CN101636044B - Embedded type circuit structure and manufacturing method thereof - Google Patents
Embedded type circuit structure and manufacturing method thereof Download PDFInfo
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- CN101636044B CN101636044B CN2008101337341A CN200810133734A CN101636044B CN 101636044 B CN101636044 B CN 101636044B CN 2008101337341 A CN2008101337341 A CN 2008101337341A CN 200810133734 A CN200810133734 A CN 200810133734A CN 101636044 B CN101636044 B CN 101636044B
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Abstract
The invention discloses an embedded type circuit structure and a manufacturing method thereof. The manufacturing method comprises the following steps: firstly, providing a circuit board which is provided with a core layer and two embedded circuits embedded in two opposite surfaces of the core layer respectively; secondly, forming a conductive channel running through the circuit board, and two conductive layers which are electrically connected with the conductive channel and are coated on and electrically connected with the two embedded circuits respectively; thirdly, forming two resistance clad layers on the two conductive layers respectively, wherein each resistance clad layer is provided with a first opening to expose the surfaces of the conductive layers; fourthly, forming an anti-oxidation layer on the surface of each conductive layer; fifthly, removing the two resistance clad layers and the two conductive layers to expose the two embedded circuits; and finally, forming two anti-welding layers to cover the two embedded circuits respectively, wherein each anti-welding layer is provided with a second opening to expose the anti-oxidation layer.
Description
Technical field
The present invention relates to a kind of manufacture method of buried circuit structure, and particularly relate to a kind of manufacture method that does not have the buried circuit structure of plating line.
Background technology
In recent years, along with making rapid progress of electronic technology, and the coming out one after another of high-tech electronic industry, make electronic product more humane, with better function constantly weed out the old and bring forth the new, and stride forward towards light, thin, short, little trend.Under this trend, because wiring board has advantages such as wiring is fine and closely woven, assembling is compact and functional, so wiring board just becomes a plurality of electronic components of carrying and makes one of main media that these electronic components are electrically connected to each other.
In the prior art; when making wiring board; usually can be after its outside line layer and patterned anti-soldering layer (solder mask layer) complete; again at electroplating surface one anti oxidation layer of the formed many connection pads of line layer (bonding pad); a nickel-gold layer (Ni/Au layer) for example; with the surface oxidation of these connection pads of preventing to be made of copper, and can increase the bond strength of these connection pads when welding.And, form anti oxidation layer in the mode of electroplating and have the fireballing advantage of formation.
In order to electroplate manufacture craft in the surface to these connection pads, these connection pads can be connected to a plating line (plating bar) respectively, and then are electrically connected mutually with the power supply of outside.And, after anti oxidation layer is finished in plating, excise plating line again or cut off the binding of plating line and these connection pads, so that these connection pads are mutually electrically insulated.Yet, limited configuration space (layoutspace) on the plating line meeting busy line plate, and the degree of freedom of the configuration of reduction line layer.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of buried circuit structure, it forms anti oxidation layer by the conductive layer that covers line layer comprehensively, so it has the bigger degree of freedom on configuration.
It is as described below that the present invention proposes a kind of manufacture method of buried circuit structure.At first, provide one to have the wiring board on road of sunkening cord in the road of sunkening cord in one first, the core layer and one second, and the road of sunkening cord in the road and second of sunkening cord in first is embedded in relative two surfaces of core layer in respectively.Then, form at least one conductive channel that runs through wiring board and one first conductive layer and one second conductive layer that is electrically connected conductive channel, first conductive layer covers and is electrically connected the road of sunkening cord in first, and second conductive layer covers and be electrically connected the road of sunkening cord in second.
Then, form one first resistance coating on first conductive layer, the first resistance coating has at least one first opening to expose a first surface of first conductive layer.And, on second conductive layer, forming one second resistance coating, the second resistance coating has at least one second opening to expose a second surface of second conductive layer.Afterwards, on first surface, form one first anti oxidation layer, and on second surface, form one second anti oxidation layer.
Then, remove the first resistance coating, second resistance coating, first conductive layer and second conductive layer, to appear the road of sunkening cord in sunken cord in first road and second.Then, form one first welding resisting layer covering the road of sunkening cord in first, and first welding resisting layer has at least one the 3rd opening, the 3rd opening exposes first anti oxidation layer.Afterwards, form one second welding resisting layer covering the road of sunkening cord in second, and second welding resisting layer has at least one the 4th opening, the 4th opening exposes second anti oxidation layer.
In one embodiment of this invention, before forming the first resistance coating, more comprise thinning first conductive layer and second conductive layer.
In one embodiment of this invention; before thinning first conductive layer and second conductive layer; the part that is positioned on the conductive channel that more is included in first conductive layer and second conductive layer forms one first protective layer and one second protective layer respectively; and after thinning first conductive layer and second conductive layer, remove first protective layer and second protective layer.
In one embodiment of this invention, the method that forms first anti oxidation layer and second anti oxidation layer comprises galvanoplastic or wireless plating technology.
In one embodiment of this invention, wireless plating technology comprises chemical deposition or physical deposition method.
In one embodiment of this invention, the material of first anti oxidation layer and second anti oxidation layer is nickel and gold.
In one embodiment of this invention, the method that removes first conductive layer and second conductive layer comprises etching.
It is as described below that the present invention proposes a kind of manufacture method of buried circuit structure.At first, provide a wiring board with sunken cord at least one road and a core layer, and in sunken cord and be embedded in a surface of core layer in the road.Then, form run through core layer and in sunken cord an at least one conductive channel on road and a conductive layer that is electrically connected conductive channel, the road of sunkening cord in conductive layer covers and is electrically connected.Then, form a resistance coating on conductive layer, resistance coating exposes a surface of conductive layer.Afterwards, on first surface, form an anti oxidation layer.Then, the conductive layer that removes resistance coating and do not covered by first anti oxidation layer is with the road of sunkening cord in appearing.Then, form a welding resisting layer with the road of sunkening cord in covering, and welding resisting layer exposes anti oxidation layer.
In one embodiment of this invention, before forming resistance coating, more comprise the thinning conductive layer.
In one embodiment of this invention, before the thinning conductive layer, the part that is positioned on the conductive channel that more is included in conductive layer forms a protective layer respectively, and after the thinning conductive layer, removes protective layer.
In one embodiment of this invention, the material of anti oxidation layer comprises nickel and gold.
In one embodiment of this invention, the method that removes conductive layer comprises etching.
The present invention proposes a kind of buried circuit structure and comprises sunken cord in the core layer, one first road, one first conductive channel, one first conductive layer, one first anti oxidation layer and one first welding resisting layer.Sunken cord in first and be embedded in a surface of core layer in the road.First conductive channel runs through one first connection pad on the road of sunkening cord in core layer and first.First conductive layer covers first connection pad and first conductive channel.First anti oxidation layer is formed on first conductive layer.First welding resisting layer covers the road of sunkening cord in first, and exposes first anti oxidation layer.
In one embodiment of this invention, the material of first anti oxidation layer comprises nickel and gold.
In one embodiment of this invention, buried circuit structure more comprises the road of sunkening cord in one second, one second conductive channel, one second conductive layer, one second anti oxidation layer and one second welding resisting layer.Sunken cord in second and be embedded in another surface of core layer in the road.Second conductive channel runs through one second connection pad on the road of sunkening cord in core layer and second.Second conductive layer covers second connection pad and second conductive channel.Second anti oxidation layer is formed on second conductive layer.Second welding resisting layer covers the road of sunkening cord in second, and exposes second anti oxidation layer.
In one embodiment of this invention, the material of second anti oxidation layer comprises nickel and gold.
In sum, because the present invention forms anti oxidation layer by conductive layer, therefore do not need in line layer, to form the existing plating line.Therefore, the present invention has the bigger degree of freedom on configuration, and configurable in the circuit board more holding wire (being the circuit of electroless coating line).
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing, be described in detail below.
Description of drawings
Figure 1A～Fig. 1 F is the manufacture craft cutaway view of the buried circuit structure of one embodiment of the invention;
Fig. 2 A～Fig. 2 D is the manufacture craft cutaway view of the buried circuit structure of another embodiment of the present invention.
The main element symbol description
110: wiring board
The road of sunkening cord in 112: the first
114: core layer
114a: upper surface
114b: lower surface
The road of sunkening cord in 116: the second
120: the first conductive layers
122: first surface
130: the second conductive layers
132: second surface
140: the first resistance coating
150: the second resistance coating
160: the first anti oxidation layers
170: the second anti oxidation layers
180: the first welding resisting layers
190: the second welding resisting layers
200: buried circuit structure
210: the first protective layers
220: the second protective layers
C: conductive channel
OP1: first opening
OP2: second opening
OP3: the 3rd opening
OP4: the 4th opening
P1: first connection pad
P2: second connection pad
Embodiment
Figure 1A～Fig. 1 F is the manufacture craft cutaway view of the buried circuit structure of one embodiment of the invention.Fig. 2 A～Fig. 2 D is the manufacture craft cutaway view of the buried circuit structure of another embodiment of the present invention.
At first, please refer to Figure 1A, a wiring board 110 is provided.Wiring board 110 for example is a buried circuit board, and buried circuit board can be individual layer or double-deck buried circuit board, and present embodiment is to be that example explains with double-deck buried circuit board, but is not in order to limit the present invention.
Then, please refer to Figure 1B, form two conductive channel C that run through wiring board 110 and one first conductive layer 120 and one second conductive layer 130 that is electrically connected conductive channel C, these conductive channels C runs through the first connection pad P1 and the second connection pad P2.Particularly, first conductive layer 120 is disposed on the upper surface 114a and covers the road 112 of sunkening cord in first, and the road 112 of sunkening cord in first conductive layer 120 and first is electrically connected.Second conductive layer 130 is disposed on the lower surface 114b and covers the road 116 of sunkening cord in second, and the road 116 of sunkening cord in second conductive layer 130 and second is electrically connected.It should be noted that the present invention does not limit the quantity of conductive channel C, for instance, the quantity of conductive channel C can be one or more.Because wiring board 110 has smooth upper surface 114a and lower surface 114b, when therefore first conductive layer 120 and second conductive layer 130 are formed at upper surface 114a and lower surface 114b with plating mode, also can have smooth surface, excessive and cause the electric conducting material can't uniform deposition or plating leakage with the concave-convex surface of avoiding the existing line plate.In addition, first conductive layer 120 forms when the plated conductive channel C with second conductive layer 130, need separately not make or increase the step of manufacture craft, so the manufacture craft of wiring board can be simplified further.
Then, please refer to Fig. 1 C, in the present embodiment, thinning first conductive layer 120 and second conductive layer 130, and the method for thinning comprises etching are so that remaining 1～6 micron of the thickness of first conductive layer 120 and second conductive layer 130.Then, please refer to Fig. 1 D, on first conductive layer 120, form one first resistance coating 140, and the first resistance coating 140 has one first opening OP1 to expose a first surface 122 of first conductive layer 120.And, on second conductive layer 130, form one second resistance coating, 150, the second resistance coating 150 and have one second opening OP2 to expose a second surface 132 of second conductive layer 130.Specifically, the first opening OP1 exposes the part on the first connection pad P1 of being positioned at of first conductive layer 120, and the second opening OP2 exposes the part on the second connection pad P2 of being positioned at of second conductive layer 130.
Afterwards, please referring again to Fig. 1 D, form one first anti oxidation layer 160 on first surface 122, and form one second anti oxidation layer 170 on second surface 132, wherein the material of first anti oxidation layer 160 and second anti oxidation layer 170 for example is nickel and gold.In the present embodiment, the method that forms first anti oxidation layer 160 and second anti oxidation layer 170 for example is galvanoplastic, that is to say, present embodiment can be by applying the mode of curtage to first conductive layer 120 and second conductive layer 130, form first anti oxidation layer 160 and second anti oxidation layer 170 respectively on first surface 122 and second surface 132.
It should be noted that being compared to prior art needs elder generation's formation plating line in line layer to form anti oxidation layer with galvanoplastic, present embodiment is to form first and second anti oxidation layers 160,170 by first and second conductive layer 120,130.Thus, present embodiment forms the configuration that first and second anti oxidation layer 160,170 can not influence the road 112,116 of sunkening cord in first and second with galvanoplastic, the configuration space on also can busy line plate 110.Therefore, present embodiment has the bigger degree of freedom on configuration, and on wiring board 110 configurable more holding wire (being the circuit of electroless coating line).In addition, the method that forms first anti oxidation layer 160 and second anti oxidation layer 170 can also be a wireless plating technology, wireless plating technology can be chemical deposition or physical deposition method, wherein chemical deposition for example is chemical vapour deposition (CVD), and the physical deposition method can be physical vapour deposition (PVD) (for example sputtering method or vapour deposition method).
Then, please refer to Fig. 1 E, remove the first resistance coating 140, second resistance coating 150, first conductive layer 120 and second conductive layer 130, to appear the road 116 of sunkening cord in sunken cord in first road 112 and second.Specifically, present embodiment only removes first and second conductive layer 120,130 that is not covered by first and second anti oxidation layer 160,170, and keeps first and second conductive layer 120,130 that is covered by first and second anti oxidation layer 160,170.In addition, in the present embodiment, the method that removes first conductive layer 120 and second conductive layer 130 comprises etching, and the upper surface 114a and the lower surface 114b of wiring board 110 are smooth surface simultaneously, also help to clean chemical agents such as residual etching solution, photoresist, to improve the quality of product.
Then, please refer to Fig. 1 F, form one first welding resisting layer 180 and one second welding resisting layer 190 to cover the road 116 of sunkening cord in sunken cord in first road 112 and second respectively.First welding resisting layer 180 has one the 3rd opening OP3, and the 3rd opening OP3 exposes first anti oxidation layer 160.Second welding resisting layer 190 has one the 4th opening OP4, and the 4th opening OP4 exposes second anti oxidation layer 170.
In addition; please refer to Fig. 2 A; in other embodiments; before thinning first conductive layer 120 and second conductive layer 130, can be earlier form one first protective layer 210 and one second protective layer 220 respectively in the part that is positioned on the first connection pad P1 and the second connection pad P2 of first conductive layer 120 and second conductive layer 130.
Then, please refer to Fig. 2 B, thinning first conductive layer 120 and second conductive layer 130.Specifically; because first protective layer 210 and second protective layer 220 cover the part on the conductive channel C of being positioned at of first conductive layer 120 and second conductive layer 130 respectively, but so only thinning first conductive layer 120 and second conductive layer 130 not by the part of first protective layer 210 and 220 coverings of second protective layer.Thus, the part that is positioned on the first connection pad P1 and the second connection pad P2 of first conductive layer 120 and second conductive layer 130 is thicker.
Then, please refer to Fig. 2 C, remove first protective layer 210 and second protective layer 220.Afterwards, but the manufacture craft of hookup 1D～Fig. 1 F and obtain the buried circuit structure 200 of Fig. 2 D.It should be noted that, because the part that is positioned on the first connection pad P1 and the second connection pad P2 of first conductive layer 120 and second conductive layer 130 is thicker, therefore when the mode with plating forms first anti oxidation layer 160 and second anti oxidation layer 170 thereon, resistance is less and be difficult for plating leakage.
In sum, the present invention forms anti oxidation layer by conductive layer, does not therefore need to form in line layer the existing plating line.Thus, the present invention forms sunken cord in can the not influencing configuration on road of anti oxidation layer with galvanoplastic, the configuration space on also can the busy line plate.Therefore, the present invention has the bigger degree of freedom on configuration, and configurable more holding wire (being the circuit of electroless coating line) on the wiring board.In addition, the present invention also can form protective layer thickening the part on first connection pad and second connection pad of being positioned at of conductive layer before the thinning conductive layer, and then the resistance when forming anti oxidation layer after reducing and can avoid the situation generation of plating leakage.
Though disclosed the present invention in conjunction with above embodiment; yet it is not in order to limit the present invention; be familiar with this operator in the field under any; without departing from the spirit and scope of the present invention; can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (10)
1. the manufacture method of a buried circuit structure comprises:
One wiring board with the road of sunkening cord in the road of sunkening cord in one first, the core layer and one second is provided, and road and this road of sunkening cord in second are embedded in relative two surfaces of this core layer in respectively and this is sunken cord in first;
One first conductive layer and one second conductive layer that formation runs through at least one conductive channel of this wiring board and is electrically connected this conductive channel, this first conductive layer covers and is electrically connected this road of sunkening cord in first, and this second conductive layer covers and be electrically connected this road of sunkening cord in second;
Form one first resistance coating on this first conductive layer, this first resistance coating has at least one first opening to expose a first surface of this first conductive layer;
Form one second resistance coating on this second conductive layer, this second resistance coating has at least one second opening to expose a second surface of this second conductive layer;
On this first surface, form one first anti oxidation layer;
On this second surface, form one second anti oxidation layer;
Remove this first resistance coating, this second resistance coating, this first conductive layer and this second conductive layer, with appear sunken cord in this road and this second of sunkening cord in first road and
Form one first welding resisting layer covering this road of sunkening cord in first, and this first welding resisting layer has at least one the 3rd opening, the 3rd opening exposes this first anti oxidation layer;
Form one second welding resisting layer covering this road of sunkening cord in second, and this second welding resisting layer has at least one the 4th opening, the 4th opening exposes this second anti oxidation layer.
2. the manufacture method of buried circuit structure as claimed in claim 1 before forming this first resistance coating, also comprises this first conductive layer of thinning and this second conductive layer.
3. the manufacture method of buried circuit structure as claimed in claim 2; wherein before this first conductive layer of thinning and this second conductive layer; the part that is positioned on this conductive channel that also is included in this first conductive layer and this second conductive layer forms one first protective layer and one second protective layer respectively; and after this first conductive layer of thinning and this second conductive layer, remove this first protective layer and this second protective layer.
4. the manufacture method of buried circuit structure as claimed in claim 1, the method that wherein forms this first anti oxidation layer and second anti oxidation layer comprises galvanoplastic or wireless plating technology.
5. the manufacture method of buried circuit structure as claimed in claim 4, wherein wireless plating technology comprises chemical deposition or physical deposition method.
6. the manufacture method of a buried circuit structure comprises:
One wiring board with sunken cord at least one road and a core layer is provided, and should in sunken cord and be embedded in a surface of this core layer in the road;
Formation run through this core layer and should in sunken cord an at least one conductive channel on road and a conductive layer that is electrically connected this conductive channel, this conductive layer cover and be electrically connected should in the road of sunkening cord;
Form a resistance coating on this conductive layer, this resistance coating exposes a surface of this conductive layer;
On this first surface, form an anti oxidation layer;
This conductive layer that removes this resistance coating and do not covered by this first anti oxidation layer is to appear the road of sunkening cord in this; And
Form a welding resisting layer with cover should in the road of sunkening cord, and this welding resisting layer exposes this anti oxidation layer.
7. the manufacture method of buried circuit structure as claimed in claim 6 before forming this resistance coating, also comprises this conductive layer of thinning.
8. the manufacture method of buried circuit structure as claimed in claim 7, wherein before this conductive layer of thinning, the part that is positioned on this conductive channel that also is included in this conductive layer forms a protective layer respectively, and after this conductive layer of thinning, removes this protective layer.
9. buried circuit structure comprises:
Core layer;
The road of sunkening cord in first, in be embedded in a surface of this core layer;
First conductive channel runs through one first connection pad on the road of sunkening cord in this core layer and this first, and wherein this first conductive channel is arranged at this surperficial position of this core layer, is surrounded by this first connection pad and electrically contacts with this first connection pad;
First conductive layer covers this first connection pad and this first conductive channel;
First anti oxidation layer is formed on this first conductive layer; And
First welding resisting layer covers this road of sunkening cord in first, and exposes this first anti oxidation layer.
10. buried circuit structure as claimed in claim 9 also comprises:
The road of sunkening cord in second, in be embedded in another surface of this core layer;
Second conductive channel runs through one second connection pad on the road of sunkening cord in this core layer and this second;
Second conductive layer covers this second connection pad and this second conductive channel;
Second anti oxidation layer is formed on this this second conductive layer; And
Second welding resisting layer covers this road of sunkening cord in second, and exposes this second anti oxidation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101337341A CN101636044B (en) | 2008-07-25 | 2008-07-25 | Embedded type circuit structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101337341A CN101636044B (en) | 2008-07-25 | 2008-07-25 | Embedded type circuit structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101636044A CN101636044A (en) | 2010-01-27 |
| CN101636044B true CN101636044B (en) | 2011-07-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101337341A Expired - Fee Related CN101636044B (en) | 2008-07-25 | 2008-07-25 | Embedded type circuit structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101636044B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI482541B (en) * | 2013-12-10 | 2015-04-21 | Subtron Technology Co Ltd | Circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1177901A (en) * | 1996-09-06 | 1998-04-01 | 松下电器产业株式会社 | Method for mfg. of printed wiring base plate and printed wiring plate |
| CN101127310A (en) * | 2006-08-18 | 2008-02-20 | 日月光半导体制造股份有限公司 | Making method for circuit board |
| CN101145552A (en) * | 2006-09-12 | 2008-03-19 | 日月光半导体制造股份有限公司 | Integrated circuit package substrate and making method |
-
2008
- 2008-07-25 CN CN2008101337341A patent/CN101636044B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1177901A (en) * | 1996-09-06 | 1998-04-01 | 松下电器产业株式会社 | Method for mfg. of printed wiring base plate and printed wiring plate |
| CN101127310A (en) * | 2006-08-18 | 2008-02-20 | 日月光半导体制造股份有限公司 | Making method for circuit board |
| CN101145552A (en) * | 2006-09-12 | 2008-03-19 | 日月光半导体制造股份有限公司 | Integrated circuit package substrate and making method |
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|---|---|
| CN101636044A (en) | 2010-01-27 |
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