CN101726820B - Wafer-level lens module - Google Patents
Wafer-level lens module Download PDFInfo
- Publication number
- CN101726820B CN101726820B CN 200810305091 CN200810305091A CN101726820B CN 101726820 B CN101726820 B CN 101726820B CN 200810305091 CN200810305091 CN 200810305091 CN 200810305091 A CN200810305091 A CN 200810305091A CN 101726820 B CN101726820 B CN 101726820B
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- China
- Prior art keywords
- wafer
- image sensor
- lens module
- adjustment part
- level lens
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Abstract
The invention relates to a wafer-level lens module. The wafer-level lens module comprises an image sensor, a lens group and a piezoelectric adjusting pieces, wherein the piezoelectric adjusting piece is superposed on the image sensor and is directly contacted to the image sensor; the lens group is superposed on the piezoelectric adjusting piece and is directly contacted to the piezoelectric adjusting piece; the piezoelectric adjusting piece has deformation parallel to the optical axis direction of the lens group; and the piezoelectric adjusting piece is used for adjusting the distance between the image sensor and the lens group. The piezoelectric adjusting piece has mechanical deformation in a power-on state, and the mechanical deformation changes the distance between the lens group and the image sensor; and the piezoelectric adjusting piece is directly attached to the lens group, the volume of the lens module is not increased and a light ray can be correctly focused on the image sensor.
Description
Technical field
The present invention relates to a kind of camera lens module, relate in particular to a kind of wafer scale (wafer level) camera lens module.
Background technology
General camera lens module mainly comprises lens set, holds lens barrel, image sensor and the microscope base of lens set, and image sensor is arranged in the microscope base, and microscope base holds rotatable lens barrel.When lens set is imaged on the image sensor, changing the distance between lens set and the image sensor, and then make light focusing on image sensor by the rotation lens barrel.But the general volume of this camera lens module is larger.
Science and technology develops rapidly, a kind of wafer-level lens module appears on the market, the interval body that it comprises image sensor, lens set and adjusts the two distance, it is bonded to each other that lens set, interval body and image sensor are the storehouse mode, so that light is imaged on the image sensor through lens set.This lens set and image sensor all adopt the integrated circuit technology manufacturing, and therefore, the camera lens module has less volume, so that it can be applicable on the miniaturized electronicss such as mobile phone.
But, because the small volume of wafer-level lens module, under the prerequisite that does not increase volume, the wafer-level lens module is difficult to MEMS (micro electro mechanical system) (Micro-Electro-Mechanism System, MEMS) or voice coil motor (Voice coil motor, VCM) etc. add mechanism, thereby so that lens set is subjected to displacement focuses.
Summary of the invention
In view of this, be necessary to provide a kind of wafer-level lens module that volume can be realized focus function that do not increase.
A kind of wafer-level lens module, it comprises image sensor, lens set and piezoelectricity adjustment part, described piezoelectricity adjustment part is superimposed upon on the described image sensor and with described image sensor and directly contacts, described lens set is superimposed upon on the described piezoelectricity adjustment part and with described piezoelectricity adjustment part and directly contacts, described piezoelectricity adjustment part has the deformation quantity of parallel described lens set optical axis direction, and described piezoelectricity adjustment part is used for adjusting the distance between described image sensor and the described lens set.
The piezoelectricity adjustment part of the wafer-level lens module of present embodiment has the mechanical deformation amount under "on" position, this mechanical deformation amount so that between lens set and the image sensor apart from changing, the piezoelectricity adjustment part directly and lens set fit, do not increase the volume of camera lens module, can so that light correctly focus on the image sensor.
Description of drawings
Fig. 1 is the synoptic diagram of embodiment of the invention wafer-level lens module.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
See also Fig. 1, the wafer-level lens module 10 that the embodiment of the invention provides comprises lens set 11, image sensor 12, piezoelectricity adjustment part 13 and glass plate 14.
To adjust distance between the two, glass plate 14 covers on the image sensor 12 piezoelectricity adjustment part 13 between lens set 11 and image sensor 12, and it is mainly in order to protect image sensor 12 to avoid being subject to outside contamination and aqueous vapor intrusion.Piezoelectricity adjustment part 13 directly is fitted on lens set 11 and the image sensor 12.
The mechanical deformation of body 131 and the electric field strength E relation in direct ratio that applies on it, available following simple formula represents mechanical deformation amount and the proportionate relationship of electric field strength E: the S=dE of body 131, S is the deformation quantity of body 131 when a certain electric field strength E, and d is the piezoelectric constant of body 131.As shown from the above formula: if when making body 131 that certain deformation S occur, can apply the electric field that electric field strength E is S/d.
When applying the electric field of identical with polarised direction (or opposite) to body 131, because direction of an electric field identical with polarised direction (or opposite), play a part polarization intensity and increase (or reducing), make body 131 cause the mechanical deformation that increases (or shortening) along polarised direction.
Apply electric field at positive pole 132 and negative pole 133, so that the length of body 131 parallel optical axis L directions changes, the variation of body 131 length is so that piezoelectricity adjustment part 13 produces the mechanical deformation amount, this deformation quantity so that between lens set 11 and the image sensor 12 apart from changing, piezoelectricity adjustment part 13 directly and lens set 11 fit, do not increase the volume of camera lens module 10, can so that light focusing on image sensor 12.
In the process of making wafer-level lens module 10, at first, adopt the wafer scale processing procedure to form a plurality of image sensor 12 at wafer, stacked coated glass sheets 14 on image sensor 12, then on glass plate 14 depositing metal layers as negative pole 133, then will be stacked on by the hollow o cylindrical body 131 that piezoelectric is made on the negative pole 133, depositing metal layers is as anodal 132 on body 131, the lens set 11 that will adopt at last the wafer scale processing procedure to form is fitted on anodal 132, thereby form a plurality of wafer-level lens modules 10, its cutting is formed single wafer-level lens module 10.
Certainly, also sheet metal can be attached on image sensor 12 and the body 131 as negative pole 133 and anodal 132; Perhaps the piezoelectricity adjustment part 13 that completes is superimposed upon on the image sensor 12.
In addition, those skilled in the art also can do other variation in spirit of the present invention, certainly, the variation that these are done according to spirit of the present invention, all should be included in the present invention's scope required for protection in.
Claims (7)
1. wafer-level lens module, comprise image sensor and lens set, it is characterized in that: described wafer-level lens module further comprises the piezoelectricity adjustment part that is superimposed upon on the described image sensor and directly contacts with described image sensor, described lens set is superimposed upon on the described piezoelectricity adjustment part and with described piezoelectricity adjustment part and directly contacts, described piezoelectricity adjustment part has the deformation quantity of parallel described lens set optical axis, and described piezoelectricity adjustment part is used for adjusting the distance between described image sensor and the described lens set.
2. wafer-level lens module as claimed in claim 1 is characterized in that: described piezoelectricity adjustment part comprises the body of hollow cylindrical and is arranged on the electrode at described body two ends.
3. wafer-level lens module as claimed in claim 2, it is characterized in that: the material of described body is piezoelectric crystal or piezoelectric ceramics.
4. wafer-level lens module as claimed in claim 3, it is characterized in that: described piezoelectric crystal comprises quartz crystal, lithium gallium oxide, lithium germanium oxide, germanic acid titanium, lithium niobate or lithium tantalate.
5. wafer-level lens module as claimed in claim 3, it is characterized in that: described piezoelectric ceramics comprises barium titanate, lead zirconate titanate, modification lead zirconate titanate, lead meta-columbute, lead niobate barium lithium or modified lead titanate.
6. such as each described wafer-level lens module of claim 1 to 5, it is characterized in that: have glass plate between described image sensor and the described piezoelectricity adjustment part.
7. wafer-level lens module as claimed in claim 6, it is characterized in that: described image sensor is charge coupled cell or cmos device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810305091 CN101726820B (en) | 2008-10-22 | 2008-10-22 | Wafer-level lens module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810305091 CN101726820B (en) | 2008-10-22 | 2008-10-22 | Wafer-level lens module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101726820A CN101726820A (en) | 2010-06-09 |
| CN101726820B true CN101726820B (en) | 2013-04-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810305091 Expired - Fee Related CN101726820B (en) | 2008-10-22 | 2008-10-22 | Wafer-level lens module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101726820B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102279503B (en) * | 2010-06-10 | 2014-06-11 | 奇景光电股份有限公司 | Auto-focusing camera module |
| US8659842B1 (en) * | 2012-09-13 | 2014-02-25 | Himax Technologies Limited | Image capturing device and assembling method thereof |
| DE102015213275A1 (en) * | 2015-07-15 | 2017-01-19 | Carl Zeiss Smt Gmbh | Mirror assembly for a lithographic exposure system and mirror assembly comprehensive optical system |
| CN110161596B (en) * | 2019-05-20 | 2021-07-23 | 河北工业大学 | Device and method for manufacturing variable-focus liquid microlens |
| CN111343372A (en) * | 2020-03-23 | 2020-06-26 | 维沃移动通信（杭州）有限公司 | Camera module and electronic equipment |
| CN114076999B (en) * | 2020-08-21 | 2023-08-11 | 宁波舜宇光电信息有限公司 | Periscope type camera shooting module |
| CN115999865A (en) * | 2023-03-07 | 2023-04-25 | 华天慧创科技（西安）有限公司 | Bonding and adhesive bonding method for wafer-level lens |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1797053A (en) * | 2004-12-24 | 2006-07-05 | 鸿富锦精密工业（深圳）有限公司 | Lens die set |
| CN1910490A (en) * | 2003-12-17 | 2007-02-07 | 诺基亚公司 | Automatic focus adjusting system |
-
2008
- 2008-10-22 CN CN 200810305091 patent/CN101726820B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1910490A (en) * | 2003-12-17 | 2007-02-07 | 诺基亚公司 | Automatic focus adjusting system |
| CN1797053A (en) * | 2004-12-24 | 2006-07-05 | 鸿富锦精密工业（深圳）有限公司 | Lens die set |
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| Publication number | Publication date |
|---|---|
| CN101726820A (en) | 2010-06-09 |
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