CN101692471A - Encapsulating method of thin film solar cell based on photocuring technology - Google Patents
Encapsulating method of thin film solar cell based on photocuring technology Download PDFInfo
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- CN101692471A CN101692471A CN 200910060344 CN200910060344A CN101692471A CN 101692471 A CN101692471 A CN 101692471A CN 200910060344 CN200910060344 CN 200910060344 CN 200910060344 A CN200910060344 A CN 200910060344A CN 101692471 A CN101692471 A CN 101692471A
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- photocuring
- solar cell
- film solar
- oxygen barrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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Abstract
The invention discloses an encapsulating method of a thin film solar cell based on a photocuring technology, which belongs to an encapsulating method of the thin film solar cell. The method comprises the following steps of firstly preparing a solar cell chip on a front panel substrate, and then rapidly molding an encapsulating material on the solar cell chip by the photocuring technology; wherein the encapsulating material comprises a photocuring water-oxygen barrier layer (the water vapor permeability being preferably less than or equal to 1g/m2.day, and the oxygen transmission rate being preferably less than or equal to 1cc/m2.day) and an outermost photocuring protective layer (having the functions of scratch resistance, wear-resistance and moisture resistance, the rigidity being preferably greater than or equal to 2H) with excellent weather resistance, and the encapsulating sequence is as follows: photocuring the water-oxygen barrier layer on the front panel substrate prepared with the solar cell chip, then photocuring the outermost protective layer on the photocuring water-oxygen barrier layer, and then completing the encapsulation work of the thin film solar cell by the overlapping sequence of the front panel substrate, the solar cell chip, the photocuring water-oxygen barrier layer and the outermost photocuring protective layer. The encapsulating method can greatly accelerate the encapsulating speed of the solar cell, and has the advantages of good encapsulating process, high product yield rate and excellent consistency.
Description
Technical field
The present invention relates to a kind of method for packing of thin-film solar cells.
Background technology
Solar cell development so far, its developed two generation product, i.e. solar cell such as the monocrystaline silicon solar cell of the first generation and second generation polysilicon, amorphous silicon.At present, academia and industrial circle generally believe that the development of solar cell has entered the third generation, and promptly CIGS compound film solar cells such as (mixing Ga among the CIS) and film Si are solar cell.
Thin-film solar cells has the lower advantage of manufacturing cost, is fit to large-scale promotion application, but is still waiting further raising its useful life.In order to ensure operate as normal and long life, the follow-up encapsulation of solar cell is an important link.If encapsulation can not effectively completely cut off the steam in the atmosphere and the erosion of oxygen, the infiltration of steam may cause solar panel short circuit generation potential safety hazard, and the erosion of oxygen molecule then can make the solar panel generated output decay.
At present, thin-film solar cells is main packaged type with back-panel glass or back veneer material by EVA glued membrane heat lamination under vacuum state still, and its technology very complicated needs large laminator device and vacuum equipment, need heat, can not at room temperature carry out continuous production operation.
Photocuring technology has advantages such as curing rate fast (thereby production efficiency height), of low pollution, energy-conservation, cured product excellent performance, is a kind of eco-friendly green technology, is particularly suitable for being applied to the streamline production model.Photocuring technology is applied to the package design of thin-film solar cells, can improve the package speed of solar cell dramatically, obtain high-quality encapsulating products.
Summary of the invention
The invention provides a kind of encapsulating method of thin film solar cell based on photocuring technology.Have in preparation on the front panel base material of solar battery chip; realize by introducing photocuring technology; the present invention proposes and has designed the battery packaging structure that is made of two photocuring functional layers (photocuring water oxygen barrier layer and photocuring outermost protective layer), reaches the packaging protection purpose of thin-film solar cells.Simultaneously, the present invention has done concrete clear and definite to the photo-curing material that can be used for above-mentioned two photocuring functional layers, guarantees the reliability of cell package.
Technical scheme of the present invention is as follows:
Encapsulating method of thin film solar cell based on photocuring technology; it is characterized in that: prepare solar battery chip on the plate substrate at first in front; utilize photocuring technology rapid shaping encapsulating material layer thereon again; wherein said encapsulating material layer comprises a photocuring water oxygen barrier layer and the photocuring outermost protective layer with good weatherability properties energy; encapsulation is in proper order: the front panel base material glazing sodified water oxygen barrier layer that solar battery chip is arranged in preparation earlier; photocuring outermost protective layer on photocuring water oxygen barrier layer again is with the front panel base material; solar battery chip; photocuring water oxygen barrier layer; the laminated layer sequence of photocuring outermost protective layer is finished the encapsulation process of solar cell.
Wherein said photocuring technology comprises that utilizing light (ultraviolet or visible light) or electron beam is the energy, and causing the liquid fast transition with chemical reactivity is solid-state technology.
Wherein said solar battery chip is the thin-film solar cells chip for preparing on the plate substrate in front.
Wherein said thin-film solar cells comprises amorphous silicon thin-film solar cell, little (many) polycrystal silicon films solar cell, the copper, indium and selenium film solar cell, copper-indium-galliun-selenium film solar cell, cadmium telluride diaphragm solar battery, the dye-sensitized film solar cell, organic thin film solar cell.
Wherein said front panel base material can be a hard, as the glass plate hard material, and perhaps soft material, as metal film and/or sheet material or appropriate plastic material, as polyester, preferred toughened glass.
Above-mentioned cell package material layer is made up of a photocuring water oxygen barrier layer and the photocuring outermost protective layer with good weatherability properties.
Wherein said photocuring water oxygen barrier layer be by a kind of its cured film water vapour permeability preferred≤1g/m
2.day with OTR oxygen transmission rate preferred≤1cc/m
2.day (more preferably water vapour permeability preferred≤0.01g/m
2.day with OTR oxygen transmission rate preferred≤0.01cc/m
2.day) photo-curing material is made by photocuring technology.Wherein said photo-curing material is a kind of photocuring glue, or claims UV glue, and it is preferably 100-15000mPa.s 25 ℃ of viscosity of measuring down, more preferably 100-10000mPa.s, most preferably 100-6000Pa.s.
The thickness of wherein said photocuring water oxygen barrier layer is preferably at 100-1500 μ m, and is more preferably at 200-1200 μ m, most preferred at 400-700 μ m.
Wherein said photocuring outermost protective layer be by a kind of its cured film hardness preferred 〉=2H (more preferably 〉=3H, most preferably 〉=4H) and the photo-curing material with good weatherability properties energy, scratch resistance performance, anti-wear performance and humidity make by photocuring technology.Wherein said photo-curing material is a kind of photocureable coating, or claims UV coating, and its viscosity of measuring under 25 ℃ are preferably at 1-2000mPa.s, more preferably at 1-500mPa.s, most preferably at 1-100mPa.s.
The thickness of wherein said photocuring outermost protective layer is preferably at 5-100 μ m, and is more preferably at 10-50 μ m, most preferred at 15-30 μ m.
Advantage of the present invention:
1, the present invention overcomes that conventional package method production efficiency is low, time-consuming, the shortcoming of high energy consumption.
2, the present invention improves the package speed of solar cell dramatically, obtains high-quality encapsulating products.
3, the double-deck encapsulating structure of photocuring of the present invention designs, and can effectively guarantee the reliability of cell package.
4, the present invention does not need high energy consumption and expensive conventional package equipment, has greatly improved battery production efficient simultaneously, can effectively reduce the production cost of solar cell.
5, photocuring technology used in the present invention is a green technology, meets the energy-conserving and environment-protective requirement.
Description of drawings
Fig. 1 is thin-film solar cells encapsulating structure figure of the present invention.
Fig. 2 is amorphous silicon thin-film solar cell encapsulating structure figure in the specific embodiment of the invention.
Fig. 2 is the packaging technology of amorphous silicon thin-film solar cell described in the specific embodiment of the invention.
Fig. 1 label list is shown: 1, and photocuring outermost protective layer; 2, photocuring water oxygen barrier layer; 3, the front panel base material; 4, the thin-film solar cells chip.
Fig. 2 label list is shown: 5, and photocuring outermost protective layer; 6, photocuring water oxygen barrier layer; 7, armorplate glass; 8, the amorphous silicon thin-film solar cell chip.
Fig. 3 label list is shown: 9a, 9b, 9c, 9d, 9e, 9f, through the amorphous silicon thin-film solar cell in each stage of packaging technology; 10,11,12,13,14,15, transport tape; 16, the cell package module; 17, the gluing chamber; 18, UV solidifies case; 19, spray booth; 20, UV solidifies case; 21, UV glue; 22, UV coating; 23, curtain coater; 24, flush coater; 25, the 250W high-pressure mercury lamp; 26, the 1000W high-pressure mercury lamp.
Embodiment
Below will describe the present invention by specific embodiment, embodiment only is used for that the invention will be further described, does not limit protection scope of the present invention.
1, at first on reinforced glass substrate, prepares the amorphous silicon thin-film solar cell chip, be delivered to the cell package module by transport tape.
2, selecting a kind of 25 ℃ of viscosity is 5000mPa.s, cured film steam transmitance≤1g/m
2.day and OTR oxygen transmission rate≤1cc/m
2.day UV glue, by curtain coater, applying a layer thickness on solar panel is the photocuring water oxygen barrier layer of 175 μ m in the gluing chamber.
3, be delivered to the UV that the 250W high-pressure mercury lamp is installed by transport tape and solidify the case curing that exposes, be 25s curing time, is delivered to spray booth by conveyer belt.
4, selecting a kind of 25 ℃ of viscosity is 25mPa.s; cured film hardness 〉=3H; and has the UV coating of good weatherability properties energy, scratch resistance performance, anti-wear performance and humidity; in spray booth, pass through flush coater; on photocuring water oxygen barrier layer, spray; form one deck photocuring outermost protective layer, coating layer thickness is 25 μ m.
5, be delivered to the UV that the 1000W high-pressure mercury lamp is installed by transport tape and solidify case curings that exposes, be 5s curing time, finishes the packaging technology of battery and process.
Claims (12)
1. based on the encapsulating method of thin film solar cell of photocuring technology; it is characterized in that: prepare solar battery chip on the plate substrate at first in front; utilize photocuring technology rapid shaping encapsulating material layer thereon again; wherein said encapsulating material layer comprises a photocuring water oxygen barrier layer and the photocuring outermost protective layer with good weatherability properties energy; encapsulation is in proper order: the front panel base material glazing sodified water oxygen barrier layer that solar battery chip is arranged in preparation earlier; photocuring outermost protective layer on photocuring water oxygen barrier layer again is with the front panel base material; solar battery chip; photocuring water oxygen barrier layer; the laminated layer sequence of photocuring outermost protective layer is finished the encapsulation process of solar cell.
2. according to the process of claim 1 wherein that described photocuring technology comprises that utilizing light (ultraviolet or visible light) or electron beam is the energy, causing the liquid fast transition with chemical reactivity is solid-state technology.
3. according to the process of claim 1 wherein that described solar battery chip is the thin-film solar cells chip for preparing on the plate substrate in front.
4. according to claim 1 and 3, wherein said thin-film solar cells comprises amorphous silicon thin-film solar cell, little (many) polycrystal silicon films solar cell, the copper, indium and selenium film solar cell, copper-indium-galliun-selenium film solar cell, cadmium telluride diaphragm solar battery, dye-sensitized film solar cell, organic thin film solar cell.
5. according to claim 1 and 3, wherein said front panel base material can be a hard, as the glass plate hard material, and perhaps soft material, as metal film and/or sheet material or appropriate plastic material, as polyester, preferred toughened glass.
6. according to the method for claim 1, above-mentioned cell package material layer is made up of a photocuring water oxygen barrier layer and the photocuring outermost protective layer with good weatherability properties.
7. according to claim 1 and 6, wherein said photocuring water oxygen barrier layer be by a kind of its cured film water vapour permeability preferred≤1g/m
2.day with OTR oxygen transmission rate preferred≤1cc/m
2.day (more preferably water vapour permeability preferred≤0.01g/m
2.day with OTR oxygen transmission rate preferred≤0.01cc/m
2.day) photo-curing material is made by photocuring technology.
8. according to claim 7, wherein said photo-curing material is a kind of photocuring glue, or claims UV glue, and it is preferably 100-15000mPa.s 25 ℃ of viscosity of measuring down, more preferably 100-10000mPa.s, most preferably 100-6000Pa.s.
9. according to claim 1,6 and 7, the thickness of wherein said photocuring water oxygen barrier layer is preferably at 100-1500 μ m, and was more preferably at 200-1200 μ m, most preferred at 400-700 μ m.
10. according to claim 1 and 6; wherein said photocuring outermost protective layer be by a kind of its cured film hardness preferred 〉=2H (more preferably 〉=3H, most preferably 〉=4H) and the photo-curing material with good weatherability properties energy, scratch resistance performance, anti-wear performance and humidity make by photocuring technology.
11. according to claim 10, wherein said photo-curing material is a kind of photocureable coating, or claims UV coating, its viscosity of measuring under 25 ℃ are preferably at 1-2000mPa.s, more preferably at 1-500mPa.s, most preferably at 1-100mPa.s.
12. according to claim 1,6 and 10, the thickness of wherein said photocuring outermost protective layer is preferably at 5-100 μ m, and was more preferably at 10-50 μ m, most preferred at 15-30 μ m.
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| CN 200910060344 CN101692471A (en) | 2009-08-14 | 2009-08-14 | Encapsulating method of thin film solar cell based on photocuring technology |
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| CN 200910060344 CN101692471A (en) | 2009-08-14 | 2009-08-14 | Encapsulating method of thin film solar cell based on photocuring technology |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102315311A (en) * | 2010-07-06 | 2012-01-11 | 杜邦太阳能有限公司 | Solar cell module device and banding coating method thereof |
| CN102475394A (en) * | 2010-11-24 | 2012-05-30 | 吉富新能源科技(上海)有限公司 | Parasol equipped with uvioresistant thin film solar cell |
| CN103367498A (en) * | 2012-04-09 | 2013-10-23 | 中电电气(上海)太阳能科技有限公司 | Solar-energy double-glass assembly and encapsulation method thereof |
| CN106476388A (en) * | 2015-08-21 | 2017-03-08 | 汉能新材料科技有限公司 | A kind of high-resistant diaphragm and composite membrane |
| CN109560205A (en) * | 2018-11-26 | 2019-04-02 | 西安交通大学 | A kind of deoxygenation packaging method of drying of perovskite/silicon lamination solar cell component |
-
2009
- 2009-08-14 CN CN 200910060344 patent/CN101692471A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102315311A (en) * | 2010-07-06 | 2012-01-11 | 杜邦太阳能有限公司 | Solar cell module device and banding coating method thereof |
| CN102475394A (en) * | 2010-11-24 | 2012-05-30 | 吉富新能源科技(上海)有限公司 | Parasol equipped with uvioresistant thin film solar cell |
| CN103367498A (en) * | 2012-04-09 | 2013-10-23 | 中电电气(上海)太阳能科技有限公司 | Solar-energy double-glass assembly and encapsulation method thereof |
| CN103367498B (en) * | 2012-04-09 | 2016-02-24 | 中电电气(上海)太阳能科技有限公司 | The two glass assembly of a kind of solar energy and method for packing thereof |
| CN106476388A (en) * | 2015-08-21 | 2017-03-08 | 汉能新材料科技有限公司 | A kind of high-resistant diaphragm and composite membrane |
| CN109560205A (en) * | 2018-11-26 | 2019-04-02 | 西安交通大学 | A kind of deoxygenation packaging method of drying of perovskite/silicon lamination solar cell component |
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Open date: 20100407 |