CN101840872B - Bubble-free encapsulation method - Google Patents
Bubble-free encapsulation method Download PDFInfo
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- CN101840872B CN101840872B CN2009101195650A CN200910119565A CN101840872B CN 101840872 B CN101840872 B CN 101840872B CN 2009101195650 A CN2009101195650 A CN 2009101195650A CN 200910119565 A CN200910119565 A CN 200910119565A CN 101840872 B CN101840872 B CN 101840872B
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Abstract
A bubble-free encapsulation method is suitable for encapsulation of a display assembly. Firstly, a first substrate and a first protection layer which is arranged on a first surface of the first substrate are provided. Furthermore, a second substrate and a second protection layer arranged on one surface of the second substrate are provided. Plasma treatment is carried out on the surfaces of the first protection layer and the second protection layer. Then the first substrate and the second substrate after the plasma treatment are immersed in a water solution in which press-fit treatment is carried out to the first substrate and the second substrate; the first protection layer and the second protection layer faces to each other during the press-fit treatment. At least, the first substrate and the second substrate after the press-fit treatment are taken out of the solution.
Description
Technical field
The invention relates to a kind of method for packing, and particularly relevant for a kind of bubble-free method for packing.
Background technology
Typical display unit example is to be LCD.LCD (LCD s, LiquidCrystal Displays) has advantages such as power saving, in light weight, radiationless and portability, replaces traditional display module gradually.And Thin Film Transistor-LCD (TFT-LCDs, Thin FilmTransistor Liquid Crystal Displays) has characteristics such as high-resolution, high reaction rate, image quality be good, be applicable to that animation shows, has been widely used in auto-navigation system, mobile computer, has shot with video-corder projector etc.In recent years more because the breakthrough of wide viewing angle technology, and make the wide and large scale TV of application layer, and the trend that replaces traditional C RT TV is arranged.
In general, the display panels primary structure can simply be divided into front end colored filter (CF, Color Filter), and rear end TFT panel.Accompany one deck liquid crystal (LC, Liquid Crystal) in the middle of the two sheet glass substrates and be responsible for the conduction of light.
The liquid crystal injection mode at first must be held TFT the combination in advance of glass and CF end glass in the past, removed the air of confined chamber again in the mode that vacuumizes, then it is immersed in the liquid crystal groove, utilize capillarity again, liquid crystal is injected slowly carried out the sealing of liquid crystal hand-hole again when finishing when injecting.
Another kind of liquid crystal injection mode is called the ODF method, the ODF method is a manufacture method in response to big chi panel production, at first on the CF panel, carry out the required frame glue coating (Sealant Dispense) of TFT and CF panel combination, then drip last required amount of liquid crystal on the CF panel, the combination of carrying out infrabasal plate and upper substrate again under the environment of vacuum is then carried out contraposition, is consolidated methods such as roasting.
Yet the operating environment of said method all must produce in liquid crystal layer to avoid bubble under vacuum environment, and causes the defective in the use.In addition, add a production formality that vacuumizes, need extra expensive instrument, and improve manufacturing cost.
In addition, when LCD encapsulation technology on the market was used in Electronic Paper industry encapsulation now, the encapsulant of aqueous solution class (water and particle) still had a unworthiness in the LCD technology, can cause problems such as skewness because of flowability is different with siphon mode with water because of particle.
Summary of the invention
The invention provides a kind of method for packing, do not have the purpose of bubble packaging effect to reach tool.
The invention provides a kind of bubble-free method for packing, be applicable to the encapsulation of a display module.At first, provide one first substrate and one first protective layer, wherein first protective layer is to be formed on the surface of first substrate, and first protective layer is covered on this surface comprehensively and has at least one intaglio pattern.In addition, provide one second substrate and one second protective layer, wherein second protective layer is to be formed on the surface of this second substrate.Then, implementing a plasma at the surface of first protective layer and second protective layer handles.Afterwards, with first substrate after plasma treated and second substrate immersion in an aqueous solution.In the aqueous solution, first substrate and second substrate are carried out pressing processing, first protective layer and second protective layer face one another during pressing.At last, first substrate after the pressing and second substrate are taken out in container.
Among the foregoing invention embodiment; the aqueous solution is an optical coupled liquid; plasma is an oxygen plasma; first substrate is an ito glass; second substrate is an ito glass; display module is an electrophoresis type display or a polarized type display; the material of first protective layer is a dimethyl silicone polymer (PDMS) (Polydimethylsiloxane; PDMS) or a minus thick film photoresistance (SU8); the material of second protective layer is a dimethyl silicone polymer (Polydimethylsiloxane; PDMS) or a minus thick film photoresistance (SU8); first protective layer and second protective layer use every crack thing (SPACER) as one, are used to keep the gap between this first substrate and this second substrate.
In the step of foregoing invention embodiment, after plasma treatment step, comprise that also a step is for adding an adhesive agent in the top of intaglio pattern.
In the step of foregoing invention embodiment, after the pressing treatment step, comprise that also a step is for adding a sealant around first substrate and the second substrate junction.
Because the material of protective layer is dimethyl silicone polymer (PDMS) or minus thick film photoresistance (SU8); it is a hydrophobic polymer material; see through the mode of oxygen plasma treatment; can make the protective layer surface nature change hydrophily into from hydrophobicity; so; can allow the aqueous solution be covered in the surface of protective layer automatically, and then, reach encapsulation and bubble-free effect simultaneously the bubble eliminating.
Description of drawings
Fig. 1 is the generalized section of the present invention's one display module; And
Fig. 2 A to Fig. 2 E is the schematic diagram of the method for packing of the display module among Fig. 1.
[primary clustering symbol description]
10 display modules, 20 first substrates
21 first protective layers, 30 second substrates
31 second protective layers, 40 aqueous solution
Embodiment
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment more cited below particularly, and cooperate appended graphicly, be described in detail below.
Fig. 1 is the generalized section of the present invention's one display module.Please consult Fig. 1 earlier, display module 10 comprises one first substrate 20, one first protective layer 21, one second substrate 30 and one second protective layer 31.
First protective layer 21 is to be formed on the surface of this first substrate 20, and this first protective layer 21 is covered on this surface comprehensively, and therefore first substrate can't be tanned by the sun out, and in addition, first protective layer 21 has at least one intaglio pattern.The material of first substrate 20 can be an indium tin oxide (ITO) glass, and the material of first protective layer 21 is a dimethyl silicone polymer (PDMS) or minus thick film photoresistance (SU8).
Second protective layer 31 is to be formed on the surface of second substrate 30.Wherein, the material of second substrate 30 can be an indium tin oxide (ITO) glass, and the material of second protective layer 31 is a dimethyl silicone polymer (PDMS) or minus thick film photoresistance (SU8).
At this, first protective layer 21 of present embodiment and the material of second protective layer 31 are chosen as dimethyl silicone polymer (PDMS).Because dimethyl silicone polymer (PDMS) is owing to have siloxy group, performance on optical transparence, thermal endurance and mechanical property has outstanding performance, when being applied to the encapsulation of a display module, can use every crack thing (SPACER) as one, be used to keep the gap between first substrate 20 and second substrate 30.
Among the foregoing invention embodiment, display module can be an electrophoresis type display or a polarized type display.
Below only introduce the structure of display module 10, and, below will cooperate Fig. 2 A to Fig. 2 E to be described in detail about the method for packing of display module 10.
Fig. 2 A to Fig. 2 E is the schematic diagram of the method for packing of display module described in Fig. 1.Please consult Fig. 2 A earlier, at first, it is to be formed on the surface of this first substrate 20 that one first substrate 20 and one first protective layer, 21, the first protective layers 21 are provided, and first protective layer 21 is covered in first substrate 20 surface comprehensively and goes up and have at least one intaglio pattern.In addition, see also Fig. 2 B, it is to be formed on the surface of second substrate 30 that one second substrate 30 and one second protective layer, 31, the second protective layers 31 are provided.
The mode that forms protective layer on substrate is identical with known method, so at this repeated description no longer.
Then, see also Fig. 2 C, implement plasma processing at first protective layer 21 that is formed on first substrate 20, wherein plasma is an oxygen plasma.
In addition, see also Fig. 2 D, implement plasma processing at second protective layer 31 that is formed on second substrate 30, wherein plasma is an oxygen plasma.
For instance, above-mentioned oxygen plasma treatment operating condition is as follows: be evacuated to 35mtorr earlier, aerating oxygen is to 75mtorr again, and the power in its RF source is 100W.See through oxygen plasma treatment, can make the surface of dimethyl silicone polymer (PDMS) is hydrophily from the hydrophobicity upgrading.
Then, see also Fig. 2 E, will be soaked in the aqueous solution 40 by first substrate 20 after plasma treated and second substrate 30, wherein the aqueous solution 40 can be an optical coupled liquid.Because it is hydrophily that the surface of dimethyl silicone polymer (PDMS) sees through the oxygen plasma upgrading, so can allow the aqueous solution 40 cover dimethyl silicone polymer (PDMS) material surface automatically, can alveolately not produce therebetween.
See also Fig. 2 F, afterwards, in the aqueous solution 40, first substrate 20 and second substrate 30 are carried out a pressing handle, wherein first protective layer 21 and second is protected 31 layers and is faced one another during pressing.Because dimethyl silicone polymer (PDMS) is owing to have siloxy group, performance on optical transparence, thermal endurance and mechanical property has outstanding performance, when being applied to the encapsulation of a display module 10, can use every crack thing (SPACER) as one, be used to keep the gap between first substrate 20 and second substrate 30, the aqueous solution 40 can be filled in the gap between its first substrate 20 and second substrate 30.
At last, see also Fig. 2 G, first substrate 20 after the pressing is taken out in container with this second substrate 30, finish the method for packing of display module.
Mandatory declaration be that above-mentioned protective layer material only illustrates with the confession of dimethyl silicone polymer (PDMS), and non-limiting the present invention.
What deserves to be mentioned is that these display modules 10 also can comprise other encapsulation step, to improve the effect of encapsulation.For example, after the plasma treatment, also comprise and add an adhesive agent, see through the effect of adhesive agent, can increase the connection relationship of first protective layer 21 and second protective layer 31 in the top of intaglio pattern.In addition, after the pressing treatment step, comprise also and add a sealant around first substrate 20 and second substrate, 30 junctions that sealant can be a hardening resin.
In sum, method for packing of the present invention can be applied on the display module, because dimethyl silicone polymer (PDMS) is a hydrophobic polymer material, do the surface at dimethyl silicone polymer (PDMS) and handle, and the mode of process oxygen plasma treatment, make its part temporarily be defined as hydrophilic area, so, (dimethyl silicone polymer (PDMS) material surface, and then bubble got rid of reaches encapsulation and bubble-free effect simultaneously can to allow filling liquid cover the poly dimethyl silica automatically.
Though the present invention with some embodiment openly as above; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking above-mentioned the claim person of defining.
Claims (8)
1. a bubble-free method for packing is applicable to the encapsulation of a LCD assembly, comprising:
One first substrate and one first protective layer are provided, this first protective layer is to be formed on the surface of this first substrate, and this first protective layer is covered on this surface comprehensively and has at least one intaglio pattern, and the material of this first protective layer is a dimethyl silicone polymer or a minus thick film photoresistance;
One second substrate and one second protective layer are provided, and this second protective layer is to be formed on the surface of this second substrate, and the material of this second protective layer is a dimethyl silicone polymer or a minus thick film photoresistance;
Implement a plasma at the surface of this first protective layer and this second protective layer and handle, this plasma is an oxygen plasma;
With this first substrate after plasma treated and this second substrate immersion in an aqueous solution;
In this aqueous solution, this first substrate and this second substrate are carried out pressing processing, this first protective layer and this second protective layer face one another during pressing; And
This first substrate after the pressing and this second substrate are taken out in container.
2. method for packing as claimed in claim 1 is characterized in that, this aqueous solution is an optical coupled liquid.
3. method for packing as claimed in claim 1 is characterized in that, this first substrate is an ito glass.
4. method for packing as claimed in claim 1 is characterized in that, this second substrate is an IT0 glass.
5. method for packing as claimed in claim 1 is characterized in that, this LCD assembly is an electrophoresis type display or a polarized type display.
6. method for packing as claimed in claim 1 is characterized in that, this first protective layer and this second protective layer use every the crack thing as one, is used to keep the gap between this first substrate and this second substrate.
7. method for packing as claimed in claim 1 after this plasma treatment step, is characterized in that, also comprises adding an adhesive agent in the top of this intaglio pattern.
8. method for packing as claimed in claim 1 after this pressing treatment step, is characterized in that, also comprises adding a sealant around this first substrate and this second substrate junction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101195650A CN101840872B (en) | 2009-03-16 | 2009-03-16 | Bubble-free encapsulation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101195650A CN101840872B (en) | 2009-03-16 | 2009-03-16 | Bubble-free encapsulation method |
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| Publication Number | Publication Date |
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| CN101840872A CN101840872A (en) | 2010-09-22 |
| CN101840872B true CN101840872B (en) | 2011-12-21 |
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| CN2009101195650A Expired - Fee Related CN101840872B (en) | 2009-03-16 | 2009-03-16 | Bubble-free encapsulation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103123547A (en) | 2011-11-16 | 2013-05-29 | 宸鸿科技(厦门)有限公司 | Piling structure of optics panel and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6331882B1 (en) * | 1998-11-26 | 2001-12-18 | Nitto Denko Corporation | Optical member, cell substrate and liquid-crystal display |
| JP2002341319A (en) * | 2001-05-21 | 2002-11-27 | Kyocera Corp | Liquid crystal display device |
| CN1388818A (en) * | 2000-06-21 | 2003-01-01 | 三井化学株式会社 | Sealing material for plastic liquid crystal display cells |
| JP2005246943A (en) * | 2004-03-04 | 2005-09-15 | Kiyokatsu Watanabe | Method for manufacturing glass substrate/laminated protection sheet and automatic device |
| CN101097334A (en) * | 2006-06-30 | 2008-01-02 | Lg.菲利浦Lcd株式会社 | Liquid crystal panel and fabrication method thereof |
-
2009
- 2009-03-16 CN CN2009101195650A patent/CN101840872B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6331882B1 (en) * | 1998-11-26 | 2001-12-18 | Nitto Denko Corporation | Optical member, cell substrate and liquid-crystal display |
| CN1388818A (en) * | 2000-06-21 | 2003-01-01 | 三井化学株式会社 | Sealing material for plastic liquid crystal display cells |
| JP2002341319A (en) * | 2001-05-21 | 2002-11-27 | Kyocera Corp | Liquid crystal display device |
| JP2005246943A (en) * | 2004-03-04 | 2005-09-15 | Kiyokatsu Watanabe | Method for manufacturing glass substrate/laminated protection sheet and automatic device |
| CN101097334A (en) * | 2006-06-30 | 2008-01-02 | Lg.菲利浦Lcd株式会社 | Liquid crystal panel and fabrication method thereof |
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| CN101840872A (en) | 2010-09-22 |
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