate the workpiece contact condition in the stamping simulation result, and is significant with the die clearance analysis to the position of rationally confirming to repair a die.This aspect is used for stamping simulation software, can the more information of multiplex's skill aspect be provided for emulation person, can play the certain guidance effect to improving workpiece surface quality.
Description of drawings
Fig. 1 workpiece contacts the display packing schematic diagram with mould,
The biased direction of many limit common node of Fig. 2 and bias unit are handled,
Fig. 3 penalty function Contact Algorithm allows to penetrate,
Fig. 4 (a) the present invention implements example model emulation model,
(b) stamped workpieces unit grid and thickness distribution,
The workpiece upper and lower surfaces grid that Fig. 5 obtains through workpiece grid and thickness biasing.
The applicability of this working of an invention process and this invention of checking is described based on a real case here.Implementation process of the present invention is following:
Fig. 4 is the input data that the present invention verifies, comprises realistic model (Fig. 4 a), the work cell grid and the thickness distribution (Fig. 4 b) of employing.The biasing means that adopts the front to introduce has been developed application program, through having calculated the upper and lower surfaces grid of workpiece.Fig. 5 is the upper and lower surfaces grid that obtains workpiece through the biasing algorithm.Through the comparison of workpiece surface grid and die grid, can analyze the situation that contacts of die and workpiece.Die mainly contacts with workpiece at the die entrance position, in the workpiece bottom, the part contact is arranged also.
Through the comparison of workpiece lower surface grid and punch grid, can analyze the situation that contacts of workpiece lower surface and punch.The contact site of punch and workpiece is a lot, and workpiece and punch bottom surface major part are by contacting.
Through the section line analysis, can analyze the contact condition of workpiece and mould on the cross section.Penetrate greatly more, explain that contact force is big more.
Claims (1)
1. the display packing of the contact condition in the thin plate punching emulation is characterized in that this procedure is following:
(1) determines the position of workpiece upper and lower surfaces,, adopt grid node biasing algorithm to determine the position of workpiece upper and lower surfaces according to unit grid, node and the thickness of plate;
(2) in analysis result, demonstrate the actual profile of die, the actual profile of punch and workpiece surface and lower surface, from these results, can analyze workpiece and mould contact range;
(3) through the section line analytical approach, obtain the parting line of workpiece upper and lower surfaces, and generate a cross section, simultaneously, take out the parting line of mould, can demonstrate the contact amount on the workpiece cross section;
Grid node biasing algorithm is that node is setovered one by one, the grid after obtaining setovering; Same node possibly appear in a plurality of unit; To certain node on the independent unit, its biased direction is exactly its normal direction; Amount of bias is exactly the amount of bias of individual unit; To the same node of a plurality of unit, elements method is to difference, and biased direction is also different; There are a plurality of bias points a plurality of unit, and biased direction is the vector
of the center M of the some A before squinting and these bias points; Amount of bias is the mean value of a plurality of unit biasing amounts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101503476A CN101853316B (en) | 2010-04-20 | 2010-04-20 | Display method of contact condition in thin plate punching emulation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101503476A CN101853316B (en) | 2010-04-20 | 2010-04-20 | Display method of contact condition in thin plate punching emulation |
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| Publication Number | Publication Date |
|---|---|
| CN101853316A CN101853316A (en) | 2010-10-06 |
| CN101853316B true CN101853316B (en) | 2012-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101503476A Expired - Fee Related CN101853316B (en) | 2010-04-20 | 2010-04-20 | Display method of contact condition in thin plate punching emulation |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102672060A (en) * | 2011-03-16 | 2012-09-19 | 重庆长安汽车股份有限公司 | Method for confirming flanging trimming line on basis of panel grids |
| CN102672059B (en) * | 2011-03-16 | 2015-09-09 | 重庆长安汽车股份有限公司 | The method of mould concave-convex mold amendment profile is determined according to emulation stamped workpieces thickness |
| CN102601194B (en) * | 2012-03-16 | 2015-05-13 | 中国第一汽车股份有限公司 | Molded surface compensation method of large stamping die aiming at deflection deformation of press machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101482403A (en) * | 2009-02-19 | 2009-07-15 | 湖南大学 | Method for confirming sheet stamping member measuring point cloud position before rebound based on finite element method |
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2010
- 2010-04-20 CN CN2010101503476A patent/CN101853316B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101482403A (en) * | 2009-02-19 | 2009-07-15 | 湖南大学 | Method for confirming sheet stamping member measuring point cloud position before rebound based on finite element method |
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| CN101853316A (en) | 2010-10-06 |
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Granted publication date: 20121205 Termination date: 20140420 |