CN101699666A - Electric connector and electronic assembly part - Google Patents
Electric connector and electronic assembly part Download PDFInfo
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- CN101699666A CN101699666A CN200910207986A CN200910207986A CN101699666A CN 101699666 A CN101699666 A CN 101699666A CN 200910207986 A CN200910207986 A CN 200910207986A CN 200910207986 A CN200910207986 A CN 200910207986A CN 101699666 A CN101699666 A CN 101699666A
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Abstract
The invention discloses an electric connector and an electronic assembly part. The electronic assembly part comprises a circuit board and the electric connector. The circuit board is provided with a first surface and a second surface which are opposite to each other. The electric connector comprises a metal shell, an insulating base, a plurality of first pins and a plurality of second pins. The insulating base is connected with the metal shell. The first pins are arranged on the insulating base and are welded on the first surface. The first pins comprise a pair of first differential signal pins, a pair of second differential signal pins and a first grounding pin positioned between the two first differential signal pins and the two second differential signal pins. The second pins are arranged on the insulating base and are welded on the second surface. The second pins comprise a power pin, a second grounding pin and a pair of third differential signal pins positioned between the power pin and the second grounding pin.
Description
Technical field
The present invention relates to a kind of electric connector and have its electronics assembling, and particularly relate to a kind of electronics assembling that is applicable to the electric connector of universal serial bus structural and has it.
Background technology
USB 3.0 (Universal Serial Bus 3.0; USB 3.0) be that a kind of its transmission rate can reach 5G bps from the signal transmission standard that USB 2.0 developed out, the transmission rate of traditional USB 2.0 then only has 480M bps.USB 3.0 electric connectors are compatible in USB 2.0 electric connectors, and meaning is that USB 3.0 has adopted the electric connector structure identical with USB 2.0, and has increased the pin of the several USB of being used to provide 3.0 functions.Therefore, under electric connector structure, need to propose USB 3.0 electric connector structures, to meet demand based on USB 2.0.
Summary of the invention
The objective of the invention is to propose a kind of electric connector, to address the above problem.
The object of the present invention is achieved like this, promptly proposes a kind of electric connector, is suitable for being mounted to a circuit board.Circuit board has a relative first surface and a second surface.Electric connector comprises a metal shell, an insulating base frame, a plurality of first pin and a plurality of second pin.Insulating base frame is connected in metal shell.These first pins are disposed at insulating base frame and are soldered to first surface, and wherein these first pins comprise pair of first differential signal pins, pair of second differential signal pins and one first ground connection pin.The first ground connection pin this to first differential signal pins and this to second differential signal pins between.These second pins are disposed at insulating base frame and are soldered to second surface, and wherein these second pins comprise a power pin, one second ground connection pin and a pair of the 3rd differential signal pins.This to the 3rd differential signal pins between the power pin and the second ground connection pin.
The present invention proposes a kind of electronic assembly part, comprises a circuit board and an electric connector.Circuit board has a relative first surface and a second surface.Electric connector comprises a metal shell, an insulating base frame, a plurality of first pin and a plurality of second pin.Insulating base frame is connected in metal shell.These first pins are disposed at insulating base frame and are soldered to first surface, and wherein these first pins comprise pair of first differential signal pins, pair of second differential signal pins and one first ground connection pin.The first ground connection pin this to first differential signal pins and this to second differential signal pins between.These second pins are disposed at insulating base frame and are soldered to second surface, and wherein these second pins comprise a power pin, one second ground connection pin and a pair of the 3rd differential signal pins.This to the 3rd differential signal pins between the power pin and the second ground connection pin.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 is the stereogram of the electronic assembly part that comprises electrical connection device of one embodiment of the invention;
Fig. 2 is the partial component stereogram of the electronic assembly part of Fig. 1;
Fig. 3 is the stereogram of the electronic assembly part of Fig. 1 in another visual angle;
Fig. 4 is the partial component stereogram of the electronic assembly part of Fig. 3;
Fig. 5 is the stereogram of the electronic assembly part of Fig. 1 in another visual angle;
Fig. 6 is the partial component stereogram of the electronic assembly part of Fig. 5;
Fig. 7 is the partial component cutaway view of the electronic assembly part of Fig. 1;
Fig. 8 is the local schematic top plan view of the electronic assembly part of Fig. 4.
The main element symbol description
100: electronic assembly part
110: circuit board
110a: first surface
110b: second surface
112: the first circuits
114: the second circuits
115,118: reference planes
116,117,119: conductive hole
120: electric connector
122: metal shell
124: insulating base frame
126: the first pins
126a: first differential signal pins
126b: second differential signal pins
126c: the first ground connection pin
128: the second pins
128a: power pin
128b: the second ground connection pin
128c: the 3rd differential signal pins
130: control chip
Embodiment
Electronic assembly part proposed by the invention and electric connector thereof are applicable to USB 3.0 frameworks, compared to USB 2.0 and USB 3.0 electric connectors, five pins have been increased, wherein four pins are used for one and transmit differential wave (transmitting differential signal pair) and one received differential wave to (receiving differential signal pair), and the 5th pin then is used for grounding function.What specify is that the USB electric connector that generally is disposed at device end (device) has the title of male (plugconnector) again; The USB electric connector that is disposed at host side (host) has the title of female (Receptacleconnector) again.Below describe electric connector of the present invention in detail.
Fig. 1 is the stereogram of the electronic assembly part that comprises electric connector of one embodiment of the invention.Fig. 2 is the partial component stereogram of the electronic assembly part of Fig. 1.Please refer to Fig. 1 and Fig. 2, the electronic assembly part 100 of present embodiment comprises a circuit board 110 (only illustrating the part of circuit board 110) and an electric connector 120, and wherein electric connector 120 for example is to be disposed at device end, and the title of male is arranged again.Electric connector 120 comprises that a metal shell 122, is connected in the insulating base frame 124 of metal shell 122, a plurality of first pin 126 and a plurality of second pin 128 that is disposed at insulating base frame 124 that is disposed at insulating base frame 124.
In the present embodiment, this is a pair of transmission (Transmitting) differential signal pins T in USB 3.0 frameworks to the first differential signal pins 126a
x +And T
x -, the second differential signal pins 126b is a pair of reception (Receiving) the differential signal pins R in the USB3.0 framework
x +And R
x -, and the 3rd differential signal pins 128c is a pair of transmission/reception differential signal pins D that supports USB 1.0 frameworks or USB 2.0 frameworks in USB 3.0 frameworks
+And D
-
Fig. 3 is the stereogram of the electronic assembly part of Fig. 1 in another visual angle.Fig. 4 is the partial component stereogram of the electronic assembly part of Fig. 3.Fig. 5 is the stereogram of the electronic assembly part of Fig. 1 in another visual angle.Fig. 6 is the partial component stereogram of the electronic assembly part of Fig. 5.Please refer to Fig. 3 to Fig. 6, circuit board 110 has a relative first surface 110a (being shown in Fig. 3 and Fig. 4) and a second surface 110b (being shown in Fig. 5 and Fig. 6), these first pins 126 are soldered to the first surface 110a of circuit board 110, and these second pins 128 are soldered to the second surface 110b of circuit board 110.
Fig. 7 is the partial component cutaway view of the electronic assembly part of Fig. 1.Please refer to Fig. 7, in the present embodiment, electronic assembly part 100 comprises that more one is mounted to the control chip 130 of first surface 110a, and wherein control chip 130 for example is the access that is used for controlling memory body (as and not b gate fast flash memory bank (NAND Flash)) (not illustrating).In addition, circuit board 110 comprises that first circuit 112 and that is disposed at first surface 110a is disposed at second circuit 114 of second surface 110b; In the present embodiment, suppose that first circuit 112 is positioned at different sections with second circuit 114, so second circuit 114 illustrates with dotted line among Fig. 7.Control chip 130 is soldered to first circuit 112.These first pins 126 are soldered to first circuit 112, and are electrically connected to control chip 130 via first circuit 112.These second pins 128 are soldered to second circuit 114, and are electrically connected to control chip 130 via second circuit 114.
In the present embodiment, circuit board 110 more comprises a plurality of conductive holes (conductive via) 116 (only showing), and these conductive holes 116 are connected to first circuit 112 with second circuit 114.Therefore, these second pins 128 can be electrically connected to control chip 130 via second circuit 114, these conductive holes 116 and first circuit 112 in regular turn.
It should be noted that, in the present embodiment, first circuit 112 that is connected to first pin 126 and second circuit 114 that is connected to second pin 128 are disposed at the first surface 112 and the second surface 114 of circuit board 110 respectively, therefore has bigger distance between first circuit 112 and second circuit 114, to reduce the probability that signal disturbs.In addition, the first surface 110a of circuit board 110 only disposes first pin 126, therefore can have bigger distance (illustrating) between the first differential signal pins 126a and the second differential signal pins 126b with reduction coupling character between the two, and then keep signal transmitting quality as Fig. 4.
Fig. 8 is the local schematic top plan view of the electronic assembly part of Fig. 1.Please refer to Fig. 8, first pin 126 of present embodiment is not overlapping in the orthographic projection of first surface 110a at the orthographic projection and second pin 128 of first surface 110a, and meaning is that first pin 126 and second pin 128 are to be disposed at circuit board 110 in staggered mode.What deserves to be mentioned is that Fig. 8 only is a kind of execution mode of this case, is not in order to restriction the present invention.In other embodiments, first pin 126 at the orthographic projection of first surface 110a and second pin 128 the orthographic projection of first surface 110a might overlap (not illustrating).
Refer again to Fig. 7, the circuit board 110 of present embodiment more comprises two reference planes (referenceplane) 118 and 115.Reference planes 118 and 115 are disturbed and can reduce by first circuit 112 and second circuit 114 signal to each other by its shield effectiveness between first circuit 112 and second circuit 114.In the present embodiment, reference planes 118 for example are that ground plane (ground plane) and reference planes 115 for example are power plane (power plane).The first ground connection pin 126c (being illustrated in Fig. 2) and the second ground connection pin 128b (being illustrated in Fig. 2) can be electrically connected on reference planes 118 by conductive hole 117 (Fig. 7 only shows) respectively, and power pin 128a (being illustrated in Fig. 2) can be electrically connected on reference planes 115 by conductive hole 119.In addition, in another embodiment, power pin 128a also can be electrically connected on other elements relevant with power supply (not illustrating).
In sum, the present invention is disposed at circuit board opposite first and second surface respectively with these first pins and these second pins, therefore first surface and first circuit that connects these first pins with at first surface and be connected between second circuit of these second pins and can have bigger distance, to reduce the signal phase mutual interference (crosstalk) between first circuit and second circuit.In addition, the present invention only disposes these first pins on the first surface of circuit board, therefore included this of these first pins is to first differential signal pins and this is to having bigger distance between second differential signal pins, with reduction coupling character between the two, and then keep signal transmitting quality.In addition, circuit board more can have the reference planes between first circuit and second circuit, disturbs further to reduce by first circuit and second circuit signal to each other by its shield effectiveness.
Though disclosed the present invention in conjunction with above embodiment; yet it is not in order to limit the present invention; be familiar with this operator in the technical field under any; without departing from the spirit and scope of the present invention; can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (14)
1. an electric connector is used to be mounted to circuit board, and this circuit board has opposite first and second surface, and this electric connector comprises:
Metal shell;
Insulating base frame is connected in this metal shell;
A plurality of first pins are disposed at this insulating base frame and are used to be soldered to this first surface, and wherein those first pins comprise:
Pair of first differential signal pins;
Pair of second differential signal pins;
The first ground connection pin, this to first differential signal pins and should be to second differential signal pins between; And
A plurality of second pins are disposed at this insulating base frame and are used to be soldered to this second surface, and wherein those second pins comprise:
Power pin;
The second ground connection pin; And
A pair of the 3rd differential signal pins is between this power pin and this second ground connection pin.
2. electric connector as claimed in claim 1 should be a pair of transmission differential signal pins T in USB 3.0 frameworks to first differential signal pins wherein
x +And T
x -, and should be a pair of reception differential signal pins R in USB 3.0 frameworks to second differential signal pins
x +And R
x -
3. electric connector as claimed in claim 1 should be to support a pair of transmission/reception differential signal pins D of USB 1.0 frameworks or USB 2.0 frameworks in USB 3.0 frameworks to the 3rd differential signal pins wherein
+And D
-
4. electric connector as claimed in claim 1, wherein those first pins are not overlapping in the orthographic projection of this first surface at orthographic projection and those second pins of this first surface.
5. electronic assembly part comprises:
Circuit board has opposite first and second surface; And
Electric connector comprises:
Metal shell;
Insulating base frame is connected in this metal shell;
A plurality of first pins are disposed at this insulating base frame and are soldered to this first surface, and wherein those first pins comprise:
Pair of first differential signal pins;
Pair of second differential signal pins;
The first ground connection pin, this to first differential signal pins and should be to second differential signal pins between;
A plurality of second pins are disposed at this insulating base frame and are soldered to this second surface, and wherein those second pins comprise:
Power pin;
The second ground connection pin; And
A pair of the 3rd differential signal pins is between this power pin and this second ground connection pin.
6. electronic assembly part as claimed in claim 5 should be a pair of transmission differential signal pins T in USB 3.0 frameworks to first differential signal pins wherein
x +And T
x -, and should be a pair of reception differential signal pins R in USB 3.0 frameworks to second differential signal pins
x +And R
x -
7. electronic assembly part as claimed in claim 5 should be to support a pair of transmission/reception differential signal pins D of USB 1.0 frameworks or USB 2.0 frameworks in USB 3.0 frameworks to the 3rd differential signal pins wherein
+And D
-
8. electronic assembly part as claimed in claim 5, wherein those first pins are not overlapping in the orthographic projection of this first surface at orthographic projection and those second pins of this first surface.
9. electronics assembling as claimed in claim 5 also comprises:
Control chip is mounted to this first surface.
10. electronic assembly part as claimed in claim 9, wherein this circuit board comprises:
First circuit is disposed at this first surface, and wherein should and be somebody's turn to do first differential signal pins in those first pins be soldered to this first circuit to second differential signal pins, and was connected to this control chip via this first line electricity; And
Second circuit is disposed at this second surface, and wherein the 3rd differential signal pins in those second pins is soldered to this second circuit, and is connected to this control chip via this second line electricity.
11. electronic assembly part as claimed in claim 10, wherein this circuit board also comprises:
A plurality of conductive holes are connected to first circuit with this second circuit, so that those second pins are electrically connected to this control chip via this second circuit, those conductive holes and this first circuit in regular turn.
12. electronic assembly part as claimed in claim 10, wherein this circuit board also comprises:
Reference planes are between this first circuit and this second circuit.
13. electronic assembly part as claimed in claim 12, wherein these reference planes are a ground plane, and this first ground connection pin and this second ground connection pin are electrically connected on this ground plane.
14. electronic assembly part as claimed in claim 12, wherein these reference planes are power plane, and this power pin is electrically connected on this power plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102079869A CN101699666B (en) | 2009-11-04 | 2009-11-04 | Electric connector and electronic assembly part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102079869A CN101699666B (en) | 2009-11-04 | 2009-11-04 | Electric connector and electronic assembly part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101699666A true CN101699666A (en) | 2010-04-28 |
| CN101699666B CN101699666B (en) | 2012-05-23 |
Family
ID=42148115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102079869A Active CN101699666B (en) | 2009-11-04 | 2009-11-04 | Electric connector and electronic assembly part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101699666B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106921101A (en) * | 2016-11-16 | 2017-07-04 | 威盛电子股份有限公司 | Adapter card and plug cable assembly |
| US10057975B2 (en) | 2016-09-30 | 2018-08-21 | Asustek Computer Inc. | Electronic assemblies and method for manufacturing the same |
-
2009
- 2009-11-04 CN CN2009102079869A patent/CN101699666B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10057975B2 (en) | 2016-09-30 | 2018-08-21 | Asustek Computer Inc. | Electronic assemblies and method for manufacturing the same |
| CN106921101A (en) * | 2016-11-16 | 2017-07-04 | 威盛电子股份有限公司 | Adapter card and plug cable assembly |
| CN106921101B (en) * | 2016-11-16 | 2019-06-04 | 威盛电子股份有限公司 | Adapter card and plug cable assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101699666B (en) | 2012-05-23 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191119 Address after: Chinese Taiwan New Taipei City Patentee after: Wei Feng electronic Limited by Share Ltd Address before: Taiwan County, Taipei, China Patentee before: VIA Technologies |