CN101783093A - 标签装置及使用该标签装置的电路板 - Google Patents

标签装置及使用该标签装置的电路板 Download PDF

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Publication number
CN101783093A
CN101783093A CN200910300227.7A CN200910300227A CN101783093A CN 101783093 A CN101783093 A CN 101783093A CN 200910300227 A CN200910300227 A CN 200910300227A CN 101783093 A CN101783093 A CN 101783093A
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China
Prior art keywords
circuit board
label apparatus
label
fixed part
column
Prior art date
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Pending
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CN200910300227.7A
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English (en)
Inventor
刘磊
孙正衡
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200910300227.7A priority Critical patent/CN101783093A/zh
Priority to US12/409,527 priority patent/US8072777B2/en
Publication of CN101783093A publication Critical patent/CN101783093A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/02Forms or constructions
    • G09F3/0297Forms or constructions including a machine-readable marking, e.g. a bar code
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/08Fastening or securing by means not forming part of the material of the label itself
    • G09F3/12Fastening or securing by means not forming part of the material of the label itself by pins, staples, or the like
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927Machine readable code, e.g. bar code
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936Marks, inscriptions, etc. for information
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10204Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24008Structurally defined web or sheet [e.g., overall dimension, etc.] including fastener for attaching to external surface

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

一种标签装置,包括一支撑体以及一标示体,所述标示体用于承载标签,所述支撑体用于支撑所述标示体并用于将所述标签装置固定至一电路板。本发明标签装置的优点在于,其有效利用了电路板上方的空间,从而大大降低了标签对于电路板设计造成的影响和浪费。另外,本发明还涉及一种使用所述标签装置的电路板。

Description

标签装置及使用该标签装置的电路板
技术领域
本发明涉及一种标签装置及使用该标签装置的电路板。
背景技术
在电路板,尤其是电脑主板的设计和制造过程中,通常需要在电路板上贴标签以对其进行追踪和记录。通常,主板上都要贴大量的条码、制造商料号、产品序列号、介质访问控制地址(Media Access Control Address)等标签,需要占用主板上大量的空白区域。对于如今力求主板紧凑设计的趋势和潮流来说,标签浪费了太多的主板设计面积。
发明内容
鉴于以上内容,有必要降低标签对于电路板设计面积的浪费。
一种标签装置,包括一支撑体以及一标示体,所述标示体用于承载标签,所述支撑体用于支撑所述标示体并用于将所述标签装置固定至一电路板。
一种电路板,包括一板体及一标签装置,所述标签装置包括一支撑体以及一设有标签的标示体,所述支撑体包括一立柱及在所述立柱底端处形成的一固定部,所述标示体由所述立柱延伸出,所述固定部将所述标签装置固定于所述板体。
本发明标签装置通过支撑体固定在电路板上,其有效利用了电路板上方的空间,从而大大降低了标签占用电路板的面积。
附图说明
下面参考附图结合具体实施方式对本发明作进一步的说明。
图1为本发明标签装置的第一较佳实施方式的立体图。
图2为图1中的标签装置与一电路板的组装侧视图。
图3为本发明标签装置的第二较佳实施方式的立体图。
图4为本发明标签装置的第三较佳实施方式的立体图。
图5为本发明标签装置的第四较佳实施方式的立体图。
图6为本发明标签装置的第五较佳实施方式的立体图。
图7为本发明标签装置的第六较佳实施方式的立体图。
图8为本发明标签装置的第七较佳实施方式的立体图。
具体实施方式
本发明标签装置的较佳实施方式包括一支撑体及一标示体。所述标示体用于承载标签,所述支撑体用于支撑所述标示体并用于将所述标签装置固定至电路板。
请参考图1及图2,在所述标签装置的第一较佳实施方式中,所述支撑体包括一立柱10及在立柱10底端处形成的一固定部20,所述标示体为一纵长的平板30。固定部20包括一卡扣22以及一绕立柱10延伸出的凸环24。凸环24位于卡扣22与所述标示体之间的略高于卡扣22处。卡扣22包括若干自立柱10延伸出的并位于同一圆面的突起220。每一突起220的最邻近所述标示体的上表面及最远离所述标示体的下表面均形成倾斜的或弧形的导引面。平板30由立柱10的顶端向上延伸出。生产中,可将标签沿纵向贴于平板30上,或通过丝印等印刷工艺将标签形成于平板30表面。
使用时,在电路板的板体100上开设通孔(图未示),将所述标签装置的卡扣22插入所述通孔,突起220穿过所述通孔,板体100被卡固于突起220与凸环24之间。拆卸时,只需稍用力拔出所述标签装置即可。其中,突起220的导引面使得所述标签装置的插拔更加容易。
请参考图3,所述标签装置的第二较佳实施方式与第一较佳实施方式的区别在于,其固定部20B为方块状,其通过在固定部20B底面涂抹黏胶将固定部20B粘贴于电路板。
请参考图4,所述标签装置的第三较佳实施方式与第一较佳实施方式的区别在于,其标示体为一横长的板体30C,标签横向的设置于板体30C表面。
请参考图5,所述标签装置的第四较佳实施方式与第一较佳实施方式的区别在于,其板体30D是由立柱10D侧向延伸出的。
请参考图6,所述标签装置的第五较佳实施方式与第一较佳实施方式的区别在于,其板体30E是水平设置于立柱10E的顶部。
请参考图7,所述标签装置的第六较佳实施方式与第三较佳实施方式的区别在于,其设有两个支撑体。
请参考图8,所述标签装置的第七较佳实施方式与第一较佳实施方式的区别在于,其标示体为一圆柱30G,标签设置于圆柱30G的侧面。
本发明标签装置的优点在于,其有效利用了电路板上方的空间,从而大大降低了标签占用电路板的面积,同时其可以被重复利用。

Claims (10)

1.一种标签装置,包括一支撑体以及一标示体,所述标示体用于承载标签,所述支撑体用于支撑所述标示体并用于将所述标签装置固定至一电路板。
2.如权利要求1所述的标签装置,其特征在于:所述标示体上粘贴或丝印有标签。
3.如权利要求1或2中任意一项所述的标签装置,其特征在于:所述支撑体包括一立柱及在所述立柱底端处形成的一固定部,所述固定部用于将所述标签装置固定于所述电路板。
4.如权利要求3所述的标签装置,其特征在于:所述固定部包括一卡扣以及一位于所述卡扣与所述标示体之间的绕所述立柱延伸出的凸环,所述卡扣包括若干个自所述立柱延伸出的并位于同一圆面的突起。
5.如权利要求4所述的标签装置,其特征在于:每一突起的最邻近所述标示体的表面及最远离所述标示体的表面均形成倾斜的或弧形的导引面。
6.如权利要求3所述的标签装置,其特征在于:所述固定部呈块状,其通过在底面涂抹黏胶以粘贴于所述电路板。
7.一种电路板,包括一板体,其特征在于:所述电路板还包括一标签装置,所述标签装置包括一支撑体以及一设有标签的标示体,所述支撑体包括一立柱及在所述立柱底端处形成的一固定部,所述标示体由所述立柱延伸出,所述固定部将所述标签装置固定于所述板体。
8.如权利要求7所述的电路板,其特征在于:所述固定部粘贴于所述板体。
9.如权利要求7所述的电路板,其特征在于:所述固定部卡固于所述板体。
10.如权利要求9所述的电路板,其特征在于:所述固定部包括一卡扣以及一位于所述卡扣上方的绕所述立柱延伸出的凸环,所述卡扣包括若干个自所述立柱延伸出的并位于同一水平面的突起,所述板体开设一通孔,所述卡扣穿过所述通孔使得所述板体被卡固于所述突起与所述凸环之间。
CN200910300227.7A 2009-01-16 2009-01-16 标签装置及使用该标签装置的电路板 Pending CN101783093A (zh)

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Application Number Priority Date Filing Date Title
CN200910300227.7A CN101783093A (zh) 2009-01-16 2009-01-16 标签装置及使用该标签装置的电路板
US12/409,527 US8072777B2 (en) 2009-01-16 2009-03-24 Label assembly and circuit board using the same

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Application Number Priority Date Filing Date Title
CN200910300227.7A CN101783093A (zh) 2009-01-16 2009-01-16 标签装置及使用该标签装置的电路板

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104302131A (zh) * 2013-07-17 2015-01-21 鸿富锦精密电子(天津)有限公司 服务器及其标示件

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102738609A (zh) * 2011-04-06 2012-10-17 鸿富锦精密工业(深圳)有限公司 电子元件固定装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2243108Y (zh) 1995-04-03 1996-12-18 陈维福 道路警示标
US6202550B1 (en) * 1998-12-30 2001-03-20 Eastman Kodak Company Printer and method for printing indicia on a compact disk using a plurality of ink jet or laser rotatable print heads
US7467871B2 (en) * 2003-10-31 2008-12-23 Reliance Medical Products, Inc. Ophthalmological instrument stand
JP3793203B2 (ja) * 2004-02-12 2006-07-05 シーレックス株式会社 撮影防止用セキュリティシール及び撮影防止用セキュリティシール供給シート
CN200986775Y (zh) 2006-07-31 2007-12-05 郭艳亭 一种用于宣传商品标签的广告装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104302131A (zh) * 2013-07-17 2015-01-21 鸿富锦精密电子(天津)有限公司 服务器及其标示件
CN104302131B (zh) * 2013-07-17 2017-07-25 赛恩倍吉科技顾问(深圳)有限公司 服务器及其标示件

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US20100181103A1 (en) 2010-07-22

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Application publication date: 20100721