CN101656347A - Electronic system of integrated antenna - Google Patents
Electronic system of integrated antenna Download PDFInfo
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- CN101656347A CN101656347A CN200910190713A CN200910190713A CN101656347A CN 101656347 A CN101656347 A CN 101656347A CN 200910190713 A CN200910190713 A CN 200910190713A CN 200910190713 A CN200910190713 A CN 200910190713A CN 101656347 A CN101656347 A CN 101656347A
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- antenna
- electronic system
- integrated electronic
- radiofrequency signal
- semiconductor chip
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Abstract
The invention relates to an electronic system of an integrated antenna, belonging to the technical field of electronic system integration. The electronic system comprises a system carrier, a chip andan antenna, wherein the chip and the antenna are integrated on the system carrier, the antenna is an annular microstrip antenna, and the radio frequency signal receiving and transmitting ends of the chip are connected with two microstrip lines of an antenna feed-in signal. By using the annular microstrip antenna to integrate, the integration level of the electronic system is improved, but the integration size is not increased.
Description
[technical field]
The invention belongs to electronic system integrated technology field, relate in particular to a kind of antenna integrated electronic system.
[background technology]
In order to satisfy electronic system miniaturization and multifunctional integrated development trend, people have proposed the notion of system in package.System in package refers to a system or subsystem is integrated in the packaging body as far as possible, comprises processor, internal memory, logic gates and various biasing circuits or the like.
Along with the fast development of various wireless communication systems, people more and more tend to advance in the packaging body whole wireless system is integrated.Now all success is integrated advances in the packaging body for passive components such as various chips and electric capacity, inductance, resistance, but advances in the encapsulation also to have very big difficulty with antenna is integrated.This mainly is because the development trend of encapsulation is more and more littler, and the performance requirement size of antenna is the bigger the better, and both are contradiction each other.
Integrated also more and more pressing on printed circuit board (PCB) with the integrated trend that satisfies the electronic system miniaturization of antenna.
[summary of the invention]
In view of this, be necessary to provide a kind of antenna also is integrated into electronic system in system's carrier.
A kind of antenna integrated electronic system, comprise system's carrier, at least one semiconductor chip and antenna, described semiconductor chip and antenna all are integrated on the described system carrier, described antenna is the ring-type microstrip antenna, and the radiofrequency signal sending and receiving end of the semiconductor chip of transmitting-receiving radiofrequency signal links to each other with two microstrip lines of antenna FD feed.
It is integrated to use the ring-type microstrip antenna to participate in, and improves the integrated level of electronic system, and does not increase integrated size.
In preferred embodiment, described system carrier is printed circuit board (PCB) or base plate for packaging.
In preferred embodiment, described antenna is located at a printed circuit board outward flange and the stacked setting of printed circuit board (PCB) that is provided with chip separately.
In preferred embodiment, described antenna is located at the base plate for packaging outward flange.
In preferred embodiment, described antenna be shaped as circle or rectangle.
In preferred embodiment, described antenna is open loop, and the microstrip line of two ports of antenna loop of open loop links to each other with the radiofrequency signal sending and receiving end of the semiconductor chip of transmitting-receiving radiofrequency signal.
In preferred embodiment, described antenna is a closed loop, and closed loop antenna is provided with two microstrip lines and links to each other with the radiofrequency signal sending and receiving end of the semiconductor chip of transmitting-receiving radiofrequency signal on loop.
In preferred embodiment, the radio frequency core signal of described semiconductor chip make a start mouthful with antenna on the connected mode of two microstrip lines of FD feed be bonding or the flip chip bonding of going between.
In preferred embodiment, the radiofrequency signal sending and receiving end of semiconductor chip connects earlier one section microstrip line, and two microstrip lines by FD feed on contact pin or plain conductor and the antenna link to each other again.
In preferred embodiment, described antenna inserts electric capacity and resistance on its loop.
In preferred embodiment, described electric capacity and resistance are that the surface mounting component Surface Mount is formed in system's carrier in system carrier outside or by the mode of organic functional thin film material with lamination.
The use of thin-film material makes that the thickness of antenna is almost constant, and according to the characteristics of organic film material, can cut apart arbitrarily it, thereby its value can get continuously, and precision is very high.
[description of drawings]
Fig. 1 is the electronic system schematic diagram of embodiment 1;
Fig. 2 is the electronic system schematic diagram of embodiment 2;
Fig. 3 is the electronic system schematic diagram of embodiment 3;
Fig. 4 (a) is the schematic diagram of resistance in electronic system among the embodiment 3;
Fig. 4 (b) is the schematic diagram of electric capacity in electronic system among the embodiment 3;
Fig. 5 is the electronic system schematic diagram of embodiment 4.
[embodiment]
Embodiment 1
As shown in Figure 1, be the electronic system schematic diagram of present embodiment.This electronic system comprises base plate for packaging 10, chip 20 and the antenna 30 as system's carrier.Can comprise at least one chip in an electronic system, the chip 20 of transmitting-receiving radiofrequency signal is positioned at base plate for packaging 10 central authorities, and antenna 30 is the open loop structure of rectangle, around the outward flange of base plate for packaging 10.The shape of antenna 30 also can be annular.The two ends of antenna 30 open loops are connected with the radiofrequency signal sending and receiving end of chip 20 by two microstrip lines 31.。Connected mode can be that lead-in wire bonding or upside-down mounting welding (flip-chip) connect.On the loop of antenna 30, insert electric capacity and resistance 32 adjusting antenna frequency band parameters.Electric capacity and resistance 32 adopt the mode of Surface Mount to be located at printed circuit board (PCB) 10 surfaces in the present embodiment.
Embodiment 2
As shown in Figure 2, be the electronic system schematic diagram of present embodiment.This electronic system comprises base plate for packaging 10, chip 20 and the antenna 30 as system's carrier.Chip 20 is positioned at base plate for packaging 10 central authorities, and antenna 30 is the closed-loop structure of rectangle, around the outward flange of base plate for packaging 10.Drawing two microstrip lines 31 on the loop of antenna 30 closed loops is connected with the radiofrequency signal sending and receiving end of chip 20.。Connected mode can be that lead-in wire bonding or flip-chip connect.On the loop of antenna 30, insert electric capacity and resistance 32 adjusting antenna frequency band parameters.Electric capacity and resistance 32 adopt the mode of Surface Mount to be located at base plate for packaging 10 surfaces in the present embodiment.
Embodiment 3
As shown in Figure 3, be the electronic system schematic diagram of present embodiment.This electronic system comprises base plate for packaging 10, chip 20 and the antenna 30 as system's carrier.Chip 20 is positioned at base plate for packaging 10 central authorities, and antenna 30 is the closed-loop structure of rectangle, around the outward flange of base plate for packaging 10.Drawing two microstrip lines 31 on the loop of antenna 30 closed loops is connected with the radiofrequency signal sending and receiving end of chip 20.。Connected mode can be that lead-in wire bonding or upside-down mounting welding (flip-chip) connect.On the loop of antenna 30, insert electric capacity and resistance 32 adjusting antenna frequency band parameters.Electric capacity 33 and resistance 34 adopt organic film material to make in the present embodiment.Can adopt packaged substrate technology directly electric capacity 33 and resistance 34 to be laminated in the base plate for packaging, Fig. 4 (a) and Fig. 4 (b) are respectively resistance 34 and electric capacity 33 schematic diagram behind the lamination in base plate for packaging 10.Wherein resistance 34 is made of thin-film material, and electric capacity 33 comprises the buried capacitor material 36 that top crown 35, bottom crown 37 and thin-film material constitute.The use of thin-film material makes that the thickness of antenna is almost constant, and according to the characteristics of organic film material, can cut apart arbitrarily it, thereby its value can get continuously, and precision is very high.
Embodiment 4
As shown in Figure 5, be the electronic system schematic diagram of present embodiment.This electronic system comprises printed circuit board (PCB) 10, chip 20 and the antenna 30 as system's carrier.Chip 20 is positioned at printed circuit board (PCB) 10 central authorities, antenna 30 is located at a printed circuit board 40 outward flanges separately, be closed loop or open-loop antenna, and this printed circuit board (PCB) 40 and the printed circuit board (PCB) 10 stacked settings that are provided with chip 20, the end of two microstrip lines 31 of antenna 30 all is provided with electroplating hole, the radiofrequency signal sending and receiving end of chip 20 links to each other with the electroplating hole of microstrip line 31 ends by contact pin or plain conductor more earlier by one section microstrip line.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (11)
1, a kind of antenna integrated electronic system, comprise system's carrier, at least one semiconductor chip and antenna, it is characterized in that, described semiconductor chip and antenna all are integrated on the described system carrier, described antenna is the ring-type microstrip antenna, and the radiofrequency signal sending and receiving end of the semiconductor chip of transmitting-receiving radiofrequency signal links to each other with two microstrip lines of antenna FD feed.
2, antenna integrated electronic system as claimed in claim 1 is characterized in that, described system carrier is printed circuit board (PCB) or base plate for packaging.
3, antenna integrated electronic system as claimed in claim 2 is characterized in that, described antenna is located at a printed circuit board outward flange and the stacked setting of printed circuit board (PCB) that is provided with chip separately.
4, antenna integrated electronic system as claimed in claim 2 is characterized in that, described antenna is located at the base plate for packaging outward flange.
5, antenna integrated electronic system as claimed in claim 1 is characterized in that, described antenna be shaped as annular or straight-flanked ring.
6, antenna integrated electronic system as claimed in claim 1 is characterized in that, described antenna is open loop, and the microstrip line of two ports of antenna loop of open loop links to each other with the radiofrequency signal sending and receiving end of the semiconductor chip of transmitting-receiving radiofrequency signal.
7, antenna integrated electronic system as claimed in claim 1 is characterized in that, described antenna is a closed loop, and closed loop antenna is provided with two microstrip lines and links to each other with the radiofrequency signal sending and receiving end of the semiconductor chip of transmitting-receiving radiofrequency signal on loop.
8, antenna integrated electronic system as claimed in claim 3 is characterized in that, the radiofrequency signal sending and receiving end of described semiconductor chip connects one section microstrip line earlier, and two microstrip lines by FD feed on contact pin or plain conductor and the antenna link to each other again.
9, antenna integrated electronic system as claimed in claim 4 is characterized in that, the connected mode of two microstrip lines of FD feed is lead-in wire bonding or flip chip bonding on the radiofrequency signal sending and receiving end of described semiconductor chip and the antenna.
10, antenna integrated electronic system as claimed in claim 1 is characterized in that, described antenna inserts electric capacity and resistance on its loop.
11, antenna integrated electronic system as claimed in claim 10 is characterized in that, described electric capacity and resistance are that the surface mounting component Surface Mount is formed in system's carrier in system carrier outside or by the mode of organic functional thin film material with lamination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910190713A CN101656347A (en) | 2009-09-22 | 2009-09-22 | Electronic system of integrated antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910190713A CN101656347A (en) | 2009-09-22 | 2009-09-22 | Electronic system of integrated antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101656347A true CN101656347A (en) | 2010-02-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910190713A Pending CN101656347A (en) | 2009-09-22 | 2009-09-22 | Electronic system of integrated antenna |
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| CN (1) | CN101656347A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104137336A (en) * | 2012-02-21 | 2014-11-05 | 株式会社藤仓 | Loop antenna |
-
2009
- 2009-09-22 CN CN200910190713A patent/CN101656347A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104137336A (en) * | 2012-02-21 | 2014-11-05 | 株式会社藤仓 | Loop antenna |
| CN104137336B (en) * | 2012-02-21 | 2016-03-02 | 株式会社藤仓 | Loop aerial |
| US9490541B2 (en) | 2012-02-21 | 2016-11-08 | Fujikura Ltd. | Loop antenna |
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Application publication date: 20100224 |