CN101747558B - Polypropylene composite used for high-density chips and preparation method thereof - Google Patents

Polypropylene composite used for high-density chips and preparation method thereof Download PDF

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Publication number
CN101747558B
CN101747558B CN2008102200666A CN200810220066A CN101747558B CN 101747558 B CN101747558 B CN 101747558B CN 2008102200666 A CN2008102200666 A CN 2008102200666A CN 200810220066 A CN200810220066 A CN 200810220066A CN 101747558 B CN101747558 B CN 101747558B
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Prior art keywords
parts
polypropene composition
density chips
mah
density
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CN101747558A (en
Inventor
黄达
丁超
罗忠富
李永华
李晟
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Kingfa Science and Technology Co Ltd
Shanghai Kingfa Science and Technology Co Ltd
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Kingfa Science and Technology Co Ltd
Shanghai Kingfa Science and Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/04—Particle-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/92—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00—Indexing scheme relating to extrusion moulding
    • B29C2948/92—Measuring, controlling or regulating
    • B29C2948/92504—Controlled parameter
    • B29C2948/92704—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00—Indexing scheme relating to extrusion moulding
    • B29C2948/92—Measuring, controlling or regulating
    • B29C2948/92819—Location or phase of control
    • B29C2948/92857—Extrusion unit
    • B29C2948/92876—Feeding, melting, plasticising or pumping zones, e.g. the melt itself
    • B29C2948/92895—Barrel or housing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses a polypropylene composite used for high-density chips and a preparation method thereof. The composite contains the components in parts by weight: 3-10 parts of polypropylene resin, 1-8 parts of Tissuemat E, 0-10 parts of PP-g-MAH, 0-3 parts of POE-g-MAH, 80-90 parts of barium sulfate, 0-10 parts of antimonous oxide and 0.5-3 parts of molecular weight regulator master batch. On the basis of the prior art, the weight ratio of barium sulfate is increased to 80-90 parts by the invention, and then the barium sulfate is compounded with other components, and therefore, the prepared polypropylene composite has the advantages of high specific gravity, high intensity, no fragility, good hand feeling and the like. The polypropylene composite is suitable for preparing the high-density chips, and colors can be regulated according to demands.

Description

A kind of high-density chips polypropene composition and preparation method thereof that is used for
Technical field
The present invention relates to the modified polypropylene material field, specifically, relate to a kind of high-density chips polypropene composition and technology of preparing thereof of being used for.
Background technology
The chip kind that present domestic entertainment industry is used is a lot.Mainly contain two big types in metal and plastics, adopt the chip of made, manufacturing cost is high, and the chip proportion made from plastics is little, and feel is poor.
Publication number is in the application for a patent for invention of CN1580125A, CN1587314A and CN1587315A, discloses the prescription of some chip special plastics, and these inventions all are that employing PET resin is a base-material, and the permanent white that adds 30-50% prepares the chip PP Pipe Compound.Because the PET injection temperature is up to 270 ℃-280 ℃, processing is relatively more difficult when therefore producing chip.In addition, use the PET resin bad as not enough, easy crisp, the surperficial easy scratch of chip toughness, the wear resistance of base-material, the injecting products surface also has hickie.
Publication number is in the patent of invention of CN1944516A, discloses the prescription of high density poly propylene as the chip PP Pipe Compound, and selecting Vestolen PP 7052 in this patent for use is base-material, adds the PP Pipe Compound of the permanent white of 40-80% as the preparation chip.But the density and the texture of preparation gained chip are still undesirable.
Summary of the invention
The objective of the invention is to overcome the defective of prior art, a kind of polypropene composition that is used for high-density chips be provided, said composition have than great, intensity is high, good hand touch be difficult for advantages such as crisp.
Another object of the present invention provides the preparation method of above-mentioned compsn.
To achieve these goals, the present invention adopts following technical scheme:
A kind of high-density chips polypropene composition that is used for, form by the component of following parts by weight:
Acrylic resin 3-10 part
Polyethylene wax 1-8 part
PP-g-MAH 0-10 part
POE-g-MAH 0-3 part
Permanent white 80-90 part
Antimony Trioxide: 99.5Min 0-10 part
Molecular weight regulator master batch 0.5-3 part.
In above-specified high density chip polypropene composition, said acrylic resin is preferably the HOPP resin, its melt flow rate(MFR) more than or equal to 20g/10min (230 ℃/2.16KG).
In above-specified high density chip polypropene composition, said polyethylene wax preferred number average molecular weight is 700-10000g/mol.Polyethylene wax has good wellability, can better combine with filler, and in addition, polyethylene wax also plays the effect of lubricant.
In above-specified high density chip polypropene composition, said PP-g-MAH is the PP grafted maleic anhydride, and percentage of grafting is 0.8%.Said POE-g-MAH is the POE grafted maleic anhydride, and percentage of grafting is 0.5-0.8%.The adding of two materials can improve the fragility of system.
In above-specified high density chip polypropene composition, the particle diameter of said permanent white is 1000 orders-3000 orders.The effect of permanent white mainly is the proportion that improves compsn.
In above-specified high density chip polypropene composition, the particle diameter of said Antimony Trioxide: 99.5Min is 3000 orders-10000 orders.Except the proportion that can improve compsn, can also improve the texture of material.
In above-specified high density chip polypropene composition, said molecular weight regulator is a di-t-butyl peroxide.The adding of molecular weight regulator master batch is in order to improve the flowability of compsn, to help injection moulding.
The preparation method of above-specified high density chip polypropene composition comprises the steps:
(1) place mixing machine to mix acrylic resin, polyethylene wax, PP-g-MAH, POE-g-MAH, permanent white, Antimony Trioxide: 99.5Min, molecular weight regulator master batch, the rotating speed of mixing machine is 200～450 rev/mins, and the time is 3～8 minutes;
(2) mixture that (1) step is obtained is sent in the screw extrusion press with melting mixing, extruding pelletization, drying under 180～235 ℃ the temperature thereupon, can obtain the high-density chips polypropene composition.
Compared with prior art, the present invention has following beneficial effect:
The present invention on the basis of existing technology; Bring up to 80-90 part to the part by weight of permanent white; Composite with other components again; The polypropene composition for preparing have than great, intensity is high, it is crisp to be difficult for and advantage such as good hand touch, be suitable for preparing high-density chips, and color can be adjusted according to demand.
Embodiment
Embodiment 1
The high-density chips polypropene composition, its component is counted by weight:
6 parts in PP 225 powder
5 parts of polyethylene waxs
8 parts of PP-g-MAH
80 parts in 2000 order permanent white
1 part of di-t-butyl peroxide
(1) place mixing machine to mix PP 225 powder, polyethylene wax, PP-g-MAH, 2000 order permanent white and di-t-butyl peroxide, the rotating speed of mixing machine is 300 rev/mins, and the time is 5 minutes;
(2) mixture that (1) step is obtained is sent in the screw extrusion press with melting mixing, extruding pelletization, dry packing under 190-220 ℃ the temperature thereupon.Its density measurement of products obtained therefrom result is 2.48g/cm 3, loss on ignition is 78.9%.
Embodiment 2
The high-density chips polypropene composition, its component is counted by weight:
4 parts in PP 300 powder
2 parts of polyethylene waxs
3 parts of PP-g-MAH
90 parts in 3000 order permanent white
1 part of di-t-butyl peroxide
(1) place mixing machine to mix PP 300 powder, polyethylene wax, PP-g-MAH, 3000 order permanent white and di-t-butyl peroxide, the rotating speed of mixing machine is 300 rev/mins, and the time is 5 minutes;
(2) mixture that (1) step is obtained is sent in the screw extrusion press with melting mixing, extruding pelletization, dry packing under 190-220 ℃ the temperature thereupon.Its density measurement of products obtained therefrom result is 2.97g/cm 3, loss on ignition is 88.3.
Embodiment 3
The high-density chips polypropene composition, its component is counted by weight:
4 parts in PP 300 powder
2 parts of polyethylene waxs
4 parts of POE-g-MAH
88 parts in 3000 order permanent white
2 parts of di-t-butyl peroxides
(1) place mixing machine to mix PP 300 powder, polyethylene wax, POE-g-MAH, 3000 order permanent white and di-t-butyl peroxide, the rotating speed of mixing machine is 300 rev/mins, and the time is 5 minutes;
(2) mixture that (1) step is obtained is sent in the screw extrusion press with melting mixing, extruding pelletization, dry packing under 190-220 ℃ the temperature thereupon.Its density measurement of products obtained therefrom result is 2.91g/cm 3, loss on ignition is 86.8%.
Embodiment 4
The high-density chips polypropene composition, its component is counted by weight:
5 parts in PP 225 powder
3 parts of polyethylene waxs
4 parts of PP-g-MAH
80 parts in 3000 order permanent white
6 parts of 5000 order Antimony Trioxide: 99.5Mins
2 parts of di-t-butyl peroxides
(1) place mixing machine to mix PP 225 powder, polyethylene wax, PP-g-MAH, 3000 order permanent white, 5000 order Antimony Trioxide: 99.5Mins and di-t-butyl peroxide, the rotating speed of mixing machine is 300 rev/mins, and the time is 5 minutes;
(2) mixture that (1) step is obtained is sent in the screw extrusion press with melting mixing, extruding pelletization, dry packing under 190-220 ℃ the temperature thereupon.Its density measurement of products obtained therefrom result is 2.77g/cm 3
Embodiment 5
The high-density chips polypropene composition, its component is counted by weight:
3 parts in PP 300 powder
1 part of polyethylene wax
3 parts of PP-g-MAH
2 parts of POE-g-MAH
84 parts in 2000 order permanent white
5 parts of 5000 order Antimony Trioxide: 99.5Mins
2 parts of di-t-butyl peroxides
(1) place mixing machine to mix PP 300 powder, polyethylene wax, PP-g-MAH, POE-g-MAH, 2000 order permanent white, 5000 order Antimony Trioxide: 99.5Mins and di-t-butyl peroxide, the rotating speed of mixing machine is 300 rev/mins, and the time is 5 minutes;
(2) mixture that (1) step is obtained is sent in the screw extrusion press with melting mixing, extruding pelletization, dry packing under 190-220 ℃ the temperature thereupon.Its density measurement of products obtained therefrom result is 2.94g/cm 3

Claims (8)

1. one kind is used for the high-density chips polypropene composition, it is characterized in that being made up of the component of following parts by weight:
Figure FSB00000614989600011
The number-average molecular weight of said polyethylene wax is 700-10000g/mol.
2. high-density chips polypropene composition according to claim 1 is characterized in that: said acrylic resin is the HOPP resin.
3. high-density chips polypropene composition according to claim 1 is characterized in that: said PP-g-MAH is the PP grafted maleic anhydride.
4. high-density chips polypropene composition according to claim 1 is characterized in that: said POE-g-MAH is the POE grafted maleic anhydride.
5. high-density chips polypropene composition according to claim 1 is characterized in that: the particle diameter of said permanent white is 1000 orders-3000 orders.
6. high-density chips polypropene composition according to claim 1 is characterized in that: the particle diameter of said Antimony Trioxide: 99.5Min is 3000 orders-10000 orders.
7. high-density chips polypropene composition according to claim 1 is characterized in that: said molecular weight regulator is a di-t-butyl peroxide.
8. the preparation method of the said high-density chips polypropene composition of claim 1 is characterized in that comprising the steps:
(1) place mixing machine to mix acrylic resin, polyethylene wax, PP-g-MAH, POE-g-MAH, permanent white, Antimony Trioxide: 99.5Min, molecular weight regulator master batch, the rotating speed of mixing machine is 200～450 rev/mins, and the time is 3～8 minutes;
(2) mixture that (1) step is obtained is sent in the screw extrusion press with melting mixing, extruding pelletization, drying under 180～235 ℃ the temperature thereupon, can obtain the high-density chips polypropene composition.
CN2008102200666A 2008-12-16 2008-12-16 Polypropylene composite used for high-density chips and preparation method thereof Active CN101747558B (en)

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CN101747558B true CN101747558B (en) 2012-06-27

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102295808B (en) * 2011-07-08 2014-10-29 金发科技股份有限公司 Stress whitening resistant polypropylene composition and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0163003B1 (en) * 1984-02-11 1989-04-12 Hoechst Aktiengesellschaft Master batch containing abrasives
EP1498450A1 (en) * 2003-07-16 2005-01-19 Clariant GmbH Use of waxes as modifier for fillers
CN1944516A (en) * 2006-10-31 2007-04-11 东莞金富亮塑胶颜料有限公司 High density poly propylene (PP) composite material
CN101205332A (en) * 2006-12-20 2008-06-25 上海日之升新技术发展有限公司 High-gloss nano barium sulfate reinforced polypropylene resin composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0163003B1 (en) * 1984-02-11 1989-04-12 Hoechst Aktiengesellschaft Master batch containing abrasives
EP1498450A1 (en) * 2003-07-16 2005-01-19 Clariant GmbH Use of waxes as modifier for fillers
CN1944516A (en) * 2006-10-31 2007-04-11 东莞金富亮塑胶颜料有限公司 High density poly propylene (PP) composite material
CN101205332A (en) * 2006-12-20 2008-06-25 上海日之升新技术发展有限公司 High-gloss nano barium sulfate reinforced polypropylene resin composition

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