CN101724371B - Hot melt adhesive composition and application thereof - Google Patents
Hot melt adhesive composition and application thereof Download PDFInfo
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- CN101724371B CN101724371B CN200910259340A CN200910259340A CN101724371B CN 101724371 B CN101724371 B CN 101724371B CN 200910259340 A CN200910259340 A CN 200910259340A CN 200910259340 A CN200910259340 A CN 200910259340A CN 101724371 B CN101724371 B CN 101724371B
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- adhesive composition
- hot
- melt adhesive
- water dispersible
- water
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Links
- 239000000203 mixture Substances 0.000 title claims abstract description 232
- 239000004831 Hot glue Substances 0.000 title claims abstract description 222
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 405
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 257
- 229920005989 resin Polymers 0.000 claims abstract description 117
- 239000011347 resin Substances 0.000 claims abstract description 117
- 239000012948 isocyanate Substances 0.000 claims abstract description 104
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 104
- 229920000728 polyester Polymers 0.000 claims abstract description 77
- 229910052809 inorganic oxide Inorganic materials 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000004814 polyurethane Substances 0.000 claims abstract description 36
- 229920002635 polyurethane Polymers 0.000 claims abstract description 31
- 229920000642 polymer Polymers 0.000 claims description 142
- 230000004913 activation Effects 0.000 claims description 114
- 238000006277 sulfonation reaction Methods 0.000 claims description 98
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 94
- 239000013078 crystal Substances 0.000 claims description 73
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 63
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 63
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims description 62
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 49
- 239000000178 monomer Substances 0.000 claims description 47
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 38
- 239000000839 emulsion Substances 0.000 claims description 31
- YARNEMCKJLFQHG-UHFFFAOYSA-N prop-1-ene;styrene Chemical class CC=C.C=CC1=CC=CC=C1 YARNEMCKJLFQHG-UHFFFAOYSA-N 0.000 claims description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 25
- 239000006193 liquid solution Substances 0.000 claims description 23
- 239000000741 silica gel Substances 0.000 claims description 23
- 229910002027 silica gel Inorganic materials 0.000 claims description 23
- 150000002148 esters Chemical class 0.000 claims description 20
- 239000012188 paraffin wax Substances 0.000 claims description 20
- 239000002002 slurry Substances 0.000 claims description 19
- 239000004408 titanium dioxide Substances 0.000 claims description 19
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 17
- 229920000570 polyether Polymers 0.000 claims description 17
- 239000004094 surface-active agent Substances 0.000 claims description 16
- PCHXZXKMYCGVFA-UHFFFAOYSA-N 1,3-diazetidine-2,4-dione Chemical compound O=C1NC(=O)N1 PCHXZXKMYCGVFA-UHFFFAOYSA-N 0.000 claims description 7
- 238000005829 trimerization reaction Methods 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract description 24
- 229920001577 copolymer Polymers 0.000 abstract description 5
- 239000005977 Ethylene Substances 0.000 abstract 1
- 239000000539 dimer Substances 0.000 description 45
- 239000002585 base Substances 0.000 description 25
- 238000003756 stirring Methods 0.000 description 19
- 229960001866 silicon dioxide Drugs 0.000 description 15
- 239000007787 solid Substances 0.000 description 15
- 239000008367 deionised water Substances 0.000 description 12
- 229910021641 deionized water Inorganic materials 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 10
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical group CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 9
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000005096 rolling process Methods 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 235000011114 ammonium hydroxide Nutrition 0.000 description 6
- SRSXLGNVWSONIS-UHFFFAOYSA-M benzenesulfonate Chemical compound [O-]S(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-M 0.000 description 5
- 229940077388 benzenesulfonate Drugs 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000013638 trimer Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000001464 adherent effect Effects 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004945 emulsification Methods 0.000 description 3
- -1 poly methylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K potassium phosphate Substances [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- FEIQOMCWGDNMHM-UHFFFAOYSA-N 5-phenylpenta-2,4-dienoic acid Chemical compound OC(=O)C=CC=CC1=CC=CC=C1 FEIQOMCWGDNMHM-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920013683 Celanese Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229920006318 anionic polymer Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000004815 dispersion polymer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a hot melt adhesive composition, comprising the following components: (1) about 43-84wt% of resin containing at least two of water-dispersible polyurethane, water-dispersible polyurethane ethylene/vinyl acetate copolymer and water-dispersible sulfonated polyester; (2) about 0.01-5wt% of water-dispersible isocyanate curing agent; (3) about 0.01-10wt% of anti-adhering agent and/or 0.1-15wt% of inorganic oxide anti-adhering agent; (4) about 0.01-0.6wt% of flatting agent; and (5) about 1-46wt% of water; wherein the water-dispersible polyurethane is crystallized polyester polyurethane. The hot melt adhesive composition is nonviscous and has no anti-viscidity phenomenon at normal temperature, as well as has excellent bonding strength after bonding, and is environment friendly. The hot melt adhesive composition is particularly suitable for bonding anti-fake materials and anti-fake paper.
Description
Technical field
The application relates to cementing compositions, particularly hot-melt adhesive composition and uses thereof.
Background technology
The very strong daily papery articles for use that circulate extensively of ownership attribute such as banknote, Valued Securities and certificate have authority, and they all must be the specialty goods with uniqueness.They combine with anti-fake material to safeguard that it is authoritative and guarantee its uniqueness.And the combination of anti-fake material and these special papery articles for use is realized by cementing compositions.
Can the fastness that combine of anti-fake material and special papery articles for use to the special papery article decisive role that normally circulate.Because these special papery articles for use sphere of circulation are wide, the circulation cycle is long, so the test that combines to stand various circulation environment and other unforeseen circumstances of anti-fake material and special papery articles for use.Therefore require used cementing compositions, particularly hot-melt adhesive composition not only inviscid at normal temperatures, but also will have good adhesive property.
In addition, environmental problem has been a worldwide problem.The development of cementing compositions, particularly hot-melt adhesive composition also progressively from solvent-borne type to environmentally friendly conversion.
Though developed multiple cementing compositions at present, still need new cementing compositions badly, particularly needs are not only inviscid at normal temperatures, but also have the environmentally friendly hot-melt adhesive composition of good adhesive property.
Summary of the invention
The application relates in one aspect to hot-melt adhesive composition.Based on the gross weight of said hot-melt adhesive composition, the application's hot-melt adhesive composition comprises following component:
(1) resin of the about 84wt% of about 43wt%-, said resin comprises at least two kinds in water-dispersible polyurethane, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester;
(2) the water dispersible isocyanates solidifying agent of the about 5wt% of about 0.01wt%-;
(3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-;
(4) flow agent of the about 0.6wt% of about 0.01wt%-; And
(5) water of the about 46wt% of about 1wt%-;
Wherein, said water-dispersible polyurethane is the crystal type PAUR of water dispersible.
The application's the purposes of the hot-melt adhesive composition that relates to the application on the other hand on the bonding of anti-fake material and anti-forge paper.
Detailed description of the present invention
Following description comprises some detail so that the various disclosed embodiments of thorough.Yet various equivalent modifications should be appreciated that and can need not one or more these details, perhaps can use other method, composition, material etc. to put into practice embodiment.
Mentioned " embodiment ", " embodiment ", " in another embodiment ", " some embodiment " or " in certain embodiments " is meant that the described characteristic that be specifically related to, structure or the characteristic relevant with said embodiment are included at least one embodiment in the whole specification sheets.Therefore, the local phrase " in one embodiment " that occurs of each in whole specification sheets, " in embodiments ", " in another embodiment " perhaps " in certain embodiments " needn't all refer to identical embodiment.In addition, concrete characteristic, structure or characteristic can combine in one or more embodiments in any suitable manner.
Only if having clear and definite opposite expression, the following term of in specification sheets and appending claims, using has the following meaning:
Term " ethylene vinyl acetate " is meant by ethene (E) and vinyl acetate between to for plastic (VA) copolymerization and the ethene polymers that contains vinyl acetate between to for plastic that makes abbreviates EVA as in this application.Polymerization method adopts high pressure mass polymerization, solution polymerization, letex polymerization and suspension polymerization.
Term " urethane " full name is a polyurethane(s) in this application, is meant the general designation that is polymerized by vulcabond or POLYMETHYLENE POLYPHENYLISOCYANATE and dihydroxyl or polyol, contain the macromolecular cpd of multiple carbamate groups (NHCOO) on the main chain.Vulcabond commonly used has tolylene diisocyanate (TDI), '-diphenylmethane diisocyanate (MDI), hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI), dicyclohexyl methane diisocyanate (HMDI), poly methylene poly phenyl poly isocyanate (PAPI), xylylene diisocyanate (XDI) etc.
Term " isocyanates solidifying agent " is meant the solidifying agent that contains isocyanate reactive group in the molecule in this application.By polymerization degree classification, it can be isocyanate-monomer, uretdione, isocyanate trimerization body and isocyanic ester polymer class solidifying agent.According to textural classification, it can be aliphatic category isocyanates solidifying agent and aromatic series kind isocyanate class solidifying agent.The illustrative examples that can be used in the application's isocyanates solidifying agent includes but not limited to monomer, dimer, tripolymer or the polymer of hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexyl methane diisocyanate, tetramethylxylylene diisocyanate and tolylene diisocyanate.Said isocyanates solidifying agent optimization aromatic kind isocyanate class solidifying agent, the more preferably dimer of aromatic series kind isocyanate and tripolymer class solidifying agent, the most preferably dimer of tolylene diisocyanate and tripolymer.
Term " anti-anti-stick " and " anti-anti-sticking thing " all are meant the reagent that can stop tackiness agent to be glued together two kinds of materials in this application, and it can help the application's hot-melt adhesive composition inviscid at normal temperatures after drying, does not have anti-sticking phenomenon.
Term " paraffin " is with sense known in the field in this application, and staple is the saturated alkane of C16-C40 to white crystals shape waxy solid for colourless, and contains a spot of naphthenic hydrocarbon and isoparaffin.
Term " flow agent " is meant the reagent that can increase sex change of the flow of system and the anti-performance of splashing in this application.
On the one hand, the application relates to hot-melt adhesive composition.Based on the gross weight of said hot-melt adhesive composition, this hot-melt adhesive composition comprises following component:
(1) resin of the about 84wt% of about 43wt%-, said resin comprises at least two kinds in water-dispersible polyurethane, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester;
(2) the water dispersible isocyanates solidifying agent of the about 5wt% of about 0.01wt%-;
(3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-;
(4) flow agent of the about 0.6wt% of about 0.01wt%-; And
(5) water of the about 46wt% of about 1wt%-,
Wherein, said water-dispersible polyurethane is the crystal type PAUR of water dispersible.
The application's hot-melt adhesive composition is mainly used in anti-fake material and anti-forge paper bonding.It is not only inviscid at normal temperatures, does not have anti-sticking phenomenon, and has good adhesive property.After the application's hot-melt adhesive composition at high temperature makes anti-fake material and anti-forge paper bonding; It has good bonding intensity; Good adhesive properties such as hot water resistance, resistance to acids and bases and crumpling resistance can satisfy the request for utilization of existing special papery articles for use circulation environment.
In addition, the application's hot-melt adhesive composition nontoxic, pollution-free, be environmentally friendly hot-melt adhesive composition.
In the research to the application's hot-melt adhesive composition, the contriver finds that the water dispersible isocyanates solidifying agent that is used for the application has potentially-reactivity.Have in the water dispersible isocyanates solidifying agent of potentially-reactivity at these; Be positioned at outside surface-the NCO group is closed; Form layer protective layer, this resist can stop the reactive group generation crosslinking reaction in the resin that uses in isocyanate reactive group and the hot-melt adhesive composition at normal temperatures.This resist loses provide protection under greater than 60 ℃ activation temperature; Make crystal type PAUR, water dispersible ethylene vinyl acetate and the activation of water dispersible sulfonated polyester of water dispersible; Inside and outside crosslinking reaction takes place each other, solidifies rapidly, thus the performance cohesive action.
In addition, present inventor's uretdione and tripolymer of also finding to adopt water dispersible has better bond effect as the hot-melt adhesive composition of solidifying agent.Compare with polymer class solidifying agent with isocyanate-monomer, use the hot-melt adhesive composition of uretdione and tripolymer class solidifying agent under identical tack temperature, to realize identical bonding intensity with the shorter bonding time.
Therefore; In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the resin of the about 84wt% of (1) about 43wt%-, said resin comprise at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of water dispersible; (2) the water dispersible isocyanates solidifying agent of the about 5wt% of about 0.01wt%-, wherein said isocyanates solidifying agent are selected from isocyanate-monomer, uretdione, isocyanate trimerization body and isocyanic ester polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the resin of the about 84wt% of (1) about 43wt%-, said resin comprise at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of water dispersible; (2) the about 5wt% of about 0.01wt%-, the isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, the activation temperature of wherein said isocyanates solidifying agent is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the resin of the about 84wt% of (1) about 43wt%-, said resin comprise at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of water dispersible; (2) the about 5wt% of about 0.01wt%-; The isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is not less than 60 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the resin of the about 84wt% of (1) about 43wt%-, said resin comprise at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is 60 ℃-Yue 120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the resin of the about 84wt% of (1) about 43wt%-, said resin comprise at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is 60 ℃-Yue 120 ℃; Be not closed-content of NCO is about 6wt%-10wt%, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the resin of the about 84wt% of (1) about 43wt%-, said resin comprise at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of water dispersible; (2) about 0.01wt%-5wt%, the water dispersible isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, the activation temperature of wherein said isocyanates solidifying agent is about 65 ℃-Yue 90 ℃, and is selected from uretdione and tripolymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the resin of the about 84wt% of (1) about 43wt%-, said resin comprise at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is about 65 ℃-Yue 90 ℃; Be not closed-content of NCO is about 6wt%-10wt%, and be selected from uretdione and tripolymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In addition, in certain embodiments, the water dispersible isocyanates solidifying agent that can be used in the application can also have following characteristic: the solids content of this isocyanates solidifying agent is about 40wt%.
In certain embodiments, the content of resin is the about 82wt% of about 65wt%-in the application's the hot-melt adhesive composition.
The crystal type PAUR that can be used in the application's water dispersible can adopt outer emulsion process and self-emulsification to prepare; Wherein self-emulsification is divided into acetone method, performed polymer dispersion method and fusion dispersion method again, preferably adopts acetone method to prepare the crystal type PAUR of water dispersible.In certain embodiments, the activation temperature of crystal type PAUR that can be used in the application's water dispersible is 60 ℃-Yue 120 ℃, about 100 ℃ of preferably about 80-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-, the water dispersible isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, wherein said water dispersible isocyanates solidifying agent is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is not less than 60 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is 60 ℃-Yue 120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is 60 ℃-Yue 120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments, the crystal type PAUR that can be used in the application's water dispersible can also have one or more in the following characteristic: particle diameter is the about 500nm of about 30nm-, the about 400nm of preferably about 50nm-; Solid content is the about 60wt% of about 40wt%-; Viscosity is less than about 1000mpa.s; The pH value is about 4-about 9.5.
In certain embodiments, can be used in the application's the crystal type PAUR of water dispersible, negatively charged ion is selected from-COO
(-),-SO2
(-),-O-SO
3 (-),-PO
3 (2-)With-O-PO
3 (2-)-PO
2 (-)Among-the R (R=alkyl) one or more.
The illustrative examples that can be used in the application's water dispersible ethylene vinyl acetate includes but not limited to contain the ethylene vinyl acetate of the about 35wt% ethene of about 20wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises at least two kinds in the crystal type PAUR of water dispersible, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the water dispersible sulfonated polyester; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the water dispersible sulfonated polyester of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the water dispersible sulfonated polyester of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is not less than 60 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the water dispersible sulfonated polyester of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is 60 ℃-Yue 120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises branch: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the water dispersible sulfonated polyester of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is 60 ℃-Yue 120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
The illustrative examples that can be used in the application's water dispersible sulfonated polyester includes but not limited to water dispersible sulfonation m-phthalic acid lipin polymer or water dispersible sulfonation terephthalic acid lipin polymer.
In certain embodiments, the activation temperature of water dispersible sulfonation m-phthalic acid lipin polymer or water dispersible sulfonation terephthalic acid lipin polymer is 60 ℃-Yue 150 ℃, preferred about 80 ℃-Yue 120 ℃.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and water dispersible sulfonation m-phthalic acid lipin polymer or the water dispersible sulfonation terephthalic acid lipin polymer of water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and water dispersible sulfonation m-phthalic acid lipin polymer or the water dispersible sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and water dispersible sulfonation m-phthalic acid lipin polymer or the water dispersible sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said water dispersible isocyanates solidifying agent is not less than 60 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is 60 ℃-Yue 120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, water dispersible ethylene vinyl acetate and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is 60 ℃-Yue 120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is not less than 60 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01 wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is 60 ℃-Yue 120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is at least two kinds in crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is 60 ℃-Yue 120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is that crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the activation temperature of 60 ℃-Yue 120 ℃ water dispersible is at least two kinds in 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is that crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the activation temperature of 60 ℃-Yue 120 ℃ water dispersible is at least two kinds in 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is not less than 60 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is that crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the activation temperature of 60 ℃-Yue 120 ℃ water dispersible is at least two kinds in 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is 60 ℃-Yue 120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is that crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the activation temperature of 60 ℃-Yue 120 ℃ water dispersible is at least two kinds in 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; The activation temperature of wherein said isocyanates solidifying agent is 60 ℃-Yue 120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments, water dispersible sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer can also have one or more in the following characteristic: second-order transition temperature is about 45 ℃-Yue 50 ℃; Molecular-weight average is about 8000-about 10000.
In certain embodiments, in hot-melt adhesive composition, resin comprises the crystal type PAUR and the water dispersible ethylene vinyl acetate of water dispersible; The crystal type PAUR of said water dispersible is about 1 with the relative weight ratio of water dispersible ethylene vinyl acetate in hot-melt adhesive composition: about 1: 1.0 of 0.05-, preferred about 1: about 1: 0.5 of 0.3-.
In certain embodiments, resin comprises the crystal type PAUR and the water dispersible property sulfonated polyester of water dispersible; The crystal type PAUR of said water dispersible is about 1 with the relative weight ratio of water dispersible sulfonated polyester in hot-melt adhesive composition: about 1: 1.0 of 0.05-, preferred about 1: about 1: 0.7 of 0.4-.
In certain embodiments, resin comprises crystal type PAUR, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester of water dispersible; The crystal type PAUR of water dispersible, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester relative weight ratio in hot-melt adhesive composition is about 1: 0.05-0.5: 0.05-0.8, preferred about 1: 0.13-0.2: 0.3-0.6.
In certain embodiments, resin comprises water dispersible ethylene vinyl acetate and water dispersible sulfonated polyester; Water dispersible sulfonated polyester and the water dispersible ethylene vinyl acetate relative weight ratio in hot-melt adhesive composition is about 1: 0.3-1: 0.6.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises about 1: 1.0 of weight ratio about 1: 0.05-, preferably about 1: the activation temperature that 0.3-is about 1: 0.5 is the crystal type PAUR of 60 ℃-Yue 120 ℃ water dispersible and the water dispersible ethylene-vinyl acetate that contains the about 35wt% ethene of about 20wt%-; (2) the about 5wt% of about 0.01wt%-, the water dispersible isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, its activation temperature is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises about 1: 1.0 of weight ratio about 1: 0.05-, preferably about 1: the activation temperature that 0.3-is about 1: 0.5 is the crystal type PAUR of 60 ℃-Yue 120 ℃ water dispersible and the water dispersible ethylene-vinyl acetate that contains the about 35wt% ethene of about 20wt%-; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; Its activation temperature is not less than 60 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises about 1: 1.0 of weight ratio about 1: 0.05-, preferably about 1: the activation temperature that 0.3-is about 1: 0.5 is the crystal type PAUR of 60 ℃-Yue 120 ℃ water dispersible and the water dispersible ethylene-vinyl acetate that contains the about 35wt% ethene of about 20wt%-; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; 60 ℃-Yue 120 ℃ of its activation temperatures; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises about 1: 1.0 of weight ratio about 1: 0.05-, preferably about 1: the activation temperature that 0.4-is about 1: 0.7 is crystal type PAUR and the water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-, the water dispersible isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, its activation temperature is 60 ℃-120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-; Said resin comprises about 1: 1.0 of weight ratio about 1: 0.05-, and preferred about 1: the activation temperature that 0.4-is about 1: 0.7 is that the crystal type PAUR and the activation temperature of 60 ℃-Yue 120 ℃ water dispersible is 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; Its activation temperature is 60 ℃-120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-; Said resin comprises that weight ratio is about 1: 0.05-0.5: 0.05-0.8, and preferred about 1: the activation temperature of 0.13-0.2: 0.3-0.6 is crystal type PAUR, water dispersible ethylene vinyl acetate and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of 60 ℃-Yue 120 ℃ water dispersible; (2) the about 5wt% of about 0.01wt%-, the water dispersible isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, its activation temperature is 60 ℃-120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-; Said resin comprises that weight ratio is about 1: 0.05-0.5: 0.05-0.8, and preferred about 1: the activation temperature of 0.13-0.2: 0.3-0.6 is that crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the activation temperature of 60 ℃-Yue 120 ℃ water dispersible is 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; Its activation temperature is 60 ℃-120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises that weight ratio is about 1: 0.3-1: 0.6 water dispersible sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer and water dispersible ethylene vinyl acetate; (2) the about 5wt% of about 0.01wt%-, the water dispersible isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, its activation temperature is 60 ℃-120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises that weight ratio is about 1: 0.3-1: 0.6 activation temperature is 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer and the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; Its activation temperature is 60 ℃-120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
The illustrative examples that can be used in the application's anti-anti-stick includes but not limited to anti-anti-stick of water dispersible styrene-propene acids and/or paraffin wax emulsions.Those of ordinary skill under this area can be understood, and can use water dispersible styrene-propene acids resist anti-stick, paraffin wax emulsions or realizes that as anti-anti-stick desired resisting instead glue effect with the mixture of arbitrary proportion blended according to self technical know-how and the disclosure.
In certain embodiments, the anti-anti-stick of water dispersible styrene-propene acids has one or more in the following characteristic: the second-order transition temperature of styrene-propene acids solid resin is about 130 ℃ of about 80-; Molecular-weight average is about 200-about 10000; Should resist the pH of anti-stick is about 7-about 9.
In certain embodiments, the anti-anti-stick of water dispersible styrene-propene acids that can be used in the application is the emulsion or the solution of styrene-propene acids solid resin, the solution of optimization styrene-acrylic acid or the like solid resin.
The exemplary instance of paraffin wax emulsions that can be used in the application includes but not limited to polythene wax emulsion, especially is hard polythene wax emulsion.In certain embodiments, the softening temperature of said hard polythene wax emulsion is about 50 ℃-Yue 60 ℃.
The illustrative examples that can be used in the application's the anti-anti-sticking thing of inorganic oxide includes but not limited to titanium dioxide slurries and/or dioxide/silica gel liquid solution.Those of ordinary skill under this area can be understood, and can use titanium dioxide slurries, dioxide/silica gel liquid solution or realize the desired anti-effect of instead gluing with the mixture of arbitrary proportion blended as the anti-anti-sticking thing of inorganic oxide according to self technical know-how and the disclosure.
In certain embodiments, the titanium dioxide slurries that can be used in the application can have one or more in the following characteristic: median size is about 0.1 μ m-0.6 μ m; The about 8-of pH value about 10.
In certain embodiments, the dioxide/silica gel liquid solution that can be used in the application can have one or more in the following characteristic: particle diameter is the about 100nm of about 5nm-, the about 50nm of preferably about 5nm-; The specific surface area of silicon-dioxide is about 10m
2The about 500m of/g-
2/ g.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises crystal type PAUR, water dispersible ethylene vinyl acetate and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of water dispersible; (2) the about 5wt% of about 0.01wt%-, the water dispersible isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, its activation temperature is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; Said anti-anti-stick is anti-anti-stick of water dispersible styrene-propene acids and/or paraffin wax emulsions, and the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is that crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the activation temperature of 60 ℃-Yue 120 ℃ water dispersible is 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; Its activation temperature is 60 ℃-120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; Said anti-anti-stick is anti-anti-stick of water dispersible styrene-propene acids and/or paraffin wax emulsions, and the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution; (4) flow agent of the about 0.6wt% of about 0.01wt%-; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; The application's hot-melt adhesive composition contains the about 10wt% of the 0.01wt%-that has an appointment; The anti-anti-stick of the preferred about 2wt% of about 0.15wt%-; Perhaps contain the about 15wt% of the 0.1wt%-that has an appointment; The anti-anti-sticking thing of the inorganic oxide of the preferred about 8wt% of about 5wt%-perhaps contains the anti-anti-stick of the about 10wt% of 0.01wt%-that has an appointment and/or the anti-anti-sticking thing of inorganic oxide of the about 15wt% of about 0.1wt%-, and the total content of wherein anti-anti-stick and the anti-anti-sticking thing of inorganic oxide is preferably about 3wt%-6.5wt%.
Those skilled in the art also can understand; Can combine disclosed content in the present specification according to the technical know-how of self again; Reasonably select the kind and the content thereof of anti-anti-stick and/or the anti-anti-sticking thing of inorganic oxide; And this content is not limited to above-mentioned preferred content, to realize desired anti-anti-sticking effect.
The illustrative examples that can be used in the application's flow agent includes but not limited to water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
In certain embodiments, solid content is the about 35wt% of about 20wt%-in the said water-based polyether ester.In certain embodiments, said water-based polyether ester is a NHS series, preferred NHS300.
In certain embodiments, polyether-modified YSR 3286 solution is BYK series, preferred BYK346.
In certain embodiments, the used fluorochemical surfactant of the application is that carbonatoms is about 6-about 10 and contain fluorine atoms number greater than 1 benzene sulfonate, and said benzene sulfonate can be selected from ammonium salt, an alkali metal salt and the alkaline earth salt of Phenylsulfonic acid.Said fluorochemical surfactant is preferably perfluorinated nonene oxygen base benzene sulfonate, more preferably an alkali metal salt of perfluorinated nonene oxygen base Phenylsulfonic acid, most preferably perfluorinated nonene oxygen base Supragil GN.
In certain embodiments, the preferred content of flow agent in the application's hot-melt adhesive composition is the about 0.4wt% of about 0.1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises crystal type PAUR, water dispersible ethylene vinyl acetate and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of water dispersible; (2) the about 5wt% of about 0.01wt%-, the water dispersible isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, its activation temperature is not less than 60 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; (4) the about 0.6wt% of about 0.01wt%-, the flow agent of the about 0.4wt% of preferably about 0.1wt%-, said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprises crystal type PAUR, water dispersible ethylene vinyl acetate and water dispersible sulfonation m-phthalic acid lipin polymer or the sulfonation terephthalic acid lipin polymer of water dispersible; (2) the about 5wt% of about 0.01wt%-, the water dispersible isocyanates solidifying agent of the about 5wt% of preferably about 2wt%-, its activation temperature is 60 ℃-120 ℃, and is selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; Said anti-anti-stick is anti-anti-stick of water dispersible styrene-propene acids and/or paraffin wax emulsions, and the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution; (4) the about 0.6wt% of about 0.01wt%-, the flow agent of the about 0.4wt% of preferably about 0.1wt%-, said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is that crystal type PAUR, water dispersible ethylene vinyl acetate and the activation temperature of 60 ℃-Yue 120 ℃ water dispersible is 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; Its activation temperature is 60 ℃-120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; Said anti-anti-stick is anti-anti-stick of water dispersible styrene-propene acids and/or paraffin wax emulsions, and the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution; (4) the about 0.6wt% of about 0.01wt%-; The flow agent of the preferred about 0.4wt% of about 0.1wt%-, said flow agent are selected from the polyether-modified YSR 3286 solution of the serial water-based polyether ester of NHS, BYK series or are the fluorochemical surfactant of perfluorinated nonene oxygen base benzene sulfonate; And the water of the about 46wt% of (5) about 1wt%-.
In certain embodiments; Gross weight based on hot-melt adhesive composition; This hot-melt adhesive composition comprises: the about 84wt% of (1) about 43wt%-; The resin of the preferred about 82wt% of about 65wt%-, said resin comprise that activation temperature is that crystal type PAUR, the water dispersible ethylene vinyl acetate that contains the about 35wt% ethene of about 20wt%-and the activation temperature of 60 ℃-Yue 120 ℃ water dispersible is 60 ℃-Yue 150 ℃ water dispersible sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer; (2) the about 5wt% of about 0.01wt%-; The water dispersible isocyanates solidifying agent of the preferred about 5wt% of about 2wt%-; Its activation temperature is 60 ℃-120 ℃; Be not closed-content of NCO is the about 15wt% of about 5wt%-, and be selected from isocyanate-monomer, dimer, tripolymer and polymer class solidifying agent; (3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of the about 10wt% of about 0.01wt%-and/or the about 15wt% of about 0.1wt%-; Said anti-anti-stick is anti-anti-stick of water dispersible styrene-propene acids and/or paraffin wax emulsions, and the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution; (4) the about 0.6wt% of about 0.01wt%-, the flow agent of the about 0.4wt% of preferably about 0.1wt%-, said flow agent are selected from the water-based polyether ester of NHS series, the polyether-modified YSR 3286 solution or the perfluorinated nonene oxygen base benzene sulfonate of BYK series; And the water of the about 46wt% of (5) about 1wt%-.
The water that can be used in the application can be any water, like tap water, zero(ppm) water, pure water, mineralized water and deionized water or the like, is preferably deionized water.
In certain embodiments, polymkeric substance mentioned above is anionic polymer or non-ionic polyalcohol.
In certain embodiments, the application's hot-melt adhesive composition also can comprise other additive, for example patience promotor and siccative etc.Those of ordinary skill in the art can be easy to grasp the kind and the content thereof of employed other additive according to actual needs.
The application relates to the purposes of hot-melt adhesive composition on the bonding of anti-fake material and anti-forge paper, the particularly purposes on the bonding of safety line and anti-forge paper on the other hand.
Choose reasonable and rational proportion through each component and content thereof in the application's the hot-melt adhesive composition; Make that the application's hot-melt adhesive composition is not only inviscid at normal temperatures; There is not anti-sticking phenomenon, and in certain temperature (for example, more than 60 ℃; Preferred more than 80 ℃) down after the activation, have good adhesive fastness, hot water resistance, resistance to acids and bases and crumpling resistance.
Hereinafter, the application will carry out illustrated in detail so that understand the application's all respects and advantage better through following embodiment.But, should be appreciated that following embodiment is nonrestrictive and only is used to explain some embodiment of the application.
Embodiment
Embodiment 1 contains the hot-melt adhesive composition of crystal type polyester type aqueous polyurethane
Embodiment 1.1
Composition weight (g)
Ethylene vinyl acetate emulsion (Vakelite is available from the big bright chemical ltd in Beijing) 8
Aqueous polyurethane (PUR 2150, available from Akzo Nobel ltd) 20
Solidifying agent: water dispersible toluene diisocyanate trimer 1.0
(B273 is available from German Bayer AG)
The 0.130wt% ethylenediamine solution of styrene-propene acids solid resin (SR 10PG is available from Weng Kaier trade Co., Ltd)
Dioxide/silica gel liquid solution (available from German Bayer AG) 2
Water-soluble flow agent (NHS 200, available from Ke Naiou trade Shanghai ltd) 0.1
Deionized water 5
A solution: (SR 10PG) is dissolved in the quadrol under 65 ℃ fully with styrene-propene acids solid resin, is made into the ethylenediamine solution of 30wt%, is cooled to room temperature then; B solution: at room temperature 8g ethylene vinyl acetate emulsion (Vakelite), 20g aqueous polyurethane (PUR 2150) and the mixing solutions of 5g deionized water are stirred; At room temperature add 0.1gA solution and 2g dioxide/silica gel liquid solution while stirring to B solution; After continuing to stir half a hour; Adding 1.0g solidifying agent (B273) and the water-soluble flow agent of 0.1g (NHS 200) also stirs, and can obtain the application's hot-melt adhesive composition.
Embodiment 1.2
Composition weight (g)
Waterborne sulfonated polyester: sulfonation isophthalic acid ester copolymer 10
(AQ 1350, available from the chemical industry at dawn)
Aqueous polyurethane (Interpon 200, available from Akzo Nobel's chemistry ltd) 20
Solidifying agent: water dispersible toluene diisocyanate trimer 1.0
(B273 is available from German Bayer AG)
The 0.130wt% concentrated ammonia solution of styrene-propene acids solid resin (SR 20PG is available from Weng Kaier trade Co., Ltd)
Dioxide/silica gel liquid solution (available from German Bayer AG) 2
Water-soluble flow agent (NHS 300, available from Ke Naiou trade Shanghai ltd) 0.05
Deionized water 5
A solution: (SR 20PG) is dissolved in the strong aqua under 65 ℃ fully with styrene-propene acids solid resin, is made into the concentrated ammonia solution of 30wt%, and is cooled to room temperature; B solution: at room temperature the waterborne sulfonated polyester of 10g (AQ 1350) is joined in the mixing solutions of 20g aqueous polyurethane (Interpon 200) and 5g deionized water, and stir; At room temperature add 0.1gA solution and 2g dioxide/silica gel liquid solution while stirring to B solution; After continuing to stir half a hour; Add 1.0g solidifying agent (B273) and the water-soluble flow agent of 0.05g (NHS300), and stir, can obtain the application's hot-melt adhesive composition.
Embodiment 1.3
Composition weight (g)
Waterborne sulfonated polyester: sulfonation isophthalic acid ester copolymer 10
(AQ 1950, available from the sky and water, Changsha chemical industry ltd)
Aqueous polyurethane (PUR 2110, available from Akzo Nobel's chemistry ltd) 20
Solidifying agent: water dispersible toluene diisocyanate trimer 1.0
(B273 is available from German Bayer AG)
The 0.130wt% concentrated ammonia solution of styrene-propene acids solid resin (SR 20PG is available from Weng Kaier trade Co., Ltd)
Dioxide/silica gel liquid solution (available from German Bayer AG) 2
Water-soluble flow agent: nonene oxygen base Supragil GN 0.1
(OBS is available from Shanghai chemical industry for making chlorine and alkali ltd)
Deionized water 5
A solution: (SR 20PG) is dissolved in the strong aqua under 65 ℃ fully with styrene-propene acids solid resin, is made into the concentrated ammonia solution of 30wt%, and is cooled to room temperature; B solution: at room temperature the waterborne sulfonated polyester of 10g (AQ 1950) is joined in the mixing solutions of 20g aqueous polyurethane (PUR2110) and 5g deionized water, and stir; At room temperature add the A solution of 0.1g and the dioxide/silica gel liquid solution of 2g while stirring to B solution; After continuing to stir half a hour; Add 1.0g solidifying agent (B273) and the water-soluble flow agent of 0.1g (OBS), and stir, can obtain the application's hot-melt adhesive composition.
Embodiment 1.4
| Component | Weight (g) |
| Waterborne sulfonated polyester: sulfonation m-phthalic acid ester copolymer (AQ 1950, available from the sky and water, Changsha chemical industry ltd) | 10 |
| Aqueous polyurethane (CP-54, fine horse bridge Shenzhen trade Co., Ltd) | 20 |
| Ethylene vinyl acetate emulsion (WH-3A is available from the genial printed material of Shenzhen Sha Jing factory) | 3.5 |
| Solidifying agent: water dispersible toluene diisocyanate trimer (B273 is available from German Bayer AG) | 1.0 |
| Styrene-propene acid resin emulsion (A 1091, available from the sharp health resin of DSM company) | 0.5 |
| Paraffin wax emulsions (E340 is available from Weng Kaier trade Co., Ltd) | 0.1 |
| Water-soluble flow agent (BYK 346, available from the chemical ltd of German Bi Ke) | 0.1 |
| Deionized water | 10 |
At room temperature the waterborne sulfonated polyester of 10g (AQ 1950) is joined in the mixing solutions of 20g aqueous polyurethane (℃ P-54) and 10g deionized water, stir, add 3.5g ethylene vinyl acetate emulsion (WH-3A) again, and stir.Add 0.5g styrene-propene acid resin emulsion (A 1091) and 0.1g paraffin wax emulsions (E340) then; After continuing to stir half a hour; Add 1.0g solidifying agent (B273) and the water-soluble flow agent of 0.1g (BYK 346), and stir, can obtain the application's hot-melt adhesive composition.
Embodiment 1.5
| Component | Weight (g) |
| Waterborne sulfonated polyester: sulfonation m-phthalic acid ester copolymer (SR-1305 is available from the sky and water, Changsha chemical industry ltd) | 20 |
| Ethylene vinyl acetate emulsion (CP 1617LV is available from Celanese China Investment Ltd.) | 10 |
| Solidifying agent: water dispersible toluene diisocyanate trimer (B273 is available from German Bayer AG) | 1.0 |
| The 30wt% concentrated ammonia solution of styrene-propene acids solid resin (SR 20PG, Weng Kaier trade Co., Ltd) | 0.1 |
| Titanium dioxide slurries (available from Dupont Co., Ltd) | 2 |
| Water-soluble flow agent: nonene oxygen base Supragil GN (OBS is available from Shanghai chemical industry for making chlorine and alkali ltd) | 0.1 |
| Deionized water | 5 |
A solution: (SR 20PG) is dissolved in the strong aqua under 65 ℃ fully with styrene-propene acids solid resin, is made into the concentrated ammonia solution of 30wt%, and is cooled to room temperature; B solution: at room temperature 10g ethylene vinyl acetate emulsion (CP 1617 LV) is joined in the mixing solutions of waterborne sulfonated polyester of 20g (SR-1305) and 5g deionized water, and stir; At room temperature add 0.1gA solution and 2g titanium dioxide slurries while stirring, after continuing to stir half a hour, add 1.0g solidifying agent (B273) and the water-soluble flow agent of 0.1g (OBS), and stir, can obtain the application's hot-melt adhesive composition to B solution.
Embodiment 1.6-embodiment 1.10
The solidifying agent B273 in using isocyanates solidifying agent XC-227 (matching chemical materials ltd admittedly) alternative embodiment 1.1-embodiment 1.5 available from Foshan gold; The content of other component and content and solidifying agent remains unchanged, and adopts the same procedure described in the embodiment 1.1-embodiment 1.5 to prepare the hot-melt adhesive composition of embodiment 1.6-embodiment 1.10 respectively.
Embodiment 1.11-embodiment 1.15
The solidifying agent B273 in using isocyanates solidifying agent XP2706 (available from German Bayer AG) alternative embodiment 1.1-embodiment 1.5; The content of other component and content and solidifying agent remains unchanged, and adopts the same procedure described in the embodiment 1.1-embodiment 1.5 to prepare the hot-melt adhesive composition of embodiment 1.11-embodiment 1.15 respectively.
Embodiment 2 contains the hot-melt adhesive composition of the polyester type aqueous polyurethane of non-crystalline type
Embodiment 2.1
Except using the polyester type aqueous polyurethane (U54 of non-crystalline type; Available from German Bayer AG) the polyester type aqueous polyurethane (PUR 2150) of the crystal type of alternative embodiment 1.1 is in addition; The content of other component and content and aqueous polyurethane remains unchanged, and adopts the identical method described in the embodiment 1.1 to prepare hot-melt adhesive composition.
Embodiment 2.2
Except using the polyester type aqueous polyurethane (U42 of non-crystalline type; Available from German Bayer AG) the polyester type aqueous polyurethane (PUR 2110) of the crystal type of alternative embodiment 1.3 is in addition; The content of other component and content and aqueous polyurethane remains unchanged, and adopts the identical method described in the embodiment 1.3 to prepare hot-melt adhesive composition.
Embodiment 2.3
Except using the polyester type aqueous polyurethane (U56 of non-crystalline type; Available from German Bayer AG) the polyester type aqueous polyurethane (CP-54) of the crystal type of alternative embodiment 1.4 is in addition; The content of other component and content and aqueous polyurethane remains unchanged, and adopts the identical method described in the embodiment 1.4 to prepare hot-melt adhesive composition.
Viscosity test under embodiment 3 normal temperature
Be coated with the hot-melt adhesive composition for preparing among the embodiment 2.1-2.3 with coating machine equably on the two sides of coiled material, the limit is coated with selvedge and under 45 ℃ temperature, carries out drying, with dried coiled material rolling through coating, is coated with about 600 meters altogether simultaneously.After at room temperature placing 3 days, be difficult to the coiled material after the rolling is launched, and anti-sticking phenomenon is arranged.
Be coated with the hot-melt adhesive composition for preparing among the embodiment 1.1-1.15 with coating machine equably on the two sides of identical coiled material, the limit is coated with selvedge and under 45 ℃ temperature, carries out drying, with dried coiled material rolling through coating, is coated with about 6000 meters altogether simultaneously.After at room temperature placing 3 months, be easy to the coiled material after the rolling is launched not anti-sticking phenomenon.
This shows that the hot-melt adhesive composition for preparing among the embodiment 1.1-1.15 is inviscid at normal temperatures, not anti-sticking phenomenon.
Embodiment 4 is about the performance test of adhesive fastness
Embodiment 4.1 heat-resisting water experiments
Be coated with the hot-melt adhesive composition for preparing among the embodiment 1.6-1.15 with coating machine equably on the two sides of safety line base material, the limit is coated with selvedge and under 45 ℃ temperature, carries out drying, with dried safety line base material rolling through coating, is coated with about 6000 meters altogether simultaneously.After at room temperature placing 150 days, with the safety line base material expansion of rolling.Under 130 ℃ temperature, the hot melt adhesive that is coated on the safety line base material is melted, and under this temperature with bonding 60 minutes of this safety line base material and paper.After 3 days, will immerse with safety line base material adherent paper and observe the bonding place in 80 ℃ the hot water and whether have the phenomenon of coming unglued.In 80 ℃ hot water, soak after 30 minutes, take out this paper, find that all there is not the phenomenon of coming unglued in the bonding place.
Be coated with the hot-melt adhesive composition for preparing among the embodiment 1.1-1.5 with coating machine equably on the two sides of safety line base material, the limit is coated with selvedge and under 45 ℃ temperature, carries out drying, with dried safety line base material rolling through coating, is coated with about 6000 meters altogether simultaneously.After at room temperature placing 150 days, with the safety line base material expansion of rolling.Under 130 ℃ temperature, the hot melt adhesive that is coated on the safety line base material is melted, and under this temperature with bonding 1 minute of this safety line base material and paper.After 3 days, will immerse with safety line base material adherent paper and observe the bonding place in 80 ℃ the hot water and whether have the phenomenon of coming unglued.In 80 ℃ hot water, soak after 30 minutes, take out this paper, find that all there is not the phenomenon of coming unglued in the bonding place.
This shows, adopt the hot-melt adhesive composition for preparing among the embodiment 1.1-1.15 carry out bonding after, the bonding place has good hot water resistance.
Embodiment 4.2 acid resistances and alkali resistance experiment
With immersing respectively at normal temperatures in 2wt% aqueous sulfuric acid and the 2wt% aqueous sodium hydroxide solution of preparation among the embodiment 4.1, observe the bonding place and whether have the phenomenon of coming unglued with safety line base material adherent paper (using the hot-melt adhesive composition of embodiment 1.1-1.15 preparation).In 2wt% aqueous sulfuric acid and 2wt% aqueous sodium hydroxide solution, soak after 30 minutes respectively, take out this paper, find that all there is not the phenomenon of coming unglued in the bonding place.
This shows, adopt the hot-melt adhesive composition for preparing among the embodiment 1.1-1.15 carry out bonding after, the bonding place has good acid resistance and alkali resistance.
The test of embodiment 4.3 crumpling resistances
Adopt that IGT is anti-to be rubbed appearance (IGT provides (dutch company); Model: rubbing times without number TESTINGSYSTEMS NBS) with preparation among the embodiment 4.1 with safety line base material adherent paper (using the hot-melt adhesive composition of embodiment 1.1-1.15 preparation); Carry out anti-measurement of rubbing number of times; Separate with paper and available pin passes and exceeds with the safety line base material, number of times rubbed in record.The result: the paper that is bonded with the safety line base material can be rubbed 24-30 time repeatedly.
This shows, adopt the hot-melt adhesive composition for preparing among the embodiment 1.1-1.15 carry out bonding after, the bonding place has good rub-off resistance.
Though the application specifies with foregoing description and embodiment, the application is not so limited.The application's protection domain is limited the claim in the appended claims, anyly is equal to replacement to what technical characterictic in the claim carried out, all should belong to the application institute restricted portion.
Claims (71)
1. hot-melt adhesive composition, it comprises following component:
(1) resin of 43wt%-84wt%, said resin comprise at least two kinds in water-dispersible polyurethane, water dispersible ethylene vinyl acetate and the water dispersible sulfonated polyester;
(2) the water dispersible isocyanates solidifying agent of 0.01wt%-5wt%;
(3) the anti-anti-sticking thing of the inorganic oxide of the anti-anti-stick of 0.01wt%-10wt% and/or 0.1wt%-15wt%;
(4) flow agent of 0.01wt%-0.6wt%; And
(5) water of 1wt%-46wt%.
Wherein said water-dispersible polyurethane is the crystal type PAUR of water dispersible.
2. hot-melt adhesive composition as claimed in claim 1, wherein said water dispersible isocyanates solidifying agent are selected from isocyanate-monomer, uretdione, isocyanate trimerization body or isocyanic ester polymer class solidifying agent.
3. like the described hot-melt adhesive composition of arbitrary claim among the claim 1-2, the activation temperature of wherein said water dispersible isocyanates solidifying agent is for being not less than 60 ℃.
4. hot-melt adhesive composition as claimed in claim 3, the activation temperature of wherein said water dispersible isocyanates solidifying agent are 60 ℃-120 ℃.
5. hot-melt adhesive composition as claimed in claim 4, the activation temperature of wherein said water dispersible isocyanates solidifying agent are 65 ℃-90 ℃.
6. like the described hot-melt adhesive composition of arbitrary claim among the claim 1-2, in the wherein said water dispersible isocyanates solidifying agent, be not closed-content of NCO is 5wt%-15wt%.
7. hot-melt adhesive composition as claimed in claim 6, in the wherein said water dispersible isocyanates solidifying agent, be not closed-content of NCO is 6wt%-10wt%.
8. hot-melt adhesive composition as claimed in claim 3, in the wherein said water dispersible isocyanates solidifying agent, be not closed-content of NCO is 5wt%-15wt%.
9. hot-melt adhesive composition as claimed in claim 4, in the wherein said water dispersible isocyanates solidifying agent, be not closed-content of NCO is 5wt%-15wt%.
10. hot-melt adhesive composition as claimed in claim 5, in the wherein said water dispersible isocyanates solidifying agent, be not closed-content of NCO is 5wt%-15wt%.
11. like the described hot-melt adhesive composition of arbitrary claim among the claim 1-2, the activation temperature of the crystal type PAUR of wherein said water dispersible is 60 ℃-120 ℃.
12. hot-melt adhesive composition as claimed in claim 11, the activation temperature of the crystal type PAUR of wherein said water dispersible are 80 ℃-100 ℃.
13. hot-melt adhesive composition as claimed in claim 3, the activation temperature of the crystal type PAUR of wherein said water dispersible are 60 ℃-120 ℃.
14. hot-melt adhesive composition as claimed in claim 4, the activation temperature of the crystal type PAUR of wherein said water dispersible are 60 ℃-120 ℃.
15. hot-melt adhesive composition as claimed in claim 5, the activation temperature of the crystal type PAUR of wherein said water dispersible are 60 ℃-120 ℃.
16. hot-melt adhesive composition as claimed in claim 6, the activation temperature of the crystal type PAUR of wherein said water dispersible are 60 ℃-120 ℃.
17. hot-melt adhesive composition as claimed in claim 7, the activation temperature of the crystal type PAUR of wherein said water dispersible are 60 ℃-120 ℃.
18. hot-melt adhesive composition as claimed in claim 8, the activation temperature of the crystal type PAUR of wherein said water dispersible are 60 ℃-120 ℃.
19. hot-melt adhesive composition as claimed in claim 9, the activation temperature of the crystal type PAUR of wherein said water dispersible are 60 ℃-120 ℃.
20. hot-melt adhesive composition as claimed in claim 10, the activation temperature of the crystal type PAUR of wherein said water dispersible are 60 ℃-120 ℃.
21. like the described hot-melt adhesive composition of arbitrary claim among the claim 1-2, wherein said water dispersible sulfonated polyester is sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
22. hot-melt adhesive composition as claimed in claim 3, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
23. hot-melt adhesive composition as claimed in claim 4, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
24. hot-melt adhesive composition as claimed in claim 5, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
25. hot-melt adhesive composition as claimed in claim 6, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
26. hot-melt adhesive composition as claimed in claim 7, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
27. hot-melt adhesive composition as claimed in claim 8, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
28. hot-melt adhesive composition as claimed in claim 9, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
29. hot-melt adhesive composition as claimed in claim 10, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
30. hot-melt adhesive composition as claimed in claim 11, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
31. hot-melt adhesive composition as claimed in claim 12, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
32. hot-melt adhesive composition as claimed in claim 13, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
33. hot-melt adhesive composition as claimed in claim 14, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
34. hot-melt adhesive composition as claimed in claim 15, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
35. hot-melt adhesive composition as claimed in claim 16, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
36. hot-melt adhesive composition as claimed in claim 17, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
37. hot-melt adhesive composition as claimed in claim 18, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
38. hot-melt adhesive composition as claimed in claim 19, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
39. hot-melt adhesive composition as claimed in claim 20, wherein said water dispersible sulfonated polyester are sulfonation m-phthalic acid lipin polymer or sulfonation terephthalic acid lipin polymer.
40. like the described hot-melt adhesive composition of arbitrary claim among the claim 1-2; Said anti-anti-stick is anti-anti-stick of water-based styrene-propene acids and/or paraffin wax emulsions, and the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution.
41. hot-melt adhesive composition as claimed in claim 3, said anti-anti-stick are anti-anti-stick of water-based styrene-propene acids and/or paraffin wax emulsions, the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution.
42. hot-melt adhesive composition as claimed in claim 4, said anti-anti-stick are anti-anti-stick of water-based styrene-propene acids and/or paraffin wax emulsions, the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution.
43. hot-melt adhesive composition as claimed in claim 5, said anti-anti-stick are anti-anti-stick of water-based styrene-propene acids and/or paraffin wax emulsions, the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution.
44. hot-melt adhesive composition as claimed in claim 6, said anti-anti-stick are anti-anti-stick of water-based styrene-propene acids and/or paraffin wax emulsions, the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution.
45. hot-melt adhesive composition as claimed in claim 7, said anti-anti-stick are anti-anti-stick of water-based styrene-propene acids and/or paraffin wax emulsions, the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution.
46. hot-melt adhesive composition as claimed in claim 11, said anti-anti-stick are anti-anti-stick of water-based styrene-propene acids and/or paraffin wax emulsions, the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution.
47. hot-melt adhesive composition as claimed in claim 12, said anti-anti-stick are anti-anti-stick of water-based styrene-propene acids and/or paraffin wax emulsions, the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution.
48. hot-melt adhesive composition as claimed in claim 21, said anti-anti-stick are anti-anti-stick of water-based styrene-propene acids and/or paraffin wax emulsions, the anti-anti-sticking thing of said inorganic oxide is titanium dioxide slurries and/or dioxide/silica gel liquid solution.
49. like the described hot-melt adhesive composition of arbitrary claim among the claim 1-2, wherein said flow agent is selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
50. hot-melt adhesive composition as claimed in claim 3, wherein said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
51. hot-melt adhesive composition as claimed in claim 4, wherein said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
52. hot-melt adhesive composition as claimed in claim 5, wherein said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
53. hot-melt adhesive composition as claimed in claim 6, wherein said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
54. hot-melt adhesive composition as claimed in claim 7, wherein said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
55. hot-melt adhesive composition as claimed in claim 11, wherein said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
56. hot-melt adhesive composition as claimed in claim 12, wherein said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
57. hot-melt adhesive composition as claimed in claim 21, wherein said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
58. hot-melt adhesive composition as claimed in claim 40, wherein said flow agent are selected from water-based polyether ester, polyether-modified YSR 3286 solution or fluorochemical surfactant.
59. like the described hot-melt adhesive composition of arbitrary claim among the claim 1-2, the activation temperature of wherein said water dispersible sulfonated polyester is 60 ℃-150 ℃.
60. hot-melt adhesive composition as claimed in claim 59, the activation temperature of wherein said water dispersible sulfonated polyester are 80 ℃-120 ℃.
61. hot-melt adhesive composition as claimed in claim 3, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
62. hot-melt adhesive composition as claimed in claim 4, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
63. hot-melt adhesive composition as claimed in claim 5, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
64. hot-melt adhesive composition as claimed in claim 6, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
65. hot-melt adhesive composition as claimed in claim 7, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
66. hot-melt adhesive composition as claimed in claim 11, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
67. hot-melt adhesive composition as claimed in claim 12, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
68. hot-melt adhesive composition as claimed in claim 21, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
69. hot-melt adhesive composition as claimed in claim 40, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
70. hot-melt adhesive composition as claimed in claim 49, the activation temperature of wherein said water dispersible sulfonated polyester are 60 ℃-150 ℃.
71. the purposes of the defined hot-melt adhesive composition of arbitrary claim on the bonding of anti-fake material and anti-forge paper among the claim 1-70.
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| CN200910259340A CN101724371B (en) | 2009-12-18 | 2009-12-18 | Hot melt adhesive composition and application thereof |
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| CN200910259340A CN101724371B (en) | 2009-12-18 | 2009-12-18 | Hot melt adhesive composition and application thereof |
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| CN101724371A CN101724371A (en) | 2010-06-09 |
| CN101724371B true CN101724371B (en) | 2012-09-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103587127A (en) * | 2012-08-16 | 2014-02-19 | 上海斯瑞聚合体科技有限公司 | Preparation method of unidirectional cloth (UD) composite material |
| CN103666358B (en) * | 2012-08-31 | 2015-07-15 | 金华光华印务制衣有限公司 | Adhesive composite and preparation method thereof |
| CN102863938B (en) * | 2012-09-05 | 2013-11-13 | 上海九元石油化工有限公司 | Preparation method of adhesive for automotive trim |
| CN102876250A (en) * | 2012-09-24 | 2013-01-16 | 无锡市科麦特光电材料有限公司 | Ethylene acrylic glue for composite metal strip |
| CN113004852B (en) * | 2019-12-19 | 2022-07-19 | 中钞特种防伪科技有限公司 | Composition for preparing hot melt adhesive, hot melt adhesive and application thereof |
| CN110988192B (en) * | 2019-12-23 | 2022-05-17 | 广东莱尔新材料科技股份有限公司 | Method for detecting anti-sticking condition of hot melt adhesive film |
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| CN1187211A (en) * | 1995-06-07 | 1998-07-08 | H.B.福勒许可和财务有限公司 | Water-based adhesive formulation having enhanced characteristics |
| CN1473863A (en) * | 2002-08-06 | 2004-02-11 | 上海合达聚合物科技有限公司 | Process for preparing water dispersion of crosslinking vinyl resin/polyurethane hybrid resin |
| CN1566249A (en) * | 2003-06-10 | 2005-01-19 | 中国印钞造币总公司 | Hot-melt adhesive compositions and the use thereof |
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2009
- 2009-12-18 CN CN200910259340A patent/CN101724371B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1187211A (en) * | 1995-06-07 | 1998-07-08 | H.B.福勒许可和财务有限公司 | Water-based adhesive formulation having enhanced characteristics |
| CN1473863A (en) * | 2002-08-06 | 2004-02-11 | 上海合达聚合物科技有限公司 | Process for preparing water dispersion of crosslinking vinyl resin/polyurethane hybrid resin |
| CN1566249A (en) * | 2003-06-10 | 2005-01-19 | 中国印钞造币总公司 | Hot-melt adhesive compositions and the use thereof |
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