CN101783341A - LED light-source module with heat dissipation structure - Google Patents
LED light-source module with heat dissipation structure Download PDFInfo
- Publication number
- CN101783341A CN101783341A CN201010105332A CN201010105332A CN101783341A CN 101783341 A CN101783341 A CN 101783341A CN 201010105332 A CN201010105332 A CN 201010105332A CN 201010105332 A CN201010105332 A CN 201010105332A CN 101783341 A CN101783341 A CN 101783341A
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- China
- Prior art keywords
- source module
- led light
- light
- radiator structure
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED light-source module with a heat dissipation structure. The LED light-source module is characterized by comprising at least one heat pipe and a plurality of LEDs, wherein an electric insulation layer is directly formed on the surface of the heat pipe, and a circuit layer is directly formed on the surface of the insulation layer; and the LEDs are fixed on the surface of the heat pipe and electrically connected with the circuit layer.
Description
The application is for dividing an application, and the application number of its female case is: 200610111212.2, and the applying date is: on August 15th, 2006, denomination of invention is " LED light-source module with radiator structure ".
Technical field
The present invention relates to a kind of LED light-source module with radiator structure, relating in particular to a kind of is light source and in conjunction with the module of high efficiency heat radiation structure with the light-emitting diode.
Background technology
Light-emitting diode (Light Emitting Diode; LED) being a kind of high efficiency cold light light-emitting component that converts electrical energy into luminous energy, also is a kind of small solid state light emitter.The main component part of element is a semiconductor p-n contact structure, adds after voltage feeds electric current connecing the face two ends, utilizes combining of electronics and hole, can discharge the energy of photon, and give off the light of particular range of wavelengths.Because light-emitting diode has color reprodubility and has the characteristic of single wavelength, feasible light-emitting diode has in recent years become the mainstream technology of the colour gamut that promotes backlight of LCD.In addition, light-emitting diode also is widely used in outdoor large display screen, and will replace existing lighting apparatus gradually.
Existing light-emitting diode is applied to the relative position relation of LCD as backlight, and common have two kinds of straight-down negative (direct type) and side types (edge type).General large scale liquid crystal display often adopts the irradiate light pattern of straight-down negative as backlight, the radiator structure of common straight-down negative light-emitting diode (LED) backlight module is the surface that light-emitting diode is adhered to printed circuit board (PCB), again the heat pipe of another apparent surface by being fixed in printed circuit board (PCB) with heat transferred to fin to carry out heat exchange.
Fig. 1 is the cross-sectional view of conventional backlight module.The early stage publication number US2006/0002142A1 of United States Patent (USP) discloses a backlight module 10, and it comprises light-emitting diode 11, printed circuit board (PCB) 12, heat pipe (heat pipe) 13 and bottom 14.Light-emitting diode 11 is surface adhering upper surfaces at metallic core (metal core) printed circuit board (PCB) 12, and described printed circuit board (PCB) 12 has control light-emitting diode 11 bright dark circuit layers.When light-emitting diode 11 continues to light, can produce heat, yet if described heat accumulates on the decay that can cause light luminance in the light-emitting diode 11.Therefore by pasting heat is taken away, and be delivered to the fin (scheming not shown) of periphery to reject heat in the environment through the hot approach (heatpath) of bottom 14 in the heat pipe 13 at printed circuit board (PCB) 12 back sides.
In addition, still there is a kind of routine techniques to disclose a backlight module 20, as shown in Figure 2.Described backlight module 20 comprises a plurality of light-emitting diodes 21 that are bonded to printed circuit board (PCB) 22, and the lower surface in printed circuit board (PCB) 22 is pasting heat pipe 23 equally.The periphery of heat pipe 23 is provided with fin 24, so the heat loss that heat pipe 23 can be taken away from printed circuit board (PCB) 22 is in atmosphere.Similarly radiator structure is also disclosed by Japanese JP2005317480 patent.
Yet above-mentioned routine techniques all has identical heat radiation approach, i.e. the heat of light-emitting diode generation must just can be delivered to heat pipe via printed circuit board (PCB) earlier.Yet printed circuit board (PCB) comprises coating layer on a bearing substrate and the substrate or insulating barrier, circuit layer at least, and the coating layer of printed circuit board (PCB) or insulating barrier are the material of low heat conductivity, for example: anti-welding lacquer (solder mask) or resin (resin), so can cause the thermal resistance value of printed circuit board (PCB) bigger than normal, thereby the heat that light-emitting diode produces can't be delivered to heat pipe efficiently and effectively.Even if printed circuit board (PCB) is replaced into the lower metallic core printed circuit board (PCB) of thermal resistance value (metal corePCB), yet the heat that light-emitting diode produces still needs each laminated material through the metallic core printed circuit board (PCB), and the sticky material by the interface or scolding tin (solder) and substrate could arrive heat pipe.
Therefore, need a kind of LED light-source module that can shorten heat transfer path and reduce corresponding total heat resistance on the market in a hurry, the heat that light-emitting diode produced by this can rapidly and be directly delivered to heat pipe, and then promotes the hot reliability and the luminous efficiency of light-emitting diode.
Summary of the invention
The LED light-source module that the purpose of this invention is to provide a kind of high cooling efficiency, it directly forms insulating barrier and metallic circuit layer on the heat pipe or the flat-plate heat pipe surface of flat, and the heat that light-emitting diode or crystal grain produced that therefore is bonded to circuit layer can rapidly and be directly delivered to heat pipe.The LED light-source module that this kind thermal diffusivity is good can be widely used in the backlight of display panels, and can be used as the display screen of public place and lighting apparatus etc.
The purpose of another announcement of the present invention provides a kind of radiator structure LED light-source module that has with low cost, and it is a plurality of light-emitting diodes to be directly fixed on the heat pipe of flat, and is electrically connected to a printed circuit board (PCB).Therefore can use existing flat heat pipe and printed circuit board (PCB), and can also have the advantage of high cooling efficiency concurrently, be a competitive LED light-source module really.
For achieving the above object, the present invention discloses a kind of LED light-source module with radiator structure, and it comprises the heat-pipe apparatus that a plurality of light-emitting diodes and a surface have at least one circuit layer.Described circuit layer directly is formed on the good electric insulation layer of the heat conductivity on described heat-pipe apparatus surface, and described again a plurality of light-emitting diodes and described circuit layer are electrical connected.Described heat-pipe apparatus can be a flat heat pipe, perhaps is the assembly that is become by a plurality of flat heat pipes, fin and fan combination, but and described heat pipe bending flatten to adapt to the needs of design.Described a plurality of light-emitting diode directly is bonded to the surface of described heat-pipe apparatus, therefore by the phase change effect in the described heat-pipe apparatus, the heat energy that can effectively described light-emitting diode be produced when shinny spills in the atmosphere rapidly, perhaps be carried to the described fin of being located at far-end carrying out the purpose of heat exchange, and then reach preferable radiating effect and save the space.
Described light-emitting diode can be the light-emitting diode after having encapsulated, and also can be the crystal grain (die) of naked crystalline substance.Therefore,, not only can reduce the formed thermal resistance of encapsulating material, and also can save the cost that each light-emitting diode encapsulates required cost simultaneously if be directly fixed on the surface of described heat-pipe apparatus with crystal grain.
The present invention discloses a kind of LED light-source module with radiator structure in addition, and it comprises a plurality of light-emitting diodes, a printed circuit board (PCB) and a heat-pipe apparatus.Described a plurality of light-emitting diode is directly fixed on the surface of described heat-pipe apparatus, and is electrical connected with described printed circuit board (PCB).The structure that is different from last announcement, described heat pipe surface need not coating one deck circuit layer.And described heat-pipe apparatus can be a flat heat pipe, perhaps is the assembly that is become by a plurality of flat heat pipes, fin and fan combination.
Description of drawings
Fig. 1 is the cross-sectional view of conventional backlight module;
Fig. 2 is the cross-sectional view of another conventional backlight module;
Fig. 3 is the top view that the present invention has the LED light-source module of radiator structure;
Fig. 4 is along the generalized section of 1-1 hatching among Fig. 3;
Fig. 5 is the cutaway view that second embodiment of the invention has the LED light-source module of radiator structure;
Fig. 6 (a) is the cutaway view that third embodiment of the invention has the LED light-source module of radiator structure;
Fig. 6 (b) is the cutaway view that fourth embodiment of the invention has the LED light-source module of radiator structure
Fig. 7 is the top view that fifth embodiment of the invention has the LED light-source module of radiator structure;
Fig. 8 is the top view that sixth embodiment of the invention has the LED light-source module of radiator structure; And
Fig. 9 is the cutaway view that sixth embodiment of the invention has the LED light-source module of radiator structure.
Embodiment
Fig. 3 is the top view that the present invention has the LED light-source module of radiator structure.LED light-source module 30 comprises a plurality of light-emitting diodes 31 and at least one heat pipe 32, also can comprise the reflector 34 of a plurality of fin 33 and a plurality of increase light utilizations in addition.The heat that light-emitting diode 31 is produced when being lighted can directly be delivered to the condensing zone that is provided with fin 33 by heat pipe 32, and spills in the atmosphere by fin 33.Heat pipe 32 is made by the good metal of heat conductivities such as copper or aluminium, its inside has an operation material that can carry out the latent heat phase change between liquid and steam, so can be delivered to the heat that light-emitting diode 31 produces in the thermal treatment zone of heat pipe 32 by heat conduction, the operation material of liquid in pipe kenel absorbs heat phase transformation rapidly and forms steam, via the steam fast moving heat energy is transferred to condensing zone, heat energy is taken away rapidly with the free convection form by fin 33 again, to solve the problem of heat radiation.Form forced convertion if install fan (figure does not show) additional in fin 33 places, then will increase the speed of heat energy loss.
Fig. 4 is along the generalized section of 1-1 hatching among Fig. 3.At at least one electric insulation layer 35 of the upper surface coating of heat pipe 32, for example: ceramic material or metal oxide (alundum (Al (Al
2O
3)) etc., utilize coating to print again or mode such as pile up is formed at circuit layer 36 on the electric insulation layer 35.Described heat pipe 32, electric insulation layer 35 and circuit layer 36 form a heat-pipe apparatus 37.In addition, can form on one circuit layer on the electric insulation layer and (figure does not show) more in regular turn at circuit layer 36, described light-emitting diode 31 directly electrically connects with the described circuit layers of going up.So heat pipe 32 surfaces can have the structure of a plurality of circuit layers, thereby increase the function and the application of LED light-source module 30.Because the heat conductivity of ceramic material is splendid, so the heat that light-emitting diode 31 produces can be transmitted to heat pipe 32 via electric insulation layer 35.The printed circuit board (PCB) that uses in the aforementioned routine techniques, the present invention not only simplifies heat transfer path, has more significantly reduced the total heat resistance.
Can use the LED light-source module of existing element for providing a kind of, and have the characteristic of high cooling efficiency concurrently, Fig. 5 is the cutaway view that second embodiment of the invention has the LED light-source module of radiator structure.A plurality of light-emitting diodes 41 directly are fixed in heat pipe 32 surfaces with heat conductivity good scolding tin 48 or elargol, and the pin of light-emitting diode 41 (lead) 411 then extends to the printed circuit board (PCB) 47 of side, and is electrical connected with printed circuit board (PCB) 47.Similarly, for increasing light utilization, reflector 34 can be set on printed circuit board (PCB) 47, the light that light-emitting diode 41 like this sends can be concentrated upwards and penetrate.
Compared to Fig. 4, though light-emitting diode 31 can use the lead frame (leadframe) with heating panel to strengthen the heat radiation of packaging body, if but LED crystal particle can be directly fixed on the heat pipe 32, then not only save the required cost of encapsulation, the thermal resistance of more removing encapsulating material from and being caused.Fig. 6 (a) is the cutaway view that third embodiment of the invention has the LED light-source module of radiator structure.A plurality of LED crystal particle (bare die) the 61st are fixed in heat pipe 32 lip-deep electric insulation layers 35, and connect LED crystal particle 61 and circuit layer 36 by wire soldering technology with plain conductor 69.LED crystal particle 61 surfaces and plain conductor 69 can cover a transparent material 65, for example: resin or silica gel (Silicone rubber), with protection LED crystal particle 61 and plain conductor 69.
In addition, Fig. 6 (b) is the cutaway view that fourth embodiment of the invention has the LED light-source module of radiator structure.A plurality of LED crystal particle (bare die) 61 with projection (bump) 68 directly are fixed on the circuit layer 36 on heat pipe 32 surfaces with flip-chip (flip chip) technology, and this circuit layer is coated on the electric insulation layer 35 equally.Therefore same the saving encapsulates required cost, and removes the thermal resistance that encapsulating material causes from.LED crystal particle 61 surfaces also can cover a transparent material 65, for example: resin or silica gel (Siliconerubber), with protection LED crystal particle 61.
Fig. 7 is the top view that fifth embodiment of the invention has the LED light-source module of radiator structure.Compared to Fig. 3, LED light-source module 70 is that light-emitting diode 31 is fixed in heat pipe 32 surfaces with array way.And the light-emitting diode (as ruddiness, blue light, green glow) of different colours can be disperseed be staggered setting, and element 31 fixed range of being separated by to each other, to reach the different light effects that goes out.
Fig. 8 is the top view that sixth embodiment of the invention has the LED light-source module of radiator structure.LED light-source module 80 comprises a plurality of light-emitting diodes 81 and a flat-plate heat pipe 82, wherein said light-emitting diode 81 is fixed in the zone of the metal oxide layer 86 on the flat-plate heat pipe 82, and same metal oxide layer 86 is provided with circuit layer (figure does not show).Large-area fin 83 can be fixed in the back side of flat-plate heat pipe 82, more can effectively increase the active area of heat exchange, shown in the cutaway view of Fig. 9.
Technology contents of the present invention and technical characterstic disclose as above, yet the those skilled in the art still may be based on teaching of the present invention and announcement and done all replacement and modifications that does not deviate from spirit of the present invention.Therefore, protection scope of the present invention should be not limited to the content that embodiment discloses, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by appending claims.
Claims (20)
1. LED light-source module with radiator structure is characterized in that comprising:
At least one heat pipe;
At least one printed circuit board (PCB); And
A plurality of light-emitting diodes are directly fixed on described heat pipe surface, and electrically connect with described printed circuit board (PCB).
2. the LED light-source module with radiator structure according to claim 1 is characterized in that, the inside of described heat pipe has an operation material that carries out the latent heat phase change between liquid and steam.
3. the LED light-source module with radiator structure as claimed in claim 1, it is characterized in that the light-emitting diode after described light-emitting diode is for encapsulation, described light-emitting diode has a plurality of pins, and described pin and described printed circuit board (PCB) directly electrically connect.
4. the LED light-source module with radiator structure as claimed in claim 1 is characterized in that described heat pipe is the heat pipe of flat-plate heat pipe or flat.
5. the LED light-source module with radiator structure as claimed in claim 1 is characterized in that further comprising at least one fin that is fixed in described heat pipe surface.
6. the LED light-source module with radiator structure as claimed in claim 1 is characterized in that described heat pipe is to be made by the good metal of heat conductivity.
7. the LED light-source module with radiator structure as claimed in claim 1 is characterized in that described heat pipe is to be made by copper or aluminium.
8. LED light-source module with radiator structure is characterized in that comprising:
One heat-pipe apparatus comprises that at least one heat pipe, is located at the circuit layer that the electric insulation layer and on described heat pipe surface is located at described electric insulation layer surface; And
A plurality of light-emitting diodes are directly fixed on described heat-pipe apparatus surface, and electrically connect with described circuit layer.
9. the LED light-source module with radiator structure according to claim 8 is characterized in that, the inside of described heat pipe has an operation material that carries out the latent heat phase change between liquid and steam.
10. the LED light-source module with radiator structure as claimed in claim 8 is characterized in that described light-emitting diode is the crystal grain of naked crystalline substance.
11. the LED light-source module with radiator structure as claimed in claim 9 is characterized in that described light-emitting diode covers a transparent material, described transparent material is resin or silica gel.
12. the LED light-source module with radiator structure as claimed in claim 9 is characterized in that described crystal grain is to be electrical connected with plain conductor or projection and described circuit layer.
13. the LED light-source module with radiator structure as claimed in claim 8 is characterized in that the light-emitting diode after described light-emitting diode is for encapsulation.
14. the LED light-source module with radiator structure as claimed in claim 8 is characterized in that described electric insulation layer is a ceramic material layer or metal oxide layer.
15. the LED light-source module with radiator structure as claimed in claim 8, it is characterized in that further comprising on one circuit layer on the electric insulation layer and, described upward electric insulation layer and the described circuit layer of going up are stacked on the described circuit layer in regular turn, the electric connection of the direct and described upward circuit layer of wherein said a plurality of light-emitting diodes.
16. the LED light-source module with radiator structure as claimed in claim 8 is characterized in that described heat-pipe apparatus is assembled by a plurality of described heat pipe to form.
17. the LED light-source module with radiator structure as claimed in claim 8 is characterized in that described heat pipe is the heat pipe of flat-plate heat pipe or flat.
18. the LED light-source module with radiator structure as claimed in claim 8 is characterized in that further comprising at least one fin that is fixed in described heat-pipe apparatus surface.
19. the LED light-source module with radiator structure as claimed in claim 8 is characterized in that described heat pipe is to be made by the good metal of heat conductivity.
20. the LED light-source module with radiator structure as claimed in claim 8 is characterized in that described heat pipe is to be made by copper or aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101053328A CN101783341B (en) | 2006-08-15 | 2006-08-15 | LED light-source module with heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101053328A CN101783341B (en) | 2006-08-15 | 2006-08-15 | LED light-source module with heat dissipation structure |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101112122A Division CN101126863A (en) | 2006-08-15 | 2006-08-15 | Light-emitting diode light source module with heat dissipation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101783341A true CN101783341A (en) | 2010-07-21 |
| CN101783341B CN101783341B (en) | 2012-05-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101053328A Active CN101783341B (en) | 2006-08-15 | 2006-08-15 | LED light-source module with heat dissipation structure |
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| Country | Link |
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| CN (1) | CN101783341B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751270A (en) * | 2011-04-18 | 2012-10-24 | 浙江中博光电科技有限公司 | Metal substrate structure with light-emitting diode (LED) |
| CN103261786A (en) * | 2010-12-15 | 2013-08-21 | 皇家飞利浦电子股份有限公司 | An illumination apparatus and a method of assembling the illumination apparatus |
| CN110707079A (en) * | 2019-10-25 | 2020-01-17 | 国网安徽省电力有限公司南陵县供电公司 | Novel heat dissipation type light-emitting diode lighting structure and manufacturing method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6418017B1 (en) * | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
| DE10245892A1 (en) * | 2002-09-30 | 2004-05-13 | Siemens Ag | Illumination device for backlighting an image display device |
| JP2005078966A (en) * | 2003-09-01 | 2005-03-24 | Seiko Epson Corp | Light source device, manufacturing method of light source device, and projection type display device |
| CN1601768A (en) * | 2003-09-22 | 2005-03-30 | 福建省苍乐电子企业有限公司 | LED structure |
| CN2706876Y (en) * | 2004-05-29 | 2005-06-29 | 无锡来德电子有限公司 | Semiconductor LED with strong radiating mechanism |
-
2006
- 2006-08-15 CN CN2010101053328A patent/CN101783341B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103261786A (en) * | 2010-12-15 | 2013-08-21 | 皇家飞利浦电子股份有限公司 | An illumination apparatus and a method of assembling the illumination apparatus |
| CN102751270A (en) * | 2011-04-18 | 2012-10-24 | 浙江中博光电科技有限公司 | Metal substrate structure with light-emitting diode (LED) |
| CN110707079A (en) * | 2019-10-25 | 2020-01-17 | 国网安徽省电力有限公司南陵县供电公司 | Novel heat dissipation type light-emitting diode lighting structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101783341B (en) | 2012-05-09 |
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