CN101726943A - Active component array substrate, liquid-crystal display panel and detection method for both - Google Patents
Active component array substrate, liquid-crystal display panel and detection method for both Download PDFInfo
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- CN101726943A CN101726943A CN200810201482A CN200810201482A CN101726943A CN 101726943 A CN101726943 A CN 101726943A CN 200810201482 A CN200810201482 A CN 200810201482A CN 200810201482 A CN200810201482 A CN 200810201482A CN 101726943 A CN101726943 A CN 101726943A
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Abstract
The invention relates to an active component array substrate which comprises a substrate, a pixel array, a plurality of chip bonding pads, a plurality of leads, a plurality of first detection lines, a plurality of first switch elements and second switch elements, a first switch line, a second switch line and at least one second detection line, wherein the second detection line is arranged in a peripheral circuit area of the substrate and electrically connected between the first detection lines and the chip bonding pads; the second switch elements are electrically connected between the first detection lines and the second detection line; and the second switch line is electrically connected with the second switch elements. By switching on the second switch elements by the second switch line, detection signals from the first detection lines can pass through the second switch elements, the second detection line, the chip bonding pads and the leads, thereby detecting whether the electric connection between the chip bonding pads and the leads is normal.
Description
Technical field
The invention relates to a kind of array base palte, display panel and both detection methods, and particularly relevant for a kind of active component array base board (Active Device Array Substrate), display panels (Liquid Crystal Display Panel, LCD panel) and both detection methods.
Background technology
In many flat-panel screens, have that high image quality, space utilization efficient are good, Thin Film Transistor-LCD (the Thin Film TransistorLiquid Crystal Display of low consumpting power, advantageous characteristic such as radiationless, TFT LCD), become main flow in the field of display.
After finishing the processing procedure of thin-film transistor array base-plate, can carry out electrical detection to the pel array on the thin-film transistor array base-plate usually, to judge that pel array could normal operation.When pel array can't normal operation, just can repair for bad element (as thin film transistor (TFT) or pixel electrode etc.) or circuit.Yet,, in the perimeter circuit district of thin-film transistor array base-plate, just need to produce testing circuit (Examining circuit) in order to detect for pel array.
Fig. 1 is the synoptic diagram of known thin-film transistor array base-plate.Please refer to Fig. 1, this thin-film transistor array base-plate 100 comprises: substrate 110, pel array 120, most chip joint pads 130, most bar lead-in wire 140, most bars detect distribution 150, a majority on-off element 160 and switch wiring 170.
Please continue with reference to Fig. 1, substrate 110 has adjacent viewing area 112 and periphery circuit region 114, and wherein periphery circuit region 114 comprises lead district 114a and pad zone 114b.Pel array 120 is disposed at viewing area 112.Chip joint pad 130 is arranged at pad zone 114b.Lead-in wire 140 is arranged at lead district 114a, and lead-in wire 140 is electrically connected between pel array 120 and the chip joint pad 130.Detect distribution 150 and be arranged at periphery circuit region 114.On-off element 160 is arranged at periphery circuit region 114 and is electrically connected at and detects between distribution 150 and the pel array 120, and switch wiring 170 electrically connects all on-off elements 160.
Please continue with reference to Fig. 1, it should be noted that and utilize switch wiring 170 to apply a high gate voltage signal (V for all on-off elements 160
Gh) can open all on-off elements 160.At this moment, the detection signal that detecting distribution 140 is provided can be input in the pel array 120, to detect for pel array 120.In addition, when apply a low gate voltage signal (V for all on-off elements 160
GL) can closeall on-off element 160.So, promptly can need not to cut for testing circuit.
Above-mentioned known testing circuit is called the design of unit short-circuit rods (Cell shorting bar), compared to traditional full probe (FullContact) detection design that needs probe unit (Probe unit) to detect, the design of said units short-circuit rods need not to utilize probe unit, can reduce and detect cost.
Yet, please continue with reference to Fig. 1, in this thin-film transistor array base-plate 100, if that chip joint pad 130 and the electric connection of lead-in wire between 140 produce is unusual (short circuit or open circuit), above-mentioned testing circuit also can't detect unusually for electric connection herein.Thus, with chip for driving (not illustrating) when being electrically connected to chip joint pad 130, the drive signal that chip for driving provided can't be transferred in the pel array 120 effectively, and will cause display abnormality when follow-up.
Summary of the invention
In view of this, the invention provides a kind of active component array base board, can the detection chip joint sheet and lead-in wire between electric connection whether normal.
The invention provides a kind of display panels, have said active element array substrate, and superior display quality can be provided.
The invention provides the detection method of a kind of active component array base board and display panels, help promoting the making qualification rate of active component array base board and display panels.
Based on above-mentioned, the present invention proposes a kind of active component array base board, comprising: a substrate, a pel array, most chip joint pads, most bar lead-in wire, most bar first detection distribution, most first on-off elements, one first switch wiring, at least one second detect distribution, most individual second switch element and a second switch distribution.Substrate has adjacent viewing area and periphery circuit region, and wherein periphery circuit region comprises lead district and pad zone, and this lead district is between viewing area and pad zone.Pixel array configuration is in the viewing area.Chip joint pad is arranged at pad zone.Lead-in wire is arranged at lead district, and lead-in wire is electrically connected between pel array and the chip joint pad.First detects distribution is arranged at periphery circuit region.First on-off element is arranged at periphery circuit region and is electrically connected at first and detects between distribution and the pel array.First switch wiring electrically connects first on-off element.The second detection distribution is arranged at periphery circuit region and is electrically connected at first and detects between distribution and the chip joint pad.The second switch element is electrically connected at first and detects between the distribution and the second detection distribution.The second switch distribution electrically connects the second switch element.
Based on above-mentioned, the present invention reintroduces a kind of display panels, comprising: said active element array substrate, a colored optical filtering substrates and a liquid crystal layer.The colored optical filtering substrates subtend is in active component array base board.Liquid crystal layer is disposed between active component array base board and the colored optical filtering substrates.
In one embodiment of this invention, said active element array substrate more comprises most the 3rd on-off elements, is electrically connected at chip joint pad and second and detects between the distribution.
In one embodiment of this invention, above-mentioned second switch distribution electrically connects second switch element and the 3rd on-off element, and second switch distribution, second switch element and the 3rd on-off element are non-loop.
In one embodiment of this invention, above-mentioned second switch distribution electrically connects second switch element and the 3rd on-off element, and second switch distribution, second switch element and the 3rd on-off element are loop.
In one embodiment of this invention, above-mentioned pel array comprises: most bar scan wirings and most bar data wiring, most active members and most pixel electrodes.Active member and corresponding scan wiring and data wiring electric connection.Pixel electrode and corresponding active member electric connection.
Based on above-mentioned, the present invention reintroduces a kind of detection method of active component array base board, is applicable to the detection said active element array substrate, and the detection method of this active component array base board comprises the following steps.At first, import one first signal to first switch wiring to open first on-off element and to import a secondary signal simultaneously and detect distribution and provide most detection signals to close the second switch element, to make to win to pel array to the second switch distribution.Afterwards, import above-mentioned secondary signal to first switch wiring to close first on-off element and to import above-mentioned first signal simultaneously and detect distribution and be delivered to chip joint pad and lead-in wire via second to open the second switch element, making the detection signal that detects distribution and provide of winning to the second switch distribution.
Based on above-mentioned, the present invention proposes a kind of detection method of display panels again, is applicable to detect above-mentioned display panels, and the detection method of this display panels comprises the following steps.At first, import one first signal to first switch wiring to open first on-off element and to import a secondary signal simultaneously and detect distribution and provide most detection signals to close the second switch element, to make to win to pel array to the second switch distribution.Afterwards, import above-mentioned secondary signal to first switch wiring with close first on-off element and import simultaneously above-mentioned first signal to the second switch distribution to open the second switch element, make and detect distribution and be delivered to chip joint pad and lead-in wire via second by first detection signal that detects distribution and provide.
In one embodiment of this invention, the first above-mentioned signal is high gate voltage signal (V
Gh), and this secondary signal is low gate voltage signal (V
GL).
In one embodiment of this invention, the first above-mentioned signal is low gate voltage signal (V
GL), and this secondary signal is high gate voltage signal (V
Gh).
The present invention cooperates the operation of second switch element because of adopting the second switch distribution, can make from first detection signal that the detects distribution second switch element, second of flowing through and detect distribution, chip joint pad and lead-in wire, but and then the detection chip joint sheet whether normal with electric connection between going between.Utilize the 3rd on-off element to be electrically connected at chip joint pad and second and detect between the distribution, can reach the isolated chip joint pad and second electric connection that detects between the distribution.So, detected electric connection between chip joint pad and the lead-in wire whether normal after, just do not need to utilize again that lapping mode will be connected with the chip joint pad outside second detects distribution and remove, and help the simplification of processing procedure.Making second switch distribution, second switch element and the 3rd on-off element is loop, and more stable detection signal can be provided.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 is the synoptic diagram of known thin-film transistor array base-plate;
Fig. 2 is the synoptic diagram of a kind of active component array base board of preferred embodiment of the present invention;
Fig. 3 is the pel array synoptic diagram of the part of active component array base board;
Fig. 4 is the process flow diagram of the detection method of a kind of active component array base board of preferred embodiment of the present invention;
Fig. 5 is the synoptic diagram of the another kind of active component array base board of preferred embodiment of the present invention;
Fig. 6 is the synoptic diagram of another active component array base board of preferred embodiment of the present invention;
Fig. 7 is the synoptic diagram of a kind of display panels of preferred embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing, specify the present invention.
Active component array base board and detection method thereof
Fig. 2 is the synoptic diagram of a kind of active component array base board of preferred embodiment of the present invention.Please refer to Fig. 2, this active component array base board 200 comprises: a substrate 210, a pel array 220, most chip joint pads 230, most bar lead-in wire 240, most bar first detection distribution 252, most first on-off elements 262, one first switch wiring 272, at least one second detect distribution 254, most individual second switch element 264 and a second switch distribution 274.
Please continue with reference to Fig. 2, substrate 210 has adjacent viewing area 212 and periphery circuit region 214, and wherein periphery circuit region 214 comprises lead district 214a and pad zone 214b, and this lead district 214a is between viewing area 212 and pad zone 214b.Pel array 220 is disposed at viewing area 212.Chip joint pad 230 is arranged at pad zone 214b.Lead-in wire 240 is arranged at lead district 214a, and lead-in wire 240 is electrically connected between pel array 220 and the chip joint pad 230.First detects distribution 252 is arranged at periphery circuit region 214.First on-off element 262 is arranged at periphery circuit region 214 and is electrically connected at first and detects between distribution 252 and the pel array 220.First switch wiring 272 electrically connects the first all on-off elements 262.The second detection distribution 254 is arranged at periphery circuit region 214 and is electrically connected at first and detects between distribution 252 and the chip joint pad 230.Second switch element 264 is electrically connected at first and detects between the distribution 252 and the second detection distribution 254.Second switch distribution 274 electrically connects all second switch elements 264.
Fig. 3 is the pel array synoptic diagram of the part of active component array base board.Please refer to Fig. 3, pel array 220 comprises: most bar scan wirings 222 and most bar data wirings 224, most active members 226 and most pixel electrodes 228.Active member 226 and corresponding scan wiring 222 and data wiring 224 electric connections.Pixel electrode 228 and corresponding active member 226 electric connections.Active member 226 can be thin film transistor (TFT), diode or other element that is fit to.
Please continue with reference to Fig. 2, it should be noted that, utilize second to detect the outside that distribution 254 is connected to chip joint pad 230, and second detects distribution 254 sees through second switch element 264 and detects distribution 252 electric connections with first of script, therefore, when second switch element 264 is opened, can transmit via second path of detecting distribution 254, chip joint pad 230, lead-in wire 240 from first detection signal that detects distribution 254, and then can whether normally detect for the electric connection between chip joint pad 230 and the lead-in wire 240.
More specifically, the first detection distribution 252 can provide G
E/ G
O(gate electrode side), Ro/Ge/Bo/Re/Go/Be detection signals such as (source side).Second detects distribution 254 is connected to chip joint pad 230 in the odd even mode that links to each other the outside.Particularly, collocation second switch element 264 is as the switch of the above-mentioned detection signal output of control, but detection chip joint sheet 230 with whether go between between 240 for opening circuit or short circuit.
Fig. 4 is the process flow diagram of the detection method of a kind of active component array base board of preferred embodiment of the present invention.The detection method 300 of this active component array base board is applicable to and detects said active element array substrate 200.Please be simultaneously with reference to Fig. 2 and Fig. 4, at first, in step S302, import one first signal to first switch wiring 272 to open first on-off element 262 and to import a secondary signal simultaneously and detect distribution 252 and provide most detection signals to close second switch element 264, to make to win to pel array 220 to second switch distribution 274.That is, in step S302, can detect for pel array 220.
Afterwards, in step S304, the input secondary signal to first switch wiring 272 to close first on-off element 262 and to import first signal simultaneously and detect distribution 254 via second and be delivered to chip joint pad 230 and go between 240 to open second switch element 264, making the win detection signal that detects distribution 252 and provide to second switch distribution 274.That is, in step 304, can detect for the electric connection between chip joint pad 230 and the lead-in wire 240.
It should be noted that in one embodiment the first above-mentioned signal is high gate voltage signal (V
Gh), and this secondary signal is low gate voltage signal (V
GL), wherein, high gate voltage signal can be used to open these first on-off elements 262 and these second switch elements 264, and low gate voltage signal can be used to close these first on-off elements 262 and these second switch elements 264.
Yet in another embodiment, the first above-mentioned signal can be low gate voltage signal (V
GL), and this secondary signal can be high gate voltage signal (V
Gh), that is the above-mentioned setting means that passes through these first on-off elements 262 of first signal and secondary signal On/Off and these second switch elements 264 also can be opposite.Change speech, this moment, low gate voltage signal was to be used for opening these first on-off elements 262 and these second switch elements 264, and high gate voltage signal is to be used for closing these first on-off elements 262 and these second switch elements 264.
Hold above-mentionedly, utilize second switch element 264 and second to detect the design of distribution 254, can detect chip joint pad 230 and whether be short circuit or open circuit, and help promoting the making qualification rate of active component array base board 200 with the electric connection that goes between between 240.
Fig. 5 is the synoptic diagram of the another kind of active component array base board of preferred embodiment of the present invention.The active component array base board 202 of this embodiment is similar with the active component array base board 200 of Fig. 2, and components identical indicates with identical symbol, is not repeated detailed structure at this.
It should be noted that as shown in Figure 5 this active component array base board 202 more comprises most the 3rd on-off elements 266, be electrically connected at chip joint pad 230 and second and detect between the distribution 254.Particularly, second switch distribution 274 electrically connects second switch element 264 and the 3rd on-off element 266, and second switch distribution 274, second switch element 264 and the 3rd on-off element 266 are non-loop.
Embodiment as shown in Figure 2, after detecting for chip joint pad 230 and lead-in wire 240, the second detection distribution 254 that still must utilize lapping mode to be connected with chip joint pad 230 outsides is removed, and to avoid follow-up chip for driving (not illustrating) is bonded on chip joint pad 230 back generation short circuits.
Therefore, in the embodiment shown in fig. 5, between the chip joint pad 230 and the second detection distribution 254, increase by the 3rd on-off element 260 again, reach the isolated chip joint pad 230 and second electric connection that detects between the distribution 254.Therefore, detected chip joint pad 230 and the electric connection of lead-in wire between 240 whether normal after, just do not need to utilize again that lapping mode will be connected with chip joint pad 230 outsides second detects distribution 254 and remove.So this embodiment helps processing procedure to be simplified, also can reduce cost of manufacture.Certainly, this active component array base board 202 also can carry out the detection method 300 of the active component array base board of above-mentioned Fig. 4.
Particularly, second of active component array base board 202 as shown in Figure 5 detects distribution 254 might not provide a pair of detection signal to chip joint pad 230 as shown in Figure 5, that is, second detects distribution 254 might not be as shown in Figure 5 two, also can be any amount between to six (promptly illustrating as Fig. 2).
Fig. 6 is the synoptic diagram of another active component array base board of preferred embodiment of the present invention.The active component array base board 204 of this embodiment is similar with the active component array base board 200 of Fig. 2, and components identical indicates with identical symbol, is not repeated detailed structure at this.
It should be noted that, as shown in Figure 6, second switch distribution 274 electrically connects second switch elements 264 and the 3rd on-off element 266, and second switch distribution 274, second switch element 264 and the 3rd on-off element 266 be loop, shown in the thick line S among Fig. 6.The active component array base board 204 of this embodiment can provide more stable detection signal, to detect for the electric connection between pel array 220 and chip joint pad 230 and the lead-in wire 240.
In sum, said active element array substrate 200,202,204 and detection method thereof, except detecting pel array 220, whether the electric connection between all right detection chip joint sheet 230 and the lead-in wire 240 is normal.Therefore, can guarantee that the drive signal that chip for driving provides can be transferred in the pel array 220.
Display panels and detection method thereof
Fig. 7 is the synoptic diagram of a kind of display panels of preferred embodiment of the present invention.Please refer to Fig. 7, this display panels 400 comprises: active component array base board 410, colored optical filtering substrates 420 and liquid crystal layer 430.Active component array base board 410 can be the active component array base board 200,202,204 of above-mentioned first embodiment and second embodiment.Colored optical filtering substrates 420 subtends are in active component array base board 410.Liquid crystal layer 430 is arranged between active component array base board 410 and the colored optical filtering substrates 420.
This display panels 400 has used said active element array substrate 200,202,204, so, can carry out good detection for active component array base board 410, and then can guarantee after chip for driving (not illustrating) is electrically connected to chip joint pad 230, stable driving voltage can be provided, and then make display panels 400 have superior display quality.Detection method 300 as for the detection method of display panels 400 and the described active component array base board of above-mentioned Fig. 4 is similar, is not promptly repeated at this.
In sum, active component array base board of the present invention, display panels and both detection methods have following advantage at least:
By second switch distribution collocation second switch element, can make from first detection signal that the detects distribution second switch element, second of flowing through and detect distribution, chip joint pad and lead-in wire, but and then the detection chip joint sheet whether normal with electric connection between going between.Utilize the 3rd on-off element to be electrically connected at chip joint pad and second and detect between the distribution, can reach the isolated chip joint pad and second electric connection that detects between the distribution.So, detected electric connection between chip joint pad and the lead-in wire whether normal after, just do not need to utilize again that lapping mode will be connected with the chip joint pad outside second detects distribution and remove, and help the simplification of processing procedure.Moreover making second switch distribution, second switch element and the 3rd on-off element is loop, and more stable detection signal can be provided.In addition, the display panels with said active element array substrate can provide superior display quality.Above-mentioned active component array base board and display panels detection method can also promote the qualification rate of making.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (16)
1. an active component array base board is characterized in that, comprising:
One substrate has an adjacent viewing area and a periphery circuit region, and wherein this periphery circuit region comprises a lead district and a pad zone, and this lead district is between this viewing area and this pad zone;
One pel array is disposed at this viewing area;
A most chip joint pad are arranged at this pad zone;
Most bar lead-in wires are arranged at this lead district, and those lead-in wires are electrically connected between this pel array and those chip joint pads;
Most bars first detect distribution, are arranged at this periphery circuit region;
Most first on-off element are arranged at this periphery circuit region, and are electrically connected between those first detection distributions and this pel array;
One first switch wiring electrically connects those first on-off elements;
At least one second detects distribution, is arranged at this periphery circuit region and is electrically connected at those first to detect between distributions and those chip joint pads;
A most second switch element are electrically connected between those first detection distributions and those the second detection distributions; And
One second switch distribution electrically connects those second switch elements.
2. active component array base board as claimed in claim 1 is characterized in that, more comprises most the 3rd on-off elements, is electrically connected between those chip joint pads and this second detection distribution.
3. active component array base board as claimed in claim 2, it is characterized in that, wherein this second switch distribution electrically connects those second switch elements and those the 3rd on-off elements, and this second switch distribution, those second switch elements and those the 3rd on-off elements are non-loop.
4. active component array base board as claimed in claim 2, it is characterized in that, wherein this second switch distribution electrically connects those second switch elements and those the 3rd on-off elements, and this second switch distribution, those second switch elements and those the 3rd on-off elements are loop.
5. active component array base board as claimed in claim 1 is characterized in that, wherein this pel array comprises:
Most bar scan wirings and most bar data wiring;
A most active member are with corresponding those scan wirings and the electric connection of those data wirings; And
A most pixel electrode are with those corresponding active members electric connections.
6. a display panels is characterized in that, comprising:
One active component array base board comprises:
One substrate has an adjacent viewing area and a periphery circuit region, and wherein this periphery circuit region comprises a lead district and a pad zone, and this lead district is between this viewing area and this pad zone;
One pel array is disposed at this viewing area;
A most chip joint pad are arranged at this pad zone;
Most bar lead-in wires are arranged at this lead district, and those lead-in wires are electrically connected between this pel array and those chip joint pads;
Most bars first detect distribution, are arranged at this periphery circuit region;
Most first on-off element are arranged at this periphery circuit region, and are electrically connected between those first detection distributions and this pel array;
One first switch wiring electrically connects those first on-off elements;
At least one second detects distribution, is arranged at this periphery circuit region and is electrically connected at those first to detect between distributions and those chip joint pads;
A most second switch element are electrically connected between those first detection distributions and this second detection distribution;
One second switch distribution electrically connects those second switch elements;
One colored optical filtering substrates, subtend is in this active component array base board; And
One liquid crystal layer is disposed between this active component array base board and this colored optical filtering substrates.
7. display panels as claimed in claim 6 is characterized in that, more comprises most the 3rd on-off elements, is electrically connected between those chip joint pads and this second detection distribution.
8. display panels as claimed in claim 7, it is characterized in that, wherein this second switch distribution electrically connects those second switch elements and those the 3rd on-off elements, and this second switch distribution, those second switch elements and those the 3rd on-off elements are non-loop.
9. display panels as claimed in claim 7, it is characterized in that, wherein this second switch distribution electrically connects those second switch elements and those the 3rd on-off elements, and this second switch distribution, those second switch elements and those the 3rd on-off elements are loop.
10. display panels as claimed in claim 6 is characterized in that, wherein this pel array comprises:
Most bar scan wirings and most bar data wiring;
A most active member are with corresponding those scan wirings and the electric connection of those data wirings; And
A most pixel electrode are with those corresponding active members electric connections.
11. the detection method of an active component array base board is applicable to that test right requires 1 described active component array base board, is characterized in that the detection method of this active component array base board comprises:
Import one first signal to this first switch wiring with open those first on-off elements and import simultaneously a secondary signal to this second switch distribution to close those second switch elements, make those first detect distributions and provide most detection signals to this pel array; And
Import this secondary signal to this first switch wiring to close those first on-off elements, and import simultaneously this first signal to this second switch distribution to open those second switch elements, make those first detect those detection signals that distributions provide and second detect distribution and be delivered to those chip joint pads and those lead-in wires via this.
12. the detection method of active component array base board as claimed in claim 11 is characterized in that, wherein this first signal is high gate voltage signal, and this secondary signal is low gate voltage signal.
13. the detection method of active component array base board as claimed in claim 11 is characterized in that, wherein this first signal is low gate voltage signal, and this secondary signal is high gate voltage signal.
14. the detection method of a display panels is applicable to that test right requires 6 described display panels, is characterized in that the detection method of this display panels comprises:
Import one first signal to this first switch wiring to open those first on-off elements, and import simultaneously a secondary signal to this second switch distribution to close those second switch elements, make those first detect distributions and provide most detection signals to this pel array; And
Import this secondary signal to this first switch wiring to close those first on-off elements, and import simultaneously this first signal to this second switch distribution opening those second switch elements, make and first detect those detection signals that distributions provide and second detect distribution and be delivered to those chip joint pads and those lead-in wires via this by those.
15. the detection method of display panels as claimed in claim 14 is characterized in that, wherein this first signal is high gate voltage signal, and this secondary signal is low gate voltage signal.
16. the detection method of display panels as claimed in claim 14 is characterized in that, wherein this first signal is low gate voltage signal, and this secondary signal is high gate voltage signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2008102014821A CN101726943B (en) | 2008-10-21 | 2008-10-21 | Active component array substrate, liquid-crystal display panel and detection method for both |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102014821A CN101726943B (en) | 2008-10-21 | 2008-10-21 | Active component array substrate, liquid-crystal display panel and detection method for both |
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| CN101726943A true CN101726943A (en) | 2010-06-09 |
| CN101726943B CN101726943B (en) | 2012-08-22 |
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| CN102402084A (en) * | 2011-09-09 | 2012-04-04 | 友达光电股份有限公司 | Display panel and alignment method thereof |
| WO2016000293A1 (en) * | 2014-06-30 | 2016-01-07 | 深圳市华星光电技术有限公司 | Display panel |
| CN106206601A (en) * | 2015-04-01 | 2016-12-07 | 中华映管股份有限公司 | Active element array substrate |
| WO2017000390A1 (en) * | 2015-07-01 | 2017-01-05 | 深圳市华星光电技术有限公司 | Detection system and detection method for display panel |
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| KR100443539B1 (en) * | 2002-04-16 | 2004-08-09 | 엘지.필립스 엘시디 주식회사 | A array substrate for Liquid crystal display and method for fabricating the same |
| KR101129438B1 (en) * | 2005-06-10 | 2012-03-27 | 삼성전자주식회사 | Display substrate and apparatus and method for testing display panel with the same |
| KR20080048627A (en) * | 2006-11-29 | 2008-06-03 | 삼성전자주식회사 | Array substrate and display panel having the same |
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| CN102402084A (en) * | 2011-09-09 | 2012-04-04 | 友达光电股份有限公司 | Display panel and alignment method thereof |
| WO2016000293A1 (en) * | 2014-06-30 | 2016-01-07 | 深圳市华星光电技术有限公司 | Display panel |
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| CN106206601B (en) * | 2015-04-01 | 2019-06-14 | 中华映管股份有限公司 | Active element array substrate |
| WO2017000390A1 (en) * | 2015-07-01 | 2017-01-05 | 深圳市华星光电技术有限公司 | Detection system and detection method for display panel |
| TWI570421B (en) * | 2016-03-30 | 2017-02-11 | Interface Optoelectronics (Shenzhen) Co Ltd | Production method of anti - breaking electric closed circuit |
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| CN101726943B (en) | 2012-08-22 |
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