CN101620415B - Control method of photoetching equipment in semiconductor process and device - Google Patents
Control method of photoetching equipment in semiconductor process and device Download PDFInfo
- Publication number
- CN101620415B CN101620415B CN2009100903712A CN200910090371A CN101620415B CN 101620415 B CN101620415 B CN 101620415B CN 2009100903712 A CN2009100903712 A CN 2009100903712A CN 200910090371 A CN200910090371 A CN 200910090371A CN 101620415 B CN101620415 B CN 101620415B
- Authority
- CN
- China
- Prior art keywords
- photoetching
- information
- photoetching equipment
- equipment
- work step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention discloses a control method of photoetching equipment in semiconductor process and a device. The main technical scheme comprises the following steps: confirming corresponding description information of a semiconductor product to be photoetched; acquiring control information of the photoetching equipment corresponding to the description information according to the preset correspondence of the description information and control information of the photoetching equipment; confirming information of the photoetching equipment executing the photoetching of all phases according to the control information of the photoetching equipment, and using a photoetching equipment corresponding to the information of the photoetching equipment to execute the photoetching to all phases of the semiconductor product. The technical scheme improves the accuracy of photoetching to the semiconductor product, thereby ensuring the performance of products.
Description
Technical field
The present invention relates to semiconductor process flow control field, relate in particular to the control method and the device of photoetching equipment in the semiconductor technology.
Background technology
In semiconductor process flow, the treatment scheme of Photo district (being the photoetching district) promptly utilizes the light source etched circuit that the Photo district of semiconductor product is carried out photoetching treatment, and particularly, this processing procedure realizes by photoetching equipment.
The general disposal route of tradition MES (Manufacturing Execution System, manufacturing execution system) is to adopt Capability treatment mechanism (compatible processing mechanism), and the ultimate principle of this treatment mechanism is as follows:
When system sets up technological process, determine to carry out the photoetching equipment of each work step photoetching in each key stratum, all photoetching equipments of determining are bundled into a unit, this unit is a Capability group (compatible group), then each implementation in work step is followed as the attribute of work step in this unit, promptly when carrying out each work step photoetching, from the Capability group, choose the photoetching equipment that is used to carry out this work step of appointment.That is to say, set up in case system finishes flow process, so each work step can with photoetching equipment fix.
In the Capability treatment mechanism, the photoetching equipment of each work step binding is in order to be applicable to the production of various handicraft products, generally all have the ubiquity characteristics, promptly be fit to of the requirement of most of product to special parameter, and the accuracy of photoetching is very big to the performance impact of semiconductor product, and semiconductor product requires very high to the susceptibility of photoetching equipment, for example, some semiconductor product requires high to the degree of accuracy of special parameter, if adopt the photoetching equipment of appointment in the Capability treatment mechanism to carry out photoetching, obviously can't tackle the singularity requirement of product; And,, when being used to carry out the photoetching equipment of setting the work step photoetching and breaking down, can't select other photoetching equipment to carry out photoetching flexibly according to the Capability treatment mechanism.
In sum, the general disposal route that adopts MES is a Capability treatment mechanism when producing the demanding semiconductor product of photoetching equipment susceptibility, lack dirigibility, and the accuracy of photoetching is low, thereby influences the performance of product.
Summary of the invention
In view of this, the embodiment of the invention provides the control method and the device of photoetching equipment in a kind of semiconductor technology, adopts this technical scheme, has improved the accuracy of semiconductor product being carried out photoetching, thereby has guaranteed properties of product.
The embodiment of the invention is achieved through the following technical solutions:
The embodiment of the invention provides the control method of photoetching equipment in a kind of semiconductor technology, comprising:
Determine to treat the descriptor of photoetching semiconductor product correspondence;
According to the default descriptor and the corresponding relation of photoetching equipment control information, obtain the photoetching equipment control information corresponding with described descriptor;
According to the definite photoetching equipment information of carrying out each work step photoetching of described photoetching equipment control information, and the utilization photoetching equipment corresponding with described photoetching equipment information carried out the photoetching to described each work step of semiconductor product.
The embodiment of the invention also provides the control device of photoetching equipment in a kind of semiconductor technology, comprising:
The control information acquiring unit is used to determine to treat the descriptor of photoetching semiconductor product correspondence, and according to the default descriptor and the corresponding relation of photoetching equipment control information, obtains the photoetching equipment control information corresponding with described descriptor;
The photoetching equipment determining unit, the photoetching equipment control information that is used for obtaining according to described control information acquiring unit determines to carry out the photoetching equipment information of each work step photoetching;
Lithographic cell is used to utilize the corresponding photoetching equipment of determining with described photoetching equipment determining unit of photoetching equipment information to carry out the photoetching of described each work step of semiconductor product.
By above technical scheme, in the embodiment of the invention, at first according to treating that the descriptor of photoetching semiconductor product correspondence obtains the photoetching equipment control information, and according to the definite photoetching equipment information of carrying out each work step photoetching of the photoetching equipment control information of obtaining, and utilize the photoetching equipment corresponding to carry out the photoetching of each work step of semiconductor product with the photoetching equipment information of determining.According to this technical scheme, before semiconductor product is carried out photoetching, can select corresponding photoetching equipment according to the specifying information of semiconductor product, and utilize selected photoetching equipment to carry out photoetching, thereby the photoetching equipment of the feasible execution photoetching of choosing can be configured according to the concrete parameter request of semiconductor product, considered that semiconductor product is to the requirement of photoetching equipment susceptibility and to the specific (special) requirements of setup parameter, and then improved accuracy to the semiconductor product photoetching, make properties of product be guaranteed, improved the acceptance rate of product.
Other features and advantages of the present invention will be set forth in the following description, and, partly from instructions, become apparent, perhaps understand by implementing the present invention.
Description of drawings
The process flow diagram of Fig. 1 in the embodiment of the invention photoetching equipment being controlled;
Fig. 2 is for determining the process flow diagram of photoetching equipment according to control information in the embodiment of the invention;
Fig. 3 is for being provided with the interface synoptic diagram of photoetching equipment information according to product coding in the embodiment of the invention;
Fig. 4 is for being provided with the interface synoptic diagram of photoetching equipment information according to product batches in the embodiment of the invention;
Fig. 5 is the position view of the tool option in the interface is set in the embodiment of the invention;
Fig. 6 is the menu synoptic diagram of the photoetching equipment information that output is determined in the embodiment of the invention;
Fig. 7 is a menu synoptic diagram of creating the photoetching equipment task in the embodiment of the invention;
Fig. 8 is the menu synoptic diagram of the available photoetching equipment that filters out in the embodiment of the invention;
The device synoptic diagram of Fig. 9 in the embodiment of the invention photoetching equipment being controlled.
Embodiment
In order to improve the accuracy of semiconductor product being carried out photoetching, the embodiment of the invention provides the control method and the device of photoetching equipment in a kind of semiconductor technology, below in conjunction with Figure of description the preferred embodiments of the present invention are described, be to be understood that, preferred embodiment described herein only is used for description and interpretation the present invention, and is not used in qualification the present invention.
In the photoetching equipment control method that the embodiment of the invention provides, at first photoetching equipment is set at the specific object for the treatment of the photoetching semiconductor product, the relevant information of the photoetching equipment that needs when promptly being provided with to semiconductor product execution photoetching process, and preserve this control information.Particularly, when preserving control information, need to indicate the semiconductor product of this control information correspondence, for simplicity, can identify the photoetching equipment control information of preserving with the descriptor of semiconductor product, also promptly set up the descriptor of product and the corresponding relation of photoetching equipment control information, with easy-to-look-up.Wherein, the descriptor of semiconductor product can be the production code member of semiconductor product, also can be production batch.
Referring to Fig. 1, after semiconductor product entered the photoetching flow process in the semiconductor process flow, the control procedure to photoetching equipment comprised the steps:
In this step, the semi-conductive descriptor of obtaining of photoetching for the treatment of can be the production code member or the product batches of this semiconductor product, also can comprise the production code member and the product batches of this semiconductor product simultaneously.
The descriptor that step 102, basis are preset and the corresponding relation of photoetching equipment control information obtain the photoetching equipment control information corresponding with the descriptor of this semiconductor product.
In this step, by signing in to the database that is used to store the photoetching equipment control information, search the photoetching equipment control information corresponding according to the descriptor of obtaining with this descriptor, particularly, if descriptor comprises the production code member and the product batches of product simultaneously, then need further to determine a production code member or a higher item of information of product batches medium priority, and obtain the item of information corresponding photoetching equipment control information higher with the priority of determining, as the information of determining photoetching equipment.
The photoetching equipment control information that step 103, basis find, definite photoetching equipment information of carrying out each work step photoetching.
The photoetching equipment corresponding with photoetching equipment information that step 104, utilization are determined carried out the photoetching of each work step of semiconductor product.
Referring to Fig. 2, in the above-mentioned steps 103,, determine to carry out the photoetching equipment information of each work step photoetching according to the photoetching equipment control information that finds, comprise the steps:
The setting option that step 202, basis are determined determines to carry out the photoetching equipment of each work step photoetching.
Step 203, judge whether the photoetching equipment of each work step appointment is available, if judge and be, then execution in step 204, otherwise execution in step 205.
Step 204, determine that this photoetching equipment is for carrying out the photoetching equipment of photoetching.
Step 205, determine the work step of this unavailable photoetching equipment correspondence, and the photoetching equipment information that is used to carry out this work step photoetching of system default is defined as carrying out the photoetching equipment information of this work step photoetching.
In the above-mentioned steps 201, the setting option that the photoetching equipment control information comprises has overall situation control option, key stratum information;
Wherein, overall situation control option is selected, represents that then employed photoetching equipment of follow-up work step and the employed photoetching equipment of first work step are same photoetching equipment, to increase the stability of product; Key stratum information comprises the work step that it need be carried out, and alternatively, has specified the photoetching equipment of each work step photoetching correspondence.
Particularly, in step 202,, be specially according to the definite photoetching equipment of carrying out each work step photoetching of the setting option of determining:
Determine the state of overall situation control option in this photoetching equipment control information;
If this overall situation control option is selected, then determine key stratum information appointment in this photoetching equipment control information be used to carry out the photoetching equipment information of the first work step photoetching for carrying out the photoetching equipment information of each work step photoetching;
If this overall situation control option is not selected, then determine the photoetching equipment information that is used to carry out each work step photoetching of key stratum information appointment in this photoetching equipment control information respectively.
Be not used to carry out the photoetching equipment information of setting the work step photoetching if key stratum information is specified, then the photoetching equipment information that is used to carry out the photoetching of described setting work step of system default be defined as carrying out the photoetching equipment information of described setting work step photoetching.
Further, this photoetching equipment control information also comprises the tool option, and this tool option is used to represent whether corresponding photoetching equipment is available.
In order to realize above purpose, (for example can adopt Web service software, Weblogic) be nested in manufacturing system, each work step choosing flexibly and controlling when semiconductor product being carried out the photoetching of Photo district to photoetching equipment with realization, the above technical scheme mainly comprise be provided with the part and the flow process control section, wherein, part is set is the process that semiconductor product to be produced is provided with board, the flow process control section is that semiconductor product to be produced is determined photoetching equipment and the process of carrying out photoetching according to the information that the part setting is set promptly.
Describe respectively part and flow process control section are set below in conjunction with concrete technology:
One, part is set:
At first, the user logins the MES system, enters the photoetching equipment setup menu.
Particularly, in the MES function menu, added the inlet of photoetching equipment setup menu when program is provided with, after the user signs in to the MES system, can enter photoetching equipment setup menu interface by the MES function menu.
After entering photoetching equipment setup menu interface, can photoetching equipment information be set by following dual mode:
Mode one: the product coding (Part ID) by semiconductor product is provided with photoetching equipment information.
The setting sign indicating number (for example the first six sign indicating number) that can get Part ID carries out the photoetching equipment information setting, and in the specific embodiment, the interface is set can be as shown in Figure 3.According to interface shown in Figure 3 after accomplishing the setting up, preserve the corresponding relation of this product coding and photoetching equipment control information.
Mode two, the product batches (Lot ID) by semiconductor product are provided with photoetching equipment information.
The setting sign indicating number that can get Part ID carries out the photoetching equipment information setting, and in the specific embodiment, the interface is set can be as shown in Figure 4.According to interface shown in Figure 4 after accomplishing the setting up, preserve the corresponding relation of this product batches and photoetching equipment control information.
Fig. 3 and shown in Figure 4 what the interface was set mainly is that setting option comprises: the overall situation control option (Bind Flag), key stratum information (Critical Layer) and some function choosing-items (Tool Flag); Tool Flag is the check box behind the photoetching equipment that Critical Layer chooses, specifically as shown in Figure 5:
Wherein, specify the key stratum that comprises in the Critical Layer information, and alternatively, specified the photoetching equipment of each work step photoetching correspondence in each key stratum;
AddTool option: tabulate for the product of the product coding of Set For Current or product batches correspondence increases the photoetching equipment of Gong choosing;
AddKeyLayer button: increase Photo crux layer to the product desire control of the product coding of Set For Current or product batches correspondence;
Row deletion: delete change in this control information or do not need the Layer layer controlled;
Row deletion: delete photoetching equipment that change in this control information or unwanted;
OK ACK button: write down the last record of revising and send (sending the Email function temporarily hides) effects such as Email notifies;
The page more than is set has simple and direct-viewing operation, stablize flexible characteristic.Simultaneously it has strict logic, the characteristic of hiding such as complete, powerful, be that each is chosen and all relates to all crux work steps that concrete production code member or product batches are carried out in the photoetching district, and provide the complete voucher of transferring items conveniently to reach the purpose of control.
With the interface that is provided with shown in Figure 5 is example, promptly carries out the photoetching equipment setting with product coding, and it is as follows to choose logic substantially:
1, overall situation control option Bind Flag selected (being to make hook among Fig. 5 before the Bind Flag):
If chosen Bind Flag option, represent that then all batches under this semiconductor product current work step and follow-up work step in flow process Photo layer all will use the identical photoetching equipment of employed photoetching equipment when entering first work step of Photo layer with product, for example, the photoetching equipment model that product enters first work step use of Photo layer is " APP01 ", then needing only this photoetching equipment can use, follow-up each work step of Photo layer all uses this photoetching equipment to produce, and do not consider the photoetching equipment control information of Critical Layer and Tool Flag correspondence.Whether wherein, it is available to determine corresponding photoetching equipment whether to make hook according to Tool Flag, if make hook, illustrates that then this photoetching equipment can use, otherwise unavailable.
If determine that the state of employed photoetching equipment was unavailable when product entered first work step of Photo layer, the photoetching equipment of then determining system default is for carrying out the board of current work step, particularly, select in the photoetching equipment tabulation that the photoetching equipment of system default can be provided with from the Capability treatment mechanism.
If being product, current work step enters first work step of Photo layer, then be defined as the photoetching equipment of first work step setting of Photo layer according to the setting of Critical Layer, and it is whether available according to definite this photoetching equipment of being provided with of Tool Flag, if unavailable, the photoetching equipment of then determining system default is for carrying out the board of current work step.
2, overall situation control option Bind Flag not selected (being not make hook before the Bind Flag among Fig. 5):
According to Fig. 5, if not beating, do not collude Bind Flag, then according to definite photoetching equipment that is provided with of Critical Layer and corresponding Tool Flag.Particularly, if Flag in Critical Layer beats and chooses under the state of getting Tool Flag and also beat and collude, represent that then this work step specified photoetching equipment and this photoetching equipment to use.If Tool Flag does not make hook, represent that this board is not in freelist.
According to above logic, as if the series arrangement with Bind Flag, Critical Layer and Tool Flag, selected (promptly making hook) with " 1 " expression, not selected (promptly not making hook) has following eight kinds of situations with " 0 " expression according to selection result:
111、110、101、100、011、010、001、000。
The Exposure website has the board record of transferring items in the history of batch transferring items, and carry out the logical relation of A1 correspondence according to transfer items the employed photoetching equipment of first work step that record determines the Photo layer of this board in match_table board tabulation (promptly being stored in the table as a result of the setting in the database) time, otherwise carry out the logical relation of A2 correspondence.
The logical relation of A1 correspondence:
111,110 expressions: return lot_step_history first exposure website board (returning the employed photoetching equipment of first work step of the historical record lithography layer of batch transferring items);
101 expressions: return returns the board of choosing;
011 expression: return the board of seed selection, irrelevant with the lot_step_history website;
100,010,001,000 expression: board is not chosen.
Wherein, the photoetching equipment of choosing is the employed photoetching equipment of first work step of Photo layer.
More than all (being that photoetching equipment is under the upstate) under the situation of photoetching equipment uptime, according to control information, appear among the lot_location and (promptly appear in batch up-to-date information), and in lot_location, show respective description.
The logical relation of A2 correspondence:
111 expressions: be the board first into exposure website of choosing (source that promptly shows the board of choosing, the prompting operating personnel looks for correlation engineering teacher to confirm when being necessary);
101,011 expression: return the board of choosing;
110,100,010,001,000 expression: board is not chosen.
Wherein, the photoetching equipment of choosing is the employed photoetching equipment of first work step of Photo layer.
Finally determine two states according to control information:
State one: selected photoetching equipment, and this photoetching equipment can be used;
As 111,101,011 among the above A1; Among the A2 111,101,011.
State two: selected photoetching equipment but this photoetching equipment is unavailable, perhaps non-selected photoetching equipment.
As 110,100,010,001,000 among the above A1; Among the A2 110,100,010,001,000.
If finally be defined as state one, then utilize this photoetching equipment to carry out photoetching; If finally be defined as state two, then utilize the photoetching equipment of system default to carry out photoetching, select in the photoetching equipment tabulation that the photoetching equipment of this system default can be provided with from the Capability treatment mechanism.
The above process of determining the photoetching equipment of the current photoetching of execution according to control information, be that product coding (Part ID) with product is that example describes, the process of the photoetching equipment of the current photoetching of execution is determined in corresponding photoetching equipment control information according to the product batches (Lot ID) of product, with the above principle basically identical, discuss no longer in detail herein.
After finishing being provided with of above photoetching equipment, control information need be saved in the specified database, during preservation, can also can not enumerate one by one herein in the mode of storage list in the mode of index.For example, can sign in to specified database with PL/SQL (the visual user's operation tool of oracle database) instrument, and utilize PL/SQL code establishing storage list " Photo_matching ", this storage list need list field title and each field corresponding data types.
Two, flow process control section:
According to above information after accomplishing the setting up, in the generative process of product, the photoetching equipment control information of obtaining photoetching equipment according to the descriptor of product, and determine the photoetching equipment information of carrying out photoetching according to above logic according to control information.Particularly:
1, when definite result for having selected photoetching equipment but this photoetching equipment is unavailable, perhaps non-selected photoetching equipment is then exported corresponding prompt information, with the prompting operating personnel, this information is:
For the current photoetching product for the treatment of has been specified photoetching equipment, but the photoetching equipment of this appointment is unavailable, for example, photoetching equipment have solid barrier the maintenance or just on the jump;
Perhaps, do not specified photoetching equipment for the current photoetching product for the treatment of.
If information is in any one in above, then allow to use capability mechanism, by dialog box prompting operating personnel as shown in Figure 6, and the indication staff selects to carry out the photoetching equipment of current photoetching from the predefined available board tabulation of capability mechanism.
2, when definite result for having selected photoetching equipment, and this photoetching equipment can use, then with the photoetching equipment output of choosing, with alert.
Further, can by WIP Tracking Job Prepare By Tool inlet transfer items by board, be operation the entry mode of transferring items is provided, create the Job (work) of board and production code member or the product batches that stack meets control, as shown in Figure 7.
Further, transfer items by work step, demonstrate current step and next all batch of work step and filter available board, specifically as shown in Figure 8 with the above-mentioned voucher that is set to by WIP Tracking Job Prepare By Step inlet.
Corresponding with above-mentioned flow process, the embodiment of the invention also provides the control device of photoetching equipment in a kind of semiconductor technology, and as shown in Figure 9, this device comprises: control information acquiring unit 901, photoetching equipment determining unit 902 and lithographic cell 903;
Function to each unit and module in the control device shown in Figure 9 is described in detail below:
Control information acquiring unit 901 is used to determine to treat the descriptor of photoetching semiconductor product correspondence, and according to the default descriptor and the corresponding relation of photoetching equipment control information, obtains the photoetching equipment control information corresponding with described descriptor;
Photoetching equipment determining unit 902, the photoetching equipment control information that is used for obtaining according to described control information acquiring unit determines to carry out the photoetching equipment information of each work step photoetching;
Lithographic cell 903 is used to utilize the corresponding photoetching equipment of determining with described photoetching equipment determining unit of photoetching equipment information to carry out the photoetching of described each work step of semiconductor product.
Among the embodiment, above-mentioned control information acquiring unit 901 specifically is used for:
When the described descriptor for the treatment of photoetching semiconductor product correspondence comprises a plurality of item of information, determine the highest item of information of described a plurality of item of information medium priorities, and, obtain the item of information corresponding photoetching equipment control information the highest with described priority according to the default descriptor and the corresponding relation of photoetching equipment control information.
Among the embodiment, photoetching equipment determining unit 902 specifically is used for:
Determine the state of overall situation control option in the described photoetching equipment control information;
If described overall situation control option is selected, then determine key stratum information appointment in the described photoetching equipment control information be used to carry out the photoetching equipment information of the first work step photoetching for carrying out the photoetching equipment information of each work step photoetching;
If described overall situation control option is not selected, then determine the photoetching equipment information that is used to carry out each work step photoetching of key stratum information appointment in the described photoetching equipment control information respectively.
Among the embodiment, photoetching equipment determining unit 902 also is used for:
When described key stratum information is not specified when being used to carry out the photoetching equipment information of setting the work step photoetching, the photoetching equipment information that is used to carry out the photoetching of described setting work step of system default is defined as carrying out the photoetching equipment information of described setting work step photoetching.
Among the embodiment, photoetching equipment determining unit 902 also is used for:
After determining to carry out the photoetching equipment information of each work step photoetching, determine whether described photoetching equipment is available;
When in determining described photoetching equipment, having unavailable photoetching equipment, determine the work step of described unavailable photoetching equipment correspondence, and the photoetching equipment information that is used to carry out described work step photoetching of system default is defined as carrying out the photoetching equipment information of described work step photoetching.
By above technical scheme, in the embodiment of the invention, at first according to treating that the descriptor of photoetching semiconductor product correspondence obtains the photoetching equipment control information, and according to the definite photoetching equipment information of carrying out each work step photoetching of the photoetching equipment control information of obtaining, and utilize the photoetching equipment corresponding to carry out the photoetching of each work step of semiconductor product with the photoetching equipment information of determining.According to this technical scheme, before semiconductor product is carried out photoetching, can select corresponding photoetching equipment according to the specifying information of semiconductor product, and utilize selected photoetching equipment to carry out photoetching, thereby the photoetching equipment of the feasible execution photoetching of choosing can be configured according to the concrete parameter request of semiconductor product, considered that semiconductor product is to the requirement of photoetching equipment susceptibility and to the specific (special) requirements of setup parameter, and then improved accuracy to the semiconductor product photoetching, make properties of product be guaranteed, improved the acceptance rate of product.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. the control method of photoetching equipment in the semiconductor technology is characterized in that, comprising:
Determine to treat the descriptor of photoetching semiconductor product correspondence;
According to the default descriptor and the corresponding relation of photoetching equipment control information, obtain the photoetching equipment control information corresponding with described descriptor;
According to the definite photoetching equipment information of carrying out each work step photoetching of described photoetching equipment control information, and the utilization photoetching equipment corresponding with described photoetching equipment information carried out the photoetching to described each work step of semiconductor product.
2. control method as claimed in claim 1 is characterized in that, the described descriptor of photoetching semiconductor product correspondence for the treatment of comprises at least one item of information;
If described descriptor comprises a plurality of items of information, the descriptor that described basis is default and the corresponding relation of photoetching equipment control information obtain the photoetching equipment control information corresponding with described descriptor, are specially:
Determine the highest item of information of described a plurality of item of information medium priorities;
According to the default descriptor and the corresponding relation of photoetching equipment control information, obtain the item of information corresponding photoetching equipment control information the highest with described priority.
3. control method as claimed in claim 1 or 2 is characterized in that, according to the definite photoetching equipment information of carrying out each work step photoetching of described photoetching equipment control information, comprising:
Determine the state of overall situation control option in the described photoetching equipment control information;
If described overall situation control option is selected, then determine key stratum information appointment in the described photoetching equipment control information be used to carry out the photoetching equipment information of the first work step photoetching for carrying out the photoetching equipment information of each work step photoetching;
If described overall situation control option is not selected, then determine the photoetching equipment information that is used to carry out each work step photoetching of key stratum information appointment in the described photoetching equipment control information respectively.
4. control method as claimed in claim 3, it is characterized in that, be not used to carry out the photoetching equipment information of setting the work step photoetching if described key stratum information is specified, then the photoetching equipment information that is used to carry out the photoetching of described setting work step of system default be defined as carrying out the photoetching equipment information of described setting work step photoetching.
5. control method as claimed in claim 3 is characterized in that, after determining to carry out the photoetching equipment information of each work step photoetching, also comprises:
Determine whether described photoetching equipment is available;
When in determining described photoetching equipment, having unavailable photoetching equipment, determine the work step of described unavailable photoetching equipment correspondence, and the photoetching equipment information of work step photoetching that is used to carry out described unavailable photoetching equipment correspondence of system default is defined as carrying out the photoetching equipment information of the work step photoetching of described unavailable photoetching equipment correspondence.
6. the control device of photoetching equipment in the semiconductor technology is characterized in that, comprising:
The control information acquiring unit is used to determine to treat the descriptor of photoetching semiconductor product correspondence, and according to the default descriptor and the corresponding relation of photoetching equipment control information, obtains the photoetching equipment control information corresponding with described descriptor;
The photoetching equipment determining unit, the photoetching equipment control information that is used for obtaining according to described control information acquiring unit determines to carry out the photoetching equipment information of each work step photoetching;
Lithographic cell is used to utilize the corresponding photoetching equipment of determining with described photoetching equipment determining unit of photoetching equipment information to carry out the photoetching of described each work step of semiconductor product.
7. control device as claimed in claim 6 is characterized in that, described control information acquiring unit specifically is used for:
When the described descriptor for the treatment of photoetching semiconductor product correspondence comprises a plurality of item of information, determine the highest item of information of described a plurality of item of information medium priorities, and, obtain the item of information corresponding photoetching equipment control information the highest with described priority according to the default descriptor and the corresponding relation of photoetching equipment control information.
8. as claim 6 or 7 described control device, it is characterized in that described photoetching equipment determining unit specifically is used for:
Determine the state of overall situation control option in the described photoetching equipment control information;
If described overall situation control option is selected, then determine key stratum information appointment in the described photoetching equipment control information be used to carry out the photoetching equipment information of the first work step photoetching for carrying out the photoetching equipment information of each work step photoetching;
If described overall situation control option is not selected, then determine the photoetching equipment information that is used to carry out each work step photoetching of key stratum information appointment in the described photoetching equipment control information respectively.
9. control device as claimed in claim 8 is characterized in that, described photoetching equipment determining unit also is used for:
When described key stratum information is not specified when being used to carry out the photoetching equipment information of setting the work step photoetching, the photoetching equipment information that is used to carry out the photoetching of described setting work step of system default is defined as carrying out the photoetching equipment information of described setting work step photoetching.
10. control device as claimed in claim 8 is characterized in that, described photoetching equipment determining unit also is used for:
After determining to carry out the photoetching equipment information of each work step photoetching, determine whether described photoetching equipment is available;
When in determining described photoetching equipment, having unavailable photoetching equipment, determine the work step of described unavailable photoetching equipment correspondence, and the photoetching equipment information of work step photoetching that is used to carry out described unavailable photoetching equipment correspondence of system default is defined as carrying out the photoetching equipment information of the work step photoetching of described unavailable photoetching equipment correspondence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100903712A CN101620415B (en) | 2009-08-06 | 2009-08-06 | Control method of photoetching equipment in semiconductor process and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100903712A CN101620415B (en) | 2009-08-06 | 2009-08-06 | Control method of photoetching equipment in semiconductor process and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101620415A CN101620415A (en) | 2010-01-06 |
| CN101620415B true CN101620415B (en) | 2011-08-31 |
Family
ID=41513690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100903712A Active CN101620415B (en) | 2009-08-06 | 2009-08-06 | Control method of photoetching equipment in semiconductor process and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101620415B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102540966A (en) * | 2010-12-21 | 2012-07-04 | 北大方正集团有限公司 | Control device and method for photoetching machines |
| CN106033211B (en) * | 2015-03-11 | 2018-09-28 | 北大方正集团有限公司 | A kind of method and device of control gluing board rubber head cleaning |
| CN107967556A (en) * | 2017-11-16 | 2018-04-27 | 上海华力微电子有限公司 | A kind of control method of technological process and partly lead equipment |
| CN107992995A (en) * | 2017-11-20 | 2018-05-04 | 上海华力微电子有限公司 | A kind of method and system for creating technological process title |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1737808A (en) * | 2004-08-20 | 2006-02-22 | 国际商业机器公司 | Method and system for intelligent automated reticle management |
| CN1959569A (en) * | 2006-05-17 | 2007-05-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cluster controller for etching devices |
-
2009
- 2009-08-06 CN CN2009100903712A patent/CN101620415B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1737808A (en) * | 2004-08-20 | 2006-02-22 | 国际商业机器公司 | Method and system for intelligent automated reticle management |
| CN1959569A (en) * | 2006-05-17 | 2007-05-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cluster controller for etching devices |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101620415A (en) | 2010-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104021043B (en) | The interruption re-access method and system of batch application program | |
| EP3256915B1 (en) | Extending a programmable logic controller with apps | |
| US7996570B1 (en) | Usage of keyboard driver in extensible firmware interface for adding new hot keys at firmware level | |
| CN101620415B (en) | Control method of photoetching equipment in semiconductor process and device | |
| CN101135891A (en) | Graphical programming language object editing and reporting tool | |
| CN106681820B (en) | Extensible big data computing method based on message combination | |
| CN105930138B (en) | A kind of message treatment method and device | |
| CN102096603A (en) | Task decomposition control method in MapReduce system and scheduling node equipment | |
| CN103310315A (en) | Automatic process approval tool based on workflows | |
| EP3114538B1 (en) | Optimized method for sorting alarms | |
| CN105074592A (en) | Sequence program component creation program and sequence program component creation device | |
| CN102541661A (en) | Wait on address synchronization interface | |
| CN112631751A (en) | Task scheduling method and device, computer equipment and storage medium | |
| CN105279269A (en) | SQL generating method and system for supporting table free association | |
| JP2015115015A (en) | Process management device, process management program, and process management system | |
| CN102540966A (en) | Control device and method for photoetching machines | |
| CN108829415A (en) | Model loading method, server and computer readable storage medium | |
| CN108154297A (en) | A kind of factory management system and information processing method | |
| CA2502553A1 (en) | Generation/management apparatus of production processing structure in factory production management system | |
| US10768902B2 (en) | Actor model programming | |
| JP5091915B2 (en) | Plant information control system and linking program | |
| CN115328664B (en) | Message consumption method, device, equipment and medium | |
| CN110532311A (en) | A kind of distributed data deriving method and system based on queue | |
| CN116307547A (en) | Linkage method, device and equipment for emergency handling of overseas oil and gas pipeline accidents | |
| CN108269323A (en) | A kind of method and device for recording production |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220718 Address after: 518116 founder Microelectronics Industrial Park, No. 5, Baolong seventh Road, Baolong Industrial City, Longgang District, Shenzhen, Guangdong Province Patentee after: SHENZHEN FOUNDER MICROELECTRONICS Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: SHENZHEN FOUNDER MICROELECTRONICS Co.,Ltd. |