CN101733244A - Oscillator for ultrasonic transducer - Google Patents
Oscillator for ultrasonic transducer Download PDFInfo
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- CN101733244A CN101733244A CN 201010112749 CN201010112749A CN101733244A CN 101733244 A CN101733244 A CN 101733244A CN 201010112749 CN201010112749 CN 201010112749 CN 201010112749 A CN201010112749 A CN 201010112749A CN 101733244 A CN101733244 A CN 101733244A
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- oscillator
- piezoelectric ceramic
- ceramic wafer
- ultrasonic transducer
- insulating materials
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Abstract
The invention relates to an oscillator for an ultrasonic transducer, comprising a piezoceramics wafer on which an electrode is arranged. The piezoceramics wafer is packaged in an insulating material fixedly, and an electrode is led out from the insulating material. By adopting insulating material with high intensity and low damping to package and fix the piezoceramics wafer in a full surrounded or a half surrounded way, the invention saves a metal iron block, thereby reducing the volume of the transducer and reducing the weight of the transducer. Meanwhile, the manufacturing cost of the oscillator is reduced, and the manufacturing process is simple. The oscillator can be arranged in a work medium directly when necessary.
Description
Technical field
The present invention relates to supersonic wave cleaning machine, specifically refer to supersonic wave cleaning machine transducer oscillator.
Background technology
Oscillator for ultrasonic transducer is the mutual conversion that is realized electric energy and mechanical energy (acoustic vibration) by the piezo-electric effect of piezoelectric ceramics, and the device that amplifies of the front and back radiation raggle block that mates by acoustic impedance.It is the ultrasonic vibration that produces by the transducer oscillator that ultrasonic wave cleans, and the instantaneous pressure cavity impact that cavitation effect produced takes place in water be cleaned thing and reach excellent cleaning effect.
Traditional ultrasonic wave (cleaning machine is used) piezoelectric ceramic wafer, when the work vibration at high speed, easily cause the ceramic wafers fragmentation, therefore the general trumpet type composite oscillator structure that adopts, it is made up of front and back metal cover board, piezoelectric ceramic wafer, prestressing force screw rod, electrode slice and insulating sleeve, metal cover board and the full ceramic wafers of prestressing force screw rod clamping prevent wafer fragmentation when vibration at high speed wherein.Apply appropriate pre _ stress, transducer has good electromechanical conversion efficiency under the condition of high-power, high amplitude.The deficiency of this front and back shim structure is that cost height, volume are big, Heavy Weight, manufacturing complexity; Another kind of form is: the small-power ultrasonic oscillator directly is bonded at the outer wall of cleaning machine inner bag with glue, all be to adopt inner bag to add this double-decker of shell when on the small-sized household supersonic wave cleaning machine, using, cause its appearance and modeling almost not change, the one, the Mechanical Builds of electric cooker, the 2nd, the inner bag of cuboid adds the moulding of shell.
Summary of the invention
At the prior art above shortcomings, the purpose of this invention is to provide the oscillator for ultrasonic transducer that a kind of volume is little, in light weight, cost is low.
Technical scheme of the present invention is achieved in that oscillator for ultrasonic transducer, comprises piezoelectric ceramic wafer, and piezoelectric ceramic wafer is provided with electrode; Described piezoelectric ceramic wafer fixed sealing is loaded in the insulating materials, and electrode is drawn from insulating materials.
The shape of piezoelectric ceramic wafer and the combination of packaged type mainly contain three kinds of forms: 1, piezoelectric ceramic wafer is a disc, and piezoelectric ceramic wafer is insulated full encirclement of material and fixes encapsulation; 2, piezoelectric ceramic wafer is an annular, and piezoelectric ceramic wafer is insulated full encirclement of material and fixes encapsulation; 3, piezoelectric ceramic wafer is a disc, and piezoelectric ceramic wafer is insulated after the fixing encapsulation of material wherein the centre of one side and exposes (being semi-surrounding), and exposed parts is the radiating surface of oscillator.Radiating surface can be conical.
Insulating materials of the present invention is high strength, low resistance insulating materials, as phenolic resins etc.
The present invention adopts high strength, low resistance insulating materials that piezoelectric ceramic wafer is surrounded entirely or the semi-surrounding encapsulation is fixed, and has saved the metal iron block, thereby has reduced transducer oscillator volume, and its weight is lightened, and the oscillator manufacturing cost reduces simultaneously, and manufacturing process is simple.In case of necessity, can directly oscillator be placed working media.The present invention can add this double-decker of shell by inner bag with domestic ultrasonic washer and be reduced to single layer structure, and external styling is easier.
Description of drawings
Fig. 1-embodiment of the invention 1 structure cutaway view;
Fig. 2-embodiment of the invention 2 structure cutaway views;
Fig. 3-embodiment of the invention 3 structure cutaway views.
The specific embodiment
The invention will be further described below in conjunction with accompanying drawing.
Referring to Fig. 1, Fig. 2 and Fig. 3, as can be seen, oscillator for ultrasonic transducer of the present invention comprises piezoelectric ceramic wafer 1 (its surface has been coated with thin metal layer) from the figure, and piezoelectric ceramic wafer 1 is provided with positive and negative electrode 2.Improvement of the present invention is that described piezoelectric ceramic wafer 1 fixed sealing is loaded in the insulating materials 3, and electrode 2 is drawn from insulating materials 3, and common two electrodes are positioned at one side.
According to the shape of piezoelectric ceramic wafer and the combination of packaged type, oscillator of the present invention mainly contains three kinds of forms (but being not limited to following manner): one, piezoelectric ceramic wafer 1 is disc, piezoelectric ceramic wafer 1 is insulated material 3 full encirclements and fixes encapsulation, sees Fig. 1; Two, piezoelectric ceramic wafer 1 is an annular, and piezoelectric ceramic wafer 1 is insulated material 3 full encirclements and fixes encapsulation, sees Fig. 2; Three, piezoelectric ceramic wafer 1 is a disc, piezoelectric ceramic wafer 1 is insulated after the fixing encapsulation of material 3 wherein the centre of one side and exposes (being semi-surrounding), exposed parts is the radiating surface of oscillator, sees Fig. 3, and this structure is compared with full encirclement structure has the little advantage of vibration attenuation.Radiating surface also can be taper shape except common plane, promptly at radiating surface one conical hole is set, and forms focusing effect, thereby increases oscillator power.
Insulating materials of the present invention is high strength, low resistance insulating materials, from big classification, plastics class, nylon-type, composite etc. is arranged, as phenolic resins, polyethylene, ABS, nylon or polyamine fat.
The present invention can directly be placed on oscillator in the working media, and is easy to use, flexible.Also can install tagger additional on oscillator two sides, front and back or single face as required, this has not only further protected ceramic wafers, makes it avoid swing crushing, is convenient to the fixed installation of oscillator and clean container again.
Claims (7)
1. oscillator for ultrasonic transducer, comprise piezoelectric ceramic wafer (1), piezoelectric ceramic wafer (1) is provided with electrode (2), it is characterized in that: described piezoelectric ceramic wafer (1) fixed sealing is loaded in the insulating materials (3), and described electrode (2) is drawn from insulating materials (3).
2. oscillator for ultrasonic transducer according to claim 1 is characterized in that: described piezoelectric ceramic wafer (1) is a disc, and piezoelectric ceramic wafer (1) is insulated full encirclement of material (3) and fixes encapsulation.
3. oscillator for ultrasonic transducer according to claim 1 is characterized in that: described piezoelectric ceramic wafer (1) is an annular, and piezoelectric ceramic wafer (1) is insulated full encirclement of material (3) and fixes encapsulation.
4. oscillator for ultrasonic transducer according to claim 1, it is characterized in that: described piezoelectric ceramic wafer (1) is a disc, piezoelectric ceramic wafer (1) is insulated after the fixing encapsulation of material (3) wherein the centre of one side and exposes, and exposed parts is the radiating surface of oscillator.
5. oscillator for ultrasonic transducer according to claim 4 is characterized in that: described radiating surface is for conical.
6. according to the arbitrary described oscillator for ultrasonic transducer of claim 1 to 5, it is characterized in that: described insulating materials is high strength, low resistance insulating materials.
7. oscillator for ultrasonic transducer according to claim 6 is characterized in that: described high strength, low resistance insulating materials are phenolic resins, polyethylene, ABS, nylon or polyamine fat.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101127497A CN101733244B (en) | 2010-02-23 | 2010-02-23 | Oscillator for ultrasonic transducer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101127497A CN101733244B (en) | 2010-02-23 | 2010-02-23 | Oscillator for ultrasonic transducer |
Publications (2)
Publication Number | Publication Date |
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CN101733244A true CN101733244A (en) | 2010-06-16 |
CN101733244B CN101733244B (en) | 2011-09-28 |
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Application Number | Title | Priority Date | Filing Date |
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CN2010101127497A Expired - Fee Related CN101733244B (en) | 2010-02-23 | 2010-02-23 | Oscillator for ultrasonic transducer |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104874113A (en) * | 2015-01-26 | 2015-09-02 | 上海爱声生物医疗科技有限公司 | Multi-frequency annular array probe and ultrasonic physiotherapy instrument including the same |
CN106515670A (en) * | 2016-11-29 | 2017-03-22 | 南京集羽电子科技有限公司 | Ultrasonic cleaning type windscreen wiper |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86206715U (en) * | 1986-09-05 | 1987-06-03 | 李少夫 | Ultrasonic atomized energy converter with packaged vibrator and flexible components |
CN2314369Y (en) * | 1997-09-26 | 1999-04-14 | 同济大学 | Ultrasonic transducer |
EP1145772A2 (en) * | 2000-04-13 | 2001-10-17 | intelligeNDT Systems & Services GmbH & Co. KG | Ultrasound transducer and method for manufacturing an ultrasound transducer |
EP1724849A2 (en) * | 2005-05-03 | 2006-11-22 | Argillon GmbH | Piezoelectric element |
CN201182007Y (en) * | 2007-12-03 | 2009-01-14 | 夏文军 | Energy converter for ultrasound Doppler signal receiving and transmitting device |
-
2010
- 2010-02-23 CN CN2010101127497A patent/CN101733244B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86206715U (en) * | 1986-09-05 | 1987-06-03 | 李少夫 | Ultrasonic atomized energy converter with packaged vibrator and flexible components |
CN2314369Y (en) * | 1997-09-26 | 1999-04-14 | 同济大学 | Ultrasonic transducer |
EP1145772A2 (en) * | 2000-04-13 | 2001-10-17 | intelligeNDT Systems & Services GmbH & Co. KG | Ultrasound transducer and method for manufacturing an ultrasound transducer |
EP1724849A2 (en) * | 2005-05-03 | 2006-11-22 | Argillon GmbH | Piezoelectric element |
CN201182007Y (en) * | 2007-12-03 | 2009-01-14 | 夏文军 | Energy converter for ultrasound Doppler signal receiving and transmitting device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104874113A (en) * | 2015-01-26 | 2015-09-02 | 上海爱声生物医疗科技有限公司 | Multi-frequency annular array probe and ultrasonic physiotherapy instrument including the same |
CN106515670A (en) * | 2016-11-29 | 2017-03-22 | 南京集羽电子科技有限公司 | Ultrasonic cleaning type windscreen wiper |
Also Published As
Publication number | Publication date |
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CN101733244B (en) | 2011-09-28 |
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