CN101738492B - Sensor apparatus and method for operating same - Google Patents
Sensor apparatus and method for operating same Download PDFInfo
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- CN101738492B CN101738492B CN200910222058XA CN200910222058A CN101738492B CN 101738492 B CN101738492 B CN 101738492B CN 200910222058X A CN200910222058X A CN 200910222058XA CN 200910222058 A CN200910222058 A CN 200910222058A CN 101738492 B CN101738492 B CN 101738492B
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- 238000000034 method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims description 10
- 230000001133 acceleration Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000004873 anchoring Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Abstract
The invention provides a sensor apparatus having a substrate and a seismic mass, where the seismic mass is fixed to the substrate by hanging springs. The seismic mass is movably provided in the direction of a substrate element and the seismic mass has a main element and an auxiliary element. The main element is connected with the auxiliary element by a spring element. Under the mechanical contact of the auxiliary element with the substrate element, the spring element is offset from the balancing position.
Description
Technical field
The present invention relates to a kind of sensor device and a kind of method of moving sensor device.
Background technology
Such sensor device is widely known by the people.For example, by the known a kind of micromechanics formula acceleration transducer of document DE 102006026880A1, its have the walking beam form can be on the z direction with respect to the oscillating mass of substrate deflection, wherein, this micromechanics formula acceleration transducer has and is positioned at suprabasil stop device, and this stop device is used for the mechanical deflection of the maximum possible of constrained vibration quality.This oscillating mass is suspended in the substrate in this wise by anchoring device, makes walking beam have about reversing the asymmetrical geometric configuration of axis by anchoring device structure.This asymmetrical geometric configuration also causes about reversing the asymmetrical mass distribution of axis, makes the acceleration of micromechanics formula acceleration transducer on the z direction cause oscillating mass owing to inertial force and with respect to substrate deflection.This deflection can detect with capacitive way by the electrode and the suprabasil corresponding counter electrode that reverse on the axis one or both sides.Such device is not set, and these devices are used for because to act on accelerating force on the oscillating mass excessive and prevent that such movable element durable attachment is to this retaining element under the situation that touching takes place between movable element and the retaining element.
Summary of the invention
Compared with prior art, have the following advantages according to sensor device of the present invention and the method for the operation sensor device according to the present invention: the danger of the sensor fault that is caused by the permanent attachment between oscillating mass and the base members (below be also referred to as " durable attachment ") is considerably reduced.This realizes in the following way: oscillating mass is configured to major component and secondary element dividually, wherein, major component and secondary element interconnect by spring element, make machinery contact between secondary element and the base members cause that spring element deflection from its equilibrium position comes out.At this, be used for making the power of spring element deflection to pass certainly in base members.The result of described deflection is: the spring force of spring element acts on the major component in this wise, makes major component refer to pressurized on the direction of base members, thereby the motion towards the base members direction of major component is braked and/or stop.At this, this spring element is supported by base members by secondary element.Therefore, particularly advantageous is the touching that has prevented between major component and the base members.In the situation of the braking deficiency that is used for preventing described touching, the spring force that acts on the major component further increases in the process of touching, produces a kind of power effect thus, and this power effect is connected on the contrary with possible adhering between major component and the base members and acts on.Particularly advantageously be, spring element is preferably provided on the space than pendulum spring more close to contact point, thereby the power effect of returning greater than the driving of pendulum spring significantly from power effect spring element, that be used for major component is got loose from base members is because the power effect of pendulum spring is by the especially longer lever arm transmission of significant adverse.Compare with pendulum spring, the spring element preferable configuration is rigidity more, make when " normal operation " (motion of oscillating mass does not make that major component is near base members), spring element do not deflect and the vibration characteristics of oscillating mass fully can or only can not ignore because spring element or influenced because vibrating elements is divided into major component and secondary element.This base members especially comprises similar parts such as basal region, micromechanics formula functional layer zone, electrode, backstop, potted element on meaning of the present invention.The existing technical staff is thinkable to be, base members might not be arranged on the base side of oscillating mass.Machinery contact on the meaning of the present invention, for example the contact of the machinery between secondary element and the base members especially comprises the direct mechanical touching that mechanical force is transmitted that has between the respective element.Spring element not only is arranged on " weak point " side of walking beam but also is arranged on " length " side on meaning of the present invention.
Favourable design proposal of the present invention and expansion scheme from following with reference to drawing the description of the drawings.
According to a kind of preferred extension regulation of the present invention, in the maximum deflection position of described spring element, not only producing the machinery contact between major component and the base members but also between secondary element and base members simultaneously.Particularly preferably be, in this case, not only the tensile force that is supported on the base members of spring element acts on the major component, and the tensile force that suprabasil driving returns that is supported on of pendulum spring also acts on the major component, these power with major component from base members press from, reduce the danger that durable attachment takes place between major component and the base members thus significantly.
According to a kind of other preferred extension regulation, spring element comprises flexural spring and/or torsionspring, thereby can realize multiple different geometric configuration when the structure oscillating mass in an advantageous manner.Therefore, especially can spring element be integrated in the various structures of oscillating mass in simple mode, thus can be in the particularly advantageous mode of cost to existing sensors device extension spring element, to prevent " durable attachment ".
According to a kind of other preferred extension regulation, spring element comprises the sheet spring, wherein, this sheet spring preferably is arranged essentially parallel to the main of major component and extends the plane orientation in the equilibrium position, and extends the plane deflection and come out from main at least in part under the situation of deflection.Particularly advantageously be that sheet spring especially compact conformation ground and cost advantageously is integrated in the oscillating mass.
According to a kind of other preferred extension regulation, spring element and/or secondary element comprise the contact element of convex form, wherein, this projection is arranged to give prominence to towards the direction of base members basically, and the machinery contact is taking place between this contact element and base members under the situation of deflection.Particularly advantageous is that contact element is arranged on the secondary element, wherein, has particularly advantageously prevented " durable attachment " of secondary element on base members by this contact element.Particularly advantageously be, contact element makes that towards the direction convergent of base members the contact area between base members and contact element is relatively little when machinery contacts, thereby has suppressed " durable attachment ".
According to a kind of other preferred extension regulation, spring element and secondary element comprise identical materials, and/or spring element, secondary element and/or contact element comprise anti-attachment material at least in part.On meaning of the present invention, the oscillating mass that has major component, spring element and secondary element also comprises the oscillating mass that is made of a member, and this oscillating mass has certain flexibility at least in the subregion.For example, spring element and secondary element are configured to the common forming section in the major component, for example are configured to the beam shape, the galianconism shape or ligule, thus particularly advantageously and cost relatively advantageously make.The spring element for example weak point of the material by major component and/or secondary element is made.This weak point preferably includes breach or the material convergent portion in the spring zone.
According to a kind of other preferred extension regulation, oscillating mass is included in the axis that reverses in the pendulum spring zone, wherein, this oscillating mass is asymmetric with respect to this mass distribution of reversing axis, and spring element, main areas and/or sub area are arranged on that side with big quality of reversing axis.Described that side with big quality is because big accelerating force and than the deflection of bigger ground of opposite side, thereby spring element is arranged on a described side is enough, can save manufacturing expense in an advantageous manner thus.
According to a kind of other preferred extension regulation, the maximum extension size perpendicular to reversing axis of oscillating mass is asymmetric, wherein, spring element, main areas and/or sub area are arranged on and reverse that side that the bigger maximum of having of axis is extended size.Particularly advantageously be, when oscillating mass moves out from the equilibrium position consumingly, at first be oscillating mass to reverse the long side touching base members that axis is reference, make it possible to particularly advantageously only prevent " durable attachment " of oscillating mass on base members by spring element being integrated into a described long side.
Another theme of the present invention is a kind of method for the operation sensor device, wherein, under the situation of machinery contact between secondary element and the base members, spring element deflection from the equilibrium position is come out, wherein, according to a kind of other preferred extension regulation, under the situation of deflection, by initial length directive effect the power on major component of spring element generation towards oscillating mass.As above described in detail, spring element is just deflection under the situation of machinery contact between secondary element and the base members only.Therefore, this spring element is only just deflection when needed particularly advantageously, i.e. just deflection when existing major component also to touch the danger of base members and having major component " durable attachment " dangerous on base members.In this case, the deflection of spring element produces a tensile force, and this tensile force drives major component and leaves base members in the touching zone, eliminate thus and/or prevent " durable attachment ".In " normally " operational mode, spring element is not tried hard to deflection, thereby the vibration characteristics of oscillating mass is can be owing to spring element not influenced or only can to ignore ground influenced.Therefore, the excess acceleration by sensor device causes that sensor device lost efficacy or the danger of fault is eliminated or minimizing significantly.
Description of drawings
Embodiments of the invention are shown in the drawings and describe in detail in the following description.In the accompanying drawing,
Fig. 1 a and 1b illustrate a schematic plan and the schematic side elevation according to the sensor device of prior art;
Fig. 2 a, 2b and 2c illustrate a schematic plan and two schematic side elevations of the sensor device of first embodiment of the invention;
Fig. 3 a and 3b illustrate a schematic plan and schematic side elevation of sensor device second embodiment of the invention;
Fig. 4 a and 4b illustrate a schematic plan and the schematic side elevation according to the sensor device of the 3rd embodiment of the present invention;
Fig. 5 a, 5b and 5c illustrate a schematic plan and two schematic side elevations according to the sensor device of the 4th embodiment of the present invention;
Embodiment
In the drawings, components identical represents with identical Reference numeral all the time, therefore always only mentions usually or mentions once.
Shown in Fig. 1 a and the 1b according to a schematic plan and a schematic side elevation of the sensor device 1 of prior art, wherein, sensor device 1 has substrate 2 and oscillating mass 3.This oscillating mass 3 is configured to z to the walking beam structure of sensitivity, be that oscillating mass 3 flexibly is fixed in the substrate 2 by pendulum spring 4, make oscillating mass 3 to tilt around reversing axis 30 with respect to substrate 2, wherein, this oscillating mass 3 has first side 50 and one and these first side, 50 opposed second sides 51, this first side 50 is being reversed first side of axis 30, and this second side 51 has significantly bigger maximum extension size 52 perpendicular to reversing axis 30 and being parallel to substrate 2.In the both sides of reversing axis 30, the material of oscillating mass 3 is identical basically, thereby because the maximum of second side 51 extension size 52 is bigger, so the asymmetric mass that oscillating mass 3 has about reversing axis 30 distributes.This can cause: at sensor device 1 perpendicular to substrate 2, when namely being parallel to the z direction and accelerating, oscillating mass 3 changes spacing and the spacing between second side 51 and the substrate 2 of winning between side 50 and the substrate 2 owing to its inertia stands one around the torque of reversing axis 30.The preferred condenser type of the variation of spacing ground is measured by the unshowned electrode on first side 50 and/or second side 51 and the unshowned corresponding counter electrode in the substrate 2, thereby the variation of this spacing is the yardstick of the acceleration of sensor device 1 on the z direction.Dangerous below existing when acceleration is excessive: second side 51 of oscillating mass 3 touches substrate 2 or base members 2 ' and durable attachment on substrate 2 or base members 2 '.Described " durable attachment " causes the complete failure of sensor device 1 unfriendly, because oscillating mass 3 can not move in this case again.
A schematic plan and two schematic side elevations at the sensor device 1 of first embodiment of the invention shown in Fig. 2 a, 2b and the 2c, this sensor device 1 is similar at the sensor device shown in Fig. 1 a and the 1b, wherein, oscillating mass 3 comprises a major component 3 ', a secondary element 3 in second side 51 " and a spring element 5.This spring element 5 for example is configured to torsionspring 5 ', and secondary element 3 " frame that is configured to u shape; this is fixed on the major component 3 ' by torsionspring 5 ' in this wise at its place, arm end, makes it possible to realize this secondary element 3 in other words " around the deflection of (be parallel to the reverse axis 30) rotation 50 by torsionspring 5 ' formation with respect to major component 3 '.In the equilibrium position of torsionspring 5 ', this is arranged essentially parallel to the main of major component 3 ' and extends the plane, and under the situation of deflection, this main size of extending departs from from the main plane of extending of major component 3 '.At secondary element 3 shown in Fig. 2 c " extend the plane deflection from major component 3 ' main and come out; and this oscillating mass 3 under the very big situation of the initial position deflection shown in Fig. 2 b owing to secondary element 3 " take place with substrate 2 or base members 2 ' the mechanical contact, wherein, in these cases, base members 2 ' only for example is the part of substrate 2.The deflection of the oscillating mass 3 shown in Fig. 2 c is very big, makes major component 3 ' also touch base members 2 '.But a tensile force passes to major component 3 ' from the spring element 5 of deflection or the torsionspring 5 ' of deflection, and this tensile force drives major component 3 ' and leaves base members 2 '.At this, the preferred power of significantly returning greater than the driving of pendulum spring 4 of this tensile force.This for example realizes in the following way: the lever arm of lever arm ratio pendulum spring 4 that is used for producing at major component 3 ' spring element 5 that drives the tensile force that returns is obviously more favourable, because extend parallel plane secondary element 3 with major component 3 ' main " than major component 3 ' significantly shorter (approximately being half length of major component).The summation of the power of returning from the driving of spring element 5 and pendulum spring 4 is big like this, thereby eliminates or reduced at least significantly the danger of " durable attachment " of major component 3 ' on base members 2 '.At secondary element 3 " and base members 2 ' between the situation in deflection under contact area in also be provided with contact element 6; this contact element 6 has suppressed secondary element 3 " danger of " durable attachment " on base members 2 ', wherein, contact element 6 has convergent portion in the direction of base members 2 ' for this reason.
A schematic plan and a schematic side elevation of sensor device 1 second embodiment of the invention have been shown in Fig. 3 a and 3b, this second embodiment is identical with first embodiment shown in Fig. 2 a, 2b and the 2c basically, wherein, spring element 5 is not to be configured to torsionspring 5 ', but with two secondary elements 3 " be configured to sheet spring 5 jointly ".The rotation 50 of spring element 5 also be parallel to reverse axis 30 and auxiliary connection element 3 respectively " with major component 3 ', wherein, the sheet spring 5 ' of long spring (Langfeder) form is worked as flexural spring.Spring element 5 and secondary element 3 " preferably made by a member and/or comprise identical materials.Particularly preferably be major component 3 ', secondary element 3 " and spring element 5 make by a member and/or by a kind of material, wherein, spring element 5 constitutes by the weak point in the material of oscillating mass 3.
Shown in Fig. 4 a and the 4b according to a schematic plan and a schematic side elevation of the sensor device 1 of the 3rd embodiment of the present invention, the 3rd embodiment is identical with second embodiment shown in Fig. 3 a and the 3b basically, wherein, spring element 5 is configured to zigzag.Particularly preferably be, by with flexural spring 5 " the indentation structure of the spring element 5 realized of form reduce the spring rate of spring element 5.
Shown in Fig. 5 a, 5b and the 5c according to a schematic plan and two schematic side elevations of the sensor device 1 of the 4th embodiment of the present invention, the 4th embodiment is identical with first embodiment shown in Fig. 2 a, 2b and the 2c basically, wherein, spring element 5 comprises a unique torsionspring 5 ' of the groove that is positioned at major component 3 ' "; secondary element 3 " be configured to the beam shape, and this beam is fixed on torsionspring 5 ' with an end " the center.In addition, secondary element 3 " be configured to rigidity basically.
Claims (11)
1. a sensor device (1), have substrate (2) and oscillating mass (3), wherein, this oscillating mass (3) is fixed in the substrate (2) by pendulum spring (4), this oscillating mass (3) is arranged to and can be flexibly moved towards the direction of base members (2 '), this base members (2 ') is the part of substrate (2), and this oscillating mass (3) has major component (3 ') and secondary element (3 "); it is characterized in that; described major component (3 ') is connected by spring element (5) and secondary element (3 "), wherein, under the situation of machinery contact between secondary element (3 ") and the base members (2 '), this spring element (5) deflection from the equilibrium position is come out.
2. sensor device according to claim 1 (1), it is characterized in that, in the maximum deflection position of described spring element (5), not only producing the machinery contact between major component (3 ') and the base members (2 ') but also between secondary element (3 ") and base members (2 ') simultaneously.
3. sensor device according to claim 1 (1) is characterized in that, described spring element (5) comprises flexural spring and/or torsionspring.
4. a described sensor device (1) in requiring according to aforesaid right is characterized in that described spring element (5) comprises the sheet spring.
5. according to a described sensor device (1) in the claim 1 to 3, it is characterized in that, described spring element (5) and/or secondary element (3 ") comprise the contact element (6) of convex form; wherein; described projection is arranged to towards the direction of base members (2 ') outstanding; and, contact between described contact element (6) and base members (2 '), forming machinery under the situation of deflection.
6. sensor device according to claim 5 (1), it is characterized in that, described spring element (5) and secondary element (3 ") comprise identical materials, and/or described spring element (5), secondary element (3 ") and/or contact element (6) comprise anti-adhesion material at least in part.
7. according to a described sensor device (1) in the claim 1 to 3, it is characterized in that, described oscillating mass (3) has one and reverse axis (30) in the zone of pendulum spring (4), wherein, described oscillating mass (3) is asymmetric with respect to the mass distribution that this reverses axis (30), and described spring element (5), major component (3 ') and/or secondary element (3 ") are arranged on that side with big quality (3) of reversing axis (30).
8. according to a described sensor device (1) in the claim 1 to 3, it is characterized in that, the maximum extension size perpendicular to reversing axis (30) of described oscillating mass (3) is asymmetric, and, described spring element (5), major component (3 ') and/or secondary element (3 ") be arranged on and reverse that side that the bigger maximum of having of axis (30) is extended size.
9. sensor device according to claim 4 (1), it is characterized in that this sheet spring is arranged essentially parallel to described major component (3 ') in the equilibrium position, and the main plane of extending is directed and mainly extend the plane deflection and come out from described at least in part under the situation of deflection.
10. one kind is used for operation requires a described sensor device (1) according to aforesaid right method, it is characterized in that, under the situation of machinery contact between secondary element (3 ") and the base members (2 '), described spring element (5) deflection from the equilibrium position is come out.
11. method according to claim 10 is characterized in that, under the situation of deflection, produces a power towards the initial position of oscillating mass (3) at major component (3 ') by described spring element (5).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008043753.0A DE102008043753B4 (en) | 2008-11-14 | 2008-11-14 | Sensor arrangement and method for operating a sensor arrangement |
| DE102008043753.0 | 2008-11-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101738492A CN101738492A (en) | 2010-06-16 |
| CN101738492B true CN101738492B (en) | 2013-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910222058XA Active CN101738492B (en) | 2008-11-14 | 2009-11-13 | Sensor apparatus and method for operating same |
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| Country | Link |
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| CN (1) | CN101738492B (en) |
| DE (1) | DE102008043753B4 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009000407B4 (en) | 2009-01-26 | 2022-09-08 | Robert Bosch Gmbh | Sensor device and manufacturing method for a sensor device |
| JP5979344B2 (en) * | 2012-01-30 | 2016-08-24 | セイコーエプソン株式会社 | Physical quantity sensor and electronic equipment |
| DE102012207939A1 (en) | 2012-05-11 | 2013-11-14 | Robert Bosch Gmbh | Spring stop for accelerometer |
| US20140260613A1 (en) * | 2013-03-15 | 2014-09-18 | Invensense, Inc. | Elastic bump stops for mems devices |
| EP2808295B1 (en) | 2013-05-31 | 2015-12-30 | Tronics Microsystems S.A. | MEMS-Sensor |
| DE102018221110B3 (en) * | 2018-12-06 | 2020-02-27 | Robert Bosch Gmbh | Micromechanical inertial sensor |
| DE102019216530A1 (en) | 2019-10-28 | 2021-04-29 | Robert Bosch Gmbh | Micromechanical component, in particular inertial sensor, with a seismic mass, a substrate and a cap |
| DE102020202828A1 (en) | 2020-03-05 | 2021-09-09 | Robert Bosch Gesellschaft mit beschränkter Haftung | Micromechanical Z acceleration sensor with spring coupled seismic mass |
| DE102020204767A1 (en) | 2020-04-15 | 2021-10-21 | Robert Bosch Gesellschaft mit beschränkter Haftung | Micromechanical device with a stop spring structure |
| DE102020205616A1 (en) | 2020-05-04 | 2021-11-04 | Robert Bosch Gesellschaft mit beschränkter Haftung | Micromechanical sensor arrangement, method for using a micromechanical sensor arrangement |
| DE102020211922A1 (en) | 2020-09-23 | 2022-03-24 | Robert Bosch Gesellschaft mit beschränkter Haftung | Micromechanical structure and micromechanical sensor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920012A (en) * | 1998-06-16 | 1999-07-06 | Boeing North American | Micromechanical inertial sensor |
| CN1826532A (en) * | 2003-07-30 | 2006-08-30 | 摩托罗拉公司(在特拉华州注册的公司) | Flexible vibratory micro-electromechanical device |
| CN1954188A (en) * | 2004-03-12 | 2007-04-25 | 松下电工株式会社 | Gyro sensor and sensor apparatus using same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11237402A (en) | 1998-02-19 | 1999-08-31 | Akebono Brake Ind Co Ltd | Semiconductor acceleration sensor and its self-diagnosing method |
| DE102006026880B4 (en) | 2006-06-09 | 2023-02-16 | Robert Bosch Gmbh | Micromechanical acceleration sensor |
-
2008
- 2008-11-14 DE DE102008043753.0A patent/DE102008043753B4/en active Active
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2009
- 2009-11-13 CN CN200910222058XA patent/CN101738492B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920012A (en) * | 1998-06-16 | 1999-07-06 | Boeing North American | Micromechanical inertial sensor |
| CN1826532A (en) * | 2003-07-30 | 2006-08-30 | 摩托罗拉公司(在特拉华州注册的公司) | Flexible vibratory micro-electromechanical device |
| CN1954188A (en) * | 2004-03-12 | 2007-04-25 | 松下电工株式会社 | Gyro sensor and sensor apparatus using same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008043753B4 (en) | 2022-06-02 |
| DE102008043753A1 (en) | 2010-05-20 |
| CN101738492A (en) | 2010-06-16 |
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