CN101740711B - High-power light-emitting diode (LED) bracket - Google Patents

High-power light-emitting diode (LED) bracket Download PDF

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Publication number
CN101740711B
CN101740711B CN 200910261998 CN200910261998A CN101740711B CN 101740711 B CN101740711 B CN 101740711B CN 200910261998 CN200910261998 CN 200910261998 CN 200910261998 A CN200910261998 A CN 200910261998A CN 101740711 B CN101740711 B CN 101740711B
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CN
China
Prior art keywords
supporting pins
support
led
bracket
hollow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN 200910261998
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Chinese (zh)
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CN101740711A (en
Inventor
姚斌
黄哲人
李博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Hongleida Optoelectric Technology Co., Ltd.
Original Assignee
GUANGDONG HONGLEIDA OPTOELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by GUANGDONG HONGLEIDA OPTOELECTRIC TECHNOLOGY Co Ltd filed Critical GUANGDONG HONGLEIDA OPTOELECTRIC TECHNOLOGY Co Ltd
Priority to CN 200910261998 priority Critical patent/CN101740711B/en
Publication of CN101740711A publication Critical patent/CN101740711A/en
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Publication of CN101740711B publication Critical patent/CN101740711B/en
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Abstract

The invention belongs to the technical field of a light-emitting diode (LED), particularly to a high-power LED bracket, which comprises a sheet-shaped bracket, wherein a plurality of LED fixing seats are arranged on the bracket in an array mode, the bracket is provided with a hollow part, the LED fixing seats are arranged in the hollow part, the bracket extends towards the hollow part to form supporting pins for supporting the LED fixing seats; and sunken steps are etched on the supporting pins, on one hand, the plastic seats of the LED fixing seats and the bracket body are steadily connected by the steps, on the other hand, the supporting pins can be conveniently cut off. The high-power LED bracket can be matched with a quartz lens to improve light transmittance, and also can be processed in a reflow soldering way.

Description

High-power LED bracket
Technical field:
The invention belongs to the LED technical field, particularly a kind of high-power LED bracket.
Background technology:
The structure of led support and LED holder has been applied for multinomial patent before the applicant, is called the utility model patent of " high-power LED bracket " etc. for CN201327841Y, name such as Granted publication number.At present, other producers adopt direct stamping forming method for the processing of support and each supporting pins on applicant and the market, and then carry out mould-injection with the support after the punch forming and be processed to form the LED holder, this process technology is fit to the thinner situation of support on the one hand, if support is thicker, then when mould-injection, be difficult to make the LED holder to form the parcel effect; Simultaneously, the lens that the LED holder that adopts this technology to process mainly cooperates plastic cement, silica gel material to make, and the lens light transmission of plastic cement, silica gel material is bad; In addition, existing led support can not be crossed Reflow Soldering processing, produces inconvenience, therefore, is necessary very much prior art is improved.
Summary of the invention:
The object of the invention is to provides a kind of high-power LED bracket for the deficiencies in the prior art; This high-power LED bracket is fit to the thicker situation of support, and the hard to bear cooperation quartz lens of energy, improves light transmission, and this product can also be crossed Reflow Soldering processing.
For achieving the above object, the present invention adopts following technical scheme:
It comprises the sheet support, and support is gone into battle and shown a plurality of LED holders, has hollow-out parts on the support, and the LED fixed seating is in hollow-out parts, and support is extended with the supporting pins that supports the LED holder in hollow-out parts, and etching has recessed step on the supporting pins.
Support is gone into battle and is shown a plurality of single supports, and single support has hollow-out parts, and single support is extended with stake body to hollow-out parts, and stake body is connected with single support by supporting pins, and etching has recessed step on the supporting pins.
Stake body is wrapped with the plastic cement seat and forms the LED holder.
Have the die bond groove on the stake body at LED holder middle part, the zone that the die bond groove surrounds is crystal bonding area.
The local step of plastic cement seat parcel supporting pins can utilize this step to make the plastic cement parcel more stable.
Be extended with supporting pins to hollow-out parts respectively around the single support, be formed with the electrode pad of relative step projection on the supporting pins.
Electrode pad on the supporting pins has two groups, and identical electrical electrode pad connects by the arc connecting portion.
The etching of arc connecting portion has recessed step.
Beneficial effect of the present invention is, etching has recessed step on the supporting pins, on the one hand, can make the plastic cement seat of LED holder keep stable with stake body by this step be connected, on the other hand, be convenient to the cut-out of supporting pins, can also hard to bear cooperation quartz lens, improve light transmission, and this product can also be crossed Reflow Soldering processing.
Description of drawings:
Fig. 1 is schematic diagram of the present invention
Fig. 2 is LED holder schematic diagram of the present invention
Fig. 3 is another angle schematic diagram of LED holder of the present invention
Fig. 4 is the front view of Fig. 3
Fig. 5 is the schematic diagram of support of the present invention
Fig. 6 is the schematic diagram of single support of the present invention
Fig. 7 is another angle schematic diagram of single support of the present invention
Fig. 8 is the front view of Fig. 7
Reference numeral:
10---support;
The 20LED holder;
30---the plastic cement seat;
40---single support,
41---supporting pins,
42---stake body,
43---the die bond groove,
Connecting portion 44;
50---step.
Embodiment:
The present invention is further illustrated below in conjunction with accompanying drawing.
Shown in Fig. 1-8, the present invention includes sheet support 10, support 10 is gone into battle and is shown a plurality of LED holders 20, being convenient to like this mass gives birth to, has hollow-out parts on the support 10, LED holder 20 is positioned at hollow-out parts, and support 10 is extended with the supporting pins 41 that supports LED holder 20 in hollow-out parts, and etching has recessed step 50 on the supporting pins 41.
Support 10 is gone into battle and is shown a plurality of single supports 40, single support 40 has hollow-out parts, single support 40 is extended with stake body 42 to hollow-out parts, stake body 42 is connected with single support 40 by supporting pins 41, etching has recessed step 50 on the supporting pins 41, and the thickness of step 50 is half of stake body 42 and support 10 thickness.
Wherein, stake body 42 is wrapped with plastic cement seat 30 and forms LED holder 20.
Further, have die bond groove 43 on the stake body 42 at LED holder 20 middle parts, the zone that die bond groove 43 surrounds is crystal bonding area.
Wherein, the local step 50 of plastic cement seat 30 parcel supporting pins 41.
The characteristics of maximum of the present invention, namely be to adopt the method for chemical corrosion to etch recessed step 50 in supporting pins 41, if adopt the method for existing direct punching press then can't process this step 50, if and can't process step 50, then 30 of plastic cement seats can not stably be fixedly connected with stake body 42.
Be extended with supporting pins 41 to hollow-out parts respectively around the single support 40, be formed with the electrode pad of relative step 50 projections on the supporting pins 41.
Electrode pad on the supporting pins 41 has two groups, and identical electrical electrode pad connects by arc connecting portion 44, and adopting the connecting portion 44 of arc mainly is to cooperate with stake body 42, and fixing with plastic cement seat 30 to a greater extent.
44 etchings of arc connecting portion have recessed step 50, adopt the method for chemical corrosion to etch recessed step 50 at connecting portion 44, also are fixing with plastic cement seat 30 to the full extent, make plastic cement seat 30 keep stable.
Certainly, above-described embodiment is preferred embodiments of the present invention, is not to limit the scope of the present invention, therefore all equivalences of doing according to the described structure of the present patent application claim, feature and principle change or modify, and all should be included in the present patent application claim.

Claims (7)

1. high-power LED bracket, it is characterized in that: it comprises sheet support (10), support (10) is gone into battle and is shown a plurality of LED holders (20), support has hollow-out parts on (10), LED holder (20) is positioned at hollow-out parts, support (10) is extended with the supporting pins (41) that supports LED holder (20) in hollow-out parts, the upper etching of supporting pins (41) has recessed step (50); Support (10) is gone into battle and is shown a plurality of single supports (40), and single support (40) has hollow-out parts, and single support (40) is extended with stake body (42) to hollow-out parts, and stake body (42) is connected with single support (40) by supporting pins (41).
2. high-power LED bracket according to claim 1 is characterized in that: stake body (42) is wrapped with plastic cement seat (30) and forms LED holder (20).
3. high-power LED bracket according to claim 1 is characterized in that: have die bond groove (43) on the stake body (42) at LED holder (20) middle part, the zone that die bond groove (43) surrounds is crystal bonding area.
4. high-power LED bracket according to claim 2 is characterized in that: the local step (50) of plastic cement seat (30) parcel supporting pins (41).
5. high-power LED bracket according to claim 1, it is characterized in that: single support (40) is extended with supporting pins (41) to hollow-out parts respectively all around, is formed with the electrode pad of relative step (50) projection on the supporting pins (41).
6. high-power LED bracket according to claim 5, it is characterized in that: the electrode pad on the supporting pins (41) has two groups, and identical electrical electrode pad connects by arc connecting portion (44).
7. high-power LED bracket according to claim 6, it is characterized in that: arc connecting portion (44) etching has recessed step (50).
CN 200910261998 2009-12-16 2009-12-16 High-power light-emitting diode (LED) bracket Active CN101740711B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200910261998 CN101740711B (en) 2009-12-16 2009-12-16 High-power light-emitting diode (LED) bracket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200910261998 CN101740711B (en) 2009-12-16 2009-12-16 High-power light-emitting diode (LED) bracket

Publications (2)

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CN101740711A CN101740711A (en) 2010-06-16
CN101740711B true CN101740711B (en) 2013-01-23

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104319341B (en) * 2014-11-17 2017-07-21 深圳市晶台股份有限公司 A kind of method for preventing the packaging deformation of LED support terminal

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101038882A (en) * 2006-03-03 2007-09-19 松下电器产业株式会社 Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
CN101051664A (en) * 2006-04-05 2007-10-10 夏普株式会社 Semiconductor light emitting device
CN101315961A (en) * 2007-06-01 2008-12-03 一诠精密工业股份有限公司 LED conducting wire frame and method for producing the same
JP2009130359A (en) * 2007-11-19 2009-06-11 Iljin Semiconductor Co Ltd Light-emitting diode device and method of manufacturing the same
CN201448768U (en) * 2009-04-22 2010-05-05 博罗冲压精密工业有限公司 Steady high-power LED support

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201717284U (en) * 2009-12-16 2011-01-19 广东宏磊达光电科技有限公司 High-power LED bracket

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101038882A (en) * 2006-03-03 2007-09-19 松下电器产业株式会社 Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
CN101051664A (en) * 2006-04-05 2007-10-10 夏普株式会社 Semiconductor light emitting device
CN101315961A (en) * 2007-06-01 2008-12-03 一诠精密工业股份有限公司 LED conducting wire frame and method for producing the same
JP2009130359A (en) * 2007-11-19 2009-06-11 Iljin Semiconductor Co Ltd Light-emitting diode device and method of manufacturing the same
CN201448768U (en) * 2009-04-22 2010-05-05 博罗冲压精密工业有限公司 Steady high-power LED support

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: GUANGDONG HONGLEIDA OPTO-ELECTRONICS TECHNOLOGY CO

Free format text: FORMER OWNER: DONGGUAN HONGLEIDA ELECTRONIC AND PLASTIC CO., LTD.

Effective date: 20101013

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 523000 DONGGUAN HONGLEIDA ELECTRONIC PLASTICS CO., LTD., BUILDING R, XIAQIAO INDUSTRIAL AREA, DONGCHENG DISTRICT, DONGGUAN CITY, GUANGDONG PROVINCE TO: 523000 GUANGDONG HONGLEIDA OPTO-ELECTRONICS TECHNOLOGY CO., LTD., NO.78, DONGQU ROAD, XIANGXI INDUSTRIAL AREA, LIAOBU TOWN, DONGGUAN CITY, GUANGDONG PROVINCE

TA01 Transfer of patent application right

Effective date of registration: 20101013

Address after: 523000 Guangdong Province, Dongguan city Liaobu Town Industrial Zone West East Road No. 78 Guangdong hongleida Photoelectric Technology Co. Ltd.

Applicant after: Guangdong Hongleida Optoelectric Technology Co., Ltd.

Address before: 523000 Guangdong city of Dongguan province Dongcheng District Industrial Park under the bridge building R Dongguan hongleida Electronic Plastic Co. Ltd.

Applicant before: Dongguan Hongleida Electronic and Plastic Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant