CN101648272A - Method for coating surface of ceramic metalized envelope with nickel - Google Patents
Method for coating surface of ceramic metalized envelope with nickel Download PDFInfo
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- CN101648272A CN101648272A CN200910024021A CN200910024021A CN101648272A CN 101648272 A CN101648272 A CN 101648272A CN 200910024021 A CN200910024021 A CN 200910024021A CN 200910024021 A CN200910024021 A CN 200910024021A CN 101648272 A CN101648272 A CN 101648272A
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Abstract
The invention provides a method for coating the surface of a ceramic metalized envelope with nickel. The method comprises the following steps: grading nickel powder meeting the requirements of qualityindexes by different particle sizes; adding a proper amount of binder, so as to obtain paste; then, directly printing the paste on the surface of a metalized layer by using the screen-printing method(the thickness of coating is controlled); and further sintering at a high temperature of 900 to 1,200 DEG C, thereby achieving the purpose of bonding the nickel layer with the metalized layer tight.In brief, the method comprises the following technical procedures: preparing nickel powder; preparing nickel paste; screen printing; sintering; and obtaining the finished products. By using the novelnickel-coating method, the invention has the advantages of not only stable and reliable quality and simple and easy-to-operate method, but also environmental friendliness and cleanliness, and is of great social and economical benefits.
Description
Technical field
The present invention relates to a kind of method for coating surface of ceramic metalized envelope with nickel.
Background technology
High voltage vacuum switchgear cabinet is widely used in the high voltage power transmission and transforming industry, and the core of high voltage vacuum switchgear cabinet is a high voltage vacuum interrupter, what be widely used at present is ceramic high voltage vacuum interrupter, and ceramic metalized envelope is one of critical component of high voltage vacuum interrupter.When ceramic metalized envelope is made, with the metal parts sealing-in time, have reliable sealing-in air-tightness and sealing strength in order to ensure ceramic metalized envelope, need be at ceramic cartridge surface applied layer of metal layer, behind high temperature sintering, form the metal layer of one deck densification, carry out nickel plating again in metallization layer then.What the method for general nickel plating adopted is traditional electronickelling technology, because electronickelling technology is relatively backward, the technical process product quality also is difficult to control, can not get effective processing if the more important thing is the electroplating wastewater of electronickelling, can pollute to environment.
Summary of the invention
The technical problem that the present invention solves: a kind of method for coating surface of ceramic metalized envelope with nickel is provided,, eliminates the electronickelling technology that falls behind by adopting the new nickel method that is coated with, stable and reliable product quality not only, method is simple, and environment-protecting clean.
The technical solution used in the present invention: will meet the nickel powder that quality index requires (granularity, purity); adopt different grain size to carry out grating; make paste by adding suitable binding agent; adopt the method for serigraphy directly to be printed on the surface of metal layer (control coating layer thickness) then; through 900 ℃～1200 ℃ high temperature sintering (atmosphere protection), reach combining closely of nickel dam and metal layer again.
Technological process is: preparation nickel powder-preparation nickel cream-serigraphy-sintering-finished product.
Concrete grammar is as follows:
A kind of method for coating surface of ceramic metalized envelope with nickel, implement according to following steps:
(1) preparation nickel powder: adopt varigrained carbonyl nickel powder to prepare burden, make the grain composition D of nickel powder
50Reach 1.5-2.5 μ m;
(2) preparation nickel cream: with the nickel powder that mixes according to nickel powder: the ratio system cream of binding agent=1: 0.4-0.6; Described binding agent adopts ethyl cellulose and terpinol according to 1: the ratio of 20-30 mixes;
(3) serigraphy: adopt silk-screen printing technique that nickel cream is printed on the metallization layer of ceramic metalized envelope, the silk screen specification is 100 orders-300 orders;
(4) sintering: the ceramic metalized envelope after the serigraphy is carried out sintering, and sintering temperature is 900 ℃～1200 ℃, is incubated 30 minutes, and protective gas is pure hydrogen or nitrogen hydrogen mixeding gas.
In the described step (1), the grain composition D of nickel powder
50Be 2.0 μ m.
In the described step (2), nickel powder: the ratio system cream of binding agent=1: 0.5; Described binding agent employing ethyl cellulose and terpinol mix according to 1: 30 ratio.
In the described step (3), the silk screen specification is 100 orders-200 orders.
In the described step (4), sintering temperature is 1000 ℃～1200 ℃.
The present invention compared with prior art replaces electronickelling technology with being coated with the nickel method, and not only stable and reliable product quality, and method is simple, obtains huge economic benefit and social benefit.
The specific embodiment
In order to change the process that tradition falls behind, the present invention adopts a kind of new nickel method that is coated with, only need to meet the nickel powder that quality index requires, make paste by adding suitable binding agent, adopt the method for serigraphy directly to be printed on the surface of metal layer then, pass through high temperature sintering again, reach combining closely of nickel dam and metal layer.The nickel dam that obtains like this has good solder wettability, sealing-in air-tightness and sealing strength with metal sealing the time.Concrete implementation step is as follows:
(1) preparation nickel powder: adopt varigrained carbonyl nickel powder to prepare burden, make the grain composition D of nickel powder
50Reach 1.5-2.5 μ m, preferred particulates grating D
50Be 2.0 μ m.
(2) preparation nickel cream: with the nickel powder that mixes according to nickel powder: the ratio system cream of binding agent=1: 0.4-0.6, preferred nickel powder: binding agent=1: 0.5; Described binding agent adopts ethyl cellulose and terpinol according to 1: the ratio of 20-30 mixes, preferred, ethyl: terpinol=1: 30;
(3) serigraphy: adopt silk-screen printing technique that nickel cream is printed on the metallization layer of ceramic metalized envelope, the silk screen specification is 100 orders-300 orders, preferred 100 orders-200 order;
(4) sintering: the ceramic metalized envelope after the serigraphy is carried out sintering, and sintering temperature is 900 ℃～1200 ℃, preferred 1000 ℃～1200 ℃, be incubated 30 minutes, and protective gas is pure hydrogen or nitrogen hydrogen mixeding gas.
Through said method be coated with nickel dam, nickel layer thickness 10～15 μ m, tensile value 〉=130Mpa, sealing-in leak rate≤1 * 10
-11Pam
3/ s, stable and reliable product quality not only, and also method is simple, and compliance with environmental protection requirements can obtain huge economic benefit and social benefit.
Claims (5)
1, a kind of method for coating surface of ceramic metalized envelope with nickel is characterized in that implementing according to following steps:
(1) preparation nickel powder: adopt varigrained carbonyl nickel powder to prepare burden, make the grain composition D of nickel powder
50Reach 1.5-2.5 μ m;
(2) preparation nickel cream: with the nickel powder that mixes according to nickel powder: the ratio system cream of binding agent=1: 0.4-0.6; Described binding agent adopts ethyl cellulose and terpinol according to 1: the ratio of 20-30 mixes;
(3) serigraphy: adopt silk-screen printing technique that nickel cream is printed on the metallization layer of ceramic metalized envelope, the silk screen specification is 100 orders-300 orders;
(4) sintering: the ceramic metalized envelope after the serigraphy is carried out sintering, and sintering temperature is 900 ℃～1200 ℃, is incubated 30 minutes, and protective gas is pure hydrogen or nitrogen hydrogen mixeding gas.
2, a kind of ceramic metallization according to claim 1 is coated with the nickel process, it is characterized in that: in the described step (1), and the grain composition D of nickel powder
50Be 2.0 μ m.
3, a kind of ceramic metallization according to claim 1 is coated with the nickel process, it is characterized in that: in the described step (2), and nickel powder: the ratio system cream of binding agent=1: 0.5; Described binding agent employing ethyl cellulose and terpinol mix according to 1: 30 ratio.
4, a kind of ceramic metallization according to claim 1 is coated with the nickel process, it is characterized in that: in the described step (3), the silk screen specification is 100 orders-200 orders.
5, a kind of ceramic metallization according to claim 1 is coated with the nickel process, it is characterized in that: in the described step (4), sintering temperature is 1000 ℃～1200 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100240216A CN101648272B (en) | 2009-09-12 | 2009-09-12 | Method for coating surface of ceramic metalized envelope with nickel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100240216A CN101648272B (en) | 2009-09-12 | 2009-09-12 | Method for coating surface of ceramic metalized envelope with nickel |
Publications (2)
| Publication Number | Publication Date |
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| CN101648272A true CN101648272A (en) | 2010-02-17 |
| CN101648272B CN101648272B (en) | 2011-08-31 |
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| CN2009100240216A Active CN101648272B (en) | 2009-09-12 | 2009-09-12 | Method for coating surface of ceramic metalized envelope with nickel |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490454A (en) * | 2011-12-12 | 2012-06-13 | 孝感市汉达电子元件有限责任公司 | Automatic plane screen paste printing technology for metalizing ceramic discharge tube |
| CN103508758A (en) * | 2013-07-05 | 2014-01-15 | 景德镇景光精盛电器有限公司 | Sintered nickel printing agent used for electro vacuum metallized ceramic |
| CN109158723A (en) * | 2018-10-15 | 2019-01-08 | 宜兴市美盛电器有限公司 | The soldering processes of electric-heat base board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL9000405A (en) * | 1990-02-20 | 1991-09-16 | Stichting Energie | POWDER-BASED STARTING MATERIAL FOR A NICKEL-BASED ALLOY FOR MANUFACTURING A POROUS ANODE FROM A FUEL CELL, METHOD FOR PREPARING SUCH MATERIAL, PROCESS FOR PRODUCING AN ANODY FOR A PURPOSE ANIMAL PROPERTIES, AND PROPERTIES. |
| CN1060531C (en) * | 1998-04-21 | 2001-01-10 | 冶金工业部钢铁研究总院 | Method for preparation of composite ceramic-Ni-Al intermetallic material |
| CN101456741B (en) * | 2008-12-29 | 2012-01-18 | 陕西宝光陶瓷科技有限公司 | Process for preparing ceramic cartridge for super long type high voltage fuse |
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2009
- 2009-09-12 CN CN2009100240216A patent/CN101648272B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490454A (en) * | 2011-12-12 | 2012-06-13 | 孝感市汉达电子元件有限责任公司 | Automatic plane screen paste printing technology for metalizing ceramic discharge tube |
| CN102490454B (en) * | 2011-12-12 | 2013-11-06 | 孝感市汉达电子元件有限责任公司 | Automatic plane screen paste printing technology for metalizing ceramic discharge tube |
| CN103508758A (en) * | 2013-07-05 | 2014-01-15 | 景德镇景光精盛电器有限公司 | Sintered nickel printing agent used for electro vacuum metallized ceramic |
| CN109158723A (en) * | 2018-10-15 | 2019-01-08 | 宜兴市美盛电器有限公司 | The soldering processes of electric-heat base board |
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| Publication number | Publication date |
|---|---|
| CN101648272B (en) | 2011-08-31 |
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Effective date of registration: 20180110 Address after: 721006 Baoji City, Shaanxi province Weibin District Baoguang Road No. 53 Patentee after: Shaanxi Baoguang Precision Ceramics Co. Ltd. Address before: 721304 mailbox 39, Chen Cang District, Baoji, Shaanxi Patentee before: Shanxi Baoguang Ceramic Science Technology Co., Ltd. |
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Effective date of registration: 20211130 Address after: No.53, Baoguang Road, Weibin District, Baoji City, Shaanxi Province 721006 Patentee after: SHAANXI BAOGUANG CERAMIC SCIENCE TECHNOLOGY CO.,LTD. Address before: No.53, Baoguang Road, Weibin District, Baoji City, Shaanxi Province 721006 Patentee before: SHAANXI BAOGUANG PRECISION CERAMICS CO.,LTD. |
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