CN101733867A - Positioning mechanism of floating pin type in-mode inserts - Google Patents
Positioning mechanism of floating pin type in-mode inserts Download PDFInfo
- Publication number
- CN101733867A CN101733867A CN200810235832A CN200810235832A CN101733867A CN 101733867 A CN101733867 A CN 101733867A CN 200810235832 A CN200810235832 A CN 200810235832A CN 200810235832 A CN200810235832 A CN 200810235832A CN 101733867 A CN101733867 A CN 101733867A
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- alignment pin
- male model
- positioning mechanism
- sliding rail
- slide block
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Abstract
The invention provides a positioning mechanism of floating pin type in-mode inserts, which is arranged in a core insert of a core plate and comprises a sliding track which is arranged in the core insert of a core plate; the sliding track provides a motion track for the objects therein; a floating positioning pin is arranged in the core insert of the core plate and is provided with a slider which is arranged in the sliding track; the floating positioning pin moves vertically to a cavity plate along with the sliding of the slider in the sliding track; one end of a spring is fixed on the sliding track, the other end thereof is fixed on the slider of the floating positioning pin; and the spring applies a certain pressure on the slider to lead the slider to be tightly adhered to one end of the sliding track under the condition that external force is not applied on the slider; the positioning mechanism of floating pin type in-mode inserts provided by the invention can lower cost to finish a thin film insert fixed technology by using the positioning mechanism of floating pin type in-mode inserts.
Description
[technical field]
The present invention relates to a kind of in-mode inserts detent mechanism, particularly about a kind of positioning mechanism of floating pin type in-mode inserts.
[background technology]
Existing IMF technology is the in-mode inserts injection molding technology, the characteristics of its technology highly significant are: the surface is the transparent membrane of one deck sclerosis, the centre is a printing pattern layer, the back side is plastic layer, because printing ink is clipped in the middle, can make product prevent that the surface from being scratched and wear-resisting wiping, and can keep the distinctness of color to be difficult for fading for a long time.In process of production, the film mold insert need be fixed in the mother module core on the caster, then male model plate and caster be snapped together, in die, inject plastic cement, finish products made thereby behind the cooling and shaping.The existing technology that the film mold insert is fixed in the die is the Electrostatic Absorption technology, promptly utilize electrostatic generator to make the mother module core on the above-mentioned caster have static, described film mold insert is adsorbed in the above-mentioned mother module core under the effect of static, yet because the cost of electrostatic generator is higher, can make manufacturer waste a lot of funds if when small lot batch manufacture, adopt static to inhale generator, reduce the profit of product.
In view of this, be necessary to provide a kind of in-mode inserts detent mechanism in fact, utilizing this in-mode inserts detent mechanism can finish film mold insert technique for fixing cheaply.
[summary of the invention]
The object of the present invention is to provide a kind of in-mode inserts detent mechanism, utilizing this in-mode inserts detent mechanism can finish film mold insert technique for fixing cheaply.
For achieving the above object, the invention provides a kind of positioning mechanism of floating pin type in-mode inserts, it is located in the male model benevolence of male model plate, and it comprises:
One sliding rail, it is located in the male model benevolence of described male model plate, and this sliding rail provides a tracks for object wherein;
One unsteady alignment pin, it is located in the male model benevolence of described male model plate, and the alignment pin that should float be provided with a slide block, and this slide block places in the described sliding rail, and described unsteady alignment pin is done motion perpendicular to caster with the slip of described slide block in sliding rail;
One spring, the one end is fixed on the described sliding rail, the other end is fixed on the slide block of described unsteady alignment pin, and this spring applies certain pressure to described slide block, makes described slide block be close to an end of described sliding rail under the situation that is not subjected to external force;
Preferable, described unsteady alignment pin head protrudes from surperficial certain distance of described male model benevolence, and this distance makes described unsteady alignment pin contact with described film mold insert greater than the surface of described male model benevolence and the distance between described film mold insert;
Preferable, described unsteady alignment pin head is a cabochon, this cabochon head makes the suffered horizontal compression of described unsteady alignment pin convert vertical buoyancy to;
Preferable, described unsteady alignment pin head is the bevelling type, this bevelling head makes the suffered horizontal compression of described unsteady alignment pin convert vertical buoyancy to;
In-mode inserts detent mechanism provided by the present invention is utilizing this in-mode inserts detent mechanism can finish film mold insert technique for fixing cheaply.
[description of drawings]
Structural representation when Fig. 1 illustrates to positioning mechanism of floating pin type in-mode inserts die sinking of the present invention.
Structural representation when Fig. 2 illustrates to positioning mechanism of floating pin type in-mode inserts matched moulds of the present invention.
Structural representation when Fig. 3 illustrates to positioning mechanism of floating pin type in-mode inserts injection of the present invention.
[specific embodiment]
The invention provides a kind of positioning mechanism of floating pin type in-mode inserts, during structural representation during according to Fig. 1 positioning mechanism of floating pin type in-mode inserts die sinking of the present invention, Fig. 2 positioning mechanism of floating pin type in-mode inserts matched moulds of the present invention during structural representation and Fig. 3 positioning mechanism of floating pin type in-mode inserts injection of the present invention shown in the structural representation, this positioning mechanism of floating pin type in-mode inserts is located in the male model benevolence 101 of male model plate 10, and it comprises:
One sliding rail 20, it is located in the male model benevolence of described male model plate 10 101, and this sliding rail 20 provides a tracks for object wherein;
One unsteady alignment pin 30, it is located in the male model benevolence 101 of described male model plate 10, and the alignment pin 30 that should float is provided with a slide block 301, this slide block 301 places in the described sliding rail 20, and described unsteady alignment pin 30 is done motion perpendicular to caster 40 with the slip of described slide block 301 in sliding rail 20; In first preferred embodiment of this case, described unsteady alignment pin 30 heads are cabochon, and this cabochon head makes described unsteady alignment pin 30 suffered horizontal compressions convert vertical buoyancy to; In second preferred embodiment of this case, described unsteady alignment pin 30 heads are the bevelling type, and this bevelling type head makes described unsteady alignment pin 30 suffered horizontal compressions convert vertical buoyancy to;
One spring 201, the one end is fixed on the described sliding rail 20, the other end is fixed on the slide block 301 of described unsteady alignment pin 30,201 pairs of described slide blocks 301 of this spring apply certain pressure, make described slide block 301 be close to an end of described sliding rail 20 under the situation that is not subjected to external force;
When die sinking, described slide block 301 is close to an end of described sliding rail 20, the head of described unsteady alignment pin 30 protrudes from the surperficial 2-3 millimeter of described male model benevolence 101, place a film mold insert on the mother module core 401 of described caster 40, when matched moulds, described unsteady alignment pin 30 contacts with described film mold insert, about 1 millimeter of the surface lies film mold insert of described male model benevolence 101, because the head of described unsteady alignment pin 30 protrudes from the surperficial 2-3 millimeter of described male model benevolence 101 during die sinking, so when matched moulds, make described slide block 301 in described sliding rail 20 perpendicular to described caster 40 motion 1-2 millimeters, under the elastic force effect that 201 pairs of unsteady alignment pins 30 of spring are applied, described film mold insert also has been subjected to described unsteady alignment pin 30 applied pressures simultaneously, thereby described film mold insert is fixed on the described mother module core 401, when injection, injection machine injects plastic cement in the space between described male model benevolence 101 and the described film mold insert, because described unsteady alignment pin 30 heads are cabochon or bevelling type, this cabochon or bevelling type head make described unsteady alignment pin 30 suffered level and pressure convert vertical buoyancy to, so certain distance moves both vertically after described unsteady alignment pin 30 is subjected to the level of plastic cement and pressure, described unsteady alignment pin 30 disconnects and contacting with described film mold insert, thus the vestige of the unsteady alignment pin 30 on the mould that reduces to form after the plastic cement cooling.
In-mode inserts detent mechanism provided by the present invention is utilizing this in-mode inserts detent mechanism can finish film mold insert technique for fixing cheaply.
Claims (4)
1. a positioning mechanism of floating pin type in-mode inserts is located in the male model benevolence of male model plate, it is characterized in that it comprises:
One sliding rail, it is located in the male model benevolence of described male model plate, and this sliding rail provides a tracks for object wherein;
One unsteady alignment pin, it is located in the male model benevolence of described male model plate, and the alignment pin that should float be provided with a slide block, and this slide block places in the described sliding rail, and described unsteady alignment pin is done motion perpendicular to caster with the slip of described slide block in sliding rail;
One spring, the one end is fixed on the described sliding rail, the other end is fixed on the slide block of described unsteady alignment pin, and this spring applies certain pressure to described slide block, makes described slide block be close to an end of described sliding rail under the situation that is not subjected to external force.
2. positioning mechanism of floating pin type in-mode inserts according to claim 1, it is characterized in that, described unsteady alignment pin head protrudes from surperficial certain distance of described male model benevolence, and this distance makes described unsteady alignment pin contact with described film mold insert greater than the surface of described male model benevolence and the distance between described film mold insert.
3. positioning mechanism of floating pin type in-mode inserts according to claim 1 is characterized in that, described unsteady alignment pin head is a cabochon, and this cabochon head makes the suffered horizontal compression of described unsteady alignment pin convert vertical buoyancy to.
4. positioning mechanism of floating pin type in-mode inserts according to claim 1 is characterized in that, described unsteady alignment pin head is the bevelling type, and this bevelling head makes the suffered horizontal compression of described unsteady alignment pin convert vertical buoyancy to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810235832A CN101733867A (en) | 2008-11-21 | 2008-11-21 | Positioning mechanism of floating pin type in-mode inserts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810235832A CN101733867A (en) | 2008-11-21 | 2008-11-21 | Positioning mechanism of floating pin type in-mode inserts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101733867A true CN101733867A (en) | 2010-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810235832A Pending CN101733867A (en) | 2008-11-21 | 2008-11-21 | Positioning mechanism of floating pin type in-mode inserts |
Country Status (1)
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| CN (1) | CN101733867A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102189647A (en) * | 2011-03-22 | 2011-09-21 | 昆山金利表面材料应用科技股份有限公司 | Injection molding mold positioning structure |
| CN102785332A (en) * | 2012-08-16 | 2012-11-21 | 上海为彪汽配制造有限公司 | Separate hardware injective envelope injection mold |
| CN102975331A (en) * | 2011-09-02 | 2013-03-20 | 智易科技股份有限公司 | Injection mold fixture |
| CN103273622A (en) * | 2013-05-29 | 2013-09-04 | 无锡新宏泰电器科技股份有限公司 | Insert positioning structure for injection mold |
| CN103802270A (en) * | 2012-11-14 | 2014-05-21 | 汉达精密电子(昆山)有限公司 | Insert locating mechanism |
| CN104128965A (en) * | 2014-07-04 | 2014-11-05 | 无锡吉兴汽车声学部件科技有限公司 | Locating mechanism of automobile acoustic component punching die |
| CN104369315A (en) * | 2013-08-14 | 2015-02-25 | 青岛佳友模具科技有限公司 | Vacuum positioning mold for injection molding of large-size insert |
| CN104960142A (en) * | 2015-05-23 | 2015-10-07 | 南通加隆塑胶有限公司 | Injection mould provided with IMD film assisted positioning hopping machine |
| CN105150450A (en) * | 2015-08-05 | 2015-12-16 | 嘉兴信元精密模具科技有限公司 | Movable insert positioning mechanism |
| CN105904670A (en) * | 2016-06-27 | 2016-08-31 | 昆山峰实电子科技有限公司 | Injection mould for in-mould fixed insert |
| CN112297340A (en) * | 2019-07-26 | 2021-02-02 | 汉达精密电子(昆山)有限公司 | Mould structure for forming glass insert |
| CN113370460A (en) * | 2021-06-24 | 2021-09-10 | 莆田市多容光学电子有限公司 | Secondary injection molding method for label |
-
2008
- 2008-11-21 CN CN200810235832A patent/CN101733867A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102189647A (en) * | 2011-03-22 | 2011-09-21 | 昆山金利表面材料应用科技股份有限公司 | Injection molding mold positioning structure |
| CN102975331B (en) * | 2011-09-02 | 2014-11-05 | 智易科技股份有限公司 | Injection mold fixture |
| CN102975331A (en) * | 2011-09-02 | 2013-03-20 | 智易科技股份有限公司 | Injection mold fixture |
| CN102785332A (en) * | 2012-08-16 | 2012-11-21 | 上海为彪汽配制造有限公司 | Separate hardware injective envelope injection mold |
| CN102785332B (en) * | 2012-08-16 | 2014-09-10 | 上海为彪汽配制造有限公司 | Separate hardware injective envelope injection mold |
| CN103802270A (en) * | 2012-11-14 | 2014-05-21 | 汉达精密电子(昆山)有限公司 | Insert locating mechanism |
| CN103273622A (en) * | 2013-05-29 | 2013-09-04 | 无锡新宏泰电器科技股份有限公司 | Insert positioning structure for injection mold |
| CN104369315A (en) * | 2013-08-14 | 2015-02-25 | 青岛佳友模具科技有限公司 | Vacuum positioning mold for injection molding of large-size insert |
| CN104369315B (en) * | 2013-08-14 | 2017-04-19 | 青岛佳友模具科技有限公司 | Vacuum positioning mold for injection molding of large-size insert |
| CN104128965A (en) * | 2014-07-04 | 2014-11-05 | 无锡吉兴汽车声学部件科技有限公司 | Locating mechanism of automobile acoustic component punching die |
| CN104960142A (en) * | 2015-05-23 | 2015-10-07 | 南通加隆塑胶有限公司 | Injection mould provided with IMD film assisted positioning hopping machine |
| CN105150450A (en) * | 2015-08-05 | 2015-12-16 | 嘉兴信元精密模具科技有限公司 | Movable insert positioning mechanism |
| CN105904670A (en) * | 2016-06-27 | 2016-08-31 | 昆山峰实电子科技有限公司 | Injection mould for in-mould fixed insert |
| CN112297340A (en) * | 2019-07-26 | 2021-02-02 | 汉达精密电子(昆山)有限公司 | Mould structure for forming glass insert |
| CN113370460A (en) * | 2021-06-24 | 2021-09-10 | 莆田市多容光学电子有限公司 | Secondary injection molding method for label |
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Open date: 20100616 |