Embodiment
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
The core concept of the manufacture method of LCD of the present invention is: form array base palte, color membrane substrates and chock insulator matter; On the oriented layer of replacing with chock insulator matter, form the hole of equivalent diameter less than the chock insulator matter equivalent diameter; With the processing of lowering the temperature of array base palte and/or color membrane substrates, make the equivalent diameter in hole greater than the chock insulator matter equivalent diameter; Array base palte and color membrane substrates are carried out box is handled, in the chock insulator matter embedded hole; To carry out hyperthermic treatment to box processed array substrate and color membrane substrates, and make chock insulator matter be fastened onto in the hole.
The present invention utilizes cooling to handle and hyperthermic treatment by on the oriented layer of replacing with chock insulator matter the hole being set, and makes chock insulator matter be fastened onto in the hole; This method is an interference fit method, the display panels that adopts this method to form, even when being subjected to external impacts, because the cylindrical spacer of each pixel is fixed by the hole, do not produce displacement between array base palte and the color membrane substrates, prevent to produce water ripple phenomenon, thereby improved product quality; Simultaneously, do not need to increase the thickness of glass substrate, reduced the test and the number of times of doing over again yet, reduced cost, improved production efficiency.
The manufacture method embodiment one of LCD of the present invention:
Fig. 1 is the process flow diagram of the manufacture method embodiment one of LCD of the present invention, and as shown in Figure 1, present embodiment specifically comprises the steps:
Step 101, formation array base palte, color membrane substrates and chock insulator matter; This chock insulator matter is arranged on the color membrane substrates;
Step 102, with the pin diameter less than the needle plate of chock insulator matter equivalent diameter and array base palte contraposition extruding, on the oriented layer of the array base palte of replacing with chock insulator matter, form the hole of equivalent diameter less than the chock insulator matter equivalent diameter;
Step 103, with the array base palte processing of lowering the temperature, make the equivalent diameter in hole greater than the chock insulator matter equivalent diameter;
Step 104, under low temperature environment, array base palte and color membrane substrates are carried out box is handled, in the chock insulator matter embedded hole;
Step 105, will carry out hyperthermic treatment, and make chock insulator matter be fastened onto in the hole box processed array substrate and color membrane substrates.
Specifically, chock insulator matter can be cylindrical spacer in the present embodiment, if the xsect of cylindrical spacer is circular, then the equivalent diameter of chock insulator matter is the diameter of cylindrical spacer xsect; If the xsect of cylindrical spacer is that ellipse waits other figures, then the equivalent diameter of chock insulator matter is the equivalent diameter of cylindrical spacer xsect.
Fig. 2 is the structural representation of the color membrane substrates of formation in manufacture method embodiment one step 101 of LCD of the present invention, and as shown in Figure 2, setting comprises cylindrical spacer 11 and oriented layer 14, the equivalent diameter d of this cylindrical spacer 11 on this color membrane substrates 10
1Expression.This color membrane substrates 10 finishes friction orientation, because oriented layer 14 is with respect to cylindrical spacer 11, very thin thickness has applied after the oriented layer 14, and during friction orientation there be not substantially the oriented layer of cylindrical spacer 11 end faces, so not shown among Fig. 2.Below similarly figure is in like manner.Fig. 3 is the structural representation of the array base palte of formation in manufacture method embodiment one step 101 of LCD of the present invention, and as shown in Figure 3, this array base palte 20 has applied oriented layer 21, finishes friction orientation.
Fig. 4 is the structural representation of the array base palte of formation in the step 102 among the manufacture method embodiment one of LCD of the present invention, as shown in Figure 4, in above-mentioned steps 102, choose the needle plate that a pin diameter is slightly less than cylindrical spacer 11 equivalent diameters, with this needle plate and array base palte 20 contrapositions extruding, the position that contraposition extrusion position of pin is replaced corresponding to cylindrical spacer 11 and array base palte 20 on it, thereby on the oriented layer 21 of the array base palte of replacing with cylindrical spacer 11 20, form the hole 22 of equivalent diameter, the equivalent diameter d in this hole 22 less than cylindrical spacer 11 equivalent diameters
2Expression, d
1With d
2Difference can be 0.05-0.15 μ m.
Fig. 5 is the structural representation of the array base palte of formation in manufacture method embodiment one step 103 of LCD of the present invention, as shown in Figure 5, and in above-mentioned steps 103, remove needle plate, with array base palte 20 processing of lowering the temperature, particularly, can adopt cooling system to lower the temperature; According to the principle of expanding with heat and contract with cold, the diameter in formed hole 22 can increase on the array base palte 20, makes the equivalent diameter in the hole 23 after increasing be slightly larger than cylindrical spacer 11 equivalent diameters, uses d
3The equivalent diameter in the hole 23 after expression increases.For example, the material coefficient of thermal expansion coefficient of oriented layer 21 is 2 * 10
-5~3 * 10
-5/ ℃, the material coefficient of thermal expansion coefficient of chock insulator matter is 4 * 10
-5~6 * 10
-5/ ℃, establish 20 ℃ of array base palte 20 coolings, can so that the equivalent diameter in hole 23 than the big 0.05-0.1 μ of cylindrical spacer 11 equivalent diameters m, i.e. d
3With d
1Difference can be 0.05-0.1 μ m.
The structural representation to box substrate of Fig. 6 for forming in manufacture method embodiment one step 104 of LCD of the present invention, as shown in Figure 6, in above-mentioned steps 104, keep low temperature environment, under this environment, array base palte 20 and color membrane substrates 10 are carried out box is handled, in cylindrical spacer 11 embedded holes 23, form box substrate.
The structural representation to box substrate of Fig. 7 for forming in the step 105 among the manufacture method embodiment one of LCD of the present invention, as shown in Figure 7, in above-mentioned steps 105, can will be placed in the air, make box substrate slowly is warming up to normal temperature box processed array substrate 20 and color membrane substrates 10; According to the principle of expanding with heat and contract with cold, the diameter in formed hole 23 can reduce on the array base palte 20, the hole 24 after obtaining reducing, and cylindrical spacer 11 is fastened onto in the hole 24; Even the display panels of Xing Chenging when being subjected to external impacts, because the cylindrical spacer 11 of each pixel is fixed by hole 24, not producing displacement between array base palte 20 and the color membrane substrates 10, thereby prevents to produce water ripple phenomenon like this.
This interference fit method does not need to increase the thickness of glass substrate, has reduced the test and the number of times of doing over again yet, and has reduced cost, has improved production efficiency; And,,, do not influence the effect that this method is improved water ripple phenomenon even the size and the positional precision deviation of each screen on glass substrate are all not quite identical because the cylindrical spacer 11 of each pixel fixed by hole 24 yet.
The manufacture method embodiment two of LCD of the present invention:
Fig. 8 is the process flow diagram of the manufacture method embodiment two of LCD of the present invention, and as shown in Figure 8, present embodiment specifically comprises the steps:
Step 201, formation array base palte, color membrane substrates and chock insulator matter; This chock insulator matter is arranged on the color membrane substrates;
Step 202, with the pin diameter less than the needle plate of chock insulator matter equivalent diameter and array base palte contraposition extruding, on the oriented layer of the array base palte of replacing with chock insulator matter, form the hole of equivalent diameter less than the chock insulator matter equivalent diameter;
The processing of lowering the temperature of step 203, the color membrane substrates that will comprise chock insulator matter makes the equivalent diameter of chock insulator matter equivalent diameter less than the hole;
Step 204, under low temperature environment, array base palte and color membrane substrates are carried out box is handled, in the chock insulator matter embedded hole;
Step 205, will carry out hyperthermic treatment, and make chock insulator matter be fastened onto in the hole box processed array substrate and color membrane substrates.
Specifically, chock insulator matter can be cylindrical spacer in the present embodiment, if the xsect of cylindrical spacer is circular, then the equivalent diameter of chock insulator matter is the diameter of cylindrical spacer xsect; If the xsect of cylindrical spacer is that ellipse waits other figures, then the equivalent diameter of chock insulator matter is the equivalent diameter of cylindrical spacer xsect.
In above-mentioned steps 201, the color membrane substrates 10 of formation can be referring to Fig. 2, and the array base palte 20 of formation can be referring to Fig. 3.
In above-mentioned steps 202, choose the needle plate that a pin diameter is slightly less than cylindrical spacer 11 equivalent diameters, with this needle plate and array base palte 20 contrapositions extruding, the position that contraposition extrusion position of pin is replaced corresponding to cylindrical spacer 11 and array base palte 20 on it, thereby on the oriented layer 21 of the array base palte of replacing with cylindrical spacer 11 20, form the hole 22 of equivalent diameter less than cylindrical spacer 11 equivalent diameters.The final array base palte 20 that forms can be referring to Fig. 4.
Fig. 9 is the structural representation of the color membrane substrates that forms in manufacture method embodiment two steps 203 of LCD of the present invention, as shown in Figure 9, in above-mentioned steps 203, with color membrane substrates 10 processing of lowering the temperature, particularly, can adopt cooling system to lower the temperature; According to the principle of expanding with heat and contract with cold, the equivalent diameter of cylindrical spacer 11 can reduce on the color membrane substrates 10, makes cylindrical spacer 12 equivalent diameters after reducing be slightly less than the equivalent diameter in hole 22, uses d
4The equivalent diameter of the cylindrical spacer 12 after expression reduces.For example, the material coefficient of thermal expansion coefficient of oriented layer 14 is 2 * 10
-5~3 * 10
-5/ ℃, the material coefficient of thermal expansion coefficient of cylindrical spacer 12 is 4 * 10
-5~6 * 10
-5/ ℃, handle by cooling, can so that cylindrical spacer 12 equivalent diameters than the little 0.005-0.02 μ of the equivalent diameter m in hole 22, i.e. d
2With d
4Difference can be 0.005-0.02 μ m.
The structural representation to box substrate of Figure 10 for forming in manufacture method embodiment two steps 204 of LCD of the present invention, as shown in figure 10, in above-mentioned steps 204, keep low temperature environment, under this environment, array base palte 20 and color membrane substrates 10 are carried out box is handled, in cylindrical spacer 12 embedded holes 22, form box substrate.
The structural representation to box substrate of Figure 11 for forming in manufacture method embodiment two steps 205 of LCD of the present invention, as shown in figure 11, in above-mentioned steps 205, can will be placed in the air, make box substrate slowly is warming up to normal temperature box processed array substrate 20 and color membrane substrates 10; According to the principle of expanding with heat and contract with cold, the equivalent diameter of cylindrical spacer 12 can increase on the color membrane substrates 20, and the cylindrical spacer 13 after obtaining increasing makes cylindrical spacer 13 be fastened onto in the hole 22; Even the display panels of Xing Chenging when being subjected to external impacts, because the cylindrical spacer 13 of each pixel is fixed by hole 22, not producing displacement between array base palte 20 and the color membrane substrates 10, thereby prevents to produce water ripple phenomenon like this.
This interference fit method does not need to increase the thickness of glass substrate, has reduced the test and the number of times of doing over again yet, and has reduced cost, has improved production efficiency; And,,, do not influence the effect that this method is improved water ripple phenomenon even the size and the positional precision deviation of each screen on glass substrate are all not quite identical because the cylindrical spacer 13 of each pixel fixed by hole 22 yet.
The manufacture method embodiment three of LCD of the present invention:
The difference of present embodiment and the foregoing description one and embodiment two is, in step 103 and step 203, the processing of simultaneously array base palte and color membrane substrates being lowered the temperature makes the equivalent diameter of chock insulator matter equivalent diameter less than the hole.
Specifically, can adopt cooling system simultaneously to the processing of lowering the temperature of array base palte and color membrane substrates, according to the principle of expanding with heat and contract with cold, the diameter in formed hole can increase on the array base palte, the equivalent diameter of cylindrical spacer can reduce on the color membrane substrates, thereby makes the cylindrical spacer equivalent diameter be slightly less than the equivalent diameter in hole.
The manufacture method embodiment four of LCD of the present invention:
The difference of present embodiment and the foregoing description one~embodiment three is, when forming the hole, present embodiment adopts mask exposure and etching technics, on the oriented layer of the array base palte of replacing with chock insulator matter, forms the hole of equivalent diameter less than the chock insulator matter equivalent diameter.This method also can reach the technique effect same with the foregoing description.
The manufacture method embodiment five of LCD of the present invention:
Chock insulator matter all is arranged on the color membrane substrates among the foregoing description one~embodiment four, and the present invention also goes for chock insulator matter and is arranged on situation on the array base palte.Specifically, can on the oriented layer of the color membrane substrates of replacing with chock insulator matter, form the hole of equivalent diameter less than the chock insulator matter equivalent diameter; With the processing of lowering the temperature of color membrane substrates and/or array base palte, make the equivalent diameter in hole greater than the chock insulator matter equivalent diameter; Array base palte and color membrane substrates are carried out box is handled, in the chock insulator matter embedded hole; To carry out hyperthermic treatment to box processed array substrate and color membrane substrates, and make chock insulator matter be fastened onto in the hole.
Be among the foregoing description one~embodiment five at first on the oriented layer of replacing with chock insulator matter, form the hole of equivalent diameter less than the chock insulator matter equivalent diameter, making the equivalent diameter in hole is in order to make the present invention have more favorable applicability less than chock insulator matter equivalent diameter purpose.Because if under low temperature environment, use the LCD of making by the manufacture method of LCD of the present invention, shrinkage can take place in oriented layer, cause the equivalent diameter in hole to increase, might chock insulator matter and oriented layer can't form interference fit, make there is the space between chock insulator matter and the oriented layer, influenced fixing effect.Therefore, the equivalent diameter that sets in advance the hole is less than the chock insulator matter equivalent diameter, makes the LCD of the manufacture method manufacturing by LCD of the present invention be applicable to wider temperature range, has more favorable applicability.
One embodiment of LCD of the present invention:
Figure 12 is the plan structure synoptic diagram of array base palte among LCD one embodiment of the present invention, as shown in figure 12, this array base palte comprise data line 51, public electrode wire 52, grid line 34, pixel electrode 37 with and go up the several holes that is provided with, as one of them hole 32 among Figure 12, these holes are used for fixing chock insulator matter.
Figure 13 is the structural representation of LCD one embodiment of the present invention, as shown in figure 13, present embodiment comprises array base palte, color membrane substrates and chock insulator matter 41, among Figure 13 the array base palte synoptic diagram be among Figure 12 A-A to sectional view, be coated with oriented layer 31 on the array base palte, be provided with a hole 32 on the oriented layer 31 of the array base palte of replacing with chock insulator matter 41, this chock insulator matter 41 is fastened onto in the hole 32.
Particularly, array base palte also comprises glass substrate 33 and is formed on grid line 34, gate insulation layer 35, source-drain electrode and passivation layer 36, pixel electrode 37 on the glass substrate 33, and color membrane substrates also comprises glass substrate 42 and is formed on color resin unit 43, public electrode 44, black matrix 45, oriented layer 46 on the glass substrate 42.
The present invention is not limited only to the above-mentioned liquid crystal display device structure shown in Figure 13, also applicable to other liquid crystal display device structures, for example, chock insulator matter is set on array base palte, and the hole of fixing this chock insulator matter is set on the oriented layer of color membrane substrates.All establish the hole on oriented layer, be used for fixing the liquid crystal display device structure of chock insulator matter, all belong to invention which is intended to be protected.
Present embodiment is by being provided with hole 32 on the oriented layer 31 of the array base palte of replacing with chock insulator matter 41, make chock insulator matter 41 be fastened onto in the hole 32, even when being subjected to external impacts, because the cylindrical spacer of each pixel is fixed by the hole, do not produce displacement between array base palte and the color membrane substrates, prevent to produce water ripple phenomenon, thereby improved product quality; Simultaneously, do not need to increase the thickness of glass substrate, reduced the test and the number of times of doing over again yet, reduced cost, improved production efficiency.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of various embodiments of the present invention technical scheme.