CN101848603A - Computing method of current-carrying capacity of PCB (Polychlorinated Biphenyl) copper layer - Google Patents
Computing method of current-carrying capacity of PCB (Polychlorinated Biphenyl) copper layer Download PDFInfo
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- CN101848603A CN101848603A CN 201010161526 CN201010161526A CN101848603A CN 101848603 A CN101848603 A CN 101848603A CN 201010161526 CN201010161526 CN 201010161526 CN 201010161526 A CN201010161526 A CN 201010161526A CN 101848603 A CN101848603 A CN 101848603A
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- copper layer
- pcb
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- current
- width
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 64
- 239000010949 copper Substances 0.000 title claims abstract description 64
- 238000004364 calculation method Methods 0.000 title claims abstract description 10
- 150000003071 polychlorinated biphenyls Chemical class 0.000 title 2
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000000205 computational method Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000006467 substitution reaction Methods 0.000 description 8
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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Abstract
The invention provides a computing method of current-carrying capacity of a PCB copper layer, which can accurately compute the current-carrying capacity of the PCB copper layer in consideration of factors of different current density of the PCB copper layer when in transmitting high current and low current, the difference of the conductivity of inner and outer copper layers, PCB temperature rise demands and the like by combining empirical parameters, and thereby, the accuracy and the reliability of PCB in the design stage are improved, and the PCB temperature rise satisfies standards.
Description
Technical field
The present invention relates to a kind of PCB designing technique, specifically a kind of PCB copper layer ampacity computational methods.
Background technology
In the PCB design; adopt PCB copper layer to carry out the transmission of big electric current through regular meeting; because there is internal resistance in PCB copper layer; current delivery can produce power consumption; cause that the PCB temperature rises; and the PCB temperature rise is an important indicator of assessment PCB reliability, therefore need calculate the width of PCB copper layer when design according to the size of transmission current, guarantees that the PCB temperature rise does not exceed standard.At present The common calculation methods is the identical current density of employing when PCB copper layer transmits little electric current and big electric current, think that the PCB ampacity increases with size of current is linear, and do not consider the difference of inside and outside copper layer, for example transmit the 1A electric current, use 10mil wide, the copper layer of loz can satisfy the temperature rise requirement, transmit the 100A electric current so, just should use 1000mil wide, the copper layer of loz, when just in time being 1A 100 times.But actual conditions are really not so, increase along with electric current, must adopt littler current density could satisfy PCB temperature rise requirement, and the current capacity of inside and outside copper layer also is different, when promptly transmitting the 100A electric current, and when the width of copper layer is not transmission 1A electric current 100 times, but should be wideer, inside and outside copper layer should consider respectively, otherwise can cause the PCB temperature rise to exceed standard, and reliability reduces.
At above problem, the present invention proposes a kind of PCB copper layer ampacity computational methods, considered that PCB copper layer is the big electric current of transmission current density different during with little electric current, factors such as the difference of ectonexine copper layer conductive capability and PCB temperature rise requirement, and in conjunction with empirical parameter, can accurate Calculation PCB copper layer current capacity, improve PCB in precision and the reliability of design phase, guarantee that the PCB temperature rise satisfies standard.
Summary of the invention
The purpose of this invention is to provide a kind of PCB copper layer ampacity computational methods.
The objective of the invention is to realize in the following manner, the detailed calculated process is as follows:
It is long-pending at first to calculate the copper layer cross section, and Consideration comprises the size of transmission current, the temperature rise that PCB requires and the difference of PCB ectonexine.
Wherein: S is the long-pending mil of unit of copper layer cross section
2
I needs the A of electric current transmitted unit for the copper layer
T
rThe temperature rise unit that allows for PCB ℃
K, b, c are constant
For internal layer copper layer k=0.024 b=0.44 c=0.725
For external copper layer k=0.048 b=0.44 c=0.725
Next calculates copper layer width.
Wherein: Width is the copper layer mil of width unit
S is the long-pending mil of unit of copper layer cross section
2
Thickness is the oz of copper layer thickness unit
Annotate: the PCB copper layer thickness is generally represented with oz, and oz is a unit of weight, is to be converted to dimensional units in calculating, should this need multiplication by constants 1.378 (mil/oz of unit)
Use above-mentioned two formula, needed PCB copper layer width in the time of just can the accurate Calculation transmission current.
The invention has the beneficial effects as follows: in computational process, considered that PCB copper layer is the big electric current of transmission current density different during with little electric current, factors such as the difference of ectonexine copper layer conductive capability and PCB temperature rise requirement, and in conjunction with empirical parameter, can accurate Calculation PCB copper layer current capacity, raising PCB is in precision and the reliability of design phase, and standard is satisfied in assurance PCB temperature rise.
Description of drawings
Accompanying drawing 1 is a PCB copper layer schematic diagram;
Embodiment
With reference to Figure of description to explaining below the work of the present invention.
The ampacity of PCB copper layer is relevant with its rated temperature-rise.The maximum temperaturerise of MIL STD (MIL-STDs) regulation is 10 ℃, is generally 2-3 times of this value in the commercial and industrial design.We are with the pcb board of loz, and maximum temperaturerise is an example for 30 ℃, when calculating transmission 10A and 1000A electric current respectively, and needed PCB copper layer width, inside and outside copper layer is considered respectively.
1. transmit 10A electric current, I=10A, T
r=30 ℃
For internal copper layer k=0.024 b=0.44 c=0.725
Substitution formula one obtains S=523mil
2, Thickness=loz
Substitution formula two obtains Width=378mil
For outside copper layer k=0.048 b=0.44 c=0.725
Substitution formula one obtains S=201mil
2, Thickness=loz
Substitution formula two obtains Width=145mil
T
rThe temperature rise unit that allows for PCB ℃
2. transmit 100A electric current, I=100A, T
r=30 ℃
For internal copper layer k=0.024 b=0.44 c=0.725
Substitution formula one obtains S=12543mil
2, Thickness=loz
Substitution formula two obtains Width=9060mil
For outside copper layer k=0.048 b=0.44 c=0.725
Substitution formula one obtains S=4819mil
2, Thickness=loz
Substitution formula two obtains Width=3480mil
By result of calculation as can be known PCB ampacity and copper layer width be not linear relationship, inside and outside copper layer also has very big difference, the result who according to said method obtains more approaches actual conditions, can guarantee the precision and the reliability that design.
Considered that PCB copper layer is the big electric current of transmission current density different during with little electric current, factors such as the difference of ectonexine copper layer conductive capability and PCB temperature rise requirement, and in conjunction with empirical parameter, can accurate Calculation PCB copper layer current capacity, raising PCB is in precision and the reliability of design phase, and standard is satisfied in assurance PCB temperature rise.
Considered PCB copper layer the big electric current of transmission current density different during with little electric current, factors such as the difference of ectonexine copper layer conductive capability and PCB temperature rise requirement, and in conjunction with empirical parameter, can accurate Calculation PCB copper layer current capacity.
Claims (1)
1. PCB copper layer ampacity computational methods is characterized in that computational process is as follows:
At first calculate the long-pending S of copper layer cross section, Consideration comprises the size of transmission current, the temperature rise that PCB requires and the difference of PCB ectonexine,
Wherein: S is the long-pending mil of unit of copper layer cross section
2
I needs the A of electric current transmitted unit for the copper layer
T
rThe temperature rise unit that allows for PCB ℃
K, b, c are constant
For internal layer copper layer k=0.024 b=0.44 c=0.725
For external copper layer k=0.048 b=0.44 c=0.725
Next calculates copper layer width W idth:
Wherein: Width is the copper layer mil of width unit
S is the long-pending mil of unit of copper layer cross section
2
Thickness is the oz of copper layer thickness unit
The PCB copper layer thickness is generally represented with oz, and oz is a unit of weight, is to be converted to dimensional units in calculating, should this need multiplication by constants 1.378, the mil/oz of unit;
Use above-mentioned two formula, needed PCB copper layer width during the accurate Calculation transmission current.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010161526 CN101848603A (en) | 2010-05-04 | 2010-05-04 | Computing method of current-carrying capacity of PCB (Polychlorinated Biphenyl) copper layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010161526 CN101848603A (en) | 2010-05-04 | 2010-05-04 | Computing method of current-carrying capacity of PCB (Polychlorinated Biphenyl) copper layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101848603A true CN101848603A (en) | 2010-09-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010161526 Pending CN101848603A (en) | 2010-05-04 | 2010-05-04 | Computing method of current-carrying capacity of PCB (Polychlorinated Biphenyl) copper layer |
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| Country | Link |
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| CN (1) | CN101848603A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105696064A (en) * | 2016-04-01 | 2016-06-22 | 广州兴森快捷电路科技有限公司 | Figure electroplating parameter acquisition method |
| CN108170958A (en) * | 2017-12-28 | 2018-06-15 | 华南理工大学 | The determining method, apparatus and computer equipment of the current capacity of PCB |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5030614A (en) * | 1987-05-15 | 1991-07-09 | Omega Engineering, Inc. | Superconductor sensors |
| CN101266274A (en) * | 2008-05-06 | 2008-09-17 | 杭州海康雷鸟信息技术有限公司 | Overhead transmission line dynamic current-carrying capacity monitoring method and its device |
| CN101609123A (en) * | 2009-07-30 | 2009-12-23 | 西安工程大学 | Online monitoring system of dynamic compatibilization of power transmission line |
| CN101672880A (en) * | 2009-09-21 | 2010-03-17 | 广东电网公司广州供电局 | Identification method of cable current-carrying capacity and identification device |
| CN101692110A (en) * | 2009-09-29 | 2010-04-07 | 广东电网公司广州供电局 | Method for determining combined insulation thermal resistance of cable and method for calculating current-carrying capacity of cable |
-
2010
- 2010-05-04 CN CN 201010161526 patent/CN101848603A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5030614A (en) * | 1987-05-15 | 1991-07-09 | Omega Engineering, Inc. | Superconductor sensors |
| CN101266274A (en) * | 2008-05-06 | 2008-09-17 | 杭州海康雷鸟信息技术有限公司 | Overhead transmission line dynamic current-carrying capacity monitoring method and its device |
| CN101609123A (en) * | 2009-07-30 | 2009-12-23 | 西安工程大学 | Online monitoring system of dynamic compatibilization of power transmission line |
| CN101672880A (en) * | 2009-09-21 | 2010-03-17 | 广东电网公司广州供电局 | Identification method of cable current-carrying capacity and identification device |
| CN101692110A (en) * | 2009-09-29 | 2010-04-07 | 广东电网公司广州供电局 | Method for determining combined insulation thermal resistance of cable and method for calculating current-carrying capacity of cable |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105696064A (en) * | 2016-04-01 | 2016-06-22 | 广州兴森快捷电路科技有限公司 | Figure electroplating parameter acquisition method |
| CN105696064B (en) * | 2016-04-01 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | A kind of acquisition methods of graphic plating parameter |
| CN108170958A (en) * | 2017-12-28 | 2018-06-15 | 华南理工大学 | The determining method, apparatus and computer equipment of the current capacity of PCB |
| WO2019128173A1 (en) * | 2017-12-28 | 2019-07-04 | 广州兴森快捷电路科技有限公司 | Method for determining current-carrying capability of pcb, apparatus and computer device |
| CN108170958B (en) * | 2017-12-28 | 2020-04-10 | 华南理工大学 | Method and device for determining current carrying capacity of PCB and computer equipment |
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Application publication date: 20100929 |