CN101609240A - Electrophoretic display thin film, electrophoretic display panel and manufacture method thereof - Google Patents

Electrophoretic display thin film, electrophoretic display panel and manufacture method thereof Download PDF

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Publication number
CN101609240A
CN101609240A CNA2009101514961A CN200910151496A CN101609240A CN 101609240 A CN101609240 A CN 101609240A CN A2009101514961 A CNA2009101514961 A CN A2009101514961A CN 200910151496 A CN200910151496 A CN 200910151496A CN 101609240 A CN101609240 A CN 101609240A
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electrophoretic display
thin film
cup structure
little cup
ditches
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CNA2009101514961A
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CN101609240B (en
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方玮嘉
朱俊鸿
胡至仁
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Prime View International Co Ltd
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AU Optronics Corp
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Abstract

The present invention discloses a kind of electrophoretic display thin film, it comprises that a conductive layer, is disposed at the dielectric layer on the conductive layer, a plurality of electrophoretic display medium and an encapsulant, wherein dielectric layer has a plurality of little cup structure and irrigation canals and ditches around little cup structure that are arrayed, and electrophoretic display medium only is disposed in little cup structure, and encapsulant only is disposed in the irrigation canals and ditches.

Description

Electrophoretic display thin film, electrophoretic display panel and manufacture method thereof
Technical field
The present invention relates to a kind of electrophoretic display thin film (electro-phoretic display film) and manufacture method thereof, and particularly relevant for a kind of electrophoretic display panel (electro-phoretic display panel) and manufacture method thereof.
Background technology
In recent years, flexible display, Electronic Paper and e-book are just flourish, employed display medium comprises that liquid crystal, electrophoretic display medium, electrochromism colour developing medium, electrolysis separate out display medium etc., and is wherein of greatest concern with the electrophoretic display device (EPD) with electrophoretic display medium again.Existing many known technologies propose solution at the volume production of electrophoretic display device (EPD), as Taiwan patent TWI 276903, Taiwan patent TWI 223729, Taiwan patent TWI 308231 etc.
Because the electrophoretic display medium in the electrophoretic display panel is comparatively responsive for water and oxygen, and water and oxygen damage electrophoretic display medium easily, therefore, by the produced electrophoretic display panel of technology that Taiwan patent TWI 276903, Taiwan patent TWI 223729, Taiwan patent TWI 308231 are proposed, need do further encapsulation usually.In the follow-up packaging technology of electrophoretic display panel, most likely use block water oxygen layer and the oxygen frame glue that blocks water that electrophoretic display panel is coated, to guarantee that electrophoretic display panel is difficult for being damaged by water and oxygen.
Fig. 1 is that known electrophoretic display panel is through the diagrammatic cross-section after encapsulating.Please refer to Fig. 1, known electrophoretic display panel 100 comprises an electrophoretic display thin film 110, a thin-film transistor array base-plate 120, oxygen layer 130 and oxygen frame glue 140 that blocks water that blocks water.Wherein, thin-film transistor array base-plate 120 comprises a thin film transistor (TFT) array (indicate) and is disposed on the substrate (indicating).Electrophoretic display thin film 110 comprises that one has dielectric layer 112, a conductive layer 114 and a plurality of electrophoretic display medium 116 that is arranged in little cup structure 112a of a plurality of little cup structure 112a.Electrophoretic display thin film 110 engages with thin-film transistor array base-plate 120, so that the electrophoretic display medium 116 among little cup structure 112a is between conductive layer 114 and thin-film transistor array base-plate 120.The oxygen layer 130 that blocks water is covered on the outside surface of conductive layer 114 (being upper surface or the surface that does not contact dielectric layer 112), and the oxygen frame glue 140 that blocks water is covered on the substrate portion fringe region of the sidewall of fringe region, electrophoretic display thin film 110 of the oxygen layer 130 that blocks water and thin-film transistor array base-plate 120.
Because the oxygen ability that blocks water of electrophoretic display thin film 110 itself is relatively poor, therefore known need reduce water and the oxygen infringement probability to electrophoretic display thin film 110 by block water the oxygen layer 130 and the oxygen frame glue 140 that blocks water.The block water oxygen layer 130 and the oxygen frame glue 140 that blocks water will cause the process complexity of known electrophoretic display panel 100 to improve, and the manufacturing cost of electrophoretic display panel 100 can't further be reduced.In addition, the block water making of the oxygen layer 130 and the oxygen frame glue 140 that blocks water can cause the integral thickness of electrophoretic display panel 100 to increase.
Summary of the invention
The invention provides a kind of electrophoretic display thin film and manufacture method thereof.
The invention provides a kind of electrophoretic display panel and manufacture method thereof.
The invention provides a kind of electrophoretic display thin film, it comprises that a conductive layer, is disposed at the dielectric layer on the conductive layer, a plurality of electrophoretic display medium and an encapsulant, wherein dielectric layer has a plurality of little cup structure (micro-cups) and irrigation canals and ditches around little cup structure (trench) that are arrayed, and electrophoretic display medium only is disposed in little cup structure, and encapsulant only is disposed in the irrigation canals and ditches.
The invention provides a kind of electrophoretic display panel, it comprises an active component array base board and aforesaid electrophoretic display thin film.Electrophoretic display thin film is disposed on the active component array base board, and wherein active component array base board has a plurality of pixel electrodes arranged into an array, and each electrophoretic display medium lays respectively between one of them pixel electrode and the conductive layer.
In an embodiment of the present invention, each little cup structure is a polygon cylinder space, cylindroid body space, or cylindrical space.
In an embodiment of the present invention, the degree of depth of each little cup structure greater than, less than or equal the thickness of electrophoretic display medium in fact.
In an embodiment of the present invention, aforesaid electrophoretic display medium does not directly contact with conductive layer.
In an embodiment of the present invention, each electrophoretic display medium comprises a dielectric solvent (dielectricsolvent) and a plurality of electrically charged particle (charge particles) that is doped in this dielectric solvent.
In an embodiment of the present invention, the degree of depth of aforesaid irrigation canals and ditches greater than, less than or equal the degree of depth of each little cup structure in fact.
In an embodiment of the present invention, the width of aforesaid irrigation canals and ditches is greater than the width of each little cup structure.
In an embodiment of the present invention, aforesaid irrigation canals and ditches are ring-like irrigation canals and ditches.
The invention provides a kind of manufacture method of electrophoretic display thin film.At first, provide a conductive layer, then on conductive layer, form a dielectric layer, and embossment (emboss) in addition, so that dielectric layer has a plurality of little cup structure (micro-cups) and irrigation canals and ditches around little cup structure (trench) that are arrayed.Afterwards, a plurality of electrophoretic display mediums of configuration in little cup structure, and in irrigation canals and ditches, dispose an encapsulant.
The invention provides a kind of manufacture method of electrophoretic display panel.At first, provide an active component array base board, wherein active component array base board has a plurality of pixel electrodes arranged into an array.Then, the manufacture method of the aforesaid electrophoretic display thin film of foundation produces an electrophoretic display thin film, and electrophoretic display thin film is disposed on the active component array base board, and wherein each electrophoretic display medium lays respectively between one of them pixel electrode and the conductive layer.
Based on above-mentioned, because the present invention produces little cup structure in dielectric layer and around the irrigation canals and ditches of little cup structure, therefore the present invention can reach the function of block water oxygen by the encapsulant that is arranged in the irrigation canals and ditches, and then promotes the reliability (reliability) of electrophoretic display thin film and electrophoretic display panel.
For allow above-mentioned purpose of the present invention, feature, and advantage can become apparent, below cooperate appended accompanying drawing, be described in detail below:
Description of drawings
Fig. 1 is that known electrophoretic display panel is through the diagrammatic cross-section after encapsulating;
Fig. 2 A, Fig. 3 A and Fig. 4 A are the manufacturing process sectional view of the electrophoretic display panel of one embodiment of the invention;
Fig. 2 B and Fig. 3 B are the manufacturing process vertical view of the electrophoretic display thin film of one embodiment of the invention;
Fig. 4 B is the enlarged drawing of a-quadrant among Fig. 4 A.
Wherein, Reference numeral
100: electrophoretic display panel 110: electrophoretic display thin film
112: dielectric layer 112a: little cup structure
114: conductive layer 116: electrophoretic display medium
120: thin film transistor (TFT) array 130: the oxygen layer blocks water
140: oxygen frame glue blocks water 200: electrophoretic display thin film
210: conductive layer 220: dielectric layer
220a: little cup structure 220b: irrigation canals and ditches
230: electrophoretic display medium 240: encapsulant
300: active component array base board 310: active member
320: pixel electrode A: zone
M: mould P1, P2: thrust
S: substrate
Embodiment
Fig. 2 A, Fig. 3 A and Fig. 4 A are the manufacturing process sectional view of the electrophoretic display panel of one embodiment of the invention, and Fig. 2 B and Fig. 3 B are the manufacturing process vertical view of the electrophoretic display thin film of one embodiment of the invention.At first, please refer to Fig. 2 A and Fig. 2 B, a conductive layer 210 and a dielectric layer 220 that engages with conductive layer 210 are provided.In the present embodiment, the material of conductive layer 210 for example is metal or other reflection characteristic favorable conductive materials, and the material of dielectric layer 220 for example is organic dielectric materials or the Inorganic Dielectric Material with good dielectric property.Then, in dielectric layer 220, form a plurality of little cup structure 220a and irrigation canals and ditches 220b around little cup structure 220a that are arrayed.In the present embodiment, little cup structure 220a and irrigation canals and ditches 220b make by modes such as embossment mode (embossing), photoengraving carving technologies.
From Fig. 2 A and Fig. 2 B as can be known, little cup structure 220a of present embodiment is the rectangular cylinder space, yet it must be the rectangular cylinder space that the present invention does not limit little cup structure 220a, little cup structure 220a can also be polygon cylinder space, cylindroid body space arbitrarily, or cylindrical space.In addition, the irrigation canals and ditches 220b of present embodiment can be ring-like irrigation canals and ditches.Shape, size and quantity that it should be noted that aforesaid ring-like irrigation canals and ditches can be changed according to the actual design demand, and the present invention does not limit especially.
Present embodiment can adopt samely makes little cup structure 220a and irrigation canals and ditches 220b to technology (as embossment mode, photoengraving carving technology) with interlock system in dielectric layer 220.In the embossment mode is example (shown in Fig. 2 A), at first, makes the rolling of mould M on dielectric layer 220, forms little cup structure 220a and irrigation canals and ditches 220b so that thrust P1, P2 on the mould M embed in the dielectric layer 220.In the present embodiment, the degree of depth of little cup structure 220a equals the degree of depth of irrigation canals and ditches 220b in fact, but the width of little cup structure 220a is then less than the width of irrigation canals and ditches 220b.Yet the present invention can adjust the width and the degree of depth of little cup structure 220a and irrigation canals and ditches 220b according to actual demand.In detail, by adjusting the thrust P1 on the mould M, the height of P2, the degree of depth that can make irrigation canals and ditches 220b greater than or less than the degree of depth of little cup structure 220a.In addition,, little cup structure 220a width and shape can be adjusted easily, and, irrigation canals and ditches 220b width and shape can be adjusted easily by adjusting width and the shape of the thrust P2 on the mould M by adjusting width and the shape of the thrust P1 on the mould M.
Please refer to Fig. 3 A and Fig. 3 B, after forming little cup structure 220a and irrigation canals and ditches 220b, then in little cup structure 220a, form a plurality of electrophoretic display mediums 230, and in irrigation canals and ditches 220b, form an encapsulant 240, to finish the making of electrophoretic display thin film 200.In the present embodiment, electrophoretic display medium 230 comprises a dielectric solvent (dielectric solvent) and a plurality of electrically charged particle (charge particles) that is doped in the dielectric solvent.
From Fig. 3 A and Fig. 3 B as can be known, the electrophoretic display thin film 200 of present embodiment comprises that a conductive layer 210, is disposed at dielectric layer 220, a plurality of electrophoretic display medium 230 and the encapsulant 240 on the conductive layer 210, wherein dielectric layer 220 has a plurality of little cup structure 220a and irrigation canals and ditches 220b around little cup structure 220a that are arrayed, and electrophoretic display medium 230 only is disposed in little cup structure 220a, and encapsulant 240 only is disposed in the irrigation canals and ditches 220b.
In the present embodiment, the thickness of electrophoretic display medium 230 equals the degree of depth of little cup structure 220a in fact.Yet in other embodiments of the invention, the thickness of electrophoretic display medium 230 can also be the degree of depth that is greater than or less than little cup structure 220a.In addition, it should be noted that because the encapsulant 240 that the degree of depth of the degree of depth of little cup structure 220a and irrigation canals and ditches 220b all less than the thickness of dielectric layer 220, therefore is arranged in the electrophoretic display medium of little cup structure 220a and is arranged in irrigation canals and ditches 220b can directly not contact with conductive layer 210.
Please refer to Fig. 3 B, 240 of sealed materials around the zone be generally defined as the viewing area, and electrophoretic display medium 230 all be positioned at 240 of encapsulants around the viewing area, encapsulant 240 then the position in the non-display area beyond the viewing area.Wherein, each viewing area can be regarded as each display unit (being display panel), and perhaps, aforesaid a plurality of viewing areas can be regarded as a display unit (being display panel).Moreover, illustrate as Fig. 3 A and Fig. 3 B, when each viewing area or a plurality of viewing area are taken as a display unit, be arranged in dielectric layer 220 width of 240 of the encapsulants of adjacent different display units, preferably, greater than dielectric layer 220 width between two in each display unit little cup structure 220a, can help follow-up cutting and the good oxygen ability that blocks water in fact.Yet, in other embodiment, if it is good and under the enough high situations of precision of cutting technique to be arranged in the oxygen ability that blocks water of encapsulant 240 of adjacent different display units, dielectric layer 220 width that are arranged in 240 of the encapsulants of adjacent different display units can be equal to or less than dielectric layer 220 width between two little cup structure 220a of each display unit in fact.
The electrophoretic display thin film 200 of present embodiment has just had encapsulant 240 when completing, and encapsulant 240 possesses the good oxygen ability that blocks water.When the encapsulant 240 in being formed at irrigation canals and ditches 220b did not have enough oxygen abilities that blocks water, then the width of irrigation canals and ditches 220b just was greater than the width of little cup structure 220a.Therefore, the encapsulant 240 in the electrophoretic display thin film 200 can be simplified the complexity of follow-up packaging technology, so encapsulant 240 has very big benefiting for the lifting of yield rate, the reduction of cost, the reduction of thickness.
Fig. 4 B is the enlarged drawing of a-quadrant among Fig. 4 A.Please provide an active component array base board 300 simultaneously with reference to Fig. 4 A and Fig. 4 B, wherein active component array base board 300 has a plurality of pixel electrodes arranged into an array 320.In detail, active component array base board 300 is made of substrate S, multi-strip scanning line (not illustrating), many data lines (not illustrating), a plurality of active member 310 and a plurality of pixel electrode 320.Then, make aforesaid electrophoretic display thin film 200 engage, so that each electrophoretic display medium 230 lays respectively between one of them pixel electrode 320 and the conductive layer 210 with active component array base board 300.The electrophoretic display medium 230 that is positioned at each little cup structure 220a can be by pixel electrode 320 drivings of correspondence to show specific image.In addition, if the material of pixel electrode 320 is a reflecting material, during as metal or the reflexive material of tool, then the material of conductive layer 210 can be transparent conductive material, as indium tin oxide (ITO), indium-zinc oxide (IZO), aluminium tin-oxide (ATO), aluminium zinc oxide (AZO), indium germanium zinc oxide (IGZO) or other suitable material, or above-mentioned combination.If the material of pixel electrode 320 is a transparent conductive material, its material is as implied above, and then the material of conductive layer 210 is a reflecting material, as metal or the reflexive material of tool.If the subregion material of pixel electrode 320 is a reflecting material and another part zone is transparent conductive material, then conductive layer 210 can use above-mentioned transparent conductive material and reflecting material.If the subregion corresponding to the conductive layer 210 of each little cup structure 220a is a transparent conductive material, and the pairing pixel electrode 320 of each little cup structure 220a is when also being transparent conductive material, and electrophoretic display panel just can be double face display panel.
Please refer to Fig. 4 A, because present embodiment is produced little cup structure 220a simultaneously in dielectric layer 220 and around the irrigation canals and ditches 220b of little cup structure 220a, therefore present embodiment can reach the function of block water oxygen by the encapsulant 240 that is arranged among the irrigation canals and ditches 220b, and then promotes the reliability (reliability) of electrophoretic display panel.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.

Claims (17)

1. an electrophoretic display thin film is characterized in that, comprising:
One conductive layer;
One dielectric layer is disposed on this conductive layer, and wherein this dielectric layer has a plurality of little cup structure and irrigation canals and ditches around described little cup structure that are arrayed;
A plurality of electrophoretic display mediums only are disposed in described little cup structure; And
One encapsulant only is disposed in these irrigation canals and ditches.
2. electrophoretic display thin film according to claim 1 is characterized in that, respectively this little cup structure is a polygon cylinder space, cylindroid body space, or cylindrical space.
3. electrophoretic display thin film according to claim 1 is characterized in that respectively the degree of depth of this little cup structure is greater than the thickness of this electrophoretic display medium.
4. electrophoretic display thin film according to claim 1 is characterized in that respectively the degree of depth of this little cup structure is less than the thickness of this electrophoretic display medium.
5. electrophoretic display thin film according to claim 1 is characterized in that respectively the degree of depth of this little cup structure equals the thickness of this electrophoretic display medium in fact.
6. electrophoretic display thin film according to claim 1 is characterized in that, this electrophoretic display medium does not directly contact with this conductive layer.
7. electrophoretic display thin film according to claim 1 is characterized in that, respectively this electrophoretic display medium comprises a dielectric solvent and a plurality of electrically charged particle that is doped in this dielectric solvent.
8. electrophoretic display thin film according to claim 1 is characterized in that, the degree of depth of these irrigation canals and ditches is greater than the degree of depth of this little cup structure respectively.
9. electrophoretic display thin film according to claim 1 is characterized in that, the degree of depth of these irrigation canals and ditches is less than the degree of depth of this little cup structure respectively.
10. electrophoretic display thin film according to claim 1 is characterized in that, the degree of depth of these irrigation canals and ditches equals the respectively degree of depth of this little cup structure in fact.
11. electrophoretic display thin film according to claim 1 is characterized in that, the width of these irrigation canals and ditches is greater than the width of this little cup structure respectively.
12. electrophoretic display thin film according to claim 1 is characterized in that, these irrigation canals and ditches comprise ring-like irrigation canals and ditches.
13. an electrophoretic display panel is characterized in that, comprising:
One active component array base board; And
Electrophoretic display thin film as claimed in claim 1, be disposed on this active component array base board, wherein this active component array base board has a plurality of pixel electrodes arranged into an array, and respectively this electrophoretic display medium lays respectively between one of them pixel electrode and this conductive layer.
14. the manufacture method of an electrophoretic display thin film is characterized in that, comprising:
One conductive layer is provided;
On this conductive layer, form a dielectric layer, and embossment in addition, so that this dielectric layer has a plurality of little cup structure and irrigation canals and ditches around described little cup structure that are arrayed;
The a plurality of electrophoretic display mediums of configuration in described little cup structure; And
Configuration one encapsulant in these irrigation canals and ditches.
15. the manufacture method of electrophoretic display thin film according to claim 14 is characterized in that, this electrophoretic display medium does not directly contact with this conductive layer.
16. the manufacture method of electrophoretic display thin film according to claim 14 is characterized in that, the width of these irrigation canals and ditches is greater than the width of this little cup structure respectively.
17. the manufacture method of an electrophoretic display panel is characterized in that, comprising:
One active component array base board is provided, and wherein this active component array base board has a plurality of pixel electrodes arranged into an array; And
Manufacture method according to the described electrophoretic display thin film of claim 14 produces an electrophoretic display thin film, and this electrophoretic display thin film is disposed on this active component array base board, wherein respectively this electrophoretic display medium lays respectively between one of them pixel electrode and this conductive layer.
CN2009101514961A 2009-07-23 2009-07-23 Electrophoretic display thin film, electrophoretic display panel and manufacture method thereof Active CN101609240B (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101852964A (en) * 2010-06-01 2010-10-06 友达光电股份有限公司 Display device
CN102338962A (en) * 2010-07-14 2012-02-01 乐金显示有限公司 Electrophoretic display device and method of fabrication thereof
US8310748B2 (en) 2010-05-21 2012-11-13 Au Optronics Corp. Display device
CN104698718A (en) * 2015-03-13 2015-06-10 深圳市迪佩科技有限公司 Flexible electronic paper display screen and display device and manufacturing method
CN114114778A (en) * 2021-12-27 2022-03-01 赣州市秋田微电子有限公司 Electrophoresis display module and manufacturing method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8310748B2 (en) 2010-05-21 2012-11-13 Au Optronics Corp. Display device
CN101852964A (en) * 2010-06-01 2010-10-06 友达光电股份有限公司 Display device
CN101852964B (en) * 2010-06-01 2013-01-02 友达光电股份有限公司 Display device
CN102338962A (en) * 2010-07-14 2012-02-01 乐金显示有限公司 Electrophoretic display device and method of fabrication thereof
US8681415B2 (en) 2010-07-14 2014-03-25 Lg Display Co., Ltd. Electrophoretic display device and fabrication method thereof
CN104698718A (en) * 2015-03-13 2015-06-10 深圳市迪佩科技有限公司 Flexible electronic paper display screen and display device and manufacturing method
CN114114778A (en) * 2021-12-27 2022-03-01 赣州市秋田微电子有限公司 Electrophoresis display module and manufacturing method thereof

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Effective date of registration: 20151012

Address after: Taiwan, China Hsinchu science and Technology Park Road, No. 3

Patentee after: Yuantai Science and Technology Industry Co., Ltd.

Address before: Hsinchu, Taiwan, China

Patentee before: AU Optronics Corporation