CN101704953B - Synthesis method of organic silicon resin containing OH groups - Google Patents
Synthesis method of organic silicon resin containing OH groups Download PDFInfo
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- CN101704953B CN101704953B CN2009100447921A CN200910044792A CN101704953B CN 101704953 B CN101704953 B CN 101704953B CN 2009100447921 A CN2009100447921 A CN 2009100447921A CN 200910044792 A CN200910044792 A CN 200910044792A CN 101704953 B CN101704953 B CN 101704953B
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- 229920005989 resin Polymers 0.000 title claims abstract description 21
- 239000011347 resin Substances 0.000 title claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 239000010703 silicon Substances 0.000 title claims abstract description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 title claims abstract description 7
- 238000001308 synthesis method Methods 0.000 title claims abstract description 7
- 239000000178 monomer Substances 0.000 claims abstract description 47
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 35
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910000077 silane Inorganic materials 0.000 claims abstract description 9
- 238000006068 polycondensation reaction Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 4
- 239000001257 hydrogen Substances 0.000 claims abstract description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000005041 acyloxyalkyl group Chemical group 0.000 claims abstract description 3
- 125000005843 halogen group Chemical group 0.000 claims abstract description 3
- 125000000962 organic group Chemical group 0.000 claims abstract description 3
- 229920002050 silicone resin Polymers 0.000 claims description 22
- 229910052799 carbon Inorganic materials 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 claims description 17
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 16
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 16
- 239000012141 concentrate Substances 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 8
- 230000007935 neutral effect Effects 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 7
- 229920002554 vinyl polymer Chemical group 0.000 claims description 7
- 239000000460 chlorine Substances 0.000 claims description 5
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- BJLJNLUARMMMLW-UHFFFAOYSA-N chloro-(3-chloropropyl)-dimethylsilane Chemical compound C[Si](C)(Cl)CCCCl BJLJNLUARMMMLW-UHFFFAOYSA-N 0.000 claims description 5
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 claims description 5
- 239000005055 methyl trichlorosilane Substances 0.000 claims description 5
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 claims description 5
- AUEJBKCWXPYRGZ-UHFFFAOYSA-N 1,1'-biphenyl diethoxysilane Chemical compound C(C)O[SiH2]OCC.C1(=CC=CC=C1)C1=CC=CC=C1 AUEJBKCWXPYRGZ-UHFFFAOYSA-N 0.000 claims description 3
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 claims description 3
- CKEZAUDJDIPPIB-UHFFFAOYSA-N 4-chlorobutyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCCl CKEZAUDJDIPPIB-UHFFFAOYSA-N 0.000 claims description 3
- GBSIYTILHVLXDE-UHFFFAOYSA-N dichloro-(4-chlorobutyl)-methylsilane Chemical compound C[Si](Cl)(Cl)CCCCCl GBSIYTILHVLXDE-UHFFFAOYSA-N 0.000 claims description 3
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000012046 mixed solvent Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims description 3
- 239000005052 trichlorosilane Substances 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- OOXSLJBUMMHDKW-UHFFFAOYSA-N trichloro(3-chloropropyl)silane Chemical compound ClCCC[Si](Cl)(Cl)Cl OOXSLJBUMMHDKW-UHFFFAOYSA-N 0.000 claims description 2
- 150000002431 hydrogen Chemical group 0.000 claims 1
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 13
- 230000007062 hydrolysis Effects 0.000 abstract description 6
- 239000007858 starting material Substances 0.000 abstract 3
- VEFXTGTZJOWDOF-UHFFFAOYSA-N benzene;hydrate Chemical compound O.C1=CC=CC=C1 VEFXTGTZJOWDOF-UHFFFAOYSA-N 0.000 abstract 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 239000011259 mixed solution Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 7
- 150000001282 organosilanes Chemical class 0.000 description 6
- 239000013067 intermediate product Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000010189 synthetic method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- TZPUFQUQYUYVQC-UHFFFAOYSA-N phenylsilylmethanamine Chemical compound NC[SiH2]C1=CC=CC=C1 TZPUFQUQYUYVQC-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Silicon Polymers (AREA)
Abstract
A synthesis method of organic silicon resin containing OH groups is characterized by selecting a silane monomer shown as the structural general formula X-C-R'-SiRnY3-n as a starting material, wherein R can refer to a phenyl group, a methyl group, an ethylene group, a hydroxyl group, hydrogen or other organic groups, R' represents a univalent alkyl group, the number of carbon atoms is 1-7, X represents a halogen atom, Y represents a hydrolysable group which can be a hydrogen group, an alcoxyl group, an acyloxy alkyl group and the like, the value of n can be 0, 1 and 2, and the starting material also comprises the silane monomer containing the methyl group or the phenyl group; and then the organic silicon resin containing OH groups can be obtained by the following steps: taking and mixing the starting materials in parts by weight, dropping the mixture in a mixed solution of water and methylbenzene at the temperature of 5-20 DEG C for co-hydrolyzed polycondensation, then conducting concentration at slightly high temperature to obtain organosilicon prepolymer, and finally conducting hydrolysis on the organosilicon prepolymer under the conditions of certain temperature and certain alkalinity. The resin has stable property and good compatibility.
Description
Technical field
The present invention relates to a kind of silicone resin and synthetic method thereof; Particularly, the present invention relates to carbon containing OH silicone resin and synthetic method thereof.
Technical background
Silicone resin is present a kind of common resins, is widely used in impregnating varnish, coating, mica tape adhesive and to the fields such as modification of silicone resin such as polyester, Resins, epoxy.Usually, containing a large amount of silicon OH in the silicone resin (is that OH directly is connected on the Si atom, Si-OH, as follows), these silicon OH brings into play important effect in the middle of practical application, but silicon OH also comes with some shortcomings or the defective part: stable inadequately as silicon OH, it and another silicon OH remove a water molecules and crosslinked at normal temperatures; But then, there are very big-difference and uncompatibility between silicon OH and the carbon OH, with silicone resin modification organic resin the time,, be difficult to make two kinds of OH to react, need high temperature and other special effective catalyst could allow both be reacted to together usually owing to have this uncompatibility between two kinds of OH.So still there is certain limitation in the application of silicone resin when particularly utilizing silicon OH on its molecule.
Summary of the invention
The objective of the invention is to be intended to relate to and propose silicone resin of carbon containing OH and preparation method thereof, at introducing carbon OH puts forward the silicone resin of synthetic this carbon containing OH to the remarkable effect of silicone resin synthetic method.
Will improve reactable and consistency between silicone resin and the organic resin greatly introducing carbon OH on the silicone resin molecular chain.On the one hand, it is more stable for carbon OH, and it autohemagglutination can not take place or with silicon OH crosslinking reaction takes place under normal conditions, so it can stable existence; On the other hand, but carbon OH it can with OH in the organic resin or COOH and other organic reactive group reaction, be easy to be used for the modification organic resin.In addition, introduce carbon OH and can improve silicone resin greatly, and improve and the compatibleness between raising and the various additives of pigments greatly with body material or by the sticking power of adhesion material.
Adopting the organosilane monomer of specific functional groups is a kind of effective and feasible method of introducing carbon OH in silicone resin with the aminomethyl phenyl silane monomer cohydrolysis polycondensation of using always, and introducing carbon OH also is necessary to a great extent in silicone resin.
The present invention seeks to be achieved through the following technical solutions:
At least choose a kind of by general structure X-C-R '-SiR
nY
3-nShown silane monomer is a starting raw material, wherein R can be phenyl, methyl, vinyl, hydroxyl, hydrogen or other organic group, R ' represents univalent alkyl, carbonatoms value 1～7, X represents halogen atom, Y represents hydrolysable group, can be chlorine, alkoxy grp, acyloxyalkyl group group etc., n value 0,1,2; Also comprise the silane monomer that contains methyl or phenyl in the starting raw material, get above-mentioned starting raw material methyl monomer, phenyl monomer, vinyl monomer, hydrogeneous monomer, X-C-R '-SiR
nY
3-nMonomer, press mass parts 20～60: 50～120: 0～30: 0～30: 20～50 mixed, be added dropwise in the mixed solvent of 5～20 ℃ water and toluene and carried out the cohydrolysis polycondensation 3～8 hours, under 80～120 ℃ of high slightly temperature, concentrate 2～5 hours then, obtain organosilicon preformed polymer, wash after the neutrality with this prepolymer in 100～120 ℃ temperature range and pH value be to be hydrolyzed 2～5 hours under 9～11 the alkaline condition, adding hydrochloric acid afterwards neutralizes and reaches neutral, washing filtering, add an amount of toluene or dimethylbenzene, reach that required to contain about 50% admittedly be discharging, obtain the silicone resin of carbon containing OH base.
Following hydrolysis reaction takes place, and obtains OH and forms the silicone resin product of carbon containing OH.
The described used general structure X-C-R '-SiR that has
nY
3-nOrganosilane monomer, comprise 3-chloropropyl triethoxysilane, 3-chloropropyl trichloro-silane, 3-chloropropyl dimethyl dichlorosilane (DMCS), chloropropyl dimethylchlorosilane, chlorobutyl Trimethoxy silane, chlorine amyl group trichlorosilane etc.
The described silane monomer that contains methyl or phenyl comprises dimethyldichlorosilane(DMCS), dimethyldiethoxysilane, phenylbenzene diethoxy silane, diphenyl dichlorosilane, a phenyl-trichloro-silicane, METHYL TRICHLORO SILANE, tetraethoxy etc.
Described vinyl monomer comprises the monomer that contains ethene in the above-mentioned monomer.
Described hydrogeneous monomer comprises hydrogenous monomer in the above-mentioned monomer.
Preparation technology's flow process that the present invention is concrete:
1, the synthetic starting raw material of silicone resin prepolymer, methyl monomer, phenyl monomer, vinyl monomer, hydrogeneous monomer, X-C-R '-SiR
nY
3-nMonomer is pressed mass parts 20～60: 50～120: 0～30: 0～30: 20～50 mixed, be added dropwise in the mixed solvent of 5～20 ℃ water and toluene and carried out the cohydrolysis polycondensation 3～8 hours, under 80～120 ℃ of high slightly temperature, concentrate 2～5 hours then, obtain organosilicon preformed polymer, wash neutrality.
2, the halogen hydrolysis reaction with above-mentioned this prepolymer in 100～120 ℃ temperature range and pH value be to be hydrolyzed 2～5 hours under 9～11 the alkaline condition, adding hydrochloric acid afterwards neutralizes and reaches neutral, washing filtering, add an amount of toluene or dimethylbenzene, reaching required solid content about 50% is discharging, obtains the silicone resin of carbon containing OH base.
Embodiment
Following examples are to further specify of the present invention, but the invention is not restricted to following embodiment.
Example one:
Get a phenyl-trichloro-silicane, dimethyldichlorosilane(DMCS), diphenyl dichlorosilane, 3-chloropropyl triethoxysilane, press monomer by mass parts 60: 70: 50: 50, under 5～20 ℃ of lower temperature, slowly organosilane monomer is added drop-wise in the flask with quick stirring, drip hydrolysis reaction and continue 4 hours, concentrate then, resin layer is separated, 80～120 ℃ of following backflow slaking reactions 4 hours, be washed to neutrality afterwards, obtain the hydrolysis prepolymer; This intermediate product is added down aqueous sodium hydroxide solutions at 100～120 ℃ stirred 3 hours, add a certain amount of hydrochloric acid afterwards and neutralize and reach neutral, washing filtering adds an amount of toluene or dimethylbenzene, reaches that required to contain about 50% admittedly be discharging.
Example two:
Get a phenyl-trichloro-silicane, dimethyldichlorosilane(DMCS), dimethyldiethoxysilane, METHYL TRICHLORO SILANE, 3-chloropropyl dimethyl dichlorosilane (DMCS) monomer, press monomer by mass parts 20: 70: 20: 10: 20, under 5～20 ℃ of lower temperature, slowly organosilane monomer is added drop-wise in the flask with quick stirring, drip hydrolysis reaction and continue 4 hours, concentrate then, resin layer is separated, 80～120 ℃ of following backflow slaking reactions 4 hours, be washed to neutrality afterwards, obtain the hydrolysis prepolymer; This intermediate product is added down potassium hydroxide aqueous solutions at 100～120 ℃ stirred 3 hours, add a certain amount of hydrochloric acid afterwards and neutralize and reach neutral, washing filtering adds an amount of toluene or dimethylbenzene, reaches that required to contain about 50% admittedly be discharging.
Example three:
Get tetraethoxy, a phenyl-trichloro-silicane, dimethyldichlorosilane(DMCS), diphenyl dichlorosilane, chloropropyl dimethylchlorosilane monomer, press monomer by mass parts 30: 60: 15: 10: 25, under 5～20 ℃ of lower temperature, slowly organosilane monomer is added drop-wise in the flask with quick stirring, drip hydrolysis reaction and continue 4 hours, concentrate then, resin layer is separated, 80～120 ℃ of following backflow slaking reactions 4 hours, be washed to neutrality afterwards, obtain the hydrolysis prepolymer; This intermediate product is added down aqueous sodium hydroxide solutions at 100～120 ℃ stirred 3 hours, add a certain amount of hydrochloric acid afterwards and neutralize and reach neutral, washing filtering adds an amount of toluene or dimethylbenzene, reaches that required to contain about 50% admittedly be discharging.
Example four:
Get diphenyl dichlorosilane, METHYL TRICHLORO SILANE, chloropropyl dimethylchlorosilane, dimethyldichlorosilane(DMCS), chlorobutyl Trimethoxy silane monomer, press monomer by mass parts 40: 50: 35: 10: 35, under 5～20 ℃ of lower temperature, slowly organosilane monomer is added drop-wise in the flask with quick stirring, drip hydrolysis reaction and continue 4 hours, concentrate then, resin layer is separated, 80～120 ℃ of following backflow slaking reactions 4 hours, be washed to neutrality afterwards, obtain the hydrolysis prepolymer; This intermediate product is added down aqueous sodium hydroxide solutions at 100～120 ℃ stirred 3 hours, add a certain amount of hydrochloric acid afterwards and neutralize and reach neutral, washing filtering adds an amount of toluene or dimethylbenzene, reaches that required to contain about 50% admittedly be discharging.
Example five:
Get a phenyl-trichloro-silicane, chloropropyl dimethylchlorosilane, dimethyldichlorosilane(DMCS), phenylbenzene diethoxy silane, chlorine amyl group trichlorosilane monomer, press monomer by mass parts 30: 60: 15: 10: 25, under 5～20 ℃ of lower temperature, slowly organosilane monomer is added drop-wise in the flask with quick stirring, drip hydrolysis reaction and continue 4 hours, concentrate then, resin layer is separated, 80～120 ℃ of following backflow slaking reactions 4 hours, be washed to neutrality afterwards, obtain the hydrolysis prepolymer; This intermediate product is added down aqueous sodium hydroxide solutions at 100～120 ℃ stirred 3 hours, add a certain amount of hydrochloric acid afterwards and neutralize and reach neutral, washing filtering adds an amount of toluene or dimethylbenzene, reaches that required to contain about 50% admittedly be discharging.
The above; only be the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claim was defined.
Claims (4)
1. the synthesis method of organic silicon resin of a carbon containing OH base is characterized in that choosing at least a kind of by general structure X-C-R '-SiR
nY
3-nShown silane monomer is a starting raw material, and wherein R is phenyl, methyl, vinyl, hydroxyl, hydrogen, and R ' represents univalent alkyl, carbonatoms value 1～7, X represents halogen atom, and Y represents hydrolysable group, be chlorine, alkoxy grp, acyloxyalkyl group group, n value 0,1,2; Also comprise the silane monomer that contains methyl or phenyl in the starting raw material, get above-mentioned starting raw material methyl monomer, phenyl monomer, vinyl monomer, hydrogeneous monomer, X-C-R '-SiR
nY
3-nMonomer is pressed mass parts 20～60: 50～120: 0～30: 0～30: 20～50 mixed, be added dropwise in the mixed solvent of 5～20 ℃ water and toluene and carried out the cohydrolysis polycondensation 3～8 hours, under 80～120 ℃ of high slightly temperature, concentrate 2～5 hours then, obtain organosilicon preformed polymer, wash after the neutrality with this prepolymer in 100～120 ℃ temperature range and pH value be to be hydrolyzed 2～5 hours under 9～11 the alkaline condition, adding hydrochloric acid afterwards neutralizes and reaches neutral, washing filtering, add an amount of toluene or dimethylbenzene, reaching required solid content and be about 50% is discharging, obtains the silicone resin of carbon containing OH base.
2. the synthesis method of organic silicon resin of carbon containing OH base according to claim 1 is characterized in that described by general structure X-C-R '-SiR
nY
3-nShown silane monomer comprises the 3-chloropropyl triethoxysilane.3-chloropropyl trichloro-silane, 3-chloropropyl dimethyl dichlorosilane (DMCS), chloropropyl dimethylchlorosilane, chlorobutyl Trimethoxy silane, chlorine amyl group trichlorosilane.
3. the synthesis method of organic silicon resin of carbon containing OH base according to claim 1 is characterized in that the described silane monomer that contains methyl or phenyl comprises dimethyldichlorosilane(DMCS), dimethyldiethoxysilane, phenylbenzene diethoxy silane, diphenyl dichlorosilane, a phenyl-trichloro-silicane, METHYL TRICHLORO SILANE, METHYL TRICHLORO SILANE, tetraethoxy.
4. the synthesis method of organic silicon resin synthetic silicone resin of carbon containing OH base according to claim 1 is characterized in that this resin has following general structure (1):
Wherein R can be phenyl, methyl, vinyl, hydroxyl, hydrogen or other organic group, and R ' represents univalent alkyl, and carbonatoms value 1～7 contains carbon OH base in the silicone resin molecular structure.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103131012B (en) * | 2013-01-08 | 2014-09-03 | 武汉大学 | Polysilane / silicon resin hybridization photoinitiator and preparation method and application thereof |
| JP6808832B2 (en) * | 2016-11-10 | 2021-01-06 | ワッカー ケミー アクチエンゲゼルシャフトＷａｃｋｅｒ Ｃｈｅｍｉｅ ＡＧ | Method for producing SiOH functional polysiloxane |
| CN113025231A (en) * | 2021-02-27 | 2021-06-25 | 深圳市盛康泰有机硅材料有限公司 | Preparation method of organic silicon resin tackifier |
| CN112979959A (en) * | 2021-02-27 | 2021-06-18 | 深圳市新泰盈电子材料有限公司 | Preparation method of organic silicon resin for self-adhesive pouring sealant |
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|---|---|---|---|---|
| CN85103446A (en) * | 1985-04-02 | 1986-10-01 | 山东大学 | The manufacture method of high-temperature resistant organic silicon resin |
| CN1810858A (en) * | 2006-02-27 | 2006-08-02 | 中蓝晨光化工研究院 | Synthesis of organosilicon resin |
| JP2007302892A (en) * | 2006-05-11 | 2007-11-22 | Wacker Chemie Ag | Silicone resin coating for electronic device |
| CN101460543A (en) * | 2005-12-23 | 2009-06-17 | 蓝星有机硅法国公司 | Process for preparing a silicone resin |
| WO2009103604A1 (en) * | 2008-02-20 | 2009-08-27 | Wacker Chemie Ag | Curable polymer mixtures |
| US20090259002A1 (en) * | 2008-04-15 | 2009-10-15 | Tsutomu Kashiwagi | Addition-curable silicone composition and cured product thereof |
-
2009
- 2009-11-23 CN CN2009100447921A patent/CN101704953B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85103446A (en) * | 1985-04-02 | 1986-10-01 | 山东大学 | The manufacture method of high-temperature resistant organic silicon resin |
| CN101460543A (en) * | 2005-12-23 | 2009-06-17 | 蓝星有机硅法国公司 | Process for preparing a silicone resin |
| CN1810858A (en) * | 2006-02-27 | 2006-08-02 | 中蓝晨光化工研究院 | Synthesis of organosilicon resin |
| JP2007302892A (en) * | 2006-05-11 | 2007-11-22 | Wacker Chemie Ag | Silicone resin coating for electronic device |
| WO2009103604A1 (en) * | 2008-02-20 | 2009-08-27 | Wacker Chemie Ag | Curable polymer mixtures |
| US20090259002A1 (en) * | 2008-04-15 | 2009-10-15 | Tsutomu Kashiwagi | Addition-curable silicone composition and cured product thereof |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2007302892A 2007.11.22 |
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| CN101704953A (en) | 2010-05-12 |
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