CN101608302B - Patterned technology - Google Patents
Patterned technology Download PDFInfo
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- CN101608302B CN101608302B CN2008101256749A CN200810125674A CN101608302B CN 101608302 B CN101608302 B CN 101608302B CN 2008101256749 A CN2008101256749 A CN 2008101256749A CN 200810125674 A CN200810125674 A CN 200810125674A CN 101608302 B CN101608302 B CN 101608302B
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- soup
- plating soup
- metal cladding
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Abstract
The invention discloses a patterned technology which comprises the following steps: firstly, soaking a plastic material in plating medicine liquid to form a plating metal layer on the surface of the plastic material; after forming the plating metal layer, soaking the plastic material in deplating medicine liquid to form a deplating metal layer on the plating metal layer, wherein the reactivity of the plating medicine liquid is larger than that of the deplating medicine liquid. The invention can reduce the quantity of circuit boards needed by a portable electronic product or an electronic device so that the portable electronic product or the electronic device is developed to trend to light weight and small volume and thickness.
Description
Technical field
The invention relates to a kind of Patternized technique, and particularly relevant for a kind of Patternized technique that forms metal pattern (metallic pattern).
Background technology
Known portable electronic product (portable electronic apparatus) or electronic installation; For example mobile phone, notebook computer, hand held Game device and personal digital aid (PDA) (Personal DigitalAssistant; PDA); Usually need a plurality of electronic components of installing, it for example is a chip (chip) and passive element (passive component) and wiring board (wiring board) that these electronic components are installed.
These electronic components need just can be electrically connected to each other through wiring board mostly at present.So, electronic signal could be transmitted between these electronic components, and these electronic components are able to bring into play function.Therefore, in the prior art, these electronic components and wiring board be portable electronic product or electronic installation indispensable necessary element.
Portable electronic product now or electronic installation mostly towards in light weight, volume is little and the trend development of thin thickness, even, the prosperity of automotive industry now, the electronic installation integration technology demand of automobile multifunctional property is maked rapid progress.Therefore; How to alleviate the weight of portable electronic devices further; Dwindle the volume of slimming portable electronic product or electronic installation; And the thickness that reduces portable electronic product or electronic installation, even integrate with the technology of complicated control panel for car steering person's the operation of controlling, be worth the problem of discussing especially.
Summary of the invention
The present invention provides a kind of Patternized technique, and it can form many circuits.
The present invention proposes a kind of Patternized technique, and this technology comprises, at first, a plastic material is soaked in the plating soup, on the surface of plastic material, to form metal cladding together.After having formed metal cladding, plastic material is soaked in one changes in the plating soup, to play formation one change metal cladding on the metal cladding, wherein the reactive behavior of plating soup is greater than the reactive behavior of changing the plating soup.
In an embodiment of the present invention, the sedimentation rate of above-mentioned metal cladding is greater than the sedimentation rate of changing metal cladding.
In an embodiment of the present invention, above-mentioned plastic material in the load (1oading) of plating soup greater than plastic material in the load of changing the plating soup.
In an embodiment of the present invention, the temperature of above-mentioned plating soup is greater than the temperature of changing the plating soup.
In an embodiment of the present invention, above-mentioned plastic material is soaked in time in the plating soup less than time of being soaked in of plastic material plating soup.
In an embodiment of the present invention, the composition of above-mentioned plating soup is identical with the composition of changing the plating soup.
In an embodiment of the present invention, the composition of above-mentioned plating soup is different with this composition of changing the plating soup.
In an embodiment of the present invention, above-mentioned plastic material comprises a pottery or engineering plastics.
In an embodiment of the present invention; Above-mentioned engineering plastics are to be selected from by polybutylene terephthalate (Polybutylene Terephthalate; PBT), polyethyleneterephthalate (PolyethyleneTerephthalate; PET), polycarbonate (Polycarbonate; PC), propylene-butadiene-styrene copolymer compound (Acrylonitrile-Butadiene-Styrene copolymers, ABS copolymers), polyamide 6 (Polyamide, PA6), the group formed of kematal (POM), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), cyclic olefin copolymerized macromolecule (COC) and nylon.
In an embodiment of the present invention, above-mentioned plastic material also comprises a plurality of granules of catalyst.
In an embodiment of the present invention, these granules of catalyst are a plurality of metal oxide particles or a plurality of metal complex composition granule.
In an embodiment of the present invention, the material of these granules of catalyst is selected from the group of being made up of manganese, chromium, palladium, copper, aluminium and platinum.
In an embodiment of the present invention, before plastic material is soaked in the plating soup, also comprise, utilize a laser beam, on the surface of plastic material, form an intaglio pattern, the activation of some of them granules of catalyst also is exposed in the intaglio pattern.
Because the present invention utilizes the plating soup and changes the plating soup on the surface of plastic material, to have formed metal cladding and to have changed metal cladding; Therefore the present invention can be used on the shell of portable electronic product or electronic installation, forming the metal pattern that comprises many circuits, and a plurality of electronic component can directly be assembled in these circuits.So, the present invention can reduce the number of portable electronic product or the needed wiring board of electronic installation so that portable electronic product or electronic installation towards in light weight, volume is little with the trend development of thin thickness.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended diagram, elaborates as follows.
Description of drawings
Figure 1A to Fig. 1 C is the flow process sectional view of the Patternized technique of one embodiment of the invention.
Fig. 2 A and Fig. 2 B are the sectional views that plays the forming process of metal cladding among Figure 1B.
Fig. 3 plays metal cladding and the formation time of changing metal cladding and the graph of a relation of thickness in the present embodiment.
Description of reference numerals
100: plastic material
102: the surface
104: intaglio pattern
110: granules of catalyst
120: play metal cladding
122: nucleus of the seed
130: change metal cladding
B: laser beam
D: the degree of depth
T1, t2: time
Embodiment
Figure 1A to Fig. 1 C is the flow process sectional view of the Patternized technique of one embodiment of the invention.See also Figure 1A, about the Patternized technique of present embodiment, at first, utilize a laser beam B, on the surface 102 of a plastic material 100, form an intaglio pattern 104, wherein the depth D of intaglio pattern 104 for example is less than 5 microns.Certainly, look closely product demand, the depth D of intaglio pattern 104 can also equal or exceed 5 microns (also can directly get through with laser and form through hole).
After forming intaglio pattern 104, some granules of catalyst 110 meeting activation also are exposed in the intaglio pattern 104.In order to clearly demonstrate further, these granules of catalyst 110 in the diagram can represent whether granules of catalyst 110 is activated with black or white.The granules of catalyst 110 of black is represented activatory granules of catalyst 110, and the granules of catalyst 110 of white is then represented non-activated granules of catalyst 110.
These granules of catalyst 110 for example are a plurality of metal oxide particles, a plurality of nitride metal composition granule, a plurality of metal complex composition granule or a plurality of metallic particles; And the material of these granules of catalyst 110 can comprise manganese, chromium, palladium, copper, aluminium or platinum, or the arbitrary combination of these metals.That is to say that the atoms metal in these granules of catalyst 110 can be manganese, chromium, palladium, copper, aluminium or platinum, and these granules of catalyst 110 can comprise any combination of these atoms metals.For example, granules of catalyst 110 for example is cupric oxide, aluminum nitride particle or metallic palladium particle.
When these granules of catalyst 110 mix with formation plastic material 100 with engineering plastics; These granules of catalyst 110 can produce chemical reaction with the polymer in some engineering plastics, to such an extent as to wherein a granules of catalyst 110 can be tied with several plastic cement polymer keys.Key knot between these granules of catalyst 110 and the plastic cement polymer can form a kind of chemical property stable molecular structure.In other words, the granules of catalyst 110 of this moment has very low activity.
When forming intaglio pattern 104 on the surface 102 of laser beam B at plastic material 100, laser beam B can destroy the key knot between some granules of catalyst 110 and the plastic cement polymer, and therefore these granules of catalyst 110 also have radical.That is to say that laser beam B can destroy above-mentioned chemical property stable molecular structure, and then improve the activity of these granules of catalyst 110.
See also Figure 1B, then, plastic material 100 is soaked in the plating soup, on the surface 102 of plastic material 100, to form metal cladding 120 together, the mean thickness that wherein plays metal cladding 120 can be below 1 micron.Specifically, the plating soup contains a plurality of metals ions, and some activation and the granules of catalyst 110 that are exposed in the intaglio pattern 104 can combine with these metals ions, and then has formed metal cladding 120.
In order to have introduced the formation of metal cladding 120 in detail, below will cooperate Fig. 2 A and Fig. 2 B to specify the forming process of metal cladding 120.
Fig. 2 A and Fig. 2 B are the sectional views that plays the forming process of metal cladding among Figure 1B.Please consult Fig. 2 A earlier, when firm formation played metal cladding 120, these activatory granules of catalyst 110 (the black granules of catalyst 110 shown in figure) can be tied with these metals ion keys in the plating soup, to form a plurality of nucleuss of the seed 122.These nucleuss of the seed 122 can be formed on these activatory granules of catalyst 110, and combine with these activatory granules of catalyst 110.
See also Fig. 2 B, then, these nucleuss of the seed 122 can combine with more metals ion and gradually grow up.When these nucleuss of the seed 122 grow to necessarily when big or small, these nucleuss of the seed 122 can just be connected to each other, and then form the continuous rete that one deck covers intaglio pattern 104, just play metal cladding 120.In other words, playing metal cladding 120 is these nucleuss of the seed 122 formed continuous retes that just are connected to each other.
Except above-mentioned formation played metal cladding 120, the present invention comprised that also a plurality of formation play the embodiment of metal cladding 120.In detail, in the embodiment that other do not illustrate, plastic material 100 can not comprise these granules of catalyst 110, and promptly plastic material 100 for example is general pottery or above-mentioned engineering plastics.
With plastic material 100 is that engineering plastics are example; Before having formed metal cladding 120, can earlier engineering plastics be soaked in the catalyzer, wherein catalyzer contains a plurality of granules of catalyst; And these granules of catalyst can be metallic particles, for example are copper metal particle or metallic palladium particle.After engineering plastics were soaked in catalyzer, these metallic particles can be attached to the surface of engineering plastics.
Afterwards, again the engineering plastics of these metallic particles of surface attachment are soaked in the plating soup.Through the reaction that a plurality of metals ion produced in these metallic particles and the plating soup, play the surface that metal cladding 120 can be formed at engineering plastics.In other words, even adopt the plastic material 100 that does not contain these granules of catalyst 110, present embodiment can also form metal cladding 120 on this plastic material 100.Therefore, the method for the laser activation granules of catalyst 110 shown in Figure 1A to Figure 1B is merely and illustrates, and non-limiting the present invention.
See also Fig. 1 C, after having formed metal cladding 120, plastic material 100 is soaked in one changes in the plating soup, to play formation one change metal cladding 130 on the metal cladding 120.The composition of plating soup can be identical with the composition of changing the plating soup.Certainly the composition of plating soup can also be different with the composition of changing the plating soup.Therefore, the two can be identical or different material with playing metal cladding 120 to change metal cladding 130.For instance, playing metal cladding 120 for example is copper metal layer, for example is nickel-gold layer or copper metal layer and change metal cladding 130.
The reactive behavior of plating soup is greater than the reactive behavior of changing the plating soup.Explanation is in advance, and activity described here is meant the last plating ability of plated film (promptly play metal cladding 120 or change metal cladding 130), and the last plating ability of a metal cladding 120 can be greater than changing metal cladding 130.Therefore, playing the sedimentation rate of metal cladding 120 can be greater than the sedimentation rate of changing metal cladding 130.
Controlled metal cladding 120 and changed the two the means of sedimentation rate of metal cladding 130 and have a variety of.In the present embodiment, can control the plating soup and change the two temperature of plating soup, the temperature that makes the plating soup is greater than the temperature of changing the plating soup.So, even the composition of plating soup is identical with the composition of changing the plating soup, the sedimentation rate that plays metal cladding 120 still can be greater than the sedimentation rate of changing metal cladding 130.In the present embodiment, the temperature of plating soup can about 1 ℃ to the 15 ℃ gap of being higher than plating soup, and for example the temperature of plating soup can be between 55 ℃ to 65 ℃, can be between 50 ℃ to 60 ℃ and change the temperature of plating soup.
In addition; Size that also can control load; So that play the sedimentation rate of the sedimentation rate of metal cladding 120 greater than change metal cladding 130, wherein aforementioned so-called load is meant the area in the zone that can form plated film (for example play metal cladding 120 or change metal cladding 130) and the ratio between plating bath (being plating soup or the change plating soup) volume.With Figure 1B is example, and when having formed metal cladding 120, the ratio between the volume of the area of intaglio pattern 104 and plating soup is the load of plastic material 100 at the plating soup.
Load is big more, and the sedimentation rate of plated film is fast more.That is to say that under the condition of plating bath constancy of volume, can form the area bigger (greater than the minimum safe load of plating bath, less than the plating bath maximum permissible load) in the zone of plated film, then the sedimentation rate of this plated film is fast more.Therefore, the size that present embodiment can also control load so that plastic material 100 in the load of plating soup greater than plastic material 100 in the load of changing the plating soup.The method of control load for example is in the coating bath that the plating soup is housed, and puts the area that a plurality of steel balls or multi-disc copper sheet increase the zone that forms plated film (having comprised metal cladding 120).So, increase the load of plastic material 100 at the plating soup.
In addition, can also control other parameters makes activity between plating soup and the plastic material 100 greater than the activity that rises between metal cladding 120 and the change plating soup.For instance, present embodiment can be controlled plating soup and the condition of changing the plating soup of stirring, and for example plating soup and time, stir speed (S.S.) or the alr mode of changing the plating soup are stirred in adjustment.Above-mentioned alr mode can comprise pneumatic blending and mechanical stirring; Wherein pneumatic blending is meant to feed in gas to plating soup and the change plating soup and stirs, and mechanical stirring then is meant utilizes jet flow, cylinder or agitating vane to stir plating soup and change plating soup.
In addition, more can select the mutually different plating soup of composition for use and change the plating soup.That is to say, can select highly active plating soup and SAization plating soup for use.The reactive behavior that can make the plating soup like this is greater than the reactive behavior of changing the plating soup; Even under the plating soup condition identical with changing the two temperature of plating soup; Still the reactive behavior that makes the plating soup is greater than the reactive behavior of changing the plating soup, and the sedimentation rate that promptly plays metal cladding 120 is still greater than the sedimentation rate of changing metal cladding 130.
Fig. 3 plays metal cladding and the formation time of changing metal cladding and the graph of a relation of thickness in the present embodiment.See also Fig. 3, wherein the longitudinal axis has been represented metal cladding 120 and the total thickness of changing metal cladding 130, and the transverse axis representative has deposited metal cladding 120 and changed 130 elapsed times of metal cladding.
From Fig. 3, when the time from zero during to time t1, plastic material 100 is to be immersed in the plating soup.When no show time time t1, there has not been metal cladding 120 to form as yet with changing metal cladding 130, promptly only form a plurality of nucleuss of the seed 122 (please refer to Fig. 2 B) on the plastic material 100, and do not form continuous rete.This section is called time of origin (initiation time) from zero to time t1 time, and from zero only form a plurality of nucleuss of the seed 122 to this section of time t1 state be called initial plating state (initiation).
As time from time t1 during, play a metal cladding 120 and accomplished, and begin formationization metal cladding 130 to time t2.That is to say that in the period from time t1 to time t2, plastic material 100 is in the being soaked in plating soup, and formationization metal cladding 130 at this section.From Fig. 3, the thickness of changing metal cladding 130 is linear the growth substantially along with the time.That is to say that basically, the sedimentation rate of changing metal cladding 130 is a certain value.
What deserves to be mentioned is; Different types of plastic material 100; It is also different that it has formed the required time of origin of metal cladding 120, and the plastic material 100 that for example contains polybutylene terephthalate (PBT) is than the more time of origin of plastic material 100 needs that contains liquid crystal polymer (LCP).Yet the sedimentation rate of changing metal cladding 130 is but irrelevant with the kind of plastic material 100 substantially.
Because the reactive behavior of plating soup is greater than the reactive behavior of changing the plating soup, so plastic material 100 needed time of origin (promptly from zero time to time t1) can be shortened.That is to say that the time that plastic material 100 is soaked in the plating soup can be less than the time of plastic material 100 being soaked in plating soups.So, present embodiment can shorten the required time of Patternized technique, and then keeps or accelerate the production rate of product.
Please consult Fig. 2 A and Fig. 2 B once more, when these nucleuss of the seed 122 formed, because it is very fast to play the sedimentation rate of metal cladding 120, and the plating soup was active higher, so the growth speed of these nucleuss of the seed 122 can be accelerated.Yet,, play metal cladding 120 and may be formed at the zone beyond the intaglio pattern 104 if the growth speed of these nucleuss of the seed 122 is too fast.The situation that in the application of making circuit, can be short-circuited like this.Therefore, shorten plastic material 100 the time in the plating soup of being soaked in and to reduce the probability that metal cladding 120 is formed at the zone beyond the intaglio pattern 104 has taken place, and in the application of making circuit, can reduce the situation that is short-circuited like this.
In sum, the present invention utilizes the plating soup on the surface of plastic material, to form metal cladding and changed metal cladding with changing the plating soup, so the present invention can be used on the shell of portable electronic product or electronic installation, forming metal pattern.This metal pattern can be used as many circuits or receive the antenna of signal.When metal pattern was used as many circuits, a plurality of electronic components can directly be assembled in these circuits.
So; The present invention can reduce portable electronic product or the needed connection electric wire of electronic installation; And then impel now portable electronic product or electronic installation further towards in light weight, volume is little and the trend development of thin thickness, i.e. the technical characterictic that the present invention disclosed can develop and portable electronic product or the electronic installation that weight is lighter, volume is littler, thickness is thinner.
Secondly, through above-mentioned highly active plating soup, the present invention can shorten and form the required time of origin of metal cladding.Therefore, although the needed time of origin of different types of plastic material is all inequality, needed time of origin all can be shortened.The sedimentation rate of adding metal cladding is irrelevant with the kind of plastic material substantially, and therefore, even carry out Patternized technique to different types of plastic material, the present invention can keep or accelerate the production rate of product.
Moreover, be in plating soup and change plating soup, to form respectively owing to playing metal cladding with changing metal cladding, so the present invention can monitor metal cladding and the growth situation of changing metal cladding individually.So, whether the present invention can detect metal cladding and change metal cladding and form and be filled in the correct zone of plastic material.In the application of making circuit, not only can avoid the situation that is short-circuited like this, also can avoid simultaneously not exclusively causing the situation that opens circuit because of circuit forms.Hence one can see that, and the present invention can improve the yield of product in the application facet of making circuit.
Though the present invention discloses as above with embodiment; Right its is not in order to limit the present invention; Those of ordinary skill in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking appended the claim person of defining.
Claims (11)
1. Patternized technique comprises:
One plastic material is provided, and wherein this plastic material comprises a plurality of granules of catalyst;
Utilize a laser beam, on the surface of this plastic material, form an intaglio pattern, the activation of some of them granules of catalyst also is exposed in this intaglio pattern;
This plastic material is soaked in the plating soup, on the surface of this plastic material, to form metal cladding together; And
After this plays metal cladding in formation, this plastic material is soaked in one changes in the plating soup, form a change metal cladding on the metal cladding to rise at this, wherein the reactive behavior of this plating soup is changed the reactive behavior of plating soup greater than this.
2. Patternized technique as claimed in claim 1, wherein this plays the sedimentation rate of the sedimentation rate of metal cladding greater than this change metal cladding.
3. Patternized technique as claimed in claim 1; Wherein this plastic material is changed the load of plating soup greater than this plastic material at this in the load of this plating soup; Wherein the load of this plating soup is meant the area in the zone that can form plated film and the ratio between the plating medicine liquid volume, and the load of changing the plating soup is meant the area in the zone that can form plated film and changes the ratio between the plating medicine liquid volume.
4. Patternized technique as claimed in claim 1, wherein the temperature of this plating soup is changed the temperature of plating soup greater than this.
5. Patternized technique as claimed in claim 1, wherein this plastic material time in this plating soup of being soaked in is soaked in the time of this change plating soup less than this plastic material.
6. Patternized technique as claimed in claim 1, wherein the composition of this plating soup is identical with this composition of changing the plating soup.
7. Patternized technique as claimed in claim 1, wherein the composition of this plating soup is different with this composition of changing the plating soup.
8. Patternized technique as claimed in claim 1, wherein this plastic material is a pottery or engineering plastics.
9. Patternized technique as claimed in claim 8, wherein this project plastics are to be selected from the group of being made up of polybutylene terephthalate, polyethyleneterephthalate, polycarbonate, propylene-butadiene-styrene copolymer compound, polyamide 6, kematal, polyphenylene sulfide, liquid crystal polymer, cyclic olefin copolymerized macromolecule and nylon.
10. Patternized technique as claimed in claim 1, wherein those granules of catalyst are a plurality of metal oxide particles or a plurality of metal complex composition granule.
11. Patternized technique as claimed in claim 1, wherein the material of those granules of catalyst is selected from the group of being made up of manganese, chromium, palladium, copper, aluminium and platinum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101256749A CN101608302B (en) | 2008-06-17 | 2008-06-17 | Patterned technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101256749A CN101608302B (en) | 2008-06-17 | 2008-06-17 | Patterned technology |
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| CN101608302A CN101608302A (en) | 2009-12-23 |
| CN101608302B true CN101608302B (en) | 2012-07-18 |
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| CN2008101256749A Expired - Fee Related CN101608302B (en) | 2008-06-17 | 2008-06-17 | Patterned technology |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102071412B (en) * | 2010-04-14 | 2012-03-07 | 比亚迪股份有限公司 | Plastic product and preparation method thereof |
| CN102418091B (en) * | 2010-04-14 | 2014-02-12 | 比亚迪股份有限公司 | Plastic product and preparation method for same |
| CN103635017B (en) * | 2012-08-24 | 2016-12-28 | 碁鼎科技秦皇岛有限公司 | Circuit board and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047419A (en) * | 1989-05-16 | 1990-11-28 | 四川大学 | The production technology of electrode of piezoelectric ceramic device |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047419A (en) * | 1989-05-16 | 1990-11-28 | 四川大学 | The production technology of electrode of piezoelectric ceramic device |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2000-212793A 2000.08.02 |
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