CN101691103A - Tire module core component of automotive tire pressure sensor in system-in-package - Google Patents
Tire module core component of automotive tire pressure sensor in system-in-package Download PDFInfo
- Publication number
- CN101691103A CN101691103A CN 200910193112 CN200910193112A CN101691103A CN 101691103 A CN101691103 A CN 101691103A CN 200910193112 CN200910193112 CN 200910193112 CN 200910193112 A CN200910193112 A CN 200910193112A CN 101691103 A CN101691103 A CN 101691103A
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- China
- Prior art keywords
- pressure sensor
- pcb board
- package
- plastic packaging
- tire
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
- B60C23/0422—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver characterised by the type of signal transmission means
- B60C23/0433—Radio signals
- B60C23/0435—Vehicle body mounted circuits, e.g. transceiver or antenna fixed to central console, door, roof, mirror or fender
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
- B60C23/0422—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver characterised by the type of signal transmission means
- B60C23/0433—Radio signals
- B60C23/0447—Wheel or tyre mounted circuits
Abstract
The invention provides a tire module core component of an automotive tire pressure sensor in a system-in-package, which can reduce the module volume and save the cost. The component integrates a pressure sensor, a microprocessor, a radio frequency chip and a resonator into a package by system-in-package technology; a double-sided PCB board is welded on a lead frame; the microprocessor and the radio frequency chip are stacked on one side of the PCB board by 3D packaging technology, and the pressure sensor and the resonator are mounted on the other side of the PCB board by SMT technology; and then plastic package, surface treatment and testing are performed. The component has reasonable parts, and has the advantages of high technical integration level and wide application range.
Description
Technical field
The present invention relates to a kind of tire pressure monitoring device, be specifically related to the tire pressure sensor technology.
Background technology
The working environment of motor tire uniqueness, determined the tire pressure hightech requirement of the pressure sensor of monitoring in real time, comprise: wide warm area, the interior higher precision of wide power voltage range and the stability requirement of reliability requirement, low-power consumption requirement and harsh environment transmission of wireless signals, therefore the core of tire pressure monitoring system is a tire module, be microcontroller chip and pressure-temperature sensor, both generally integrate.Abroad early the tire pressure sensor of its Development and Production is also comparatively ripe because of legislation, and domesticly is in blank at this production field, is mainly produced and the supply of material by external three tame major companies at present:
(1) Freescale MPXY80X0 series TPMS system development platform
MPXY80x0 is called Daytona, and this is a kind of capacitive mems (microelectromechanical system MEMS) pressure sensor of surface micromachined.Daytona comprises pressure intensifier, positive temperature coefficient diffusion resistance temperature sensor and other all essential circuit.Make it to export 8 bit digital pressure and temperature data through calibration.All these is on a chip.MC68HC908RF2, also claim RF2, it comprises two parts, first is the flash HC08 micro-control unit (identical with MC68HC908RK2) of 2KB, second portion is the RF projector that can launch the uhf band digital data, its transmitting range can reach hundreds of rice (identical with MC33493, as to claim Tango 3 again).MC33594 claims Romeo2, receives the receptor that RF2 transmits.Romeo2 can receive with the data of demodulation Manchester encoding and by common Serial Peripheral Interface (SPI) (SPI) output.MC68HC908KX8 is called for short KX8, as the receiver microcontroller, also can use MC9S12DP256 to substitute KX8.The MPXY80X0series of Motorola system for monitoring pressure in tyre reference design comprises 5 modules: 4 tire modules and 1 receiver module.Tire module comprises Daytona, RF2, battery, discrete component and printed antenna.Receiver module has LED, battery, power connector and the RS-232 serial interface of Romeo2, KX8,5 indicating status.
(2) the NPX development system of general GE Novasensor
The NPX development system has two kinds, and a kind of is NPX I, and another kind is NPX II.NPX II is than the how integrated acceleration pick-up of NPX I.The characteristics of NPX development system are: all the sensors all is integrated on the chip; Can accurately measure tire temperature inside, air pressure and cell pressure, have temperature compensation function simultaneously, make measurement more accurate.But NPX II is the acceleration/accel of measured automobiles also.LF wakes up in addition in addition, centrifugal switch wakes up and quicken to wake up functions such as (NPX II).
(3) the SP12 development system of Infineon Sensor company
In the TPMS development system of Infineon Infineon science and technology, Sensor is the product that adopts the Norway specialty tyre pressure sensor SensoNor of maker of purchase, it has adopted silicon piezoresistance type pressure sensor based on the MEMS technology as the tire pressure monitoring unit, the SP12 of Infineon can transmit four groups of different data (temperature, pressure, acceleration/accel and power supply) simultaneously with SP12T, and is furnished with one and can finishes measurement, signal compensation and adjustment and SPI serial communication interface CMOS large-scale integration circuit.SP12 of Infineon and SP12T are provided with compensate function, can detect and compensate pressure, acceleration/accel, temperature and power supply voltage signal, and the compensation value of different types of tyres when varying environment accurately is provided, and have guaranteed the measurement reliability effectively.The SP12 sensor has adopted LF to wake the transient working pattern up, and in sensor assembly, increased acceleration pick-up, utilize the sensivity of its mass to motion, can realize that the automobile starting Auto Power On just enters System self-test, if and detect acceleration/accel when very little (the not motion of expression automobile), allow system enter sleep state, reduce system power dissipation widely.The LF mode also has the automatic tire positioning function.TDK510XF series is the monolithic FSK/ASK projector that is operated in 433-435MHZ (TDK5100F) and 311-317MHZ (TDK5101F) frequency band, this device contains an integrated PLL (phaselocked loop) synthesizer, and a high efficiency power amplifier is to drive loop antenna.The signal of RF receives available TDA5210 (FSK/ASK) receptor.
Except above-mentioned three kinds of main flow development systems, also have TPMS chipset that ATMEL system for monitoring pressure in tyre development platform, Philip P2SC development system and SmarTire company provide and corresponding solution etc.
The typical products that is come out by these platform developments has Freescale MPXY80XX series (controller+radio frequency), the SP30 of Infineon (sensor+controller) and universal electric NPXII series (sensor+controller) etc.
A patent investigation of carrying out recently shows, always having 63 patents relevant with the tire pressure inductor up to now registers in American National Patent Office, wherein most of patent concentrates on development, encapsulation and the unit design of sensor, the domestic relevant independent intellectual property right of then not having any TPMS field.
Summary of the invention
Technical purpose of the present invention is the key component by further integration tire pressure sensor, makes entire module only comprise 2 even 1 parts, saves the technology cost of manufacture when reducing the module volume, improves the field of application of tire pressure sensor.
For achieving the above object, first purpose of the present invention is to provide the tire module core component of automotive tire pressure sensor of system in package, can launch the signal that comprises 315MHz or two kinds of frequencies of 434MHz simultaneously, to adapt to the standard of zones of different, it includes pcb board and lead frame, by drawing-in system level encapsulation technology, with microprocessor chip, radio frequency chip and pressure sensor and comprise resonator, resistance and electric capacity are at interior passive device, plastic packaging is assembled in the same encapsulation, described microprocessor chip and radio frequency chip are folded stack on the one side of pcb board by the 3D encapsulation technology, described pressure sensor resonator is utilized the another side of SMT technology plastic packaging at pcb board, and final plastic packaging is a pressure sensor.
During plastic packaging, adopt the automatic plastic-sealing machine, increase film rolling and bring the protection sensor openings, utilize vacuum suction and particular design to make film be close to sensor surface.Every plastic packaging one mould, the film that winding is also rolled and more renewed is to guarantee plastic packaging sensor complete later.
Another object of the present invention also is to provide the plastic package process of above-mentioned pressure sensor tire module core component, by drawing-in system level encapsulation technology, with microprocessor chip, radio frequency chip and pressure sensor and comprise resonator, resistance and electric capacity and be assembled in the same encapsulation at interior passive device plastic packaging, it is made of following steps:
(1), two-sided pcb board is welded on the lead frame;
(2), PCB and lead frame are made plastic packaging of box dam formula;
(3), use folded stack microprocessor chip of 3D encapsulation technology and radio frequency chip in the one side of pcb board;
(4), the another side at pcb board uses SMT technology, placement pressure sensor resonator;
(5), carry out a plastic packaging, surface treatment and test verification at last.
The present invention compared with prior art, have following obvious improvement and outstanding characteristics: the raw product of this invention has been passed through the test of electro permanent magnetic compatibility, interference and means such as reliability simulation and emulation, requiring to make in strict accordance with the american car ebctronic reliability, is the highest product of integrated level in the present like product in the world.
In addition, this product can be launched the signal of 315MHz (the TPMS product that uses in Europe) and two kinds of different frequencies of 434MHz (the TPMS product that uses in the U.S.) simultaneously, satisfies the standard of Europe and two countries of the U.S. simultaneously.And, can change transmitting frequency by programming, be beneficial to be applicable in the future domestic TPMS standard.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is the structural representation of looking up of automobile tire pressure sensor;
Fig. 2 is the plan structure scheme drawing of automobile tire pressure sensor;
Fig. 3 is the schematic perspective view of Fig. 2;
Fig. 4 is an encapsulation finished product outside drawing of the present invention;
Fig. 5 is plastic package process realization flow figure of the present invention.
Among the figure: 1, microprocessor chip, 2, radio frequency chip, 3, pressure sensor, 4, resonator, 5, pcb board, 6, lead frame.
The specific embodiment
Referring to Fig. 1-shown in Figure 4, the tire module core component of automotive tire pressure sensor of system in package, utilize drawing-in system level encapsulation technology, with microprocessor chip 1, radio frequency chip 2 and pressure sensor 3 and comprise resonator 4, resistance and electric capacity at interior passive device, plastic packaging is assembled in the same encapsulation, microprocessor chip 1 and radio frequency chip 2 are folded stack on the one side of pcb board 5 by the 3D encapsulation technology, pressure sensor 3 resonator 4 are utilized the another side of SMT technology plastic packaging at pcb board 5, and final plastic packaging is an automobile tire pressure sensor.Pressure sensor 3 wherein adopts the automatic plastic-sealing machine when plastic packaging, increase film rolling and bring the protection sensor openings, utilizes vacuum suction and particular design to make film be close to sensor surface.Every plastic packaging one mould, the film that winding is also rolled and more renewed is to guarantee plastic packaging sensor complete later.
Referring to shown in Figure 5, the plastic package process realization flow of pressure sensor 3 tire module core components of the present invention is as follows: (1), at first two-sided pcb board 5 is welded on the lead frame 6; (2), pcb board 5 and lead frame 6 are adopted plastic packaging of box dam formula; (3), use folded stack microprocessor chip 1 of 3D encapsulation technology and radio frequency chip 2 in the one side of pcb board 5; (4), the another side at pcb board 5 uses SMT technology, placement pressure sensor 3 resonator 4; (5), at last carry out a plastic packaging, surface treatment and test verification, obtain the automobile tire pressure sensor of the high system in package of present technique aggregation degree.Use has the RF chip and the built-in resonator 4 of two transmitting frequencies, can export the signal of 315MHz and two kinds of different frequencies of 434MHz simultaneously by circuit layout.
Claims (3)
1. the tire module core component of automotive tire pressure sensor of a system in package, can launch the signal that comprises 315MHz or two kinds of frequencies of 434MHz simultaneously, to adapt to the standard of zones of different, it includes pcb board and lead frame, it is characterized in that: by drawing-in system level encapsulation technology, with microprocessor chip, radio frequency chip and pressure sensor and comprise resonator, resistance and electric capacity are at interior passive device, plastic packaging is assembled in the same encapsulation, on the one side of pcb board, described pressure sensor resonator is utilized the another side of SMT technology plastic packaging at pcb board by the folded stack of 3D encapsulation technology for described microprocessor chip and radio frequency chip.
2. the tire module core component of automotive tire pressure sensor of system in package according to claim 1, it is characterized in that: described pressure sensor also utilizes film to be mounted on the opening of pressure sensor when plastic packaging, and the opening of pressure sensor is not filled by plastic packaging material.
3. the plastic package process of the tire module core component of automotive tire pressure sensor of a system in package, by drawing-in system level encapsulation technology, with microprocessor chip, radio frequency chip and pressure sensor and comprise resonator, resistance and electric capacity and be assembled in the same encapsulation at interior passive device plastic packaging, it is characterized in that, comprise the following steps:
A, two-sided pcb board is welded on the lead frame;
B, PCB and lead frame are made plastic packaging of box dam formula;
C, use folded stack microprocessor chip of 3D encapsulation technology and radio frequency chip in the one side of pcb board;
D, use SMT technology, placement pressure sensor resonator at the another side of pcb board;
D, carry out a plastic packaging, surface treatment and test at last.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910193112 CN101691103A (en) | 2009-10-16 | 2009-10-16 | Tire module core component of automotive tire pressure sensor in system-in-package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910193112 CN101691103A (en) | 2009-10-16 | 2009-10-16 | Tire module core component of automotive tire pressure sensor in system-in-package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101691103A true CN101691103A (en) | 2010-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910193112 Pending CN101691103A (en) | 2009-10-16 | 2009-10-16 | Tire module core component of automotive tire pressure sensor in system-in-package |
Country Status (1)
| Country | Link |
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| CN (1) | CN101691103A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104362144A (en) * | 2014-09-22 | 2015-02-18 | 广东合微集成电路技术有限公司 | Tire pressure monitoring system package structure and package method thereof |
| CN112566799A (en) * | 2018-08-02 | 2021-03-26 | 倍耐力轮胎股份公司 | Tyre comprising a monitoring device |
| US11981164B2 (en) | 2018-08-02 | 2024-05-14 | Pirelli Tyre S.P.A. | Tyre comprising a monitoring device |
-
2009
- 2009-10-16 CN CN 200910193112 patent/CN101691103A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104362144A (en) * | 2014-09-22 | 2015-02-18 | 广东合微集成电路技术有限公司 | Tire pressure monitoring system package structure and package method thereof |
| CN112566799A (en) * | 2018-08-02 | 2021-03-26 | 倍耐力轮胎股份公司 | Tyre comprising a monitoring device |
| US11780276B2 (en) | 2018-08-02 | 2023-10-10 | Pirelli Tyre S.P.A. | Tyre comprising monitoring device with a flexible support |
| US11981164B2 (en) | 2018-08-02 | 2024-05-14 | Pirelli Tyre S.P.A. | Tyre comprising a monitoring device |
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| PB01 | Publication | ||
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Open date: 20100407 |