The processing method that a kind of extrafine electronic wire is connected with connector
Technical field
The present invention relates to a kind of processing method, especially relate to the processing method that a kind of electronics line is connected with connector.
Background technology
Extrafine electronic wire comprises insulator layer mostly and is coated on the cored wire conductor in the insulator layer.Wherein, insulator layer prevents the generation of electromagnetic interference when connecting signal mainly as cored wire conductor.Be the together moulding of whole piece axis when this kind wire rod is made in factory, thereby must carry out line end stripping processing and be connected with bonder terminal to expose the internal core wire conductor.
The processing method that existing extrafine electronic wire is connected with bonder terminal comprises the steps:
A. after cutting out the length of required extrafine electronic wire wire rod, adopt cutter directly at relevant position the extrafine electronic line segment to be cut, wire stripping goes out terminal riveting segment and earth plate adapter section;
B. with this cut, the extrafine electronic line terminals riveting segment of wire stripping sends into another riveting mechanism and bonder terminal is riveted;
C. the terminal section of wire rod riveted is inserted in the preset glue shell;
D. earth plate is welded on the adapter section of the above-mentioned earth plate of cutting in advance;
E. winding displacement pastes neat.
Yet, adopt above-mentioned process between extrafine electronic wire and bonder terminal, to rivet, the precision that is connected between bonder terminal and the electronics line is not high, and the mechanical connection of circuit is unreliable, influences the transmission of the signal of telecommunication.
Summary of the invention
The technical problem that the present invention mainly solves provides the processing method that a kind of extrafine electronic wire is connected with connector, and it is high to use this method welding extrafine electronic wire to be connected precision with bonder terminal, quality better.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the processing method that provides a kind of extrafine electronic wire to be connected with connector comprises the steps:
A. by predetermined length the extrafine electronic winding displacement is cut;
B. cut off the insulator layer of the electronics line in the electronics winding displacement in the steps A with laser and move out, expose cored wire conductor;
The surface of the cored wire conductor that C. in step B, exposes cuts off cored wire conductor according to predetermined length after plating one deck tin again;
D. will cut off good cored wire conductor and bonder terminal with the above high temperature of 230 degree welds.
Wherein, in steps A, between the said electronics line by with the said bonder terminal that is connected between the spacing requirement be made into the winding displacement that is equidistant arrangement with tool or adhesive tape, spacing is 0.2mm~1.5mm.
Wherein, before step D carries out, on said and bonder terminal that extrafine electronic wire is connected, add tin strand or tin cream.
Wherein, in step D, the above high temperature of said 230 degree adopts the mode of PULSE HEATING, LASER HEATING or flatiron heating to obtain.
Wherein, in step D, the temperature range of said welding is 230 degree~250 degree.
Wherein, in step B, said insulator layer is tetrafluoroethene-perfluoroalkyl ethylene oxy copolymer p FA, ethene-four oxygen ethene ETFE, polyvinylchloride, crosslinked polyethylene XLPE or polythene PE.
Wherein, in step B, said laser is CO
2Laser.
Wherein, in step B, the said cored wire conductor that exposes is zinc-plated alloy copper wire, tinned copper wire, silver-plated alloy copper wire or silver-gilt copper wire.
Wherein, the external diameter of said cored wire conductor is less than 0.4mm.
The invention has the beneficial effects as follows: be different between existing extrafine electronic wire and the bonder terminal and adopt the riveted joint mode to be connected the not high situation of precision; The present invention carries out the insulator layer of extrafine electronic wire after laser cuts off cored wire conductor and bonder terminal to be carried out high-temperature soldering; Laser cuts off the precision height, quality is guaranteed; Welding then guarantees the steadiness that extrafine electronic wire is connected with the bonder terminal circuit, thereby guarantees the stable of signal of telecommunication transmission.
Description of drawings
Fig. 1 is the flow chart of the processing method that is connected with connector of extrafine electronic wire of the present invention.
Embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
Extrafine electronic wire comprises the cored wire conductor that insulator layer and insulated body layer coat.The technological method for processing of electronics line of the present invention and connector welding in turn includes the following steps:
(1). according to the spacing of the connector that will connect require extrafine electronic wire to be made into the winding displacement that is equidistant arrangement with tool or adhesive tape, spacing is 0.2mm~1.5mm;
(2). be cut into the desired length of product to the extrafine electronic winding displacement in the step (1);
(3). use CO
2Laser cuts off the insulator layer of electronics line in the step (2);
(4). move out the insulator layer that cuts off in the step (3) with the machine of moving, expose cored wire conductor;
(5). again cored wire conductor is cut into the needed length of welding by preset length after the surface of the cored wire conductor that exposes in the step (4) plated one deck tin;
(6). with add tin strand or tin cream on the terminal of the connector that will be connected;
(7). the cored wire conductor of the extrafine electronic wire that is spacing arrangement that the mode that adopts PULSE HEATING, LASER HEATING or flatiron heating will have been cut off with the high temperature more than 230 degree and the bonder terminal that has added tin strand or tin cream weld.The optimum temperature range of said welding is 230 degree~250 degree.
In the present embodiment, said insulator layer is tetrafluoroethene-perfluoroalkyl ethylene oxy copolymer p FA, ethene-four oxygen ethene ETFE, polyvinylchloride, crosslinked polyethylene XLPE or polythene PE; Said cored wire conductor is zinc-plated alloy copper wire, tinned copper wire, silver-plated alloy copper wire or silver-gilt copper wire.The external diameter of said electronics line is less than 0.8mm, and the external diameter of the cored wire conductor of said electronics line is less than 0.4mm.
Being different between existing extrafine electronic wire and the bonder terminal adopts the riveted joint mode to be connected the not high situation of precision; The present invention carries out the insulator layer of extrafine electronic wire after laser cuts off the terminal of cored wire conductor and connector to be carried out high-temperature soldering; Precision is high, quality is guaranteed; Guarantee the steadiness that extrafine electronic wire is connected with the bonder terminal circuit, thereby guaranteed the stable of signal of telecommunication transmission.
In sum; Terminal with cored wire conductor and connector the processing method that extrafine electronic wire of the present invention is connected with connector is cut off the insulator layer of extrafine electronic wire with laser after carries out high-temperature soldering; Laser cuts off the precision height, quality is guaranteed; It is firm that high-temperature soldering has guaranteed that extrafine electronic wire is connected with the bonder terminal circuit, thereby guarantee the stable of signal of telecommunication transmission.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.