CN101666946B - Display panel and sealing structure - Google Patents

Display panel and sealing structure Download PDF

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Publication number
CN101666946B
CN101666946B CN2009101799345A CN200910179934A CN101666946B CN 101666946 B CN101666946 B CN 101666946B CN 2009101799345 A CN2009101799345 A CN 2009101799345A CN 200910179934 A CN200910179934 A CN 200910179934A CN 101666946 B CN101666946 B CN 101666946B
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wall
substrate
overside
display panel
side direction
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CN101666946A (en
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朱智伟
谢明哲
王世育
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AU Optronics Corp
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AU Optronics Corp
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Abstract

The invention provided a display panel and a sealing structure. The display panel comprises a first base plate, a second base plate positioned oppositely to the first base plate, a display medium and the sealing structure, wherein the display medium is positioned between the first base plate and the second base plate and is used for displaying an image; the sealing structure is positioned betweenthe first base plate and the second base plate and is used for sealing the display medium between the first base plate and the second base plate; and the sealing structure comprises an inner retaining wall, an outer retaining wall and frame glue, wherein the inner retaining wall surrounds the display medium, the outer retaining wall surrounds the inner retaining wall, a space for containing the frame glue is formed between the inner and the outer retaining walls, the outer retaining wall is provided with a plurality of lateral punch holes, and the frame glue is arranged inside the space for containing the frame glue. The sealing structure provided by the invention improves the structure intensity and enhances the margin of the manufacturing process in limited layout space.

Description

Display panel and hermetically-sealed construction
Technical field
The invention relates to a kind of display panel and hermetically-sealed construction, and particularly relevant for a kind of display panel and hermetically-sealed construction with side direction perforation.
Background technology
At improving rapidly of multimedia society, be indebted to the tremendous progress of semiconductor element and display device mostly.With regard to display panel, have that high image quality, space utilization efficient are good, the display panel (Liquid Crystal Display, TFT LCD) of low consumpting power, advantageous characteristic such as radiationless becomes the main flow in market gradually.
Generally speaking, display panel is made of thin-film transistor array base-plate, liquid crystal layer and colored optical filtering substrates, wherein thin-film transistor array base-plate is fitted with colored optical filtering substrates by the stickability of the frame glue that is arranged in frame, and liquid crystal layer is sealed between thin-film transistor array base-plate and the colored optical filtering substrates by frame glue.Therefore, the liquid crystal that will be injected in the processing procedure that is mainly used in of frame glue stably is sealed between thin-film transistor array base-plate and the colored optical filtering substrates, and in addition, frame glue also can be to the contribution that provides a little of keeping of bug hole spacing (cell gap).
Along with the expectation of consumer for compact, the high-res of display panel, demand such as high-quality, in limited arrangement space, the width of frame is gradually towards downsizing, so the width of frame glue also dwindles thereupon.Yet, when the dwindling of the width of frame glue, to face the problem of structural strength deficiency and adhesion deficiency, cause the reliability of display panel not good, what is more, physical strength deficiency or the adhesion because of frame glue is not enough separated from one another easily between thin-film transistor array base-plate and the colored optical filtering substrates.On the other hand, when the dwindling of the width of frame glue, how accurately to inject frame glue in limited design width, also the ability and the degree of stability of board and frame glue injection processing procedure on the line produced in test.
Summary of the invention
The invention provides a kind of display panel, the hermetically-sealed construction that it can reduce the width of frame and have high mechanical properties.
The invention provides a kind of hermetically-sealed construction, it can possess the intensity of certain degree in limited arrangement space, and increases the surplus desire degree of processing procedure of frame glue.
The present invention proposes a kind of display panel.This display panel comprises one first substrate, one second substrate, a display medium and a hermetically-sealed construction.Second substrate is positioned at the subtend of first substrate.Display medium is used to show an image between first substrate and second substrate.Hermetically-sealed construction is between first substrate and second substrate, and hermetically-sealed construction is sealed in display medium between first substrate and second substrate, and wherein hermetically-sealed construction comprises a home record wall, an overside wall and a frame glue.The home record wall be surrounded on display medium around.The overside wall is surrounded on the periphery of home record wall, forms a frame glue accommodation space between home record wall and the overside wall, and the overside wall has a plurality of side direction perforation.Frame glue is disposed in the frame glue accommodation space.
The present invention proposes a kind of hermetically-sealed construction, and it is suitable for a display medium of a display panel is sealed between one first substrate and one second substrate.This hermetically-sealed construction comprises a home record wall, an overside wall and a frame glue.Wherein, the home record wall be surrounded on display medium around.The overside wall is surrounded on the periphery of home record wall, forms a frame glue accommodation space between home record wall and the overside wall, and the overside wall has a plurality of side direction perforation.Frame glue then fills in the frame glue accommodation space.
In one embodiment of this invention, above-mentioned frame glue can also further be arranged in the side direction perforation to small part.
In one embodiment of this invention, above-mentioned each side direction perforation is along the Width setting of overside wall, and the side direction perforation is arranged on the sustained height plane of overside wall separated from one anotherly.At this moment, a side of side direction perforation for example is respectively in abutting connection with first substrate.And the height of side direction perforation is essentially 1/2nd of overside wall height.
In one embodiment of this invention, above-mentioned side direction perforation pattern is on the plane of 1/2nd height of overside wall.At this moment, the height of side direction perforation for example is essentially 1/4th of overside wall height.
In one embodiment of this invention, above-mentioned first substrate has one first common electrode, second substrate has one second common electrode, second common electrode extend to the home record wall on the surface of first substrate, and first common electrode and second common electrode electrically connect by the home record wall.At this moment, can have deformation buffering pattern on the surface of home record wall, first common electrode is connected by the deformation buffering pattern of home record wall with second common electrode.
In one embodiment of this invention, above-mentioned display panel can also comprise a plurality of conducting separation materials, these conducting separation materials are between first substrate and second substrate, and one first common electrode on first substrate and one second common electrode on second substrate electrically connect by the conducting separation material.Wherein, these conducting separation materials can be to be arranged in display medium.Certainly, these conducting separation materials also can be arranged in frame glue accommodation space.
In one embodiment of this invention, above-mentioned hermetically-sealed construction can also comprise an electrode layer, is coated on the surface of home record wall.
Based on above-mentioned, structure by side direction perforation on home record wall and the overside wall, when in frame glue accommodation space, inserting frame glue, frame segment glue can further be distributed in the side direction perforation on the overside wall, so, the stickability between can increasing on the frame glue and first substrate and second substrate reaches the effect of taking into account structural strength when dwindling frame glue width, on the other hand, also can increase the processing procedure ability and the degree of stability of frame glue processing procedure.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Description of drawings
Figure 1A and Figure 1B are respectively the schematic perspective view and the sectional view of the display panel of one embodiment of the invention;
Fig. 2 A and Fig. 2 B illustrate the making process flow diagram of the display panel of one embodiment of the invention;
Fig. 3 A and Fig. 3 B illustrate the making process flow diagram of the display panel of another embodiment of the present invention;
Fig. 4 is the diagrammatic cross-section along thickness direction of a kind of display panel in one embodiment of the invention;
Fig. 5 A and Fig. 5 B are respectively the vertical view of a kind of display panel in one embodiment of the invention;
Fig. 6 is the diagrammatic cross-section along thickness direction of another kind of display panel in one embodiment of the invention;
Fig. 7 illustrates the schematic top plan view of display panel in one embodiment of the invention.
Drawing reference numeral
200,300,400,500: display panel
202: the viewing area
210: the first substrates
220: the second substrates
230: display medium
240,340,440,540: hermetically-sealed construction
242: the home record wall
244: the overside wall
244H: side direction perforation
244A: first part of overside wall
244B: the second portion of overside wall
246: frame glue
250: the auxiliary gap thing
260: electrode layer
260A: first common electrode
260B: second common electrode
270: the conducting separation material
280: deformation buffering pattern
PH: elevation plane
S: frame glue accommodation space
T: the conducting district of home record wall
W: the Width of overside wall
Embodiment
The present invention proposes a kind of the frame plastic clip to be located at hermetically-sealed construction between the inside and outside shelves wall, utilize the home record wall of frame glue both sides and the structural strength that the overside wall comes reinforcement integral body, make display panel when dwindling the width of frame, hermetically-sealed construction represents structural strength to a certain degree in limited width.In addition, when carrying out frame glue processing procedure, predetermined structure on the overside wall provides the accommodation space of a buffering of frame glue, so can make frame glue processing procedure obtain the bigger surplus desire degree of processing procedure (process margin), and, the structural strength that can further increase hermetically-sealed construction integral body by the frame segment glue in the predetermined structure of overside wall with and and upper and lower base plate between adhesion.The following display panel that will arrange in pairs or groups graphic detailed description hermetically-sealed construction of the present invention and use the sealing structure for a little embodiment.
Figure 1A and Figure 1B are respectively the schematic perspective view and the sectional view of the display panel of one embodiment of the invention, and wherein Figure 1B is along the sectional view of BB ' profile line among Figure 1A.Please be simultaneously with reference to Figure 1A and Figure 1B, display panel 200 comprises one first substrate 210, one second substrate 220, a display medium 230 and a hermetically-sealed construction 240.Wherein, second substrate 220 is positioned at the subtend of first substrate 210, and display medium 230 is between first substrate 210 and second substrate 220, and hermetically-sealed construction 240 is sealed in display medium 230 between first substrate 210 and second substrate 220.Particularly, hermetically-sealed construction 240 comprises a home record wall 242, an overside wall 244 and a frame glue 246, wherein home record wall 242 be surrounded on display medium 230 around, overside wall 244 is surrounded on the periphery of home record wall 242, and form a frame glue accommodation space S between home record wall 242 and the overside wall 244, and overside wall 244 has a plurality of side direction perforation 244H, and frame glue 246 is disposed among the frame glue accommodation space S.
Furthermore, first substrate 210 and second substrate 220 can be thin-film transistor array base-plate and colored optical filtering substrates.Display medium 230 is mainly used in and shows an image.For instance, display medium 230 mainly is made of liquid crystal layer, pel array and common electrode (not illustrating), and display medium 230 is distributed in the viewing area 202 of display panel 200, liquid crystal molecule in the liquid crystal layer is made toppling in various degree according to the voltage difference between pel array and the common electrode, make and display panel 200 presents different GTGs in viewing area 202, and then demonstrate image.These display mediums 230 in order to show image are sealed between first substrate and second substrate by a hermetically-sealed construction.
More specifically, in hermetically-sealed construction 240 of the present invention, frame glue 246 is adhered between first substrate 210 and second substrate 220 by the support of both sides home record wall 242 and overside wall 244, thus, structural strength that can lift-off seal structure 240 integral body, in other words, the structural strength that hermetically-sealed construction 240 of the present invention can acquire a certain degree in limited width, therefore, when being applied to display panel 200, it can effectively reduce the integral width of frame, increase the arrangement space of viewing area 202, and then improve the aperture opening ratio and the display quality of display panel 200.Wherein, the width range of home record wall 242 can be 10 microns to 50 microns in fact, and the width range of overside wall 244 can be 100 microns to 400 microns in fact, and the scope of frame glue accommodation space S can be 100 microns to 1000 microns in fact.In the present embodiment, the width range of home record wall 242 can be 15 microns in fact, and the width range of overside wall 244 can be 200 microns in fact, and the scope of frame glue accommodation space S can be 700 microns in fact.
What deserves to be mentioned is that hermetically-sealed construction of the present invention more is provided with a plurality of side direction perforation 244H except home record wall and overside wall being arranged from supported on both sides frame glue on overside wall 244, these side direction perforation 244H runs through overside wall 244, and is communicated with frame glue accommodation space S.In detail, overside wall 244 is the annular wall of a continuous kenel, and side direction perforation 244H is the hole that hollows out along Width on the annular wall.In the processing procedure of reality, when on the quality entity of frame glue 246 during greater than frame glue accommodation space S, unnecessary frame segment glue 246 just can flow along the sidewall of overside wall 244, and then flow among the side direction perforation 244H of overside wall 244, thus, frame glue 246 then is distributed in frame glue accommodation space S and to the side direction of small part perforation 244H behind curing process.By increasing the contact area of frame glue 246, then can further promote the adhesion between frame glue 246 and the overside wall 244 with overside wall 244.On the other hand, the side direction of these overside walls 244 perforation 244H provides the accommodation space of 246 1 bufferings of frame glue, makes the supply of frame glue 246 allow error slightly, and then promotes the ability and the degree of stability of processing procedure.In addition, these side direction perforation 244H also can be used as the excessive excessive Jiao Kou of processing procedure center glue 246, avoids frame glue 246 excessive and when leading off nowhere, and the side force that applies is on the home record wall 242 of its both sides and overside wall 244 and then cause the situation of hermetically-sealed construction 240 avalanches.
In order further to promote the intensity of hermetically-sealed construction, shown in Figure 1B, also auxiliary gap thing 250 (photo spacer) can be set further in frame glue accommodation space in the present embodiment, increase adhesion and anchorage force between glue frame 246 and first substrate 210 and second substrate 220 by auxiliary gap thing 250.
Please continue with reference to Figure 1A and Figure 1B, in the present embodiment, home record wall 242 can utilize identical material by making with the mask processing procedure with overside wall 244.In addition, these side direction perforation 244H can be arranged on the sustained height plane P H of overside wall 244 separated from one anotherly, and side direction perforation 244H is provided with along the Width W of overside wall 244.Thus, can use easy processing procedure to carry out the making of side direction perforation 244H.
To be example below, enumerate the method for making that has shelves wall outside the side direction perforation in a kind of display panel, please refer to Fig. 2 A and Fig. 2 B, hereinafter will illustrate in the lump at this with the display panel shown in Figure 1A 200.In order to clearly demonstrate the method for making of overside wall and side direction perforation, in Fig. 2 A and Fig. 2 B, only schematically show the structure and the size of first substrate, second substrate and overside wall, and omitted illustrating of other possibility members.
Please refer to Fig. 2 A, directly on second substrate 220, form overside wall 244, and the method for formation overside wall 244 is for example prior to forming a photoresist separation material material layer (not illustrating) on second substrate 220.Then, via half mode mask photoresist separation material material layer (not illustrating) is exposed, because half mode mask has the different zone of light penetration, make side direction perforation 244H on the photoresist separation material material layer predetermined form zone and other zones and be subjected in various degree exposure, behind developing manufacture process, promptly on second substrate 220, form overside wall 244 with side direction perforation 244H.In the present embodiment, first substrate 210 and second substrate 220 for example are respectively thin-film transistor array base-plate and colored optical filtering substrates.
Shown in Fig. 2 A, second substrate 220 is fitted with a side and first substrate 210 of overside wall 244 with side direction perforation 244H.Overside wall 244 structures after the applying are shown in Fig. 2 B, and the side of side direction perforation 244H is common in abutting connection with first substrate 210.And, in the present embodiment, the height of side direction perforation 244H can be in fact overside wall 244 height h 1/2nd, or other highly for example are 3/4ths or 1/4th of height h, and preferable support structure is relatively arranged.Certainly, the height of side direction perforation 244H also can be the height h of overside wall 244.Therefore, have outside the side direction perforation 244H shelves wall 244 can with existing process-compatible, and reach the intensity that increases hermetically-sealed construction 240 and dwindle border width, increase aperture opening ratio, promote the effect of display quality with easy processing procedure.Certainly, first substrate 210 and second substrate 220 can also be colored optical filtering substrates and thin-film transistor array base-plate, and the present invention is not as limit.
In the present invention, the structure that side direction is bored a hole in the overside wall does not limit and all must be positioned on the plane of first substrate.Below will cooperate graphic Fig. 3 A and Fig. 3 B that the side direction perforation structure of the overside wall of different configuration modes and generation type is described for other embodiment.
Please refer to Fig. 3 A, on first substrate 210, form the first of overside wall 244 earlier, and its formation method for example is directly to form a photoresist separation material material layer (not illustrating) on first substrate 210.Then, expose and the first part 244A of developing manufacture process via a mask processing procedure with formation overside wall 244.And, as shown in Figure 3A, directly on second substrate 220, form the second portion 244B of overside wall 244, and the method for the second portion 244B of formation overside wall 244 can be utilized method as the aforementioned, prior to forming a photoresist separation material material layer on second substrate 220.Then, photoresist separation material material layer is exposed, on second substrate 220, to form the second portion 244B of overside wall 244 with side direction perforation 244H via half mode mask.
As shown in Figure 3A, second substrate 220 is fitted with the overside wall 244 of the 244A of first on the overside wall 244 of second portion 244B and first substrate 210.After fitting, the structure of overside wall 244 is shown in Fig. 3 B, and side direction perforation 244H all is positioned at first partly on 244A and the plane that second portion 244B is connected, and for example the side direction 244H that bores a hole is arranged on 1/2nd the elevation plane PH of overside wall 244 substantially.And in the present embodiment, the height of side direction perforation 244H for example is essentially 1/4th of overside wall 244 height h.Therefore, have side direction perforation 244H overside wall 244 can with existing process-compatible, and reach the intensity that increases hermetically-sealed construction 240 and dwindle border width, increase aperture opening ratio, promote the effect of display quality with easy processing procedure.
Certainly, the height of side direction perforation 244H also can be in fact less than overside wall 244 height 1/2nd or less than 1/4th of overside wall height, the present invention does not limit the size of side direction perforation 244H, and the deviser can design the size and the distribution density of side direction perforation based on demands such as the width of the viscosity of frame glue, overside wall, panel size sizes.
Fig. 4 is the diagrammatic cross-section along thickness direction of a kind of display panel in one embodiment of the invention.Please refer to Fig. 4, in the display panel 300 of present embodiment, hermetically-sealed construction 340 can comprise more that one is coated on home record wall 242 lip-deep electrode layers 260.In detail, first substrate 210 has the first common electrode 260A, second substrate 220 has the second common electrode 260B, and wherein the first common electrode 260A for example is electrically connected at the pel array on first substrate 210, and the second common electrode 260B for example is the counter electrode with respect to pel array.As shown in Figure 4, the second common electrode 260B extends out on the surface of home record wall 242 from viewing area 202, and the surface of covering home record wall 242, and the first common electrode 260A also 202 extends out to being provided with in the scope of home record wall 242 and frame glue 246 from the viewing area, make when winning substrate 210 and 220 applyings of second substrate, the first common electrode 260A and the second common electrode 260B electrically connect by home record wall 242, and then conducting first substrate 210 and second substrate 220.In other words, in the present embodiment, home record wall 242 in the hermetically-sealed construction 340 can be used the common electrode (i.e. the first common electrode 260A and the second common electrode 260B) of conducting upper and lower base plate (i.e. first substrate 210 and second substrate 220) directly as conducting separation material 270.
Please refer to Fig. 4, in the present embodiment, more can have deformation buffering pattern 280 on home record wall 242 and the surface that first substrate 210 is connected, the first common electrode 260A is connected by the deformation buffering pattern 280 of home record wall 242 with the second common electrode 260B, when external force put on home record wall 242, deformation buffering pattern 280 can absorb the energy that external force applies.In addition, in the present embodiment, more a plurality of auxiliary gap things 250 interlaced with each other can be set in frame glue accommodation space S, these auxiliary gap things 250 interlaced with each other are arranged on respectively on first substrate 210 and second substrate 220 alternately, by increasing the contact area of frame glue 246 with auxiliary gap thing 250, the adhesion of lift-off seal structure 340 between first substrate 210 and second substrate 220.In addition, the height of auxiliary gap thing 250 is slightly less than the height of home record wall 242 or overside wall 244, can increase the anchorage force between first substrate 210 and second substrate 220.
When with the home record wall in the hermetically-sealed construction during directly as the conducting separation material, position is set for it and scope is not particularly limited.Below enumerating two kinds of embodiment cooperates Fig. 5 A to illustrate with the different configuration modes of home record wall as conducting separation material 270 with Fig. 5 B.
Fig. 5 A and Fig. 5 B are respectively the vertical view of a kind of display panel in one embodiment of the invention.Please earlier with reference to Fig. 5 A, when with the home record wall 242 in the hermetically-sealed construction 340 during directly as conducting separation material 270, can be distributed in four corners of home record wall 242 on the home record wall 242 substantially in order to the zone of the conducting first common electrode 260A and the second common electrode 260B, as the part of the conducting district T that is denoted as home record wall 242 among Fig. 5 A.Certainly, also can be distributed in the full field of this home record wall 242 on the home record wall 242 in order to the zone of the conducting first common electrode 260A and the second common electrode 260B, as the zone of the conducting district T that is denoted as home record wall 242 among Fig. 5 B and the formation area coincidence of home record wall 242.When with the home record wall 242 in the hermetically-sealed construction 340 during directly as conducting separation material 270, the present invention does not limit on the home record wall 242 formation position and the scope in order to the zone of the conducting first common electrode 260A and the second common electrode 260B.
Fig. 6 is the diagrammatic cross-section along thickness direction of another kind of display panel in one embodiment of the invention.Please refer to Fig. 6, in the present embodiment, a conducting separation material 270 that is different from hermetically-sealed construction 440 is set in addition on the display panel 400.Specifically, in the present embodiment, display panel 400 also comprises a plurality of conducting separation materials 270, wherein in the display medium 230 of conducting separation material 270 between first substrate 210 and second substrate 220.As shown in Figure 6, conducting separation material 270 is positioned on second substrate 220, and be positioned at the contiguous hermetically-sealed constructions 440 in viewing area 202 around, when first substrate 210 and 220 applyings of second substrate, the first common electrode 260A and the second common electrode 260B electrically connect by conducting separation material 270, and then conducting first substrate 210 and second substrate 220.
Fig. 7 illustrates the schematic top plan view of display panel in one embodiment of the invention.Please refer to Fig. 7, in the present embodiment, the conducting separation material 270 of display panel 500 is to be arranged in frame glue accommodation space S.As shown in Figure 7, the second common electrode 260B 202 extends out to frame glue accommodation space S from the viewing area, and home record wall 242 is positioned on the second common electrode 260B, the first common electrode 260A also 202 extends out to frame glue accommodation space S from the viewing area, make when winning substrate 210 and 220 applyings of second substrate, the first common electrode 260A and the second common electrode 260B electrically connect by the conducting separation material 270 that is positioned at frame glue accommodation space S, and then conducting first substrate 210 and second substrate 220.
In sum, display panel of the present invention and hermetically-sealed construction have following advantage at least:
In the hermetically-sealed construction of the present invention, home record wall and overside wall are defined in frame glue between home record wall and the overside wall, strengthen the structural strength of hermetically-sealed construction integral body by the support strength of home record wall and overside wall, and the adhesive strength between can improving on frame glue and first substrate and second substrate by this, reach the effect of taking into account structural strength when dwindling frame glue width.
In the manufacture process of frame glue, but a little error on the one side tolerable frame glue processing procedure, raising processing procedure ability and degree of stability are bored a hole in the unnecessary frame glue overflow of coating between home record wall and the overside wall to the side direction of overside wall.On the other hand, after the frame adhesive curing,, can further promote the adhesion between frame glue and the overside wall, strengthen the structural strength of hermetically-sealed construction integral body by the contact area that increases frame glue and overside wall.
The production method of home record wall and overside wall can be integrated in the processing procedure of colored optical filtering substrates or thin-film transistor array base-plate, to save production cost.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; can do a little change and retouching, so protection scope of the present invention is worked as with being as the criterion that claims were defined.

Claims (21)

1. a display panel is characterized in that, described display panel comprises:
One first substrate;
One second substrate is positioned at the subtend of described first substrate;
One display medium between described first substrate and described second substrate, is used to show an image; And
One hermetically-sealed construction, between described first substrate and described second substrate, and described hermetically-sealed construction is sealed in described display medium between described first substrate and described second substrate, and wherein said hermetically-sealed construction comprises:
One home record wall, be surrounded on described display medium around;
One overside wall is surrounded on the periphery of described home record wall, forms a frame glue accommodation space between described home record wall and the described overside wall, and described overside wall has a plurality of side direction perforation; And
One frame glue is disposed in the described frame glue accommodation space.
2. display panel as claimed in claim 1 is characterized in that, described frame glue also comprises described these side direction perforation that are arranged in to small part.
3. display panel as claimed in claim 1 is characterized in that, each described side direction perforation is along the Width setting of described overside wall, and described these side direction perforation are arranged on the sustained height plane of described overside wall separated from one anotherly.
4. display panel as claimed in claim 3 is characterized in that, a side of described these side direction perforation is respectively in abutting connection with described first substrate.
5. display panel as claimed in claim 4 is characterized in that, the height of described these side direction perforation is essentially 1/2nd of described overside wall height.
6. display panel as claimed in claim 3 is characterized in that, described these side direction perforation pattern are on the plane of 1/2nd height of described overside wall.
7. display panel as claimed in claim 6 is characterized in that, the height of described these side direction perforation is essentially 1/4th of described overside wall height.
8. display panel as claimed in claim 1, it is characterized in that, described first substrate has one first common electrode, described second substrate has one second common electrode, described second common electrode extend to described home record wall on the surface of described first substrate, and described first common electrode and described second common electrode electrically connect by described home record wall.
9. display panel as claimed in claim 8 is characterized in that, has deformation buffering pattern on the surface of described home record wall, and described first common electrode is connected by the described deformation buffering pattern of described home record wall with described second common electrode.
10. display panel as claimed in claim 1, it is characterized in that, described display panel also comprises a plurality of conducting separation materials, between described first substrate and described second substrate, one first common electrode and one second common electrode on described second substrate on described first substrate electrically connect by described these conducting separation materials.
11. display panel as claimed in claim 10 is characterized in that, described these conducting separation materials are arranged in described display medium.
12. display panel as claimed in claim 10 is characterized in that, described these conducting separation materials are arranged in described frame glue accommodation space.
13. a hermetically-sealed construction is suitable for a display medium of a display panel is sealed between one first substrate and one second substrate, it is characterized in that described hermetically-sealed construction comprises:
One home record wall, be surrounded on described display medium around;
One overside wall is surrounded on the periphery of described home record wall, forms a frame glue accommodation space between described home record wall and the described overside wall, and described overside wall has a plurality of side direction perforation; And
One frame glue fills in the described frame glue accommodation space.
14. hermetically-sealed construction as claimed in claim 13 is characterized in that, described frame glue also comprises described these side direction perforation that are arranged in to small part.
15. hermetically-sealed construction as claimed in claim 13 is characterized in that, each described side direction perforation is along the Width setting of described overside wall, and described these side direction perforation are arranged on the sustained height plane of described overside wall separated from one anotherly.
16. hermetically-sealed construction as claimed in claim 15 is characterized in that, a side of described these side direction perforation is respectively in abutting connection with this first substrate.
17. hermetically-sealed construction as claimed in claim 16 is characterized in that, the height of described these side direction perforation is essentially 1/2nd of described overside wall height.
18. hermetically-sealed construction as claimed in claim 15 is characterized in that, described these side direction perforation pattern are on the plane of 1/2nd height of described overside wall.
19. hermetically-sealed construction as claimed in claim 18 is characterized in that, the height of described these side direction perforation is essentially 1/4th of described overside wall height.
20. hermetically-sealed construction as claimed in claim 13 is characterized in that, described hermetically-sealed construction also comprises an electrode layer, is coated on the surface of described home record wall.
21. hermetically-sealed construction as claimed in claim 20 is characterized in that, has deformation buffering pattern on the surface of described home record wall.
CN2009101799345A 2009-10-10 2009-10-10 Display panel and sealing structure Active CN101666946B (en)

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CN105242446B (en) * 2015-11-09 2018-08-14 深圳市华星光电技术有限公司 The production method of liquid crystal display panel
CN105467632B (en) * 2016-01-18 2018-11-23 京东方科技集团股份有限公司 A kind of liquid crystal display panel, its method for conducting leak test and display device
CN110928061B (en) * 2019-11-29 2022-04-26 武汉华星光电技术有限公司 Display panel and display device
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