CN101833133B - Processing design method of diamond cutter for cutting optical fibers - Google Patents

Processing design method of diamond cutter for cutting optical fibers Download PDF

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CN101833133B
CN101833133B CN2009100479373A CN200910047937A CN101833133B CN 101833133 B CN101833133 B CN 101833133B CN 2009100479373 A CN2009100479373 A CN 2009100479373A CN 200910047937 A CN200910047937 A CN 200910047937A CN 101833133 B CN101833133 B CN 101833133B
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face
diamond
processing
crystal
processing base
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CN101833133A (en
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沈志义
赵磊
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SHANGHAI LAO FENGXIANG DIAMOND PROCESSING CENTER CO Ltd
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SHANGHAI LAO FENGXIANG DIAMOND PROCESSING CENTER CO Ltd
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Abstract

The invention relates to the technical field of ultra-precision processing and discloses a processing design method of a diamond cutter for cutting optical fibers. In order to solve the problems that a diamond cutter edge in the prior art can not have higher sharpness, larger strength and the like, the processing design method provided in the invention is characterized by comprising the following steps of: A. selecting materials; B. determining the axial direction of a crystal axis as the direction of the diamond cutter edge; C. determining the processing base face of a natural diamond or a synthesized diamond; D. precisely determining the direction of a cutter edge face according to the determined processing base face, then determining the directions of two cutter faces perpendicular to the base face, and finally processing the two cutter faces; and E. processing the cutter edge face and the cutter edge of the diamond cutter by respectively using the two cutter faces as positioning faces. The invention has the advantages that the processing design method can ensure that the cutter edge has higher mechanical strength and wearing resistance when achieving the requirement of sharpness, and the diamond cutter has high qualified rate, is convenient to repair, and can easily reach the same performance index with a new product.

Description

A kind of processing design method of diamond cutter for cutting optical fibers
Technical field
The present invention relates to the ultraprecise machining technology, particularly relate to a kind of processing design method of diamond cutter for cutting optical fibers.
Background technology
Lay or keep in repair the optical-fibre communications net that extends in all direction and be unable to do without fiber cut, docking technique.It is modern fiber cut, the indispensable specific purpose tool (see figure 1) of butt joint that the ultraprecise mini optical fibre cuts employed diamond cutter.
Diamond is the hardest in the world crystalline material, is called as precious superhard tool material.The accurate miniature diamond cutter must be a raw material with the diamond monocrystalline.
In the design of diamond cutter, for the edge strength that guarantees diamond cutter reaches processing and request for utilization, all adopt the bigger angle of wedge usually, must be as the angle of wedge of conventional diamond cutting tool greater than 75 ° angle.Though the angle of wedge that increases diamond cutter can improve the intensity of blade, the angle of wedge of blade is big more, and the blade sharpness is poor more.
Smooth smooth in order to guarantee the tangent plane after the optical fiber glass-cutting, so that light signal can pass through cut surface smoothly, the blade of diamond cutter for cutting optical fibers needs very sharp, so the angle of wedge of this cutter wishes to do for a short time.But in the production of prior art, if the diamond cutter are designed, are fabricated to the little angle of wedge, a lot of problems and difficulty will appear: the one, and the insufficient strength of blade is damaged easily; The 2nd, in the mill, the qualification rate of product is lower, has wasted valuable diamond material; Three reparations after being to use, not only processing step is complicated, process is difficult, but also the performance index when often not reaching the diamond cutter new product and dispatching from the factory.
Summary of the invention
Adopt the cutting diamond cutter of prior art design, processing, can't take into account the higher sharpness of diamond blade and than hard intensity, and product percent of pass is low aborning, waste is big; Reparation difficulty after the use is very big.
The objective of the invention is to propose a kind of new processing design method in order to solve above-mentioned technical matters, its technical scheme is as follows.
1. the processing design method of a diamond cutter for cutting optical fibers, described processing design comprises processing design method in manufacturing first and the method for repairing again after using; Described processing design method in manufacturing first may further comprise the steps,
A. select Ia or Ib type rough diamond monocrystal or Ib type synthesizing diamond monocrystal for use, the requirement of selecting for use also has: a. volume is 10mm 3More than; B. cleanliness reaches the adamantine standard of one-level crusher; C. crystalline form is complete, and perhaps the part that crystalline form is complete accounts for more than 50% of whole monocrystal;
B. observe, check the diamond monocrystal with magnifier, determine a crystallographic axis axially as diamond blade direction;
C. utilize the growth characteristics of diamond monocrystal, the dissolving characteristic of diamond monocrystal, the symmetry of diamond monocrystal, the anisotropy rule of diamond monocrystal, determine the processing base face of diamond cutter, described definite, its content comprises design effort and checking work;
When implementing the processing base face of described definite diamond cutter, its target call is as follows,
A. processing design object is the rough diamond monocrystal, and its target call is the combination in any that comprises following content:
The diagonal line of quadrilateral erosion line is parallel on processing base face and vertical (100) crystal face;
Processing base face is 54 ° of 44 ' angles with (111) crystal face;
Processing base face and stepped growth step, growth line are parallel;
One side in the pyrometric cone on processing base face and (111) crystal face is parallel;
One side of inverted triangle erosion line on processing base face and (111) crystal face is parallel;
Processing base face is parallel with the parallel erosion line on (110) crystal face or be symmetry status with netted growth line;
Processing base face is medium with (111) crystal face---cleavage plane is 54 ° of 44 ' angles fully;
Processing base face is parallel with the stepped striped of the imperfect cleavage of (110) crystal face;
Processing base face is parallel with two crystallographic axis of diamond monocrystal; Described two crystallographic axis, its direction is determined by (210) the face corrosion direction position on (111) crystal face position of crystal, (100) crystal face position, (110) crystal face;
B. processing design object is the synthesizing diamond monocrystal, and its target call is the combination in any that comprises following content:
Processing base face is 54 ° of 44 ' angles with (111) crystal face;
Processing base face and stepped growth step, growth line are parallel;
One side in the pyrometric cone on processing base face and (111) crystal face is parallel;
Processing base face is medium with (111) crystal face---cleavage plane is 54 ° of 44 ' angles fully;
Processing base face is parallel with the stepped striped of the imperfect cleavage of (110) crystal face;
Processing base face is parallel with two crystallographic axis of synthesizing diamond monocrystal; Described two crystallographic axis, its direction is determined by the seed crystal phantom orientation on (111) crystal face position of crystal, (100) crystal face position, (110) crystal face position, the synthesizing diamond monocrystal;
D. accurately determine the orientation of blade face with the processing base face of determining; Determine the orientation of two knife faces vertical then with basal plane; Reprocess two knife faces;
E. with described two knife faces respectively as locating surface, implement the blade face of diamond cutter and the processing of blade;
Described processing base face be defined as (001),
Figure DEST_PATH_GSB00000595475500021
Crystal face, described blade be not only parallel with (001) crystal face, but also and by the plane parallel at X crystallographic axis, Y crystallographic axis place; Described blade and two L 3Plane parallel or described blade and two L at axle place 3Nonparallelism≤3 ° between the plane at axle place; Described blade face becomes 59 ° ± 1 ° angle with described processing base face; Described two knife faces vertical with described processing base face and with two L 3The axle place plane parallel, perhaps described two knife faces vertical with described processing base face and with two L 3Nonparallelism≤3 ° between the plane at axle place;
Described method of repairing again after using is meant: with described two knife faces respectively as locating surface, implement the blade face of diamond cutter and the reparation of blade.
2. described blade, it is on the ranks of a density maximum of diamond monocrystal (100) veil, and its line density is
Figure DEST_PATH_GSB00000595475500022
Described a is 0.356nm, described blade, and its microcosmic covalent bond structure is the symmetry status that can improve intensity and wearing quality.
The invention has the beneficial effects as follows: implement processing design method of the present invention, the blade that can make diamond cutter for cutting optical fibers has bigger physical strength and wearing quality when sharpness requires reaching, the product percent of pass height, reparation after the use is not only convenient, and can reach performance index identical when dispatching from the factory with new product easily.
Description of drawings
Fig. 1 is the synoptic diagram that the inventive method is implemented in an octahedron;
Fig. 2 is the octahedral synoptic diagram among Fig. 1;
Fig. 3 is the diamond cutter head synoptic diagram among Fig. 1;
Fig. 4 is the schematic perspective view that machines back diamond cutter head;
Fig. 5 be the diamond cutter head synoptic diagram.
The present invention is described in further detail below in conjunction with the drawings and specific embodiments.
Embodiment
The processing of diamond monocrystalline cutter design at first will design the processing orientation of diamond monocrystalline crystal, promptly determine the crystal orientation of cutter processing base face.Since the anisotropy of crystal, when design is directed, the one, consider to select the direction that veil density is big relatively in the diamond crystal structure to make blade, to guarantee the wearing quality of diamond cutter; The 2nd, consider that blade is subjected to force direction how to avoid the cleavage direction of diamond crystal, design has inconsiderate slightly, the anisotropy of diamond monocrystalline and cleavage characteristic very likely become the book weakness of diamond cutter, cause diamond blade insufficient strength in processing or use, and it is broken to cause the diamond blade to split; The 3rd, be according to the processing technology requirement of diamond cutter, the nonhomogeneous hardness from the diamond crystal different directions is considered the processing orientation of diamond cutter.Process the hardest diamond crystal, that will design each machined surface of diamond cutter by the nonhomogeneous hardness of diamond crystal ponders the polishing direction, so that the design diamond cutter can be realized processing.Must make the reverse processing polishing that can implement the blade face in two blade faces of diamond blade such as, Design and Machining orientation, otherwise, even the processing directional energy of design satisfies all other requirements, finally also can fail because of the polishing that can not implement blade.Therefore, the processing orientation of diamond crystal is the key of diamond cutter processing design.
In the design of diamond cutter, for the edge strength that guarantees diamond cutter reaches processing and request for utilization, all adopt the bigger angle of wedge usually, must be as the angle of wedge of conventional diamond cutting tool greater than 75 degree.The angle of wedge that increases diamond cutter can improve edge strength, but the cutter angle of wedge is big more, and the blade sharpness is poor more.Smooth smooth in order to guarantee the tangent plane after the optical fiber glass-cutting, so that light signal can pass through cut surface smoothly, the blade of diamond cutter for cutting optical fibers must be very sharp, so the angle of wedge of this cutter, and under the guaranteed situation of intensity, wishing can be smaller.The design of accurate miniature diamond cutter for cutting optical fibers, the main difficult point of processing are: (1) cutting optical fibre needs cutter very sharp, so the angle of wedge of diamond cutter is smaller, and this makes the design difficulty of edge strength and processing technology bigger; (2) diamond cutter for cutting optical fibers belongs to miniature diamond cutter, process to the orientation of diamond cutter, fix, ponder, detection etc. all has big difficulty, causes machining precision to be difficult to guarantee, passing rate of processing is lower; (3) diamond cutter for cutting optical fibers is using rear knife edge to need repeatedly to repair, and is very high to the repeatable accuracy requirement of processing technology.
The inventive method can: the blade density that makes diamond cutter is maximum relatively, make the covalent bond structure of diamond blade microcosmic be symmetry status, make the edge strength of diamond cutter and fiber cut quality be improved (blade microcosmic covalent bond structure is meant the carbon atom covalent bond crystal structure state on the corresponding crystal orientation of diamond blade).Processing technology of the present invention is easy, reliable; The making of diamond cutter and reparation, its precision height, efficient are also high.
Below in conjunction with Fig. 1 to Fig. 5, technical scheme of the present invention is carried out describe, in general terms, introduction and explanation.
Fig. 1 is the synoptic diagram that the inventive method is implemented in an octahedron; Fig. 2 is the octahedral synoptic diagram among Fig. 1; Fig. 3 is the diamond cutter head synoptic diagram among Fig. 1; Fig. 4 is the schematic perspective view that machines back diamond cutter head; Fig. 5 be the diamond cutter head synoptic diagram.Illustrate: about L 3Axle on a standard octahedron, has eight faces, and a L is arranged on each face 3Axle is so have eight L on this standard octahedron 3Axle; Among the above-mentioned figure, the L of part only draws 3The axle, whole L does not draw 3Axle.
The symbol that occurs in this patent file (001), (
Figure 20091004793731000021
), (100), (110), (111), represent the symbol of a crystal face at crystal orientation rear space relative position, be called the Michaelis symbol of crystal face.
A kind of processing design method of diamond cutter for cutting optical fibers, described processing design comprises processing design method in manufacturing first and the method for repairing again after using; Be characterized in described processing design method in manufacturing first, may further comprise the steps,
A. select Ia or Ib type rough diamond monocrystal or Ib type synthesizing diamond monocrystal for use, the requirement of selecting for use also has: a. volume is more than the 10mm3; B. cleanliness reaches the adamantine standard of one-level crusher; C. crystalline form is complete, and perhaps the part that crystalline form is complete accounts for more than 50% of whole monocrystal;
B. observe, check the diamond monocrystal with magnifier, determine a crystallographic axis axially as diamond blade direction;
C. utilize the growth characteristics of diamond crystal, the dissolving characteristic of diamond crystal, the symmetry of diamond crystal, the anisotropy rule of diamond crystal, determine the processing base face of diamond cutter, described definite, its content comprises design effort and checking work;
When implementing the processing base face of described definite diamond cutter, its target call is as follows,
A. processing design object is the rough diamond monocrystal, and its target call is the combination in any that comprises following content:
The diagonal line of quadrilateral erosion line is parallel on processing base face and vertical (100) crystal face;
Processing base face is 54 ° of 44 ' angles with (111) crystal face;
Processing base face and stepped growth step, growth line are parallel;
One side in the pyrometric cone on processing base face and (111) crystal face is parallel;
One side of inverted triangle erosion line on processing base face and (111) crystal face is parallel;
Processing base face is parallel with the parallel erosion line on (110) crystal face or be symmetry status with netted growth line;
Processing base face is medium with (111) crystal face---cleavage plane is 54 ° of 44 ' angles fully;
Processing base face is parallel with the stepped striped of the imperfect cleavage of (110) crystal face;
Processing base face is parallel with two crystallographic axis of diamond crystal; Described two crystallographic axis, its direction is determined by (210) the face corrosion direction position on (111) crystal face position of crystal, (100) crystal face position, (110) crystal face;
B. processing design object is the synthesizing diamond monocrystal, and its target call is the combination in any that comprises following content:
Processing base face is 54 ° of 44 ' angles with (111) crystal face;
Processing base face and stepped growth step, growth line are parallel;
One side in the pyrometric cone on processing base face and (111) crystal face is parallel;
Processing base face is medium with (111) crystal face---cleavage plane is 54 ° of 44 ' angles fully;
Processing base face is parallel with the stepped striped of the imperfect cleavage of (110) crystal face;
Processing base face is parallel with two crystallographic axis of synthesizing diamond crystal; Described two crystallographic axis, its direction is determined by the seed crystal phantom orientation on (111) crystal face position of crystal, (100) crystal face position, (110) crystal face position, the synthesizing diamond crystal;
D. accurately determine the orientation of blade face with the processing base face of determining; Determine the orientation of two knife faces vertical then with basal plane; Reprocess two knife faces;
E. with described two knife faces respectively as locating surface, implement the blade face of diamond cutter and the processing of blade.
An explanation done in the noun " crystallographic axis " that occurs in the above description.In the art, X-axis, Y-axis, Z axle also are referred to as crystallographic axis.
Below each further technical scheme is described, introduces and illustrates.
1. further technical scheme.
Described processing base face be defined as (001), (
Figure 20091004793731000022
) crystal face, described blade had been not only parallel with (001) crystal face, but also and by the plane parallel at X crystallographic axis, Y crystallographic axis place; Described blade and two L 3Plane parallel or described blade and two L at axle place 3Nonparallelism≤3 ° between the plane at axle place; Described blade face becomes 59 ° ± 1 ° angle with described processing base face; Described two knife faces vertical with described processing base face and with two L 3The axle place plane parallel, perhaps described two knife faces vertical with described processing base face and with two L 3Nonparallelism≤3 ° between the plane at axle place.
Above-mentioned partial content can describe in conjunction with Fig. 5: the blade face becomes 59 ° ± 1 ° angle, knife face vertical with basal plane with processing base face, and angle of wedge maximal value is that 64 °, minimum value are 60 °.Must compare greater than 75 ° of angles with the angle of wedge of conventional diamond cutting tool, the diamond cutter that the inventive method is produced can be sharp a lot.
2. further technical scheme.
Described blade, it is on the ranks of a density maximum of diamond crystal (100) veil, and its line density is
Figure G2009100479373D00061
(a=0.356nm), described blade, its microcosmic covalent bond structure is the symmetry status that can improve intensity and wearing quality.
The residing microcosmic crystal structure of the processing base face orientation of above-mentioned diamond cutter and blade is on the ranks of a density maximum of diamond crystal (100) veil the diamond blade, and its line density is
Figure G2009100479373D00062
(a=0.356nm), the microcosmic covalent bond structure of blade is symmetry status, thereby diamond edge strength and wearing quality all are improved.Simultaneously, also make diamond cutter machining process diamond the location, ponder, polishing, detection side be to being symmetry completely, make location, fixing, detection, the machined surface calibration of this miniature diamond cutter work in-process and ponder that the polishing direction has all reached standardization.When diamond cutter processing or blade reparation, as long as make positioning and fixing, just can carry out the processing of blade face or the reparation of blade with knife face, the precision and the efficient of processing and reparation all are improved.
Blade microcosmic covalent bond structure is meant the carbon atom covalent bond crystal structure state on the corresponding crystal orientation of diamond blade.
3. further technical scheme.
Described method of repairing again after using is meant: with described two knife faces respectively as locating surface, implement the blade face of diamond cutter and the reparation of blade.
Embodiment one
The concrete introduction with the processing design method in manufacturing first, the work of the making diamond cutter head that carries out.Be described and understand in conjunction with Fig. 1 to Fig. 5.
Selecting materials of diamond cutter: check, select for use Ia or Ib type rough diamond monocrystal body (being natural diamond) or Ib type synthesizing diamond monocrystal (being diamond synthesis); Crystalline form is complete or be not less than 1/2nd crystal, and volume reaches more than the 10mm3; Cleanliness reaches the adamas requirement of one-level crusher.
Observe, check the diamond monocrystal with magnifier, to the crystal habit feature and the dissolving characteristic check of different shape diamond monocrystal, determine a crystallographic axis axially as diamond blade direction.
Utilize the growth characteristics of diamond crystal, the dissolving characteristic of diamond crystal, the symmetry of diamond crystal, the anisotropy rule of diamond crystal, determine the processing base face of diamond cutter.
Considering, during the Design and Machining basal plane, should consider that the diamond cutter head of shaping finally can meet: processing base face be defined as (001), ( ) crystal face, blade had been not only parallel with (001) crystal face, but also and by the plane parallel at X crystallographic axis, Y crystallographic axis place; Blade and two L 3Plane parallel, blade and two L at axle place 3Nonparallelism≤3 ° between the plane at axle place; The blade face becomes 59 ° ± 1 ° angle with processing base face; Two knife faces vertical with processing base face and with two L 3The plane parallel at axle place, perhaps two knife faces vertical with processing base face and with two L 3Nonparallelism≤3 ° between the plane at axle place.
According to the solution theory of the Bradley of crystal growth dimension rule and contrary Bradley dimension rule, can determine the crystal orientation of this processing base face by diamond crystal habit feature and dissolving characteristic, and it is definite that this basal plane is done the judgement of crystallographic axis position.Detect, verify according to select materials crystal concrete crystal habit feature and dissolving characteristic then, determine Design and Machining basal plane accurately.
The content of determining work comprises design effort and checking work, and their target call is divided into two classes: a class is to the rough diamond monocrystal; Another kind of to the synthesizing diamond monocrystal.Existing division is as follows.
The first kind, the processing design object is the rough diamond monocrystal, its target call is the combination in any that comprises following content: it is parallel that quadrilateral loses the diagonal line of line on processing base face and vertical (100) crystal face; Processing base face is 54 ° of 44 ' angles with (111) crystal face; Processing base face and stepped growth step, growth line are parallel; One side in the pyrometric cone on processing base face and (111) crystal face is parallel; One side of inverted triangle erosion line on processing base face and (111) crystal face is parallel; Processing base face is parallel with the parallel erosion line on (110) crystal face or be symmetry status with netted growth line; Processing base face is medium with (111) crystal face---cleavage plane is 54 ° of 44 ' angles fully; Processing base face is parallel with the stepped striped of the imperfect cleavage of (110) crystal face; Processing base face is parallel with two crystallographic axis of diamond crystal; Described two crystallographic axis, its direction is determined by (210) the face corrosion direction position on (111) crystal face position of crystal, (100) crystal face position, (110) crystal face.
Second class, the processing design object is the synthesizing diamond monocrystal, its target call is the combination in any that comprises following content: processing base face is 54 ° of 44 ' angles with (111) crystal face; Processing base face and stepped growth step, growth line are parallel; One side in the pyrometric cone on processing base face and (111) crystal face is parallel; Processing base face is medium with (111) crystal face---cleavage plane is 54 ° of 44 ' angles fully; Processing base face is parallel with the stepped striped of the imperfect cleavage of (110) crystal face; Processing base face is parallel with two crystallographic axis of synthesizing diamond crystal; Described two crystallographic axis, its direction is determined by the seed crystal phantom orientation on (111) crystal face position of crystal, (100) crystal face position, (110) crystal face position, the synthesizing diamond crystal.
Carry out following work then.
Accurately determine the orientation of blade face with the processing base face of determining; Determine the orientation of two knife faces vertical then with basal plane; Reprocess two knife faces.
With two knife faces respectively as locating surface, implement the blade face of diamond cutter and the processing of blade.
The requirement of processing work: processing base face be defined as (001), (
Figure 4
) crystal face, blade had been not only parallel with (001) crystal face, but also and by the plane parallel at X crystallographic axis, Y crystallographic axis place; Blade and two L 3Plane parallel, blade and two L at axle place 3Nonparallelism≤3 ° between the plane at axle place; The blade face becomes 59 ° ± 1 ° angle with processing base face; Two knife faces vertical with processing base face and with two L 3The plane parallel at axle place, perhaps two knife faces vertical with processing base face and with two L 3Nonparallelism≤3 ° between the plane at axle place.Above-mentioned partial content can describe in conjunction with Fig. 5: the blade face becomes 59 ° ± 1 ° angle, knife face vertical with basal plane with processing base face, and angle of wedge maximal value is that 64 °, minimum value are 60 °.
In addition, just better if processing can also meet following requirement: blade is on the ranks of a density maximum of diamond crystal (100) veil, and its line density is
Figure G2009100479373D00081
(a=0.356nm), and two blade faces that will constitute blade be processed into symmetry status.
Embodiment two
For the diamond cutter for cutting optical fibers of manufacturing according to the inventive method, after using, repair if desired, very easily at that time, if with two knife faces on the diamond cutter respectively as locating surface, carry out the blade face of diamond cutter and the reparation of blade are got final product.

Claims (2)

1. the processing design method of a diamond cutter for cutting optical fibers, described processing design comprises processing design method in manufacturing first and the method for repairing again after using; It is characterized in that: described processing design method in manufacturing first, may further comprise the steps,
A. select Ia or Ib type rough diamond monocrystal or Ib type synthesizing diamond monocrystal for use, the requirement of selecting for use also has: a. volume is 10mm 3More than; B. cleanliness reaches the adamantine standard of one-level crusher; C. crystalline form is complete, and perhaps the part that crystalline form is complete accounts for more than 50% of whole monocrystal;
B. observe, check the diamond monocrystal with magnifier, determine a crystallographic axis axially as diamond blade direction;
C. utilize the growth characteristics of diamond monocrystal, the dissolving characteristic of diamond monocrystal, the symmetry of diamond monocrystal, the anisotropy rule of diamond monocrystal, determine the processing base face of diamond cutter, described definite, its content comprises design effort and checking work;
When implementing the processing base face of described definite diamond cutter, its target call is as follows,
A. processing design object is the rough diamond monocrystal, and its target call is the combination in any that comprises following content:
The diagonal line of quadrilateral erosion line is parallel on processing base face and vertical (100) crystal face;
Processing base face is 54 ° of 44 ' angles with (111) crystal face;
Processing base face and stepped growth step, growth line are parallel;
One side in the pyrometric cone on processing base face and (111) crystal face is parallel;
One side of inverted triangle erosion line on processing base face and (111) crystal face is parallel;
Processing base face is parallel with the parallel erosion line on (110) crystal face or be symmetry status with netted growth line;
Processing base face is medium with (111) crystal face---cleavage plane is 54 ° of 44 ' angles fully;
Processing base face is parallel with the stepped striped of the imperfect cleavage of (110) crystal face;
Processing base face is parallel with two crystallographic axis of diamond monocrystal; Described two crystallographic axis, its direction is determined by (210) the face corrosion direction position on (111) crystal face position of crystal, (100) crystal face position, (110) crystal face;
B. processing design object is the synthesizing diamond monocrystal, and its target call is the combination in any that comprises following content:
Processing base face is 54 ° of 44 ' angles with (111) crystal face;
Processing base face and stepped growth step, growth line are parallel;
One side in the pyrometric cone on processing base face and (111) crystal face is parallel;
Processing base face is medium with (111) crystal face---cleavage plane is 54 ° of 44 ' angles fully;
Processing base face is parallel with the stepped striped of the imperfect cleavage of (110) crystal face;
Processing base face is parallel with two crystallographic axis of synthesizing diamond monocrystal; Described two crystallographic axis, its direction is determined by the seed crystal phantom orientation on (111) crystal face position of crystal, (100) crystal face position, (110) crystal face position, the synthesizing diamond monocrystal;
D. accurately determine the orientation of blade face with the processing base face of determining; Determine the orientation of two knife faces vertical then with basal plane; Reprocess two knife faces;
E. with described two knife faces respectively as locating surface, implement the blade face of diamond cutter and the processing of blade;
Described processing base face be defined as (001), (
Figure 20091004793731000011
) crystal face, described blade had been not only parallel with (001) crystal face, but also and by the plane parallel at X crystallographic axis, Y crystallographic axis place; Described blade and two L 3Plane parallel or described blade and two L at axle place 3Nonparallelism≤3 ° between the plane at axle place; Described blade face becomes 59 ° ± 1 ° angle with described processing base face; Described two knife faces vertical with described processing base face and with two L 3The axle place plane parallel, perhaps described two knife faces vertical with described processing base face and with two L 3Nonparallelism≤3 ° between the plane at axle place;
Described method of repairing again after using is meant: with described two knife faces respectively as locating surface, implement the blade face of diamond cutter and the reparation of blade.
2. the processing design method of a kind of diamond cutter for cutting optical fibers according to claim 1 is characterized in that: described blade, and it is on the ranks of a density maximum of diamond monocrystal (100) veil, and its line density is
Figure FSB00000595475400021
Described a is 0.356nm, described blade, and its microcosmic covalent bond structure is the symmetry status that can improve intensity and wearing quality.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1294542A (en) * 1998-01-27 2001-05-09 彼得·格卢克 Diamond cutting tool
CN1733442A (en) * 2004-08-13 2006-02-15 上海老凤祥钻石加工中心有限公司 Diamond optical fiber cutter processing and designing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1294542A (en) * 1998-01-27 2001-05-09 彼得·格卢克 Diamond cutting tool
CN1733442A (en) * 2004-08-13 2006-02-15 上海老凤祥钻石加工中心有限公司 Diamond optical fiber cutter processing and designing method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP昭62-271605A 1987.11.25
JP特开平8-11006A 1996.01.16

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