CN101728341A - Electronic packaging device - Google Patents
Electronic packaging device Download PDFInfo
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- CN101728341A CN101728341A CN200810166537A CN200810166537A CN101728341A CN 101728341 A CN101728341 A CN 101728341A CN 200810166537 A CN200810166537 A CN 200810166537A CN 200810166537 A CN200810166537 A CN 200810166537A CN 101728341 A CN101728341 A CN 101728341A
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- housing
- buffering mechanism
- fluid
- accommodation space
- packaging device
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Abstract
The invention relates to an electronic packaging device with a substantial and closed accommodation space, which comprises a fluid, an electronic assembly and a spatial buffering mechanism. The fluid is positioned in the accommodation space; the electronic assembly is arranged in the accommodation space, and at least a part of the electronic assembly contacts the fluid; and at least the local spatial buffering mechanism contacts the fluid, and shifts or deforms by means of the fluid so as to be adapted to the volume change of the fluid.
Description
Technical field
The present invention relates to a kind of packaging system, particularly a kind of electronic packaging device.
Background technology
The miniature electric assembly, for example light-emitting diode, solar cell or integrated circuit etc. electrically reach optical function in order to bring into play it, have usefulness and life of product simultaneously concurrently, these electronic building bricks can be sealed in the encapsulating structure, thereby form an electronic packaging device.
Yet the electronic building brick in these are encapsulated in is easy to generate high heat when running, and this will cause the deformed damaged of whole electronic packaging device or dispel the heat bad.Therefore, the problem that how to provide a kind of electronic packaging device can overcome heat radiation and expand has become one of present important topic.
Summary of the invention
Because above-mentioned problem, the purpose of this invention is to provide a kind of can tolerate to expand with heat and contract with cold have the electronic packaging device of heat radiation concurrently.
For reaching above-mentioned purpose, the invention provides a kind of electronic packaging device with accommodation space of substantial and closed, it comprises fluid, electronic building brick and spatial buffering mechanism.Fluid is arranged in accommodation space; Electronic building brick is arranged in the accommodation space, and at least a portion contacts with fluid; Spatial buffering mechanism is local at least to be contacted with fluid, and by its displacement or deformation, to adapt to the change in volume of fluid.
For reaching above-mentioned purpose, the invention provides a kind of electronic packaging device, it comprises housing, spatial buffering mechanism, fluid and electronic building brick.Housing and spatial buffering mechanism system form the fluid accommodation space; Spatial buffering mechanism is to adapt to the change in volume of fluid accommodation space and displacement or deformation; Fluid is arranged in the fluid accommodation space; Electronic building brick is arranged in the fluid accommodation space, and at least a portion contacts with fluid.
The heat that electronic building brick generated can be quickened heat radiation by the convection current of fluid.
In an embodiment of the present invention, accommodation space can be formed by several different modes, for example is to form with housing seal, or housing and spatial buffering mechanism are collaborative and form.Having a part in the accommodation space at least is accommodation space as fluid.
For example: in one embodiment, electronic packaging device comprises housing, and housing has accommodation space.At least one spatial buffering mechanism is arranged in the housing, or is positioned at accommodation space.That is to say, can be divided into two parts in the accommodation space, a part is ccontaining at least one spatial buffering mechanism, and another part is ccontaining fluid and electronic building brick.
For example: in one embodiment, electronic packaging device comprises at least one housing, and housing combines with spatial buffering mechanism and forms accommodation space, and the major part of accommodation space is used for ccontaining fluid and electronic building brick.For example housing has first connected to each other and second portion, and spatial buffering mechanism links first and second portion.In another embodiment, electronic packaging device can comprise a plurality of housings, forms accommodation space thereby the two ends of spatial buffering mechanism link housing respectively.The shape of housing can be worked in coordination, and for example, a housing has an opening, and opening and another housing mate in fact.
No matter accommodation space by how many housings is formed, housing and spatial buffering mechanism are independently assembly or integrated assembly; Or housing has first and second portion, and first and second portion are independently assembly or integrated assembly; Or the first of housing and spatial buffering mechanism are independently assembly or integrated assembly; Or the second portion of housing and spatial buffering mechanism are independently assembly or integrated assembly.
Housing and spatial buffering mechanism are to bind or chimeric, or spatial buffering mechanism is that a part is bonding on housing, and another part is to be embedded in housing.That is to say that the different part more than two of spatial buffering mechanism can connect housing by modes different more than two kinds.
In addition, electronic building brick can be arranged on the housing, and at least a portion of housing can be circuit board, and electronic building brick and circuit board electrically connect.
With thermal characteristics, at least a portion of housing can be the heat radiation that radiator is assisted electronic building brick.With optical characteristics, at least a portion of housing can be the transparent body or radiator or light-scattering body or condensing body or light wavelength conversion body or light reflector.With material, at least a portion of housing is glass material or metal material or ceramic material.In addition, housing also can be provided with radiator or light-scattering body or condensing body or light wavelength conversion body or light reflector on the one side of accommodation space, perhaps housing also can be provided with radiator or light-scattering body or condensing body or light wavelength conversion body or light reflector on the one side of accommodation space dorsad.
Spatial buffering mechanism can be positioned at housing, for example, is arranged in the accommodation space that forms with housing seal merely; Or with the collaborative accommodation space that forms of housing; Or it is outer and be connected with housing and form accommodation space to be positioned at housing.
In addition, no matter how accommodation space forms, electronic packaging device can comprise a plurality of spatial buffering mechanism, and these spatial buffering mechanism can be arranged at accommodation space and/or be arranged at outside the housing.That is to say that a plurality of spatial buffering mechanism can some be arranged in the housing, other is arranged at outside the housing; Perhaps all be arranged in the housing; Perhaps all be arranged at outside the housing.
Spatial buffering mechanism can be a single component, as resilient assembly, perhaps has the assembly of cushion space, or is made of a plurality of assembly.For example: spatial buffering mechanism is elastic parts or slide assemblies, or it comprises elastic parts or slide assemblies; Or spatial buffering mechanism is pellosil or balloon or piston, or spatial buffering mechanism comprises pellosil or balloon or piston; Perhaps spatial buffering mechanism comprises passage and slip separator, and the slip separator is to be slidedly arranged in the passage.
In addition, electronic building brick is naked crystalline substance (bare chip) or other undersized electronic building brick.With material, electronic building brick can be a semiconductor subassembly, or the organic semiconductor assembly, or organic electronic assembly.Electronic building brick can be to utilize thin film manufacture process to make, and at this, the thin film manufacture process of indication is the processing procedure that film is made in physical vapour deposition (PVD) or chemical vapour deposition (CVD) or printing etc.With application, electronic building brick is photoelectric subassembly or (PCC) power or treatment circuit etc.Photoelectric subassembly is electrical-optical transition components (electronic-optical converting element) or light-electric transition components (optical-electronic converting element), but to be not limited to be light-emitting diode or organic electric exciting light-emitting diode or solar cell; (PCC) power is but is not limited to semiconductor power component (semiconductor power element) or power transistor or power diode etc.; Treatment circuit is but is not limited to integrated circuit (integrated circuit) or microprocessor or digital signal processor or ASIC.In addition, electronic building brick also can be a superconductor component.
In addition, fluid can the doping fluorescent transition material, and fluid is colloidal state or liquid or gaseous state or above-mentioned combination.
From the above, can adapt to the change in volume of fluid accommodation space and displacement or deformation according to the spatial buffering mechanism of electronic packaging device of the present invention, so electronic packaging device can be avoided damaging because of the expansion or the contraction of inside.And the fluid in the electronic packaging device can be assisted the electronic building brick heat radiation, so electronic packaging device also can have preferable heat radiation function.
Description of drawings
Figure 1A to Fig. 7 B is the schematic diagram of the electronic packaging device of preferred embodiment according to the present invention.
The component symbol explanation:
1,1a, 1b, 1c, 2,2a, 3: electronic packaging device.
10,20,30: accommodation space.
11,21,31: fluid.
12,22,32: electronic building brick.
13,15,23,25,33,35: spatial buffering mechanism.
14,24,26,34: housing.
141: first.
142: second portion.
151: cushion space.
152,332: passage.
153,333: the slip separator.
Embodiment
Hereinafter with reference to relevant drawings, the electronic packaging device of most preferred embodiments according to the present invention is described.
Shown in Figure 1A, the electronic packaging device 1 of one of preferred embodiment according to the present invention comprises fluid 11, electronic building brick 12, spatial buffering mechanism 13 and housing 14.Housing 14 has the accommodation space 10 of substantial and closed, and fluid 11 is positioned at accommodation space 10, and electronic building brick 12 is arranged at accommodation space 10 and at least a portion contacts with fluid 11.Spatial buffering mechanism 13 is local at least to be contacted with fluid 11, and by its displacement or deformation, to adapt to the change in volume of fluid 11.
Have the accommodation space of a part in the accommodation space 10 at least as fluid.That is to say a part of accommodation space buffer gear 13 of accommodation space 10, ccontaining fluid 11 of another part and electronic building brick 12.Spatial buffering mechanism 13 is because of adapting to the change in volume displacement or the deformation of fluid accommodation space.
At least a portion of housing 14 is first 141 or second portion 142, an or subdivision of first 141, or a subdivision of second portion 142, it can be the transparent body or radiator or light-scattering body or condensing body or light wavelength conversion body or light reflector.With material, at least a portion of housing 14 is first 141 or second portion 142, or a subdivision of first 141, or a subdivision of second portion 142, it can be glass material or metal material or ceramic material or plastic material.
For instance, first 141 is glass materials, and it is the transparent body, and second portion 142 is metal materials, and it is a light reflector.Perhaps, a subdivision of first 141 is light reflectors, and a subdivision of second portion 142 is condensing bodies.About the first 141 or the variation of other kind permutation and combination such as optical characteristics, thermal characteristics or material of its subdivision or second portion 142 or its subdivision, can push away to such an extent that go out according to above explanation owing to know this skill person, so repeat no more.
In addition, electronic packaging device also can comprise optical module (figure show), and it is assembled with housing or spatial buffering mechanism.For example: can be provided with light-scattering body or condensing body or light wavelength conversion body or assemblies such as light reflector or fluorophor adhesive tape on the housing 14, these assemblies can be arranged in the housing 14 or outside the housing.In addition, also can be provided with radiator on the housing 14, radiator can be arranged in the housing 14 or outside the housing.
In addition, electronic packaging device 1 also comprises spatial buffering mechanism 15, and spatial buffering mechanism 15 is positioned at accommodation space 10, and spatial buffering mechanism 15 comprises cushion space 151, cushion space 151 expands because of the change in volume that adapts to fluid 11 or shrinks, and spatial buffering mechanism 15 also can be balloon or piston.
In the present embodiment, spatial buffering mechanism 13,15 is respectively pellosil and balloon, and when the volume of fluid 11 such as Figure 1B expanded, spatial buffering mechanism 13 deformation and central portion branch were towards a side shifting of contacting with fluid 11 not, spatial buffering mechanism 15 can in contract cushion space 151 thereby dwindle; When the volume-diminished of fluid 11, spatial buffering mechanism 13 deformation and central portion branch are towards a side shifting of contacting with fluid 11, and spatial buffering mechanism 15 can expand, cushion space 151 thereby swell. Spatial buffering mechanism 13,15 can change deformation because of the pressure that adaptation is subjected to.
In addition, with shape, spatial buffering mechanism 13 is film like or sheet or tabular or block; With plasticity, but spatial buffering mechanism 13 is deformable body or elastic parts; With material, spatial buffering mechanism 13 is silica gel material or rubber material.
For instance, spatial buffering mechanism 13 is pellosils etc., be connected in housing 14 around it, and the surface of its both sides is because of bearing different pressures deformation.
In addition, spatial buffering mechanism 13 can be a slide assemblies, and shown in Fig. 1 C, spatial buffering mechanism 13 is unfixing with housing 14, when its pressurized, and can be at housing 14 intrinsic displacements.Moreover shown in Fig. 1 D, the part of spatial buffering mechanism 13 can be fixed on the housing 14, and another part housing 14 with contact and displacement with the situation of pressurized.
Shown in Fig. 2 A, different with Figure 1A is, the spatial buffering mechanism 15 of electronic packaging device 1a has passage 152 and slip separator 153, and slip separator 153 is slidedly arranged in the passage 152.
In the present embodiment, when the volume of fluid 11 such as Fig. 2 B expanded, spatial buffering mechanism 13 deformation and central portion branch were towards a side shifting of contacting with fluid 11 not, the slip separator 153 of spatial buffering mechanism 15, then can move cushion space 151 thereby dwindle along passage 152 toward cushion spaces 151; When the volume-diminished of fluid 11, spatial buffering mechanism 13 deformation and central portion branch are towards a side shifting of contacting with fluid 11, and the slip separator 153 of spatial buffering mechanism 15 then can move along passage 152 toward fluids 11, cushion space 151 thereby swell.
As shown in Figure 3A, different with Figure 1A is, the housing 14 of electronic packaging device 1b combines with spatial buffering mechanism 13 and forms accommodation space 10, housing 14 and spatial buffering mechanism 13 can be used as the complete shell of electronic packaging device 1b, and spatial buffering mechanism 13 is isolated airtight accommodation space 10 and extraneous space outerpace.
In the present embodiment, when the volume of fluid 11 such as Fig. 3 B expanded, spatial buffering mechanism 13 deformation and central portion branch be a side shifting on boundary outwardly; When the volume-diminished of fluid 11, spatial buffering mechanism 13 deformation and central portion branch are towards a side shifting of contacting with fluid 11.
Shown in Fig. 4 A, different with Figure 1A is, the housing 14 of electronic packaging device 1c combines with spatial buffering mechanism 13 and forms accommodation space 10, and spatial buffering mechanism 13 and housing 14 are relative and establish.Electronic building brick 12 is arranged on the housing 14, and spatial buffering mechanism 13 is also relative with electronic building brick 12 and establish.
In the present embodiment, when the volume of fluid 11 such as Fig. 4 B increased, spatial buffering mechanism 13 deformation and central portion branch be a side shifting on boundary outwardly; When the volume-diminished of fluid 11, spatial buffering mechanism 13 deformation and central portion branch are towards a side shifting of contacting with fluid 11.
Electronic packaging device 1c can combine with other device, and for example with housing 14 assembling or be fixed on other the outside manufacture or ground, but spatial buffering mechanism 13 is not subjected to the still deformation of restraining of outside manufacture.
In addition, at least a portion of spatial buffering mechanism 13 can be the optic regulating assembly, and such as but not limited to light-scattering body or condensing body or light wavelength conversion body or light reflector or fluorophor adhesive tape etc., it can adjust the discrepancy of light.
For instance, electronic building brick 12 is light-emitting diodes, and spatial buffering mechanism 13 can be adjusted light passes spatial buffering mechanism 13 from electronic building brick 12 angular range with fluid 11 collocation; Perhaps, electronic building brick 12 is solar cells, and spatial buffering mechanism 13 can be adjusted the focal length that light is incident upon electronic building brick 12 with fluid 11 collocation.
Because the assembly among Fig. 2 A to Fig. 4 B, for example fluid, electronic building brick, spatial buffering mechanism, housing etc. have identical or similar structure, effect, connection relationship or production method, variation aspect etc. with aforementioned or subsequent embodiment, so repeat no more the details of these assemblies.
Shown in Fig. 5 A, different with Figure 1A is, the housing 24,26 of electronic packaging device 2 combines with spatial buffering mechanism 23 and forms accommodation space 20, and two ends of spatial buffering mechanism 23 link housing 24,26 respectively and form accommodation space 20.Housing 24 is container-like, and its opening is towards housing 26, and electronic building brick 22 is arranged on housing 24, and electronic building brick 22 and housing 26 are relative and establish.
In the present embodiment, spatial buffering mechanism 23 is arranged on the housing 24, and around around the housing 24 and be provided with, spatial buffering mechanism 23 and housing 24 can move as Fig. 5 B because of adapting to the change in volume of fluid.Spatial buffering mechanism 23 can be a snake belly tube, and it stretches because of the change in volume that adapts to fluid or shrinks.
In addition, spatial buffering mechanism 23 is provided with on every side around housing 24, and spatial buffering mechanism 23 also can being provided with around housing 26 on every side.
In the present embodiment, housing 26 is tabulars, and housing 24 is container-like, and electronic building brick is arranged on the bottom of container, and the opening surface of container is connected to housing 26 and with spatial buffering mechanism 23.In another embodiment, two housings 24,26 can all be tabulars also.
At least a portion of housing 24 and/or housing 26 is the optic regulating assembly, such as but not limited to light-scattering body or condensing body or light wavelength conversion body or light reflector or fluorophor adhesive tape etc., or housing 24 and/or housing 26 are provided with the optic regulating assembly, such as but not limited to light-scattering body or condensing body or light wavelength conversion body or light reflector or fluorophor adhesive tape etc., the discrepancy of optic regulating assembly adjustable light.
For instance, electronic building brick 22 is light-emitting diodes, and the part of housing 24 is light-scattering bodies, and housing 24 can be adjusted light passes housing 24 from electronic building brick 22 angular range with fluid 21 collocation, housing 26 is light reflectors, passes after its light that electronic building brick 22 is sent reflexes to housing 24.Perhaps, electronic building brick 22 is solar cells, and the part of housing 24 is that light focuses on body, and it light can be concentrated is incident upon electronic building brick 22.
In addition, the design of optical module also can change into, can be provided with light-scattering body or condensing body or light wavelength conversion body or assemblies such as light reflector or fluorophor adhesive tape on the housing 24, and these assemblies can be arranged in the housing 24 or outside the housing.
In addition,, also can be provided with radiator on the housing 24, or at least one part of housing 24 is radiators in order to reach preferable radiating effect.
Shown in Fig. 6 A and Fig. 6 B, different with 5A is, the housing 24,26 of electronic packaging device 2a combines with spatial buffering mechanism 23 and forms accommodation space 20, and housing 26 has an opening, and opening and housing 24 mate in fact.The shape of opening conforms to the shape of housing 24 approximately, and the area of opening is slightly larger than housing 24 approximately.
The cohesive process of spatial buffering mechanism 23 is summarized as follows, at first, the housing 24 that electronic building brick 22 is installed is on the opening of housing 26, then, point glue is on housing 24 and housing 26, then spatial buffering mechanism 23 is positioned over the some Jiao Chu on housing 24 and the housing 26, so just glue-bondable housing 24 of spatial buffering mechanism 23 and housing 26.This some glue mode is simple easily, and because of a Jiao Chu all on the surface, the same side of housing 24 and housing 26, so contraposition is more or less freely.Fluid 21 can reinject after a glue is finished, and so can avoid 21 pairs of points of fluid glue to exert an influence.
The major part of accommodation space 20 is ccontaining fluid 21 and electronic building brick 22, and some is an accommodation space buffer gear 25 in addition.In addition, if save spatial buffering mechanism 25, then whole accommodation spaces 20 just can be used to ccontaining fluid 21 and electronic building brick 22.
Shown in Fig. 7 A, different with Fig. 5 A is, the housing 34 of electronic packaging device 3 is to combine with spatial buffering mechanism 33 and form accommodation space 30, and spatial buffering mechanism 33 is to be positioned at outside the housing 34 and to be connected with housing 34.The major part of accommodation space 30 is ccontaining fluid 31 and electronic building brick 32, and some is an accommodation space buffer gear 35 in addition.In addition, if save spatial buffering mechanism 35, then whole accommodation spaces 30 just can be used to ccontaining fluid 31 and electronic building brick 32.
In the present embodiment, spatial buffering mechanism 33 has passage 332 and slip separator 333, and slip separator 333 is slidedly arranged in the channel 332, and channel 332 connects an opening of housing 34, thereby fluid 31 can flow between spatial buffering mechanism 33 and housing 34.
When the volume of fluid 31 such as Fig. 7 B expanded, 333 of the slip separators of spatial buffering mechanism 33 can be along passage 332 toward extraneous spatial movement; When the volume-diminished of fluid 31, the pressure in extraneous space is bigger, thereby 333 of the slip separators of spatial buffering mechanism 33 can move along passage 332 toward fluids 31.
In addition, spatial buffering mechanism 33 also can be as the spatial buffering mechanism 15 of Fig. 2 A, has an airtight cushion space, it is the extraneous opening sealing of spatial buffering mechanism 33, slip separator 333 not a side of contacting with fluid 31 as cushion space, when the volumetric expansion of fluid 31,333 of the slip separators of spatial buffering mechanism 33 can move along passage 332 toward cushion spaces; When the volume-diminished of fluid 31, the pressure of cushion space is bigger, thereby 333 of the slip separators of spatial buffering mechanism 33 can move along passage 332 toward fluids 31.
Because the assembly among Fig. 5 A to Fig. 7 B, for example fluid, electronic building brick, spatial buffering mechanism, housing etc. have identical or similar structure, effect, connection relationship or production method, variation aspect etc. with previous embodiment, so the details that repeats no more these assemblies in sum, because of the spatial buffering mechanism according to electronic packaging device of the present invention can be because of adapting to the change in volume displacement or the deformation of fluid accommodation space, so electronic packaging device can be avoided damaging because of the expansion or the contraction of inside.And the fluid in the electronic packaging device can be assisted the electronic building brick heat radiation, so electronic packaging device also has preferable heat radiation function.
The above only is for example, but not is restriction.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the accompanying Claim scope its equivalent modifications of carrying out or change.
Claims (11)
1. electronic packaging device with accommodation space of substantial and closed, it comprises: fluid, it is positioned at described accommodation space;
Electronic building brick, it is arranged at described accommodation space, contacts with described fluid to small part; And
First spatial buffering mechanism, it contacts with described fluid the part at least, and by its displacement or deformation, to adapt to the change in volume of described fluid.
2. the electronic packaging device of equipment according to claim 1, it further comprises:
Housing, it has described accommodation space, and wherein said first spatial buffering mechanism is positioned at described housing.
3. electronic packaging device according to claim 1, it further comprises:
At least one housing, it combines with described first spatial buffering mechanism and forms described accommodation space.
4. electronic packaging device according to claim 3, it has a plurality of described housings, and the two ends of described first spatial buffering mechanism link described housing respectively and form described accommodation space.
5. electronic packaging device according to claim 4, one of them described housing has an opening, and described opening and another described housing mate in fact.
6. electronic packaging device according to claim 3, it further comprises:
Second spatial buffering mechanism, it is positioned at described accommodation space, forms cushion space in wherein said second spatial buffering mechanism.
7. according to claim 2 or the described electronic packaging device of claim 3, at least a portion of wherein said housing is a circuit board.
8. according to claim 2 or the described electronic packaging device of claim 3, wherein said spatial buffering mechanism is positioned at outside the described housing.
9. electronic packaging device according to claim 1, the wherein said first space buffer machine comprises elastic parts or slide assemblies.
10. electronic packaging device according to claim 1, wherein said electronic building brick are naked crystalline substance.
11. the electronic packaging device with accommodation space of substantial and closed, it comprises:
Housing;
Spatial buffering mechanism, itself and described housing form the fluid accommodation space, and because of adapting to the change in volume displacement or the deformation of described fluid accommodation space;
Fluid, it is positioned at described fluid accommodation space; And
Electronic building brick, it is arranged at described fluid accommodation space, and at least a portion contacts with described fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810166537XA CN101728341B (en) | 2008-10-17 | 2008-10-17 | electronic packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810166537XA CN101728341B (en) | 2008-10-17 | 2008-10-17 | electronic packaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101728341A true CN101728341A (en) | 2010-06-09 |
| CN101728341B CN101728341B (en) | 2011-12-28 |
Family
ID=42448966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810166537XA Expired - Fee Related CN101728341B (en) | 2008-10-17 | 2008-10-17 | electronic packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101728341B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103000596A (en) * | 2012-12-10 | 2013-03-27 | 齐凯 | Immersion cooling type semiconductor component |
| CN103594757A (en) * | 2012-08-16 | 2014-02-19 | 比亚迪股份有限公司 | Electric automobile battery heating device, and radiator thereof |
| CN106068683A (en) * | 2014-03-20 | 2016-11-02 | 西门子公司 | There is the electric module of clamping device |
-
2008
- 2008-10-17 CN CN200810166537XA patent/CN101728341B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103594757A (en) * | 2012-08-16 | 2014-02-19 | 比亚迪股份有限公司 | Electric automobile battery heating device, and radiator thereof |
| CN103000596A (en) * | 2012-12-10 | 2013-03-27 | 齐凯 | Immersion cooling type semiconductor component |
| CN106068683A (en) * | 2014-03-20 | 2016-11-02 | 西门子公司 | There is the electric module of clamping device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101728341B (en) | 2011-12-28 |
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Granted publication date: 20111228 Termination date: 20131017 |