CN101815425A - Heat radiating method of high-power power supply and integrated heat radiating cabinet - Google Patents
Heat radiating method of high-power power supply and integrated heat radiating cabinet Download PDFInfo
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- CN101815425A CN101815425A CN 201010147790 CN201010147790A CN101815425A CN 101815425 A CN101815425 A CN 101815425A CN 201010147790 CN201010147790 CN 201010147790 CN 201010147790 A CN201010147790 A CN 201010147790A CN 101815425 A CN101815425 A CN 101815425A
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- power supply
- sidewall
- loam cake
- sectional material
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Abstract
The invention relates to a heat radiating method of a high-power power supply, wherein the cabinet of the power supply is an integrated heat radiating cabinet in a closed design and comprises a bottom, an upper cover and side walls. An aluminum extruded radiator is arranged at the bottom of the cabinet, and the smooth surface of the radiator faces the inside of the cabinet; the surface provided with heat radiating blades faces the outside; the upper cover of the cabinet is an integral sectional material, and an external connecting device for installing the power supply and/or a position for controlling the device are/is arranged on the upper cover; the side walls 2 of the cabinet are pieced by four independent single-chip sectional materials; the upper end and the lower end of each single-chip sectional material are respectively connected with the bottom and the upper cover of the cabinet; and after the device of the power supply is installed and a circuit is connected, glue is poured into the cabinet. Through the technical scheme, a mould has low manufacturing cost, convenient assembly and strong waterproof and burglarproof property and is particularly applicable for high-power inverse power supply boxes. In addition, because the cabinet is in an integrated design, the design requirement on electromagnetic compatibility of a high-power power supply circuit is greatly reduced.
Description
Technical field
The invention belongs to the heat sink technology field, specifically is the heat dissipating method and the integral heat dissipation cabinet of large power supply.
Background technology
In the prior art, the large power, electrically source heat-dissipating adopts more is provided with independent radiator or radiator fan on the related power device in the circuit board of power supply, some ventilating openings is set simultaneously and then constitutes the air channel to dispel the heat on the cabinet of power supply.And the cabinet of large power supply is all made by panel beating or by extrudate, its structure is comparatively single, and area of dissipation is less, and is not suitable for the heat radiation use of large power supply.Even squeeze out powerful housing, its manufacturing expense and die cost are also quite high.And, because cabinet is provided with opening, cause the electromagnetic compatibility structure and the complicated waterproof construction that need independent designed openings place.
Summary of the invention
In order to solve the problem that prior art exists, the present invention proposes a kind of heat dissipating method and integral heat dissipation cabinet of large power supply, and concrete technical scheme is as follows:
A kind of heat dissipating method of large power supply, the cabinet of power supply adopts closed design;
The bottom of cabinet is the extrusion pressing type radiator, is used for installing the power device of power supply in the level and smooth one side of this radiator, and the heating of power device is conducted to the extrusion pressing type radiator; The tool another side is provided with many group blades, by heat conduction the plane heat is imported on the blade, dispels the heat;
The loam cake of cabinet is an integral section, and loam cake is used to install the aerial lug spare and/or the control device of power supply;
The wall of cabinet by four independently the single-chip sectional material assembly unit constitute; The two ends up and down of single-chip sectional material are connected with loam cake with the bottom of cabinet respectively;
At the device of power supply of packing into, connect circuit after, in cabinet, pour into glue again, make the water-proof anti-theft function.
Described four independently single-chip sectional material form by two groups of different section bar monolithics, one group of sidewall wherein as the cabinet length direction, another group is as the sidewall of cabinet Width; The limit, the adjacent left and right sides of the sidewall of length, Width connects successively.
The inside sidewalls of described length, Width is provided with fixed leg, and this fixed leg is through inside sidewalls, and perpendicular to the loam cake and the bottom of cabinet; Be provided with the hole corresponding at the loam cake of cabinet and the edge of bottom, the sidewall of cabinet and loam cake and bottom fixed by fixed leg and corresponding hole with described fixed leg.
The sidewall two ends of length, Width are respectively equipped with corresponding groove and fin, and this groove and fin are located at the corresponding adjacent edge four single-chip sectional material successively, and fin is inserted in the groove.
A kind of integral heat dissipation cabinet of realizing said method comprises bottom, loam cake and sidewall;
The bottom of described cabinet is the extrusion pressing type radiator, in the level and smooth one side of this radiator towards cabinet inside; Another side is provided with many group radiator shutters;
The loam cake of cabinet is an integral section, on be covered with the position of the aerial lug spare and/or the control device that are used to install power supply;
The sidewall of cabinet by four independently the single-chip sectional material assembly unit constitute; The two ends up and down of single-chip sectional material are connected with loam cake with the bottom of cabinet respectively;
At the device of power supply of packing into, connect circuit after, encapsulating in cabinet.
Described four independently single-chip sectional material form by two groups of different section bar monolithics, one group of sidewall wherein as the cabinet length direction, another group is as the sidewall of cabinet Width; The limit, the adjacent left and right sides of the sidewall of length, Width connects successively.
The inside sidewalls of described length, Width is provided with fixed leg, and this fixed leg is through inside sidewalls, and perpendicular to the loam cake and the bottom of cabinet; Be provided with the hole corresponding at the loam cake of cabinet and the edge of bottom, the sidewall of cabinet and loam cake and bottom fixed by fixed leg and corresponding hole with described fixed leg.
The sidewall two ends of length, Width are respectively equipped with corresponding groove and fin, and this groove and fin are located at the corresponding adjacent edge four single-chip sectional material successively, and fin is inserted in the groove.
In all right attached heat sinks of chassis base, for example install radiator fan or water cooling plant etc. in the radiator shutter additional, increase radiating effect.
Described extrusion pressing type radiator is the aluminium extruded type radiator.
The technical program makes that the Mold Making cost is low, and easy to assembly, water-proof anti-theft is strong, is specially adapted to the large power inverter power source box and uses.In addition, because cabinet is global design, for the just reduction greatly of EMC Design requirement of large power, electrically source circuit itself.
Description of drawings
Fig. 1 is the side schematic view of integral heat dissipation cabinet;
Fig. 2 is the schematic top plan view (loam cake is not installed) of integral heat dissipation cabinet.
Embodiment
Below in conjunction with accompanying drawing and embodiment the technical program is described further.
A kind of heat dissipating method of large power supply, the cabinet of power supply adopts closed design, constitutes the integral heat dissipation cabinet, and it comprises bottom, loam cake and sidewall;
The bottom 1 of described cabinet is the aluminium extruded type radiator, in the level and smooth one side of this radiator towards cabinet inside; The one side that is provided with radiator shutter 4 can be established the additional heat fan, further strengthens radiating effect by radiator fan.Also can in radiator shutter 4, establish S shape water-cooling pipe.Among the figure, flange 3 is provided with installing hole, is used for fixing the entire heat dissipation box body.
The loam cake of cabinet is an integral section, on be covered with the position of the aerial lug spare and/or the control device that are used to install power supply;
The sidewall 2 of cabinet by four independently the single-chip sectional material assembly unit constitute; The two ends up and down of single-chip sectional material are connected with loam cake with the bottom of cabinet respectively;
At the device of power supply of packing into, connect circuit after, encapsulating in cabinet.
For sidewall 2, described four independently single-chip sectional material comprise two groups of different section bar monolithics, one group of sidewall wherein as the cabinet length direction, another group is as the sidewall of cabinet Width; The limit, the adjacent left and right sides of the sidewall of length, Width connects successively.
The inside sidewalls of described length, Width is provided with fixed leg 5, and this fixed leg 5 is through inside sidewalls, and perpendicular to the loam cake and the bottom of cabinet; Be provided with the hole corresponding at the loam cake of cabinet and the edge of bottom, the sidewall of cabinet and loam cake and bottom fixed by fixed leg 5 and corresponding hole with described fixed leg.
The sidewall two ends of length, Width are respectively equipped with corresponding groove and fin, and this groove and fin are located at the corresponding adjacent edge four single-chip sectional material successively, and fin is inserted in the groove.
Claims (9)
1. the heat dissipating method of a large power supply is characterized in that the cabinet of power supply adopts closed design;
The bottom of cabinet is the extrusion pressing type radiator, is used for installing the power device of power supply in the level and smooth one side of this radiator, and another side is provided with many group blades, the heating of power device is conducted to radiator shutter by base plate dispel the heat;
The loam cake of cabinet is an integral section, and loam cake is used to install the aerial lug spare and/or the control device of power supply;
The wall of cabinet by four independently the single-chip sectional material assembly unit constitute; The two ends up and down of single-chip sectional material are connected with loam cake with the bottom of cabinet respectively;
At the device of power supply of packing into, connect circuit after, encapsulating in cabinet again.
2. heat dissipating method according to claim 1, the wall that it is characterized in that described casing are two groups of different section bar monolithics, one group of sidewall wherein as the cabinet length direction, and another group is as the sidewall of cabinet Width; The limit, the adjacent left and right sides of the sidewall of length, Width connects successively.
3. heat dissipating method according to claim 2 is characterized in that the inside sidewalls of described length, Width is provided with fixed leg, and this fixed leg is through inside sidewalls, and perpendicular to the loam cake and the bottom of cabinet; Be provided with the hole corresponding at the loam cake of cabinet and the edge of bottom, the sidewall of cabinet and loam cake and bottom fixed by fixed leg and corresponding hole with described fixed leg.
4. heat dissipating method according to claim 3, the sidewall two ends that it is characterized in that length, Width are provided with the corresponding adjacent edge four single-chip sectional material successively and are respectively equipped with corresponding groove and fin, and fin is inserted in the groove.
5. an integral heat dissipation cabinet of realizing said method is characterized in that comprising bottom, loam cake and sidewall;
The bottom of described cabinet is the extrusion pressing type radiator, in the level and smooth one side of this radiator towards cabinet inside; The one side that is provided with fin is established the additional heat blade;
The loam cake of cabinet is an integral section, on be covered with the position of the aerial lug spare and/or the control device that are used to install power supply;
The sidewall of cabinet by four independently the single-chip sectional material assembly unit constitute; The two ends up and down of single-chip sectional material are connected with loam cake with the bottom of cabinet respectively;
At the device of power supply of packing into, connect circuit after, irritating in cabinet has glue.
6. integral heat dissipation cabinet according to claim 5, it is characterized in that described four independently single-chip sectional material comprise two groups of different section bar monolithics, one group of sidewall wherein as the cabinet length direction, another group is as the sidewall of cabinet Width; The adjacent left stone limit of the sidewall of length, Width connects successively.
7. integral heat dissipation cabinet according to claim 6 is characterized in that the inside sidewalls of described length, Width is provided with fixed leg, and this fixed leg is through inside sidewalls, and perpendicular to the loam cake and the bottom of cabinet; Be provided with the hole corresponding at the loam cake of cabinet and the edge of bottom, the sidewall of cabinet and loam cake and bottom fixed by fixed leg and corresponding hole with described fixed leg.
8. integral heat dissipation cabinet according to claim 7, the sidewall two ends that it is characterized in that length, Width are respectively equipped with corresponding groove and fin, this groove and fin are located at the corresponding adjacent edge four single-chip sectional material successively, and fin is inserted in the groove.
9. according to the arbitrary described integral heat dissipation cabinet of claim 5～8, its, integral heat dissipation cabinet according to claim 5, it is characterized in that described extrusion pressing type radiator is the aluminium extruded type radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101477908A CN101815425B (en) | 2010-04-15 | 2010-04-15 | Heat radiating method of high-power power supply and integrated heat radiating cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101477908A CN101815425B (en) | 2010-04-15 | 2010-04-15 | Heat radiating method of high-power power supply and integrated heat radiating cabinet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101815425A true CN101815425A (en) | 2010-08-25 |
| CN101815425B CN101815425B (en) | 2012-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101477908A Expired - Fee Related CN101815425B (en) | 2010-04-15 | 2010-04-15 | Heat radiating method of high-power power supply and integrated heat radiating cabinet |
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| CN (1) | CN101815425B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103929928A (en) * | 2014-02-24 | 2014-07-16 | 山东省科学院海洋仪器仪表研究所 | Submarine barrel-shaped high-voltage inverter power supply modularized heat radiation device |
| CN106231868A (en) * | 2016-08-11 | 2016-12-14 | 合肥阿格德信息科技有限公司 | A kind of power module |
| CN110865440A (en) * | 2018-08-27 | 2020-03-06 | 苏州旭创科技有限公司 | OSFP optical module and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1550953A (en) * | 2003-05-13 | 2004-12-01 | 扎尔曼技术株式会社 | Computer |
| CN201054104Y (en) * | 2007-04-28 | 2008-04-30 | 东力奇有限公司 | Combined computer host enclosure |
| CN201057680Y (en) * | 2007-05-16 | 2008-05-07 | 中国电子科技集团公司第五十四研究所 | High-power integrated radio frequency equipment cabinet |
| CN201222726Y (en) * | 2008-07-02 | 2009-04-15 | 深圳市云海通讯股份有限公司 | Cabinet for direct-amplifying station |
| CN201682726U (en) * | 2010-04-15 | 2010-12-22 | 镇江市东亚电子散热器有限公司 | Cabinet integration radiator of high power supply |
-
2010
- 2010-04-15 CN CN2010101477908A patent/CN101815425B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1550953A (en) * | 2003-05-13 | 2004-12-01 | 扎尔曼技术株式会社 | Computer |
| CN201054104Y (en) * | 2007-04-28 | 2008-04-30 | 东力奇有限公司 | Combined computer host enclosure |
| CN201057680Y (en) * | 2007-05-16 | 2008-05-07 | 中国电子科技集团公司第五十四研究所 | High-power integrated radio frequency equipment cabinet |
| CN201222726Y (en) * | 2008-07-02 | 2009-04-15 | 深圳市云海通讯股份有限公司 | Cabinet for direct-amplifying station |
| CN201682726U (en) * | 2010-04-15 | 2010-12-22 | 镇江市东亚电子散热器有限公司 | Cabinet integration radiator of high power supply |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103929928A (en) * | 2014-02-24 | 2014-07-16 | 山东省科学院海洋仪器仪表研究所 | Submarine barrel-shaped high-voltage inverter power supply modularized heat radiation device |
| CN103929928B (en) * | 2014-02-24 | 2016-08-17 | 山东省科学院海洋仪器仪表研究所 | Seabed tubular high voltage inverting power source modularized radiating device |
| CN106231868A (en) * | 2016-08-11 | 2016-12-14 | 合肥阿格德信息科技有限公司 | A kind of power module |
| CN110865440A (en) * | 2018-08-27 | 2020-03-06 | 苏州旭创科技有限公司 | OSFP optical module and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101815425B (en) | 2012-11-14 |
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