CN101612604A

CN101612604A - Silicon wafer wastes pulverizing device

Info

Publication number: CN101612604A
Application number: CN200810130726A
Authority: CN
Inventors: 邓昌沪; 赵宽
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-06-26
Filing date: 2008-06-26
Publication date: 2009-12-30

Abstract

The invention discloses a kind of silicon wafer wastes pulverizing device, by water circulating tank 1, water outlet tube connector 2, rotational flow separation jar 3, flanged pipe 4, injection rotational flow generator 5, charging horn mouth 6, give barrel 7, buncher 8, head tank 9, valves 10, draw and inhale horn mouth 11, water pump 12, exit of pump takes over 13, wash-out valve 14, pressure injection water pipe 15, water-circulating pipe 16 is formed, taking over 5-2 when water pump pump water from injection rotational flow generator 5 pressure injection water radially injects, during from perforation 5-1 injection outflow, the axial centre charging arrow K end of injection rotational flow generator 5 promptly forms negative pressure, silicon wafer wastes promptly sucks with negative pressure, suck moment generation bump in negative pressure, process at bump reaches crushing effect, reach crushing effect and need not adopt other abrasive media because crushing process is the effect of hitting certainly of silicon wafer wastes, therefore avoided other material to peel off the pollution of generation, reached and not only finish the purpose of pulverizing but also keep silicon chip material purity the silicon chip material because of stressed effect.

Description

Silicon wafer wastes pulverizing device

Technical field

The present invention relates to a kind of powder technology, particularly silicon wafer wastes pulverizing device.

Technical background

The popularization of solar energy can not only reduce the generating coal-fired oil that consumes, but also the discharging that has alleviated polluter, solar electrical energy generation mainly is subjected to one-time investment big for a long time, the solar-energy photo-voltaic cell price is high to be restricted, solar cell battery price height depends primarily on solar cell fabrication process, particularly will refine the HIGH-PURITY SILICON silicon single crystal rod and produce useless sheet at slicing process, be to cause the most direct factor of cost increase, because the price of HIGH-PURITY SILICON silicon single crystal rod is up to 4000 yuan/kilogram, and bad sheet of slicing processes is a general phenomenon very, and how utilizing these waste materials is to reduce effective way of solar cell manufacturing cost.

The invention task

The present invention will provide a kind of a large amount of useless silicon chip that utilizes the manufacture of solar cells process to produce, and these useless silicon chips are prepared into the fine powder body, and regeneration is produced solar cell or made other silicon materials device, makes expensive silicon materials waste product obtain utilizing.

Realize that technical scheme of the present invention is, centre bore in the ring-like wall of negative pressure that useless silicon chip is produced by high-velocity flow, the moment that enters centre bore in the ring-like wall of negative pressure at a high speed produces bump mutually, bump is that silicon chip is from hitting, because silicon chip belongs to the bigger character of fragility, usually under smaller pressure action embrittlement takes place, promptly chipping because of the stressed silicon chip of multiple spot under high-speed impact, cracked effect repeatedly reaches the purpose of pulverizing the most at last, in order to realize that producing moment continuously produces bump mutually, the water under high pressure that is pumped by water pump enters an injection rotational flow generator, the injection rotational flow generator is one and entad has radially by ring that angle has anglec of rotation perforation simultaneously, one end of perforation is ring-like chamber, the other end is a centre bore in the ring-like wall, when water under high pressure sprays when entering in the ring-like wall centre bore from ring-like chamber through perforation, just formed negative pressure with the injection direction end opposite, the size of negative pressure and the outlet pressure of water pump are proportional, the big more negative pressure of pressure is just big more, the big more silicon chip of negative pressure is just big more by the speed of centre bore in this ring-like wall, the big more silicon chip of negative pressure is big more by the speed of centre bore in this ring-like wall, pulverizing speed is just fast more, centre bore blocks in the ring-like wall of negative pressure, need restriction to enter the silicon chip flow of centre bore in the ring-like wall of negative pressure, the silicon chip flow that control enters centre bore in the ring-like wall of negative pressure is to adopt a barrel of giving by the buncher driving, have a discharging opening that only accounts for radius for the barrel port of export, drive when rotating at buncher to barrel, the opening that accounts for radius rotates to the center and just can spill with material in the doffing, spill material from this discharging opening and enter a charging horn mouth, bell-mouthed outlet of this charging and injection rotational flow generator join, under suction function, promptly be inhaled into the negative pressure gap and form bump, for will clash into cracked silicon chip and moisture from, have silicon chip particle water jet from the outflow of injection rotational flow generator and enter the rotational flow separation jar by flanged pipe, at rotational flow separation jar water to the upper reaches, the silicon chip particle is to deposit, when the deposition some, open the valve of rotational flow separation pot bottom, the valve and the head tank of rotational flow separation pot bottom join, rotational flow separation jar deposition silicon chip particle promptly enters head tank, because the exit of pump of water pump is taken over the port of export and is communicated with the suction horn mouth that draws of pressure injection water pipe in head tank, when the water-aspirator pressure water flow jet enters the pressure injection water pipe, the suction horn mouth that draws of pressure injection water pipe promptly forms negative pressure, draw and inhale horn mouth and promptly form negative pressure and will be stored in that the silicon chip particle sucks in the head tank, the silicon chip particle that sucks enters the ring-like chamber of injection rotational flow generator with pressure flow and sprays to centre bore by perforation, contain the silicon chip particle in the water under high pressure that sprays, these silicon chip particles enter silicon chip with the kinetic-potential bump of acceleration from the charging horn mouth, make silicon chip be subjected to more intensive granule bump, further improved crush efficiency, under the continuous operation of water pump, silicon chip is chipping at the injection rotational flow generator, separate at the rotational flow separation jar, enter head tank by valve, inhale the ring-like chamber that horn mouth enters the injection rotational flow generator through drawing again, enter centre bore in the ring-like wall in the perforation injection, centre bore forms to clash into and reaches the pulverizing effect in ring-like wall.

Described rotational flow separation jar is that flanged pipe is connected rotational flow separation jar partial center radially, when High-Pressure Water enters, the radially tank skin of rotational flow separation jar plays guide functions, High-Pressure Water is at rotational flow separation jar swirling motion, the current of swirling motion are with quality heavy substance precipitation separation, water upwards flows because of injecting promptly continuously, is connected the water circulating tank through one with it then and enters the water pump circulation again.

The described suction horn mouth that draws is the loudspeaker that are connected pressure injection pipe inlet end, and the exit of pump that communicates with it is taken over and to be left the certain interval shell type and be installed in and draw the suction horn mouth, goes into when high-pressure water jet, when entering the pressure injection water pipe, draws and inhales horn mouth and will form negative pressure.

Silicon wafer wastes pulverizing device positive effect of the present invention is, made full use of the useless sheet that the manufacture of solar cells process produces, make full use of these useless sheets and help reducing the solar cell manufacturing cost, can promote to reduce the solar cell price, positive role is played in the application of promoting solar energy.

Description of drawings

Fig. 1 is a silicon wafer wastes pulverizing device system diagram of the present invention;

Fig. 2 is the vertical view of Fig. 1;

Fig. 3 is to the barrel schematic diagram;

Fig. 4 is the left view of Fig. 3;

Fig. 5 is an injection rotational flow generator front view;

Fig. 6 is an injection rotational flow generator ring radial cross-section;

Fig. 7 is Fig. 5 A-A cutaway view;

Among Fig. 1, water circulating tank 1, water outlet tube connector 2, rotational flow separation jar 3, flanged pipe 4, injection rotational flow generator 5, charging horn mouth 6, give barrel 7, buncher 8, head tank 9, valves 10, draw inhale that horn mouth 11, water pump 12, exit of pump take over 13, wash-out valve 14, pressure injection water pipe 15, water-circulating pipe 16;

Among Fig. 4, discharging opening 7-1;

Among Fig. 5, perforation 5-1, pressure injection water are taken over 5-2, ring cavity 5-3, water inlet arrow f, charging arrow K;

Specific embodiment

With reference to Fig. 1, silicon wafer wastes is placed on in the barrel 7, during buncher 8 rotations, give barrel 7 with buncher 8 rotations, when the discharging opening 7-1 that gives barrel 7 goes to a center with upper/lower positions, silicon wafer wastes spills from discharging opening 7-1, load can be determined by buncher 8 speeds, the silicon wafer wastes that spills falls into charging horn mouth 6, because what the water that pumps of water pump 12 did not stop takes over the 5-2 injection from pressure injection water, water inlet arrow f with reference to Fig. 5 passes through entad jet of perforation 5-1 through ring cavity 5-3, inject press water continuously, press water is when continuous injection, because perforation 5-1 is ring injection rotational flow generator 5 radial distribution, with reference to Fig. 5, perforation 5-1 entad has angle, entad angle Selection 30 degree are to 45 degree, preferred 35 degree, with reference to Fig. 6, injection rotational flow generator 5 perforation 5-1 have the anglec of rotation, the anglec of rotation is selected 7.5 to 15 degree, preferred 11 degree, the axial centre charging arrow K end of injection rotational flow generator 5 promptly forms negative pressure, enter silicon wafer wastes from charging horn mouth 6 and under the effect of injection negative pressure, promptly enter flanged pipe 4, at the leading portion that enters flanged pipe 4 because the acceleration effect injected to the center of perforation 5-1, silicon wafer wastes is clashed into, pressure, make silicon wafer wastes cracked, cracked silicon wafer wastes enters rotational flow separation jar 3 with current, with reference to Fig. 2, to be installed in rotational flow separation jar 3 radially off-centre with rotational flow separation jar 3 connecting pipe flanged pipes 4, when entering rotational flow separation jar 3, pressure flow forms eddy flow in the tank skin guide functions of rotational flow separation jar 3, the material that the hydrodynamics effect of eddy flow is big with quality is pressed close to tank skin, the little material of quality entad moves, because the silicon chip quality is greater than water, tank skin is always pressed close in silicon chip by institute, water always flows to a jar center, the tank deck center of rotational flow separation jar 3 is equipped with water outlet tube connector 2, the water that is continuously pumped into always flows out continuously from water outlet tube connector 2, the water that flows out flows into the water circulating tank 1 that links with tube connector 2 continuously, and the water inlet of water pump 12 connects the outlet water-circulating pipe 16 of water circulating tank 1, and water pump 12 is continuously from water circulating tank 1 pump up water, water pump 12 is taken over 13 from the water of water circulating tank 1 suction from exit of pump and is flowed into pressure injection water pipe 15, discharge connection 13 is provided with to draw with pressure injection water pipe 15 junctions inhales horn mouth 11, when the current pressure injection of discharge connection 13 enters pressure injection water pipe 15, draws and inhales horn mouth 11 formation negative pressure, the fine powder that is stored in head tank 9 silicon wafer wastes is inhaled horn mouth 11 formation vacuum flow entrance pressure water injection pipes 15 with drawing, enter the ring cavity 5-3 of injection rotational flow generator 5 then,, entad contain the grain in small, broken bits of silicon wafer wastes in the current of jet through perforation 5-1 jet entad, the fine silt of these silicon wafer wastes and flanged pipe 4 enter silicon wafer wastes and converge, when converging, owing to contain the fine silt of silicon wafer wastes in the current from jet entad, the speed of fine silt that contains silicon wafer wastes in these current from jet entad is greater than the speed that enters silicon wafer wastes from flanged pipe 4, pulverize effect at this fine silt bump silicon wafer wastes that produces silicon wafer wastes, flow into rotational flow separation jar 3 once more after pulverizing effect, water upwards flows to after rotational flow separation, enters water circulating tank 1 once more through water outlet tube connector 2, separate the silicon wafer wastes fine silt that is deposited on rotational flow separation jar 3 bottoms and promptly enter head tank 9 through opening the valve 10 that is connected between rotational flow separation jar 3 and the head tank 9, the silicon wafer wastes fine silt that enters head tank 9 enters from drawing suction horn mouth 11 once more with the water that water pump 12 pumps again, and the water that the silicon wafer wastes fine silt pumps along with water pump 12 sprays from perforation 5-1 once more through ring cavity 5-3 again and enters circulation so repeatedly, finally reach the purpose that is crushed to fine powder, do not adopt other material stressed because crushing process is the bump certainly of silicon wafer wastes, therefore avoided other material to peel off the pollution of generation, reach and not only finish the purpose of pulverizing but also keep silicon chip material purity the silicon chip material because of stressed effect to the silicon wafer wastes contact.

Claims

1, a kind of by water circulating tank 1, water outlet tube connector 2, rotational flow separation jar 3, flanged pipe 4, injection rotational flow generator 5, charging horn mouth 6, give barrel 7, buncher 8, head tank 9, valves 10, draw inhale that horn mouth 11, water pump 12, exit of pump take over 13, silicon wafer wastes pulverizing device that wash-out valve 14, pressure injection water pipe 15, water-circulating pipe 16 are formed is characterized in that: the pressure injection water of injection rotational flow generator 5 is taken over 5-2 and is connected with pressure injection water pipe 15, and the arrow K of injection rotational flow generator 5 holds and is connected with the outlet of charging horn mouth 6.

2, it is characterized in that by the described silicon wafer wastes pulverizing device of claim 1: injection rotational flow generator 5 rings radially have perforation 5-1, perforation 5-1 entad has angle, entad angle Selection 30 degree are to 45 degree, preferred 35 degree, perforation 5-1 has the anglec of rotation, the anglec of rotation is selected 7.5 to 15 degree, preferred 11 degree.