CN101808463B - Wiring board processing method - Google Patents
Wiring board processing method Download PDFInfo
- Publication number
- CN101808463B CN101808463B CN2009101054402A CN200910105440A CN101808463B CN 101808463 B CN101808463 B CN 101808463B CN 2009101054402 A CN2009101054402 A CN 2009101054402A CN 200910105440 A CN200910105440 A CN 200910105440A CN 101808463 B CN101808463 B CN 101808463B
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- China
- Prior art keywords
- wiring board
- preprocessing
- processing
- fine finishining
- allowance
- Prior art date
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- Expired - Fee Related
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Abstract
The invention provides a wiring board processing method. The processing method comprises the following steps: 1. preprocessing a wiring board, wherein machining allowances are retained on the edges of the machining positions of the wiring board after the preprocessing, compared with the dimensional requirements; and 2. according to the dimensional requirements, finishing the preprocessed wiring board obtained in the step 1, wherein the machining allowances retained in the step 1 are completely or partially removed during the finishing process. The method of the invention has simple process and is convenient to implement, the processing efficiency and processing cost can be ensured simultaneously; and the yield can be increased and the processing cost can be reduced under the premise of maintaining the processing accuracy.
Description
[technical field]
The present invention relates to the wiring board manufacturing technology, the wiring board manufacturing technology that especially a kind of cost is low, efficient is high.
[background technology]
In order to adapt to the needs of aspects such as environment for use, installation, the size of wiring board must satisfy corresponding designing requirement.Therefore, wiring board must be processed to meet the size of dimensional requirement in manufacturing process.In the prior art, the wiring board dimensioned method that adopts usually is stamping or CNC (Computerized Numerical Control computer numerical control (CNC) machining center) processing method.Adopt the stamping method, edges of boards are crude, and the edge layering possibly occur and causes and scrap; Adopt the CNC processing method, the course of processing time is long, and the milling cutter consumption is big, expense is high.
[summary of the invention]
Technical problem to be solved by this invention provides the wiring board manufacturing technology that a kind of cost is low, efficient is high.
For solving the problems of the technologies described above, the present invention provides a kind of Wiring board processing method, may further comprise the steps:
A. earlier wiring board is carried out preprocessing; Compare with dimensional requirement, the edge of the wiring board working position after preprocessing remains with allowance;
B. to carrying out fine finishining through the wiring board after the step a preprocessing according to dimensional requirement, the allowance that keeps among the step a is all or part of elimination in the fine finishining process.
In the inventive method; The allowance that the edge of wiring board working position keeps among the step a will all be eliminated in the fine finishining process of step b; Or part is eliminated (consideration tolerance); Therefore preprocessing process dimension precision requirement is low, can accomplish the preprocessing process with fast speeds, and low simultaneously required precision is also for selecting for use low-cost cutter to create condition; After preprocessing, make wiring board satisfy size and required precision through fine finishining again.
On this basis, further:
Preprocessing process among the step a is the stamping course of processing, perhaps for adopting waste and old milling cutter to drag for the course of processing on limit in advance.Stamping processing is adopted in preprocessing, can make the preprocessing process rapidly and efficiently; Edges of boards issuable crude and lamination also can be eliminated in the fine finishining process of step b.Preprocessing adopts waste and old milling cutter to drag for the limit in advance, also can carry out with fast speed, has practiced thrift the cost of charp tool simultaneously.
Fine finishining process among the step b is for adopting the process of CNC (Computerized NumericalControl computer numerical control (CNC) machining center) deburring.In the fine finishining process, wiring board is machined to the size range of requirement.
The allowance that the edge of the wiring board working position among the step a after preprocessing keeps can be 0.05mm-0.3mm.The control of allowance can be processed actual conditions such as complexity, processing dimension, process equipment, process velocity according to wiring board and confirmed.
The invention has the beneficial effects as follows: process is simple, and it is convenient to implement, and can take into account working (machining) efficiency and processing cost simultaneously, can under the prerequisite that keeps machining accuracy, improve productive rate, cut down finished cost.
[embodiment]
Embodiment one
Adopt a kind of detailed process of the inventive method processing wiring board to be:
A. adopt the stamping processing method to carry out preprocessing to wiring board earlier; Compare with dimensional requirement, the wiring board after preprocessing has the allowance of 0.05mm-0.3mm;
B. to carrying out CNC fine finishining according to dimensional requirement through the wiring board after the step a preprocessing; Through allowance all or part of elimination in the fine finishining process of the wiring board edges of boards 0.05mm-0.3mm after the step a preprocessing, the size conforms dimensional requirement of fine finishining rear board.
Embodiment two
Adopt a kind of detailed process of the inventive method processing wiring board to be:
A. earlier wiring board is carried out preprocessing: adopt waste and old milling cutter that wiring board is carried out CNC and drag for the limit in advance; Compare with dimensional requirement, the wiring board after preprocessing has the allowance of 0.05mm-0.3mm;
B. to carrying out CNC fine finishining according to dimensional requirement through the wiring board after the step a preprocessing; Through allowance all or part of elimination in the fine finishining process of the wiring board edges of boards 0.05mm-0.3mm after the step a preprocessing, the size conforms dimensional requirement of fine finishining rear board.
Among the step a, the limit is lower to dimension precision requirement owing to dragging in advance, so speed can double than normally dragging for the limit; Wiring board in step a through dragging for the limit in advance; CNC fine finishining processing capacity among the step b is very little; CNC fine finishining speed among the step b also can be accelerated like this, has reduced the consumption of cutter in the CNC fine finishining process simultaneously, has improved cutter life greatly.
During practical implementation, comprehensively factors such as wiring board processing capacity, stamping mould therefor expense, process time are considered working (machining) efficiency and cost, to select suitable pre-process method.So if little or the too high unit cost of preprocessing that causes of stamping die cost is higher because of processing capacity, then preprocessing process can adopt waste and old milling cutter wiring board to be dragged in advance the method on limit.Allowance can variation as the case may be chosen different margin, confirms that the factor that allowance need be considered includes but not limited to: wiring board processing complexity, processing dimension, process equipment, process velocity etc.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (1)
1. Wiring board processing method is characterized in that: may further comprise the steps:
A. earlier wiring board is carried out preprocessing; Compare with dimensional requirement, the edge of the wiring board working position after preprocessing remains with allowance;
B. to carrying out fine finishining through the wiring board after the step a preprocessing according to dimensional requirement, the allowance that keeps among the step a is all or part of elimination in the fine finishining process;
Wherein, the preprocessing process among the step a is the stamping course of processing, perhaps for adopting waste and old milling cutter to drag for the course of processing on limit in advance;
Fine finishining process among the step b is for adopting the process of CNC deburring;
The allowance that the edge of the wiring board working position among the step a after preprocessing keeps is 0.05mm-0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101054402A CN101808463B (en) | 2009-02-13 | 2009-02-13 | Wiring board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101054402A CN101808463B (en) | 2009-02-13 | 2009-02-13 | Wiring board processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101808463A CN101808463A (en) | 2010-08-18 |
| CN101808463B true CN101808463B (en) | 2012-04-18 |
Family
ID=42610014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101054402A Expired - Fee Related CN101808463B (en) | 2009-02-13 | 2009-02-13 | Wiring board processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101808463B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111586963A (en) * | 2020-05-22 | 2020-08-25 | 浙江德清盛宏电器有限公司 | Safety type electric control bottom plate and production process thereof |
| CN112188744B (en) * | 2020-10-29 | 2022-05-17 | 惠州市特创电子科技股份有限公司 | Circuit board and processing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1672830A (en) * | 2004-03-26 | 2005-09-28 | 鸿富锦精密工业（深圳）有限公司 | Metal plate punching process |
| CN101284351A (en) * | 2008-05-30 | 2008-10-15 | 汕头超声印制板公司 | Printed circuit board contour processing method |
| EP1815922B1 (en) * | 2006-02-03 | 2009-01-14 | Feintool Intellectual Property AG | Method of and tool for fine-cutting pieces with small edge radius and strongly reduced depth in a single step arrangement |
-
2009
- 2009-02-13 CN CN2009101054402A patent/CN101808463B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1672830A (en) * | 2004-03-26 | 2005-09-28 | 鸿富锦精密工业（深圳）有限公司 | Metal plate punching process |
| EP1815922B1 (en) * | 2006-02-03 | 2009-01-14 | Feintool Intellectual Property AG | Method of and tool for fine-cutting pieces with small edge radius and strongly reduced depth in a single step arrangement |
| CN101284351A (en) * | 2008-05-30 | 2008-10-15 | 汕头超声印制板公司 | Printed circuit board contour processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101808463A (en) | 2010-08-18 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120418 Termination date: 20130213 |