CN101833245B - Gluing device and gluing method - Google Patents
Gluing device and gluing method Download PDFInfo
- Publication number
- CN101833245B CN101833245B CN 200910079909 CN200910079909A CN101833245B CN 101833245 B CN101833245 B CN 101833245B CN 200910079909 CN200910079909 CN 200910079909 CN 200910079909 A CN200910079909 A CN 200910079909A CN 101833245 B CN101833245 B CN 101833245B
- Authority
- CN
- China
- Prior art keywords
- substrate
- glue
- gluing
- moulding
- envelope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Coating Apparatus (AREA)
Abstract
The invention discloses a gluing device and a gluing method. The device comprises a sealing frame strip, a first substrate and a glue dripping module, wherein the sealing frame strip is arranged on a substrate to be glued to form a closed area; the first substrate is pressed on the sealing frame strip to form closed space with the sealing frame strip and the substrate to be glued, and is used for accommodating glue; and the glue dripping module is used for instilling glue on the substrate to be glued through at least two instilling openings arranged on the first substrate, and the volume of the instilled glue is equal to the product of the acreage of the closed area formed by the sealing frame strip and the target thickness of the glue. The gluing method and the gluing device can avoid the waste of the glue, save the gluing time and ensure the uniformity of gluing.
Description
Technical field
The present invention relates to lcd technology, relate in particular to a kind of glue spreading apparatus and method.
Background technology
The photoresist coating is a very important processing step in the Thin Film Transistor-LCD (TFT-LCD), and the photoresist coating method mainly contains two kinds in the prior art, and a kind of is rotary coating (s pin) mode, and another kind is crack coating (slit) mode.
The process of rotary coating mode is: at first coating thickness is greater than the photoresist of target thickness on substrate, and the high speed rotating substrate makes that the photoresist on the substrate is evenly distributed then, and makes the thickness of photoresist be reduced to target thickness.The problem that this coating method exists is: because the thickness of the photoresist that is coated with in advance is greater than target thickness, so can cause the photoresist waste; And the mode through rotary plate is reduced to target thickness with the thickness of photoresist, and required time is very long, and efficient is very low; In addition, on the substrate after the gluing, the thickness of edge need remove the undesirable photoresist of edge's thickness usually less than target thickness.
The process of slot coated mode is: a slit moves along the substrate of treating gluing, and the ejection photoresist is applied on the substrate from this slit.This coating method is: owing to be directly on substrate, to be coated with, so technology difficulty is big, and it is even to occur crawling easily.
Summary of the invention
The objective of the invention is provides a kind of glue spreading apparatus and method to the problem that exists in the prior art, can avoid the waste of glue, saves the gluing time, and can guarantee uniformity of gluing.
To achieve these goals, the invention provides a kind of glue spreading apparatus, comprising:
The envelope moulding is arranged on the substrate of treating gluing, forms the zone of a closure;
First substrate is pressed on the said envelope moulding, forms a closed space with said envelope moulding and the substrate of treating gluing, is used to hold glue;
Drip the rubber moulding piece, be used for through offering on said first substrate at least two and instil and mouthful glue is instilled into the said substrate of treating gluing, the area that the volume of the glue of instillation equals the enclosed region that said envelope moulding forms multiply by the target thickness of glue;
The module of bleeding; Be used for through the bleeding point offered on said first substrate with said first substrate, seal moulding and treat that the gas in the closed space that the substrate of gluing forms takes away, make said first substrate, seal moulding and treat and be vacuum in the closed space that the substrate of gluing forms;
Inflator module; Be used for when said rubber moulding piece is instilled into through said perfusing hole glue on the said substrate of treating gluing with glue after; Inflation inlet through offering on said first substrate inflates air in the said closed space, makes said first substrate to separate with the substrate of gluing.
The present invention also provides a kind of glue spreading method, comprising:
Description of drawings
Between said step 2 and step 3, also comprise: the module of bleeding through the bleeding point on said first substrate with said first substrate, seal moulding and treat that the gas in the closed space that the substrate of gluing forms takes away, make to be vacuum in this closed space;
After step 3, also comprise: inflator module with said first substrate, envelope frame glue be coated with in the closed space that the substrate of glue forms and charge into gas, makes said first substrate, envelope frame glue and to be coated with the interior air pressure of closed space that the substrate of glue forms identical with air pressure outside this closed space through the inflation inlet on said first substrate.
Glue spreading apparatus provided by the invention and method are carried out the instillation of glue simultaneously through a plurality of instillation mouths that are arranged on first substrate, compare with rotation gluing mode in the prior art; Can save the gluing time; Because the area of the enclosed region that forms according to the target thickness of glue and envelope moulding decides the volume of the glue of instillation, can avoid the waste of glue, compares with slit gluing mode in the prior art; Offer a plurality of instillation mouths on first substrate; Through a plurality of instillation mouthful instillation glue, can realize uniform gluing, and reduce the bad possibility of technology generation.
Through accompanying drawing and embodiment, technical scheme of the present invention is done further detailed description below.
Shown in Figure 1 is the glue spreading apparatus first example structure synoptic diagram of the present invention;
Shown in Figure 2 is the glue spreading apparatus second example structure synoptic diagram of the present invention;
Shown in Figure 3 is glue spreading method process flow diagram of the present invention.
Embodiment
Be illustrated in figure 1 as the glue spreading apparatus first example structure synoptic diagram of the present invention, this glue spreading apparatus comprises: first substrate 11, envelope moulding 12 and dripping offers on rubber moulding piece 14, the first substrates 11 and instils mouthfuls 13, and the principle of work of this glue spreading apparatus is:
The substrate of treating gluing is placed on the carrying platform; Treating upward placement envelope of the substrate of gluing (the not shown substrate of treating gluing among Fig. 1) moulding 12; Envelope moulding 12 is closed bars, forms the zone of a closure, and closed zone promptly is the zone of follow-up gluing.
Dripping rubber moulding piece 14 mouthfuls 13 is instilled into glue on the substrate of treating gluing through instiling.The area that the volume that drips the glue that rubber moulding piece 14 instils equals to seal the enclosed region that moulding 12 forms multiply by the target thickness of glue, drips like this after rubber moulding piece 14 is instilled into the glue of fixed volume on the substrate of treating gluing, and the thickness of glue just can reach target thickness.
Among Fig. 1; First substrate and treat that the distance between the substrate of gluing just seals the height of moulding; In order to guarantee first substrate, to treat to hold in the substrate of gluing and the closed space that the envelope moulding forms the envelope frame glue of preset fixed volume; First substrate and treat that the distance between the substrate of gluing should that is to say that the thickness of envelope moulding is answered the target thickness greater than glue to be coated with greater than the target thickness of glue to be coated with.
Glue spreading apparatus shown in Figure 1 carries out the instillation of glue simultaneously through a plurality of instillation mouths that are arranged on first substrate, compares with rotation gluing mode in the prior art; Can save the gluing time; And, owing to the zone of envelope moulding with gluing limits, can be so that the thickness of the glue that has been coated be even; And needn't after gluing is accomplished, also need the undesirable glue of edge's thickness be removed; In addition, the area of the enclosed region that can form according to the target thickness and the envelope moulding of glue decides the volume of the glue of instillation, can avoid the waste of glue.Compare with slit gluing mode in the prior art, glue spreading apparatus shown in Figure 1 offers a plurality of instillation mouths on first substrate, through a plurality of instillation mouthful instillation glue, can realize uniform gluing, and reduce technology difficulty.
In order to improve uniformity of gluing, can increase the quantity of the instillation mouth on first substrate, and with a plurality of instillation mouthful evenly setting.Preferably, the density that instils mouthful can be every square centimeter more than 9 or 9, and the shape that instils mouthful can be quadrilateral, circle, triangle etc., and the circumscribed diameter of the shape that instils mouthful is greater than 0mm, and is less than or equal to 2mm.
Be illustrated in figure 2 as the glue spreading apparatus second example structure synoptic diagram of the present invention; The difference part of Fig. 2 and device shown in Figure 1 is: in first substrate shown in Figure 2 except instiling mouthfuls 13; Also offered bleeding point 15 and inflation inlet 16, also comprised inflator module 17 in the glue spreading apparatus and bleed module 18.The principle of work of glue spreading apparatus shown in Figure 2 is:
The substrate of treating gluing is placed on the carrying platform, is treating to place envelope moulding 12 on the substrate of gluing, envelope moulding 12 is closed bars, forms the zone of a closure, and closed zone promptly is the zone of follow-up gluing.
The module of bleeding 18 is taken the gas in the closed space away through bleeding point 15, makes the substrate 11 of winning, envelope moulding 12 and treat to be vacuum in the closed space that the substrate of gluing forms.Dripping rubber moulding piece 14 then mouthfuls 13 is instilled into glue on the substrate of treating gluing through instiling.The area that the volume that drips the glue that rubber moulding piece 14 instils equals to seal the enclosed region that moulding 12 forms multiply by the target thickness of glue, drips like this after rubber moulding piece 14 is instilled into the glue of fixed volume on the substrate of treating gluing, and the thickness of glue just can reach target thickness.
After gluing is accomplished; Inflator module 17 inflates air in first substrate 11, envelope moulding 12 and the substrate of gluing has formed the closed space through the inflation inlet on first substrate 16; Air pressure in this closed space equals after the outside air pressure of closed space, and first substrate just can separate with the substrate of gluing.
Glue spreading apparatus shown in Figure 2; Before instillation glue; Earlier with first substrate, seal moulding and treat that the closed space that the substrate of gluing forms is evacuated, and can submit uniformity of gluing to, on the one hand because liquid glue can not receive air resistance in closed space; On the other hand, there is bubble residual in the glue that can avoid instiling.
Bleeding point on first substrate and inflation inlet can be arranged on the zone except that the mouth that instils, and the shape of bleeding point and inflation inlet also can be quadrilateral, circle, triangle etc.Bleeding point is to be used to take away gas, and the density of bleeding point preferably can be less than the density of the mouth that instils; For example; Can be every square centimeter more than 0.01 or 0.01, the circumscribed diameter of the shape of bleeding point is more than or equal to 2mm, and is less than or equal to 5mm.Inflation inlet is to be used to charge into gas; There is not special requirement for homogeneity and speed; So inflation inlet can be arranged on the edge of the formed enclosed region of envelope moulding on first substrate; Quantity can be 5-10, and the circumscribed diameter of the shape of inflation inlet can be more than or equal to 2mm, and is less than or equal to 5mm.
In the concrete process that realizes; Bleeding point 15 can be controlled through valve with the open and close of the mouth 13 that instils, and when the module 18 of bleeding is bled through bleeding point 15, mouthful 13 closures will instil; At first substrate, when sealing moulding and treating that closed space that the substrate of gluing forms is vacuum; With bleeding point 15 closures, the mouth 13 that will instil is opened, and carries out the instillation of glue.
In Fig. 2 or the glue spreading apparatus shown in Figure 1, glue is instilled on the substrate of treating gluing dripping a rubber moulding piece, accomplish gluing after, need to seal moulding and take away from the substrate of gluing.For when taking the envelope moulding away; Do not damage the shape at the edge of the glue that has been coated with,, can on the envelope moulding, apply layer of substance sealing before moulding is placed on the substrate of treating gluing; Make the infiltration angle between photoresist and the envelope moulding spend more than or equal to 0, and less than 90 degree.Soaking into the angle is an a kind of physical quantity that reflects liquid to the infiltration degree of solid, and it is more little to soak into the angle, and the wettability between liquid and the solid is poor more.In the embodiment of the invention, select for use and photoresist between the infiltration angle less than the infiltration angle of 90 degree, promptly photoresist does not soak into being coated between the material that seals on the moulding, in the time of will sealing moulding like this and take away, can not damage the edge of the glue that has been coated with.The material that is coated on the envelope moulding comes down to be used for to isolate envelope moulding and photoresist, can be called a kind of isolated substance.Isolated substance can be that principal ingredient is the fluororesin of polytetrafluoroethylene (PTFE).
In embodiment one or embodiment two, glue spreading apparatus can also comprise one second substrate, and second substrate is arranged on the below of the substrate of treating gluing, offers bleeding point on second substrate.Before gluing, will treat that earlier the substrate of gluing is placed on second substrate, the module of bleeding then through the bleeding point on second substrate with second substrate with treat that the gas between the substrate of gluing takes away, make second substrate with treat that the substrate of gluing fits tightly.And then, carry out gluing treating to place the envelope moulding and first substrate on the substrate of gluing.After gluing finishes, charge into gas through the bleeding point on second substrate, the substrate that makes second substrate and be coated with glue is separately taken the substrate that has been coated with glue away from second substrate.
Through second substrate is set, and with second substrate with treat that the gas between the substrate of gluing takes away, can treat the stationkeeping of the substrate of gluing so that in the gluing process.On second substrate, offer bleeding point, after gluing finishes, can take away from second substrate, for example, can from bleeding point, stretch out flexible probe,, remove then the substrate that has been coated with glue jack-up from second substrate through the substrate that bleeding point will be coated with glue.
Be illustrated in figure 3 as glue spreading method process flow diagram of the present invention, comprise:
Glue spreading method of the present invention carries out the instillation of glue simultaneously through a plurality of instillation mouths that are arranged on first substrate, compares with rotation gluing mode in the prior art; Can save the gluing time; And, owing to the zone of envelope moulding with gluing limits, can be so that the thickness of the glue that has been coated be even; And needn't after gluing is accomplished, also need the undesirable glue of edge's thickness be removed; In addition, the area of the enclosed region that can form according to the target thickness and the envelope moulding of glue decides the volume of the glue of instillation, can avoid the waste of glue.Compare with slit gluing mode in the prior art, offer a plurality of instillation mouths on first substrate,, can realize uniform gluing, and reduce technology difficulty through a plurality of instillation mouthful instillation glue.
If adopt glue spreading apparatus as shown in Figure 2; Glue spreading method then provided by the invention; Between step 2 and step 3, also comprise: the module of bleeding through the bleeding point on first substrate with first substrate, seal moulding and treat that the gas in the closed space that the substrate of gluing forms takes away, make this closed space near vacuum.And; After step 3, also comprise: inflator module through the inflation inlet on first substrate with first substrate, envelope frame glue be coated with in the closed space of substrate formation of glue and charge into gas; The air pressure that makes the substrate of winning, envelope frame glue and be coated with in the closed space that the substrate of glue forms is identical with this closed space air pressure outward, and such first substrate just can separate with the substrate that has been coated with glue.
If the glue spreading apparatus that adopts embodiment three to be provided; Glue spreading method then provided by the invention; Before step 1, also comprise: second substrate is arranged on the substrate below of treating gluing; Through the bleeding point on second substrate with second substrate with treat that the air between the substrate of gluing takes away, make second substrate with treat that the substrate of gluing fits tightly.And, after step 3, also comprise: at second substrate be coated with between the substrate of glue and charge into gas, make the substrate that has been coated with glue to remove from second substrate through the bleeding point on second substrate.
Glue spreading method provided by the invention and glue spreading apparatus go for the coating of photoresist in the TFT-LCD array base palte manufacturing process, and perhaps the coating of polyimide (ployimide is called for short PI) layer also can be used for the coating of the glue of semiconductor technology.
What should explain at last is: above embodiment is only in order to technical scheme of the present invention to be described but not limit it; Although the present invention has been carried out detailed explanation with reference to preferred embodiment; Those of ordinary skill in the art is to be understood that: it still can make amendment or be equal to replacement technical scheme of the present invention, also can not make amended technical scheme break away from the spirit and the scope of technical scheme of the present invention and these are revised or be equal to replacement.
Claims (9)
1. a glue spreading apparatus is characterized in that, comprising:
The envelope moulding is arranged on the substrate of treating gluing, forms the zone of a closure;
First substrate is pressed on the said envelope moulding, forms a closed space with said envelope moulding and the substrate of treating gluing, is used to hold glue;
Drip the rubber moulding piece, be used for through offering on said first substrate at least two and instil and mouthful glue is instilled into the said substrate of treating gluing, the area that the volume of the glue of instillation equals the enclosed region that said envelope moulding forms multiply by the target thickness of glue;
The module of bleeding; Be used for through the bleeding point offered on said first substrate with said first substrate, seal moulding and treat that the gas in the closed space that the substrate of gluing forms takes away, make said first substrate, seal moulding and treat and be vacuum in the closed space that the substrate of gluing forms;
Inflator module; Be used for when said rubber moulding piece with glue through said instil mouthful glue is instilled on the said substrate of treating gluing after; Inflation inlet through offering on said first substrate inflates air in the said closed space, makes said first substrate to separate with the substrate of gluing.
2. glue spreading apparatus according to claim 1 is characterized in that, said first substrate and treat that distance between the substrate of gluing is more than or equal to the target thickness of glue to be coated with.
3. glue spreading apparatus according to claim 1 is characterized in that, the said density that instils mouthful is every square centimeter more than 9, and the circumscribed diameter of the said figure that instils mouthful is greater than 0mm, and is less than or equal to 2mm.
4. glue spreading apparatus according to claim 1 is characterized in that, the density of said bleeding point is every square centimeter more than 0.01, and the circumscribed diameter of the figure of said bleeding point is more than or equal to 2mm, and is less than or equal to 5mm.
5. glue spreading apparatus according to claim 1; It is characterized in that; Said inflation inlet is arranged on said first substrate marginal position of the enclosed region that the envelope moulding forms, and the circumscribed diameter of the figure of said inflation inlet is more than or equal to 2mm, and is less than or equal to 5mm.
6. glue spreading apparatus according to claim 1 is characterized in that, also comprises:
Second substrate is arranged on said below of treating the substrate of gluing;
The said module of bleeding is treated said second substrate and said that through the bleeding point offered on said second substrate air between the substrate of gluing takes away; Make said second substrate and the said substrate of gluing of treating fit tightly; And when said rubber moulding piece with glue through said instil mouthful glue is instilled on the said substrate of treating gluing after; Said inflator module inflates air to said second substrate through the bleeding point of offering on said second substrate and has been coated with between the substrate of glue, makes the substrate that has been coated with glue to separate with said second substrate.
7. according to the described glue spreading apparatus of arbitrary claim among the claim 1-6, it is characterized in that, apply one deck isolated substance on the said envelope moulding, the infiltration angle between said isolated substance and the glue to be coated with is more than or equal to 0 degree, and spends less than 90.
8. a glue spreading method is characterized in that, comprising:
Step 1, will seal moulding and be placed on the substrate of treating gluing, said envelope moulding forms the zone of a closure;
Step 2, first substrate is pressed on the said envelope moulding, forms the space of a closure, be used to hold glue with said envelope moulding and the substrate of treating gluing;
Step 3, drip the rubber moulding piece and through the instillation mouth offered on said first substrate glue is instilled on the said substrate of treating gluing, the area that the volume of the glue of instillation equals the enclosed region that said envelope moulding forms multiply by the target thickness of glue;
Between said step 2 and step 3, also comprise: the module of bleeding through the bleeding point on said first substrate with said first substrate, seal moulding and treat that the gas in the closed space that the substrate of gluing forms takes away, make to be vacuum in this closed space;
After step 3, also comprise: inflator module with said first substrate, envelope frame glue be coated with in the closed space that the substrate of glue forms and charge into gas, makes said first substrate, envelope frame glue and to be coated with the interior air pressure of closed space that the substrate of glue forms identical with air pressure outside this closed space through the inflation inlet on said first substrate.
9. glue spreading method according to claim 8 is characterized in that,
Before said step 1, also comprise: second substrate is arranged on the substrate below of treating gluing; Through the bleeding point on said second substrate with said second substrate with treat that the air between the substrate of gluing takes away, make second substrate with treat that the substrate of gluing fits tightly;
After said step 3, also comprise: at said second substrate be coated with between the substrate of glue and charge into gas, make the substrate that has been coated with glue to remove from said second substrate through the bleeding point on said second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910079909 CN101833245B (en) | 2009-03-12 | 2009-03-12 | Gluing device and gluing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910079909 CN101833245B (en) | 2009-03-12 | 2009-03-12 | Gluing device and gluing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101833245A CN101833245A (en) | 2010-09-15 |
| CN101833245B true CN101833245B (en) | 2012-12-26 |
Family
ID=42717361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910079909 Active CN101833245B (en) | 2009-03-12 | 2009-03-12 | Gluing device and gluing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101833245B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102402077B (en) | 2011-04-13 | 2013-11-20 | 深圳市华星光电技术有限公司 | Liquid crystal frame glue forming device and display panel assembling equipment using same |
| US20140338597A1 (en) * | 2013-05-16 | 2014-11-20 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Mask Plate for Glue Coating and Manufacturing Method Thereof |
| CN103293849A (en) * | 2013-05-16 | 2013-09-11 | 深圳市华星光电技术有限公司 | Mask for size material coating and fabricating method thereof |
| CN103293859A (en) * | 2013-05-27 | 2013-09-11 | 苏州扬清芯片科技有限公司 | Method for manufacturing photoresist film |
| CN104133326A (en) * | 2014-08-08 | 2014-11-05 | 中航华东光电有限公司 | Method for carrying out vacuum encapsulation binding on reinforcing glass of liquid crystal display module |
-
2009
- 2009-03-12 CN CN 200910079909 patent/CN101833245B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101833245A (en) | 2010-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101833245B (en) | Gluing device and gluing method | |
| US7435311B1 (en) | Panel-to-panel lamination method for improved uniformity | |
| JP6231956B2 (en) | Substrate processing equipment | |
| TWI630958B (en) | Substrate processing method and substrate processing apparatus | |
| KR100277516B1 (en) | Solution applicator | |
| WO2016061852A1 (en) | Substrate packaging method and packaging structure | |
| JP6761860B2 (en) | Coating processing equipment, coating processing method and computer storage medium | |
| IL192071A0 (en) | Device and method for the surface treatment of substrates | |
| TW200618699A (en) | Thin-film pattern forming method, semiconductor device, electro-optic device, and electronic apparatus | |
| WO2017156829A1 (en) | Substrate packaging method | |
| CN202166827U (en) | Coating equipment | |
| KR102312634B1 (en) | Substrate processing apparatus and substrate processing method | |
| US20130314659A1 (en) | Liquid crystal panel, method for injecting liquid crystal thereof and apparatus for injecting liquid crystal | |
| JP7053835B2 (en) | Board processing method and board processing equipment | |
| JP2004188407A (en) | Assembly method of substrate and assembly apparatus of substrate | |
| JP2003059823A (en) | Film formation method and film-forming apparatus | |
| JPWO2010116654A1 (en) | Thin film forming apparatus and thin film forming method | |
| JP6731293B2 (en) | Optical film forming method, program, computer storage medium, and optical film forming apparatus | |
| JP2000515262A (en) | Method and apparatus for patterning an encapsulated liquid crystal layer | |
| TWI274947B (en) | Apparatus and process for filling liquid crystal into LCD cell | |
| JPH07199199A (en) | Production of liquid crystal display element | |
| KR20190055448A (en) | Substrate treating apparatus | |
| CN110340801B (en) | High-step substrate wafer wax pasting method | |
| JP7367446B2 (en) | Coating method and coating device | |
| JPH11319678A (en) | Fluid coating device and fluid coating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150630 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150630 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150630 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |