CN101709460A - Chemical Ni-P plating anode composite plating layer structure and preparation process thereof - Google Patents
Chemical Ni-P plating anode composite plating layer structure and preparation process thereof Download PDFInfo
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- CN101709460A CN101709460A CN200910220254A CN200910220254A CN101709460A CN 101709460 A CN101709460 A CN 101709460A CN 200910220254 A CN200910220254 A CN 200910220254A CN 200910220254 A CN200910220254 A CN 200910220254A CN 101709460 A CN101709460 A CN 101709460A
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Abstract
The invention discloses a chemical Ni-P plating anode composite plating layer structure and a preparation process thereof, develops a composite plating layer with anode property and solves current problems. The composite plating layer comprises the following process improvements of: 1. improving the proportion of a formula to be plated, and adding plating for the second time; and 2. preparing a plating solution with a pH value of 4.5-8 from the following components: 10-30 percent of nickel sulfate (g/l), 26-36 percent of sodium hypophosphite (g/l), 15 percent of malic acid (g/l), 2-10 percent of citric acid (g/l), 2-6 percent of amion acetic acid (g/l), 10-15 percent of lactic acid (ml/l) and 4-6 percent of diaminoethane (g/l) at the temperature of 65-90 DEG C. The corrosion speeds of the composite plating layer and an inner high-potential plating layer in a 3 percent of NaCl solution and a 2MHCl solution are respectively reduced by 6.1905 times and 18.889 times; because the pH value of the plating solution and the type of a chelating agent are controlled, the ingredient structure of the plating layer is effectively controlled; and the composite plating layer has stable process, convenient operation, less investment, easy automation control and mass production.
Description
Technical field
The present invention relates to anti-corrosion of metal coating, be specifically related to a kind of chemical Ni-P plating anode composite plating layer structure and preparation technology.
Background technology
Chemical plating Mi-P alloy coating has excellent corrosion resisting property, and its solidity to corrosion is in some medium even than the also high several magnitude of stainless steel.Its weak point is that coating belongs to cathodic coating, and electropotential is apparently higher than the body material of steel, if there is hole in coating surface, then can make Ni-P alloy layer and matrix constitute galvanic cell; This galvanic cell is made up of top layer " big negative electrode " and " primary anode " of matrix, can quicken electrochemical corrosion at the galvanic cell place, until perforation.
In 1998 02 phases " Plating and Finishing " in " chemical nickel plating new technology and the application in industry thereof " literary composition author Hu Xinguo reported the preparation technology of nickel-phosphorus coating and the application in industry, mentioned domestic and the big gap of state's serving existence, remained further to be developed coating efficiently; In 2005 01 phases " electroplate with cover with paint, lacquer, colour wash, etc. " in " present Research of Ni-P and the application of coating " literary composition the inferior graceful people this paper that waits of author coroner summarize with regard to the present Research and the development trend of domestic and international Ni-P.Point out that present electroless plating composite plating layer structure mainly is to add hard particles in the nickel-phosphorus coating, as the composite deposite of formation such as SiC, Al2O3, Cr2O3, Si3N4, CaF2, diamond, WC.Zhang Shusheng points out that in 2006 Ph D dissertation " nickel-phosphorus composite deposit heat exchange element Study on Preparation and alcohol coagulation test analysis " nickel-phosphorus coating exists the space to quicken the corrosion of matrix.
Requirement for chemical plating Mi-P alloy coating should be " covering fully " (being that coating is answered the imporosity), but from the situation of many workpiece and equipment self and the technological process of chemical plating Mi-P alloy, realize that the complete imporosity of coating almost is impossible, even very meticulous of pre-treatment, thickness of coating reaches more than the 50 μ m, and it is also quite difficult to carry out aftertreatment.
Summary of the invention
The present invention discloses a kind of chemical Ni-P plating anode composite plating layer structure and preparation technology, on the basis of the original electroless plating Ni-P of coating self alloy layer, develop composite deposite by being adjusted to branch,, realize effective anticorrosion purpose to address the above problem with anode character.
The present invention has mainly studied the influence rule of processing parameter to Coating composition structure, electropotential, contain Ni2+, the plating bath that H2PO2-, the main salt of PO43-etc., complexing agent, additive etc. form is to the influence of matrix surface deposition process, and the composite deposite electropotential constitutes corrosion proof influence etc.By above-mentioned research and experiment, finally obtain composite deposite novel material with anode character on the test specimen surface:
Thickness is that 10-100 μ m, bonding force reach 55-80N, more than the hardness 1500-2800HV, and the corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.021-0.050, the corrosion speed in 2MHCl solution (mg/h): 0.72-1.02; Potential difference (V): 0.02-0.10.
The preparation technology that the present invention takes is:
1, implementation method
(1) technology: this technology has been done improvement to the formula rate of a plating, has increased the secondary plating simultaneously.
Technical process: the sandblast-cleaning-oil removing of workpiece-cleaning-activation-time plating-cleaning-secondary plating-cleaning-aftertreatment
(2) configuration of plating bath:
In the technical recipe ratio required different medicine is dissolved, be mixedly configured into plating bath then: single nickel salt (g/L) 10%-30%, inferior sodium phosphate (g/L) 26%-36%, oxysuccinic acid (g/L) 15%, citric acid (g/L) 2%-10%, Padil (g/L) 2-6%, lactic acid (mL/L) 10-15%, second diamino (g/L) 4-6%, pH value 4.5-8, temperature (℃) 65-90, adjust pH value and reach processing requirement.
(3) parameter control; The major control plating bath is formed (content of nickel salt, intercalating agent, reductive agent), temperature and pH value.Automatically analyze each parameter, replenish soup automatically, keep processing parameter stable by volume pump.
2, equipment: 1 of coating bath (can be not more than 100 ℃ by controlled temperature, polypropylene lining or stainless steel tank), 2 of rinse baths, 1 of activated bath, 1 of rear treating groove, automatic control device comprises volume pump, photoelectrometric agent, micro-chip etc.
The present invention has changed this galvanic cell combination of " primary anode " of top layer " big negative electrode " and matrix owing to adopt the method for electroless plating, prepares the composite deposite that the surface has anode character on original Ni-P alloy basis.
Because the pH value of control plating bath and the type of sequestrant have reached the purpose of control Coating composition structure, and then change the electropotential distribution of coating.
Owing to carry out processing condition such as temperature, pH value, chelating agent to Coating composition, bonding force, electropotential and anti-corrosion sex experimental study, proposed the technical recipe system of optimizing.The corrosion speed of composite deposite in 3%NaCl solution compared with internal layer noble potential coating and reduced by 6.1905 times, and the corrosion speed in 2MHCl solution is compared with internal layer noble potential coating and reduced by 18.889 times.Simultaneously stable, easy and simple to handle, the less investment of this technical matters, easily be automated control and produce in batches.
Embodiment
Embodiment 1
(1) technological specification
The composition of plating bath:
A plating: single nickel salt 30g/L, inferior sodium phosphate 36g/L, citric acid 10g/L, lactic acid 15ml/L, PH are about 85 ℃-90 ℃ of 4.5-5.5, temperature;
The secondary plating: single nickel salt (g/L) 10%, inferior sodium phosphate (g/L) 26%, second diamino (g/L) 4%, pH value 6-7, temperature (℃) 50-80.
(2) technical process
Sandblast (eliminating surface rusty stain, burr etc.)-washing-oil removing (metal cleaner)-washing-activation-washing-time plating (internal layer)-cleaning-secondary plating (skin)-washing-seasoning-aftertreatment.
(3) coating: thickness: 10 μ m; Bonding force: 50N; Hardness: HV1500; The corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.050, the corrosion speed in 2MHCl solution (mg/h): 1.02; Potential difference 0.02V.
Embodiment 2
(1) technological specification
The composition of plating bath:
A plating: 70 ℃ of single nickel salt 10g/L, inferior sodium phosphate 26g/L, Padil 2g/L, PH 6-7, temperature;
The secondary plating: single nickel salt (g/L) 10%, inferior sodium phosphate (g/L) 20%, Padil (g/L) 4%, pH value 6-7, temperature (℃) 50-80.
(2) technical process
Sandblast (eliminating surface rusty stain, burr etc.)-washing-oil removing (metal cleaner)-washing-activation-washing-time plating (internal layer)-cleaning-secondary plating (skin)-washing-seasoning-aftertreatment.
(3) coating: thickness: 50 μ m; Bonding force: 60N; Hardness: HV2300; The corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.040, the corrosion speed in 2MHCl solution (mg/h): 0.90; Potential difference: 0.05V.
Embodiment 3
(1) technological specification
The composition of plating bath:
A plating: 70 ℃ of single nickel salt 10g/L, inferior sodium phosphate 26g/L, second diamino 4g/L, PH 6-7, temperature;
The secondary plating: single nickel salt (g/L) 10%, inferior sodium phosphate (g/L) 20%, second diamino (g/L) 6%, pH value 6-7, temperature (℃) 50-80.
(2) technical process
Sandblast (eliminating surface rusty stain, burr etc.)-washing-oil removing (metal cleaner)-washing-activation-washing-time plating (internal layer)-cleaning-secondary plating (skin)-washing-seasoning-aftertreatment.
Coating: thickness: 80 μ m; Bonding force: 80N; Hardness: HV2800; The corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.021, the corrosion speed in 2MHCl solution (mg/h): 0.72; Potential difference: 0.10V.
Embodiment 4
(1) technological specification
The composition of plating bath:
A plating: 65 ℃ of single nickel salt 20g/L, inferior sodium phosphate 20g/L, lactic acid 10mL/L, PH 7-8, temperature;
The secondary plating: single nickel salt (g/L) 10%, inferior sodium phosphate (g/L) 26%, Padil (g/L) 6%, pH value 6-7, temperature (℃) 50-80.
(2) technical process
Sandblast (eliminating surface rusty stain, burr etc.)-washing-oil removing (metal cleaner)-washing-activation-washing-time plating (internal layer)-cleaning-secondary plating (skin)-washing-seasoning-aftertreatment.
Coating: thickness: 30 μ m; Bonding force: 70N; Hardness: HV2000; The corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.030, the corrosion speed in 2MHCl solution (mg/h): 0.80; Potential difference: 0.07V.
The above; only be the preferable embodiment of the present invention; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to replacement or change according to technical scheme of the present invention and inventive concept thereof, all should be encompassed within protection scope of the present invention.
The specific embodiment material property sees Table 1
The specific embodiment processing parameter sees Table 2
Table 1
Continuous table 1
Table 2
Continuous table 2
Claims (12)
1. chemical Ni-P plating anode composite plating layer structure, it is characterized in that: described anode composite plating layer structure, thickness is that 10-100 μ m, bonding force reach 55-80N, more than the hardness 1500-2800HV, the corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.021-0.050, the corrosion speed in 2MHCl solution (mg/h): 0.72-1.02; Potential difference (V): 0.02-0.10.
2. the preparation technology of a chemical Ni-P plating anode composite plating layer structure, technical process is the sandblast-cleaning-oil removing-cleaning-activation-plating-cleaning-cleaning-aftertreatment of workpiece, it is characterized in that: described technical process has increased the secondary plating on the plating basis, and technical process is the sandblast-cleaning-oil removing-cleaning-activation-time plating-cleaning-secondary plating-cleaning-aftertreatment of workpiece.
3. according to the preparation technology of the described a kind of chemical Ni-P plating anode composite plating layer structure of claim 2, it is characterized in that: the plating bath configuration of a described plating and secondary plating: single nickel salt (g/L) 10%-30%, inferior sodium phosphate (g/L) 26%-36%, oxysuccinic acid (g/L) 15%, citric acid (g/L) 2%-10%, Padil (g/L) 2-6%, lactic acid (mL/L) 10-15%, second diamino (g/L) 4-6%, pH value 4.5-8, temperature (℃) 65-90, with required different medicines dissolving, be mixedly configured into plating bath then, and the adjustment pH value reaches processing requirement.
4. according to the preparation technology of claim 2 or 3 described a kind of chemical Ni-P plating anode composite plating layer structures, it is characterized in that: a described plating is the internal layer plating, and the secondary plating is outer plating.
5. according to the preparation technology of the described a kind of chemical Ni-P plating anode composite plating layer structure of claim 3, it is characterized in that: described plating bath configuration: a plating: single nickel salt 30g/L, inferior sodium phosphate 36g/L, citric acid 10g/L, lactic acid 15ml/L, PH are about 85 ℃-90 ℃ of 4.5-5.5, temperature; The secondary plating: single nickel salt (g/L) 10%, inferior sodium phosphate (g/L) 26%, second diamino (g/L) 4%, pH value 6-7, temperature (℃) 50-80.
6. according to the preparation technology of the described a kind of chemical Ni-P plating anode composite plating layer structure of claim 3, it is characterized in that: described plating bath configuration a: plating: 70 ℃ of single nickel salt 10g/L, inferior sodium phosphate 26g/L, Padil 2g/L, PH 6-7, temperature;
The secondary plating: single nickel salt (g/L) 10%, inferior sodium phosphate (g/L) 20%, Padil (g/L) 4%, pH value 6-7, temperature (℃) 50-80.
7. according to the preparation technology of the described a kind of chemical Ni-P plating anode composite plating layer structure of claim 3, it is characterized in that: described plating bath configuration a: plating: 70 ℃ of single nickel salt 10g/L, inferior sodium phosphate 26g/L, second diamino 4g/L, PH 6-7, temperature;
The secondary plating: single nickel salt (g/L) 10%, inferior sodium phosphate (g/L) 20%, second diamino (g/L) 6%, pH value 6-7, temperature (℃) 50-80.
8. according to the preparation technology of the described a kind of chemical Ni-P plating anode composite plating layer structure of claim 3, it is characterized in that: described plating bath configuration a: plating: 65 ℃ of single nickel salt 20g/L, inferior sodium phosphate 20g/L, lactic acid 10mL/L, PH 7-8, temperature;
The secondary plating: single nickel salt (g/L) 10%, inferior sodium phosphate (g/L) 26%, Padil (g/L) 6%, pH value 6-7, temperature (℃) 50-80.
9. according to the composite plating layer structure of the described a kind of chemical Ni-P plating anode composite plating layer structure preparation technology preparation of claim 5, it is characterized in that: described coating: thickness: 10 μ m; Bonding force: 50N; Hardness: HV1500; The corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.050, the corrosion speed in 2MHCl solution (mg/h): 1.02; Potential difference 0.02V.
10. according to the composite plating layer structure of the described a kind of chemical Ni-P plating anode composite plating layer structure preparation technology preparation of claim 6, it is characterized in that: described coating: thickness: 50 μ m; Bonding force: 60N; Hardness: HV2300; The corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.040, the corrosion speed in 2MHCl solution (mg/h): 0.90; Potential difference: 0.05V.
11. the composite plating layer structure according to the described a kind of chemical Ni-P plating anode composite plating layer structure preparation technology preparation of claim 7 is characterized in that: coating: thickness: 80 μ m; Bonding force: 80N; Hardness: HV2800; The corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.021, the corrosion speed in 2MHCl solution (mg/h): 0.72; Potential difference: 0.10V.
12. the composite plating layer structure of described according to Claim 8 a kind of chemical Ni-P plating anode composite plating layer structure preparation technology preparation is characterized in that: coating: thickness: 30 μ m; Bonding force: 70N; Hardness: HV2000; The corrosion speed (mg/h) of composite deposite in 3%NaCl solution: 0.030, the corrosion speed in 2MHCl solution (mg/h): 0.80; Potential difference: 0.07V.
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| CN108085663A (en) * | 2017-12-04 | 2018-05-29 | 陕西航空电气有限责任公司 | A kind of processing method for being used to improve AL-SiC substrate anti-corrosion ability |
| CN109440091A (en) * | 2018-12-29 | 2019-03-08 | 大连大学 | The preparation process of tri- layers of anode composite plating layer of chemical Ni-P plating/Ni-Zn-P |
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| CN102644067A (en) * | 2012-03-28 | 2012-08-22 | 广州鸿葳科技股份有限公司 | Method for chemically plating double-layer Ni-P plating layer |
| CN108085663A (en) * | 2017-12-04 | 2018-05-29 | 陕西航空电气有限责任公司 | A kind of processing method for being used to improve AL-SiC substrate anti-corrosion ability |
| CN108085663B (en) * | 2017-12-04 | 2020-07-03 | 陕西航空电气有限责任公司 | Treatment method for improving corrosion resistance of AL-SiC substrate |
| CN109440091A (en) * | 2018-12-29 | 2019-03-08 | 大连大学 | The preparation process of tri- layers of anode composite plating layer of chemical Ni-P plating/Ni-Zn-P |
| CN109576685A (en) * | 2018-12-29 | 2019-04-05 | 大连大学 | Tri- layers of anode composite plating layer of chemical Ni-P plating/Ni-Zn-P |
| CN109868463A (en) * | 2019-01-28 | 2019-06-11 | 大连四方佳特流体设备有限公司 | A kind of method of modifying improving stainless steel pump material property |
| CN114934268A (en) * | 2022-05-18 | 2022-08-23 | 大连大学 | Magnesium alloy chemical nickel-phosphorus plating solution and plating process thereof |
| CN114934268B (en) * | 2022-05-18 | 2023-06-27 | 大连大学 | Magnesium alloy chemical nickel-phosphorus plating solution and plating process thereof |
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