CN101827500B - Formation method of conical structural hole - Google Patents
Formation method of conical structural hole Download PDFInfo
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Abstract
The invention provides a formation method of a conical structural hole capable of improving the heating efficiency. The invention is characterized in that the method comprises the following steps: A. determining the range of the optimum welding point melting temperature Tjb; B. determining the inlet temperature Trb conforming to the range of the optimum welding point melting temperature Tjb; C. determining the inlet speed Vrb according to a curve of different welding point temperatures corresponding to different inlet speeds; D. calculating the range of the upper bottom diameter dr of a single-hole initial set inlet; E. optimizing and calculating the single-hole inlet integral factor which includes the determination of the optimum inlet height hb, the optimum inlet upper bottom diameter drb and the optimum inlet angle arb; and F. determining a gap Lb between holes. The invention combines the advantages of numerical value simulation, can replace the experiment process in a large selective parameter range, and can obtain the optimizing parameter combinations of the problems to be solved at high efficiency and low cost, so the conical structural hole with high heating efficiency and good structural dimension can be formed in a determination method.
Description
Technical field
The present invention relates to a kind of formation method of conical structural hole; Said conical structural hole can be used for the hot-blast outlet part in the circuit board component reflow soldering equipment; Or be used for the hot blast heating exit portion of circuit board component device for disassembling, or be used for other and spray the device that carries out heat exchange etc. through fluid.
Background technology
With regard to wiring board, related to that for example circuit board component Reflow Soldering welding process and circuit board component are disassembled process.
1. solder reflow process
According to Chinese epoxy resin employer's organization statistics, China became second-biggest-in-the-world printed circuit board (PCB) (PCB) producing country in 2003, and China successfully replaced Japan in 2006, became global first epoxy resin PCB producing country.The World PCB output value reached 46,000,000,000 dollars in 2008, and China accounts for 28% of the global gross output value, and output has then surpassed 50%.
Production process after the PCB is components and parts surface mount (SMT), Reflow Soldering, wave-soldering, detects, dispatches from the factory.Wherein, in solder reflow process, at first use the heater strip heated air, let air pass a series of holes again, accomplish the process of Reflow Soldering behind the fusing soldering paste afterwards the surface-pasted components and parts of heat transferred PCB.Energy consumption in this hot blast heating and the transmittance process is very big, but can improve the efficient of heat exchange through the structure that the change hot blast portals, thereby realizes energy-saving effect.
Yet, existing bottoming hole structure and size often rule of thumb or the physical dimension of equipment and definite, whether the manufacturing approach of equipment or method for using are also unclear is exactly the version and the size of optimum.
2. the wiring board element is disassembled process
PCB is the control centre of electric equipment products, is widely used in computer and all kinds of electromechanical equipment.Along with a large amount of productions of electronic product and more and more fast scrapping the cycle, the quantity of waste and old PCB is also in rapid increase.From 2003, China will have at least 5,000,000 television sets, 4,000,000 refrigerators, 6,000,000 washing machines every year, and surpassed 2,000 ten thousand computers and reach and scrap the time limit.
Various electronic devices and components on the PCB surface, have been assembled; Contain multiple metal (gold, silver, palladium, niobium, copper, iron, aluminium etc.) in PCB and these components and parts; The content of metal species material is about 40%; The result of study of Technical University Of Denmark shows; Just contain about 272.4kg plastics, 129.84kg copper, 0.45kg gold, 40.86kg iron, 29.51kg lead, 19.97kg nickel, 9.99kg antimony among the PCB that 1t arbitrarily collects, except plastics and copper mainly are present among the PCB, other precious metal mainly is present in the electronic devices and components.But the method for the waste and old PCB of current domestic and international processing mainly contains burning disposal, chemical Treatment, Mechanical Crushing processing, microbe stripping metal, supercritical fluid technique and ultrasonic technology etc.In processing procedure, exist a problem, that is exactly that the higher relatively electronic devices and components of precious metal content mix with the particle of PCB through broken back fully, thereby has diluted precious metal particles, makes follow-up extractive process more complicated, and cost is also higher.
If, will produce good environment and economic benefit to the recycling of classifying of these electronic devices and components.When these electronic wastes are realized that resource is utilized again, improved the economic benefit of processing procedure, reduced harm to environment, more help developing the recycling economy in this field.
Some colleges and universities and the research institution domestic since 2005 have progressively carried out the research of disassembling circuit board component, and the author has submitted in 2005 that application number is 200510103506.6, the patent application of " a kind of circuit board component thermal disassembling equipment and method " by name to.After this, similarly components and parts are disassembled the also constantly appearance of technology related patent U.S. Patent No. file.
But these patent documents all are to disassemble technology to components and parts on the monolithic wiring board specially, all do not refer in detail to the problem that improves efficiency of energy utilization.
Summary of the invention
The objective of the invention is to, a kind of formation method of conical structural hole is provided, adopt this formation method can be easy to obtain the version and the size of optimum conical structural hole.
To achieve these goals,, the formation method of following a kind of conical structural hole is provided, comprises according to an embodiment of the present invention:
A, confirm best solder joint fusion temperature T
JbScope;
B, determine and meet best solder joint fusion temperature T
JbThe inlet temperature T of scope
Rb
C, confirm entrance velocity V according to the curve of the corresponding different weld point temperature of different entrance velocities
Rb
D, calculate single hole and just be incorporated into a mouthful upper base diameter d
rScope;
The inlet composite factor of E, computation optimization single hole, said composite factor comprise best entrance height h
b, best inlet upper base diameter d
RbAnd best inlet angle [alpha]
RbConfirm;
F, confirm the spacing L between the hole
b
The present invention combines the numerical simulation advantage; Can replace experimentation in the optional parameters scope on a large scale; Make up with the efficient and low-cost parameters optimization that obtains to deal with problems, thereby can form the preferable conical structural hole of the high physical dimension of a kind of efficiency of heating surface with the method for confirming.
According to the formation method of above-mentioned conical structural hole, wherein said step B comprises:
The mode of numbered analog simulation is set up the threedimensional model of bellmouth structure, sets entrance velocity, calculates the different weld point temperature that obtained by different inlet temperatures, chooses to meet best solder joint fusion temperature T
JbThe weld point temperature of scope;
From selected weld point temperature, select peaked weld point temperature, its corresponding inlet temperature is as determined inlet temperature.
According to the formation method of above-mentioned conical structural hole, wherein said step C comprises:
The mode of numbered analog simulation calculates the curve by the corresponding different weld point temperature of different entrance velocities;
Entrance velocity value when choosing the slope of curve and beginning the to descend determined value of doing.
According to the formation method of above-mentioned conical structural hole, wherein said step D comprises:
The mode of numbered analog simulation calculates the curve of the corresponding different weld point temperature of different inlet upper base diameters;
Choose the pairing inlet upper base of the highest weld point temperature place certain limit diameter range as just being incorporated into a mouthful upper base diameter range.
According to the formation method of above-mentioned conical structural hole, wherein said step e comprises:
The mode of numbered analog simulation calculates by many groups of inlet composite factors and does the many groups of parameters that comprise different heating numerical value that the factor level orthogonal test obtains, and selects according to required heating numerical parameter.
Different heating numerical value has different significance levels, and different weight parameters is set;
According to the total heat value result of weight calculation, the conduct that the selection result value is big is selected.
Formation method according to above-mentioned conical structural hole is characterized in that, said step F comprises:
Calculate a plurality of weld point temperature that draw by a plurality of inlet spacings according to the numbered analog simulation method;
To be in best solder joint fusion temperature T
JbThe pairing inlet spacing of lower limit as the best spacing that enters the mouth.
Description of drawings
Fig. 1 is the flow chart of the formation method of conical structural hole of the present invention.
Fig. 2 is the entrance structure figure of conical structural hole.
Fig. 3 is the structure chart between the porous of conical structural hole.
Fig. 4 is the weld point temperature distribution map that draws according to different entrance velocity simulations.
Fig. 5 is the weld point temperature distribution map that simulation draws according to difference inlet upper base diameter.
Fig. 6 is the model sketch map of two inlets among Fig. 3.
Fig. 7 is the distribution map of the weld point temperature that simulation draws according to difference inlet spacing.
Fig. 8 is the velocity field cloud atlas of inlet spacing when being respectively 50mm, 56mm and 60mm; Plane of symmetry velocity field cloud atlas when plane of symmetry velocity field cloud atlas, (b) when wherein (a) is for inlet spacing L=50mm is inlet spacing L=56mm, the plane of symmetry velocity field cloud atlas during (c) for inlet spacing L=60mm.
Embodiment
Fig. 1 shows the flow chart of the formation method of conical structural hole of the present invention.
Is example below in conjunction with accompanying drawing with the optimizing process of a concrete outcome instance, and the formation method of the conical structural hole of the hot-blast outlet of circuit board component reflow soldering of the present invention or device for disassembling is elaborated.
Adopt the conical structural hole and the spread pattern thereof of the improved efficiency of heating surface of this method formation to distinguish as shown in Figures 2 and 3, its concrete data are following:
(1) basic data: with the air is heat medium, adopts the heat transfer type of thermal convection, best solder joint fusion temperature T
Jb=200 ℃～230 ℃;
(2) influencing factor data: when inlet and substrate distance H=50mm, best inlet temperature T
Rb=235 ℃ (508k), best entrance velocity V
Rb=8m/s;
(3) single hole size: when inlet and substrate distance H=50mm, best inlet form comprises best entrance height h
Rb=6mm, best inlet upper base diameter d
Rb=16mm, best inlet angle [alpha]
Rb=20 ° of (best diameter D that go to the bottom that enter the mouth
Rb=20.36mm);
(4) size between the porous: when inlet and substrate distance H=50mm, two center line of suction optimal spacing L
bBetween 50mm to 56mm, i.e. 50mm≤L
b≤56mm.
Below, according to the formation method of conical structural hole of the present invention shown in Figure 1, the concrete computational process that obtains the The above results data is elaborated.
Step 101: according to existing experience and reference data, as disassemble temperature required, fusing time etc., determine be used for the solder joint fusing the best solder joint fusion temperature T that will reach
JbScope.
For the wiring board of tin-lead solder before 2006, the heating-up temperature on components and parts surface generally is controlled between 210 ℃～230 ℃; For the wiring board that uses lead-free solder after RoHS instruction in 2006 is implemented, temperature generally is controlled between 240 ℃～260 ℃.If consider that on the other hand heating-up temperature is too low, components and parts also can't be dismantled.And then after comprehensive, determine best solder joint fusion temperature T
Jb=200 ℃～230 ℃.Be understood that, for to disassemble the difference of wiring board or components and parts, the best solder joint fusion temperature scope that solder joint fusing institute will reach is difference also, all can confirm according to practical experience and reference data.
Set up inlet upper base diameter d
1=14mm, the inlet angle [alpha]
1=20 °, entrance height h
1The threedimensional model of the bellmouth structure of=4mm, and set entrance velocity V
1=8m/s.According to this model; Utilize numbered analog simulation (adopt in the present embodiment is the Fluent of U.S. ANSYS company exploitation) to calculate a plurality of weld point temperature that obtain by a plurality of inlet temperatures; Choose the weld point temperature that meets best solder joint fusion temperature scope; From selected weld point temperature, select peak based on the reason of disassembling efficient then, its corresponding inlet temperature is best inlet temperature.
In this specific embodiment, analog simulation calculates as inlet temperature T
rBe respectively the first initial inlet temperature T
R1When=225 ℃ (498k) and the second initial inlet temperature T
R2When=235 ℃ (508k), be that the center of circle, 10mm are the mean temperature T in the scope of radius with the solder joint
eWith maximum temperature T
h, therefrom select then and meet best solder joint fusion temperature T
Jb=200 ℃～230 ℃ mean temperature T
eAnd maximum temperature T
h, from selected result, choosing peak then, the pairing initial inlet temperature T of selected preferable value
rAs best inlet temperature T
Rb
The analog simulation result shows, around solder joint owing to there is the heat exchange of solder joint and air-flow, so solder joint temperature on every side is low slightly.When inlet temperature is the first initial inlet temperature T
R1In the time of=225 ℃, be the center with the solder joint, radius is the first solder joint mean temperature T in the 10mm scope
E1=215.64 ℃, the first solder joint maximum temperature T
H1=222.7 ℃; When inlet temperature is the second initial inlet temperature T
R2In the time of=235 ℃, be the center with the solder joint, radius is the second solder joint mean temperature T in the 10mm scope
E2=224.48 ℃, the second solder joint maximum temperature T
H2=232.88 ℃.
Through judging that two kinds of situation all meet above-mentioned definite best solder joint fusion temperature T
Jb=200 ℃～230 ℃, all as choosing object.Then according to the preferable mean temperature T of following principles of selected
eAnd maximum temperature T
h:
Consider when temperature is high and can shorten heating time, be beneficial to solder joint and melt fast, so get the object that conduct that wherein temperature is high is chosen.So being taken into mouthful temperature is the second initial inlet temperature T
R2=235 ℃ as selected best inlet temperature T
RbIn addition, because the maximum temperature of inlet should not surpass 235 ℃, can determine best inlet temperature T thus
Rb=235 ℃.
Step 103 is confirmed entrance velocity V according to the curve of the corresponding different weld point temperature of different entrance velocities
Rb
At first, calculate the curve that is obtained different weld point temperature by different entrance velocities according to numbered analog simulation, this curve is specifically referring to shown in Figure 4.Analyzing this curve can know, inlet hot blast speed is big more, and the temperature at weld point temperature place is high more, and along with the increase of inlet velocity, weld point temperature increases fast, is presented as that slope is very big.But along with the continuous increase of entrance velocity, specific air consumption linearly rises, and therefore after wind speed reached certain value, weld point temperature increased slower, is presented as that slope diminishes.After promptly having crossed this value, it is just not obvious to the influence of the efficiency of heating surface to improve speed again, and when promptly arriving certain value, the slope of curve obviously descends.That is to say, compare that the energy that is consumed for raising speed is but more, this obviously not desired reaching with the efficient that heating-up temperature increases.Therefore, though choose relatively low that of heating-up temperature high specific air consumption, the entrance velocity when promptly choosing the slope of curve and beginning to descend is elected to be and is best entrance velocity.
Specifically, set inlet and substrate distance H=50mm, inlet temperature is the best inlet temperature T that aforementioned calculation goes out
Rb=235 ℃, heating time, t=15s calculated entrance velocity V through the analog simulation mode
rWhen being respectively 4m/s, 6m/s, 8m/s, 10m/s, 12m/s, the weld point temperature T that is reached
m
Tendency chart is as shown in Figure 4 as a result, and abscissa is represented entrance velocity V among this figure
r, ordinate is represented weld point temperature T
mFrom this figure, can find out, from entrance velocity V
r=8mm/s begins, and slope of a curve begins to descend.According to above-mentioned selection principle, choosing 8mm/s is best entrance velocity, i.e. V
Rb=8mm/s.
Inlet upper base diameter d
rReach effective heating-up temperature near needing to make solder joint.
In this step, calculate a plurality of weld point temperature that obtain by a plurality of inlet upper base diameters, weld point temperature is in the optimum range pairing inlet upper base diameter range as just being incorporated into a mouthful upper base diameter range according to the numbered analog simulation method.
Specifically, set entrance height h
1=4mm, inlet angle [alpha]
1=20 °, inlet temperature are above-mentioned best inlet temperature T
Rb=235 ℃, entrance velocity are above-mentioned best entrance velocity V
Rb=8m/s, heating time, t=10s adopted the method for numbered analog simulation to calculate when inlet upper base diameter d
rBe respectively the weld point temperature T of single hole under 12mm, 14mm, 16mm, 18mm, 20mm and six kinds of different situations of 22mm
m, trend is as shown in Figure 5 as a result for it.
The abscissa upper base diameter d of representing to enter the mouth among Fig. 5
r, ordinate is represented the weld point temperature T that reached
mAs can be seen from Figure 5, when inlet upper base diameter d
rDuring less than 14mm, it is big more to enter the mouth, and the weld point temperature that reaches behind the heating 10s is high more, and when inlet upper base diameter d
rBehind 14mm, increase inlet upper base diameter again, the temperature that reaches behind the heating 10s decreases, and this is that air can not smooth and easyly circulate under inlet, thereby influences the efficiency of heating surface because inlet is excessive.
According to this result, choosing heating-up temperature is that single hole just is incorporated into mouthful upper base diameter, i.e. a d at 139 ℃-140 ℃ pairing inlet upper base diameters of peak
r=14mm to 16mm.
In addition, also to confirm entrance height h
rAnd inlet angle [alpha]
rScope.
Carrying out entrance height h
rChoose the time, setting fluid space is the column type space of diameter 30mm, height 30mm, inlet diameter is 10mm; The inlet angle [alpha] is 0 °, according to the symmetry of model, sets up threedimensional model; The inlet porting temperature is 503k (230 ℃), entrance velocity 8m/s, 25 ℃ of initial temperatures.Set up the model that entrance height h is 0mm, 2mm, 4mm, 6mm, 8mm, 10mm, 12mm, 14mm, 16mm respectively; Calculate the solder joint fusing time; Result of calculation shows, entrance height not significantly influence during to heating therefore can be according to the situation of equipment installation with entrance height h
rBe selected between the 4mm to 6mm.
Confirming the inlet angle [alpha]
rThe time, need to consider of the influence of inlet angle to the efficiency of heating surface.Setting inlet α angle respectively is that its temperature field of 0 °, 10 °, 20 °, 30 °, 40 °, 50 ° analog computations distributes; Characteristic according to general wiring board; Therefore the height of solder joint gets on the substrate 1.5mm place face Temperature Distribution as investigating object, because Temperature Distribution is symmetrical distribution generally between 1mm～2mm; To reflect the Temperature Distribution on whole plane through Temperature Distribution on the line of planar central along X-direction; Result of calculation shows, α angle effective heating region maximum (be boundary division effective coverage with 200 ℃) between 20 °～30 ° the time is promptly chosen the inlet angle [alpha]
rIt is 20 ° to 30 °.
The method of step 105, employing numbered analog simulation is carried out the computation optimization of the inlet composite factor of single hole, comprising best entrance height h
b, best inlet upper base diameter d
RbAnd best inlet angle [alpha]
RbConfirm.
In this module; Calculate by many groups of inlet composite factors according to the numbered analog simulation method and to do the many groups of heating numerical parameters that the factor level orthogonal test obtains, will heat the pairing one group of composite factor that enters the mouth of numerical parameter optimum value as the best composite factor that enters the mouth.
Specifically, setting inlet temperature is best inlet temperature T
Rb=235 ℃ (508k), entrance velocity is best entrance velocity V
Rb=8m/s, 25 ℃ of initial temperatures, and with apart from the face of the high H ' of substrate=1.5mm as investigation face; Be characteristic face (referring to " characteristic curve " among Fig. 1; Because whole Temperature Distribution is symmetrical distribution, therefore reflect the Temperature Distribution on the full feature face with the Temperature Distribution on the characteristic curve), set up model; Do three factors, three horizontal quadrature analysis of experiments, and according to the single hole of the definite the best that simulates inlet form.
The factor level table is seen table 1, and orthogonal table is seen table 2, and the experimental data result of each group after analog simulation calculates sees table 3.
Table 1 factor level table
| Tested number | Level number (inlet upper base diameter d r/mm) | Level number (inlet angle [alpha] r/°) | Level number (entrance height h r/mm) |
| Test1 | 1(14) | 1(20) | 1(4) |
| Test2 | 1(14) | 2(25) | 2(5) |
| Test3 | 1(14) | 3(30) | 3(6) |
| Test4 | 2(15) | 1(20) | 2(5) |
| Test5 | 2(15) | 2(25) | 3(6) |
| Test6 | 2(15) | 3(30) | 1(4) |
| Test7 | 3(16) | 1(20) | 3(6) |
| Test8 | 3(16) | 2(25) | 2(5) |
| Test9 | 3(16) | 3(30) | 1(4) |
Table 2 orthogonal table L
9(3
3)
| Tested number | Solder joint fusing required time (s) | Effective heating surface (area) (HS (mm 2) |
| Test1 | 25.62 | 243.24 |
| Test2 | 25.9 | 232.31 |
| Test3 | 26.42 | 211.2 |
| Test4 | 25.17 | 339.73 |
| Test5 | 25.53 | 326.79 |
| Test6 | 24.58 | 314.1 |
| Test7 | 23.08 | 467.51 |
| Test8 | 24.87 | 452.3 |
| Test9 | 24.4 | 437.35 |
| Mean value | 25.06 | 336.06 |
Table 3 orthogonal experiments
According to calculating, with best solder joint fusion temperature T
Jb=200 ℃～230 ℃ lower limit 473k (200 ℃) is as the line of demarcation, with being divided into effective heating region and invalid heating region two parts on the characteristic face.
For unitized each investigation amount, carry out to give a definition:
T '=25.06/ solder joint fusing required time;
S '=effective heating surface (area) (HS/336.06
Orthogonal experiments is after reunification seen table 4.
| Tested number | T′ | S′ |
| Test1 | 0.98 | 0.72 |
| Test2 | 0.97 | 0.69 |
| Test3 | 0.95 | 0.63 |
| Test4 | 1.00 | 1.01 |
| Test5 | 0.98 | 0.97 |
| Test6 | 1.02 | 0.93 |
| Test7 | 1.09 | 1.39 |
| Test8 | 1.01 | 1.35 |
| Test9 | 1.03 | 1.30 |
Result after unified each the investigation amount of table 4
Interpretation, in above each item investigation amount, therefore the significance level of solder joint fusing required time, is set weight and is respectively 0.6 and 0.4 greater than the significance level of effective heating surface (area) (HS.Calculate and respectively test score, to obtain weighted average, the result sees table 5.
| The experiment number | Test1 | Test2 | Test3 | Test4 | Test5 |
| Score value | 0.88 | 0.86 | 0.82 | 1.00 | 0.98 |
| The experiment number | Test6 | Test7 | Test8 | Test9 | |
| Score value | 0.98 | 1.21 | 1.15 | 1.14 |
Table 5 is respectively organized experiment analysis results
Can be known that by table 5 the 7th group numerical value is maximum, the optimised form that promptly enters the mouth is the 7th group, that is, and and best entrance height h
Rb=6mm, best inlet upper base diameter d
Rb=8mm, best inlet angle [alpha]
Rb=20 ° is D thereby also can draw the best inlet diameter of going to the bottom
Rb=20.36mm.
Solder joint fusing required time is 23.08s under entering the mouth this moment, and specific air consumption is 37.12 * 10
-3M, effective heating surface (area) (HS 467.51mm of single inlet
2, effectively heating region temperature-averaging value is 492.56k (219.56 ℃), effective coverage temperature variance is 80.27.
In this step, calculate a plurality of weld point temperature that draw by a plurality of inlet spacings, will be in best solder joint fusion temperature T according to the numbered analog simulation method
JbThe pairing inlet spacing of lower limit as the best spacing that enters the mouth.
Two inlet models are as shown in Figure 6, set inlet and substrate spacing H=50mm, best entrance height h
Rb=6mm, best inlet upper base diameter d
Rb=16mm, the best diameter D that goes to the bottom that enters the mouth
Rb=20.36mm, best inlet temperature T
Rb=235 ℃, best entrance velocity V
Rb=8m/s, and getting apart from substrate 1.5mm place as characteristic face (reflecting the Temperature Distribution between two inlets with Temperature Distribution on the characteristic curve among Fig. 7) calculates respectively when two Temperature Distribution of spacing L when being 40mm, 50mm, 60mm that enter the mouth.Temperature Distribution is as shown in Figure 7 on the characteristic curve.Enter the mouth to the left side distance of center line O-O ' of A of point on the characteristic curve in the abscissa X presentation graphs 6 among Fig. 7, that is, the point in the scope of L/2 on the characteristic curve is to the distance of center line O-O '.
Equally with best solder joint fusion temperature T
Jb=200 ℃～230 ℃ lower limit 473k (200 ℃) is as the line of demarcation, the maximum spacing L that can find out two inlets by Fig. 7 at 50mm to the 60mm, i.e. 50mm≤L≤60mm.
In addition; Fig. 8 (a), Fig. 8 (b) and Fig. 8 (c) show respectively as inlet spacing L=50mm; Plane of symmetry velocity field cloud atlas can be known from this figure when L=56mm and L=60mm, when two inlet spacings excessive (L=60mm); The zone line of spacing does not reach the heating-up temperature value, and therefore two inlet spacings are unsuitable excessive.
In sum, two inlet center distance should be between 50mm～56mm, i.e. 50mm≤L
b≤56mm.
So far, the derivation of each result data in this specific embodiment finishes.
It should be noted that the numerical parameter in this embodiment is an instantiation in order to explain that conical structural hole formation method of the present invention is lifted, can not limit the present invention.
Claims (6)
1. the formation method of a conical structural hole is characterized in that, comprising:
A, confirm best solder joint fusion temperature T
JbScope;
B, determine and meet best solder joint fusion temperature T
JbThe inlet temperature T of scope
Rb
C, confirm entrance velocity V according to the curve of the corresponding different weld point temperature of different entrance velocities
Rb
D, calculate single hole and just be incorporated into a mouthful upper base diameter d
rScope, and definite entrance height h
rAnd inlet angle [alpha]
rScope;
The inlet composite factor of E, computation optimization single hole, said composite factor comprise best entrance height h
b, best inlet upper base diameter d
RbAnd best inlet angle [alpha]
RbConfirm;
F, confirm the spacing L between the hole
b
2. the formation method of conical structural hole according to claim 1 is characterized in that, said step B comprises:
The mode of numbered analog simulation is set up the threedimensional model of bellmouth structure, sets entrance velocity, calculates the different weld point temperature that obtained by different inlet temperatures, chooses to meet best solder joint fusion temperature T
JbThe weld point temperature of scope;
From selected weld point temperature, select peaked weld point temperature, its corresponding inlet temperature is as determined inlet temperature.
3. the formation method of conical structural hole according to claim 1 is characterized in that, said step C comprises:
The mode of numbered analog simulation calculates the curve by the corresponding different weld point temperature of different entrance velocities;
Entrance velocity value when choosing the slope of curve and beginning the to descend determined value of doing.
4. the formation method of conical structural hole according to claim 1 is characterized in that, said step D comprises:
The mode of numbered analog simulation calculates the curve of the corresponding different weld point temperature of different inlet upper base diameters;
Choose the pairing inlet upper base of the highest weld point temperature place certain limit diameter range as just being incorporated into a mouthful upper base diameter range;
Situation according to equipment is installed is confirmed entrance height h
rScope;
The field distribution of analog computation inlet temperature; The Temperature Distribution of investigation on the plane at substrate definite value height place; To reflect the Temperature Distribution on whole plane through Temperature Distribution on the line of this planar central, select to make the maximum angle of effective heating region as the inlet angle [alpha] along X-direction
r
5. the formation method of conical structural hole according to claim 1 is characterized in that, said step e comprises:
The mode of numbered analog simulation calculates by many groups of inlet composite factors and does the many groups of parameters that comprise different heating numerical value that the factor level orthogonal test obtains;
Different heating numerical value has different significance levels, and different weight parameters is set;
According to the total heat value result of weight calculation, the inlet composite factor of the correspondence that the selection result value is big is as selected.
6. the formation method of conical structural hole according to claim 1 is characterized in that, said step F comprises:
Calculate a plurality of weld point temperature that draw by a plurality of inlet spacings according to the numbered analog simulation method;
To be in best solder joint fusion temperature T
JbThe pairing inlet spacing of lower limit as the best spacing that enters the mouth.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201201088Y (en) * | 2008-04-25 | 2009-03-04 | 东莞市健时自动化设备有限公司 | Multiple proportionality jet current device |
| JP2009285720A (en) * | 2008-05-30 | 2009-12-10 | Nippon Dennetsu Co Ltd | Soldering method and soldering equipment |
| CN201423482Y (en) * | 2009-04-15 | 2010-03-17 | 东莞市安达自动化设备有限公司 | Nozzle elevating device of crest welder |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH11121920A (en) * | 1997-10-13 | 1999-04-30 | Nippon Telegr & Teleph Corp <Ntt> | Solder reflow method and device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201201088Y (en) * | 2008-04-25 | 2009-03-04 | 东莞市健时自动化设备有限公司 | Multiple proportionality jet current device |
| JP2009285720A (en) * | 2008-05-30 | 2009-12-10 | Nippon Dennetsu Co Ltd | Soldering method and soldering equipment |
| CN201423482Y (en) * | 2009-04-15 | 2010-03-17 | 东莞市安达自动化设备有限公司 | Nozzle elevating device of crest welder |
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| CN101827500A (en) | 2010-09-08 |
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