CN101604557A - The plasma display of electrocondution slurry and this slurry of use - Google Patents
The plasma display of electrocondution slurry and this slurry of use Download PDFInfo
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Abstract
The present invention proposes a kind of electrocondution slurry that is used to form the plasma display electrode, comprise conductive metal powder, organic components and glass powder with low melting point, it is characterized in that, described conductive metal powder is made up of the metal dust of particle diameter different size between 0.2 to 3.5, to improve the conductivity of unit mass metal.In one embodiment of the present invention, described conducting metal is a silver powder, and it is formed by two kinds that are selected from following group at least: silver powder A: particle size distribution is at the ball shape silver powder of 0.2-0.5 micron; Silver powder B: particle size distribution is at the ball shape silver powder of 0.7-0.9 micron; Silver powder C: particle size distribution is at the ball shape silver powder of 1-1.5 micron; Silver powder D: particle size distribution is at the ball shape silver powder of 1.5-2 micron; Silver powder E: particle size distribution is at the ball shape silver powder of 2-2.5 micron; Silver powder F: the flake silver powder of particle size distribution about 1.5 microns; Silver powder G: the flake silver powder of particle size distribution about 2.5 microns; And silver powder H: the flake silver powder of particle size distribution about 3.5 microns.
Description
Technical field
The present invention relates to a kind of plasma display that is used to form the electrocondution slurry of plasma display electrode of substrate and comprises this electrode.
Background technology
By in recent years, flat panel display reaches its maturity.Large scale, high definition and low-power consumption are the developing direction of flat-panel monitor.Particularly plasma flat-panel display is owing to have high brightness, high-contrast and low cost, and the characteristics that are easy to large scaleization, and becomes the trend of large scale flat-panel monitor gradually.Plasma display mainly contains two glass substrates to be formed, and the centre is filled with penning gas, and the red, green, blue three-color phosphor is arranged in the display unit of each pattern.Transparent ITO electrode is arranged on the prebasal plate, on the ITO electrode, be useful on the silver-colored bus electrode that increases conductance.When display was worked, the addressing electrode on the metacoxal plate was determined luminescence unit, ITO electrode discharge ionized gas, thereby the light-emitting phosphor in the diploe wall after exciting.
In order to make the quantity of pixel on the power, ignition voltage and the raising glass substrate that reduce plasma display, the bus electrode on the prebasal plate and the quality of the addressing electrode on the metacoxal plate are very important.Requiring in definition is not in the extra high plasma flat-panel display, and silk screen printing method for producing confluxes and the technology of addressing electrode is widely adopted.The characteristics of this method are that manufacturing process is easier, can save raw material, thereby have obtained using widely.But the weak point of this technology is to form high-precision electrode pattern, and along with the increase of print pass, silk screen is easy to generate inelastic deformation, makes electrode pattern not reach required precision.Patent CN1424738A has introduced the technology with the silk screen printing method for producing silver electrode.
Because the condition restriction of print process itself, it is very difficult to make meticulousr electrode.So someone has proposed to adopt photosensitive paste to make the new method of electrode pattern.This technology is silver coating slurry on whole glass substrate, hides exposure and formation sub-image under the ultraviolet ray of suitable wavelength then with mask plate.Develop with dilute alkaline soln at last, remove the part that does not have exposure.
Use the method for photosensitive pulp coating exposure to make silver electrode, its advantage is to form high-precision figure.But the lines that this requirement is produced have very high conductance, and this is very important for the power and the ignition voltage that reduce display.Patent CN200610100230.0 mentions the preferable particle size scope and makes the light sensitivity electrocondution slurry at the ball shape silver powder of 1-1.5 micron, the electrode that uses this ball shape silver powder to make, conductance height.But this requires the silver powder content in the photosensitive paste to need more than 65%.As everyone knows, silver costs an arm and a leg as noble metal, and the light sensitivity pasty slurry cost that uses this silver powder to make is very high.
Summary of the invention
The objective of the invention is to solve the problem of the not high or conductive metal powder large usage quantity of conductive electrode conductance in the existing plasma display.
Therefore the present invention proposes a kind of new conducting metal composition, and its conductive metal powder with different-grain diameter is mixed by predetermined ratio, to improve the conductivity of unit mass metal.
In one embodiment of the present invention, described conducting metal is a silver powder, and it is formed by two kinds that are selected from following group at least:
Silver powder A: particle size distribution is at the ball shape silver powder of 0.2-0.5 micron;
Silver powder B: particle size distribution is at the ball shape silver powder of 0.7-0.9 micron;
Silver powder C: particle size distribution is at the ball shape silver powder of 1-1.5 micron;
Silver powder D: particle size distribution is at the ball shape silver powder of 1.5-2 micron;
Silver powder E: particle size distribution is at the ball shape silver powder of 2-2.5 micron;
Silver powder F: the flake silver powder of particle size distribution about 1.5 microns;
Silver powder G: the flake silver powder of particle size distribution about 2.5 microns; And
Silver powder H: the flake silver powder of particle size distribution about 3.5 microns.
The present invention also provides a kind of plasma display, its electrocondution slurry that is used to form bus electrode and addressing electrode is made up of conducting metal, organic components and glass powder with low melting point, it is characterized in that described conductive metal powder is made up of the metal dust of particle diameter different size between 0.2 to 3.5.
In a kind of embodiment of the present invention, described conductive metal powder is a silver powder, and it is formed by two kinds that are selected from following group at least:
Silver powder A: particle size distribution is at the ball shape silver powder of 0.2-0.5 micron;
Silver powder B: particle size distribution is at the ball shape silver powder of 0.7-0.9 micron;
Silver powder C: particle size distribution is at the ball shape silver powder of 1-1.5 micron;
Silver powder D: particle size distribution is at the ball shape silver powder of 1.5-2 micron;
Silver powder E: particle size distribution is at the ball shape silver powder of 2-2.5 micron;
Silver powder F: the flake silver powder of particle size distribution about 1.5 microns;
Silver powder G: the flake silver powder of particle size distribution about 2.5 microns; And
Silver powder H: the flake silver powder of particle size distribution about 3.5 microns.
The present invention uses dissimilar silver powder to make up, be used to form the electrode of plasma display, especially added a certain amount of flake silver powder, because with respect to spherical silver powder, the contact area of flake silver powder improves a lot, and the flake silver powder of fine particulate has good filling effect to the slit between the silver powder, has improved the conductance of the unit mass metal electrode that is formed by metal dust effectively, thereby can reduce the content of silver in the photosensitive paste, reduce cost.
Description of drawings
Fig. 1 uses the light sensitivity paste to prepare PDP bus electrode schematic diagram
Embodiment
If no special instructions, when mentioning percentage (%), be meant percentage by weight herein.
Be reluctant bound by theoryly, the principal element that influences the conductance of electrode (bus electrode and addressing electrode) is tap density and particle diameter.For the bigger silver powder of particle,, often lower by the conductance of its electrode that forms because its tap density is less.For the less metal dust of particle size, can obtain higher tap density, but this does not also mean that its conductance is bound to raise, because the size of metal dust is more little, its grain boundary face in unit volume or unit length is just many more, the increasing and can reduce conductance of grain boundary face.So in the prior art, the technical staff is in order to obtain the electrode of ideal conducting rate, balance in addition between metallic particles particle diameter and tap density always is to find out an optimum.
Can the inventor considering such problem all the time: find a kind of method, make formed electrode not only have high tap density but also have high conductance.The inventor is surprised to find that under study for action, if the silver powder of different size specification is made up, is used to form the electrode of plasma display, then can obtain high conductance.And,, then need to consume more silver powder if obtain same conductance according to the technology of prior art.
Therefore,, provide a kind of electrocondution slurry that is used for plasma display, it is characterized in that conductive compositions wherein is the combination of the silver powder of multiple particle size and type in a first aspect of the present invention.
In a kind of embodiment, the electrocondution slurry that is used for plasma display according to the present invention has been used in combination at least two kinds of following silver powder:
Silver powder A: particle size distribution is at the ball shape silver powder of 0.2-0.5 micron;
Silver powder B: particle size distribution is at the ball shape silver powder of 0.7-0.9 micron;
Silver powder C: particle size distribution is at the ball shape silver powder of 1-1.5 micron;
Silver powder D: particle size distribution is at the ball shape silver powder of 1.5-2 micron;
Silver powder E: particle size distribution is at the ball shape silver powder of 2-2.5 micron;
Silver powder F: the flake silver powder of particle size distribution about 1.5 microns;
Silver powder G: the flake silver powder of particle size distribution about 2.5 microns; And
Silver powder H: the flake silver powder of particle size distribution about 3.5 microns.
In a preferred embodiment of the present invention, this electrocondution slurry uses the silver powder of at least three kinds of particle sizes, and wherein a kind of ball shape silver powder (silver powder A) that is particle size distribution at the 0.2-0.5 micron.
In a preferred embodiment of the present invention, this electrocondution slurry uses the silver powder of at least four kinds of particle sizes, and wherein a kind of ball shape silver powder (silver powder A) that is particle size distribution at the 0.2-0.5 micron, a kind of ball shape silver powder (silver powder B) that is particle size distribution at the 0.7-0.9 micron, a kind of ball shape silver powder (silver powder C) that is particle size distribution at the 1-1.5 micron, a kind of is the flake silver powder (silver powder G) of particle size distribution about 2.5 microns.
Further preferred as above-mentioned preferred implementation, wherein the relative weight ratio of silver powder A, silver powder B, silver powder C and silver powder G is respectively 1: 4-12: 10-20: 0.1-0.5.
In another preferred embodiment of the present invention, this electrocondution slurry uses the silver powder of at least three kinds of particle sizes, and wherein a kind of ball shape silver powder (silver powder A) that is particle size distribution at the 0.2-0.5 micron, a kind of ball shape silver powder (silver powder C) that is particle size distribution at the 1-1.5 micron; A kind of ball shape silver powder (silver powder E) that is particle size distribution at the 2-2.5 micron.In this case, the relative weight of above-mentioned three kinds of silver powder ratio is 1: 8-25: 5-9.
In another embodiment, this electrocondution slurry uses the silver powder of at least three kinds of particle sizes, and wherein a kind of ball shape silver powder (silver powder A) that is particle size distribution at the 0.2-0.5 micron, a kind of ball shape silver powder (silver powder B) that is particle size distribution at the 0.7-0.9 micron, a kind of ball shape silver powder (silver powder C) that is particle size distribution at the 1-1.5 micron, in this case, the relative weight of above-mentioned three kinds of silver powder ratio is 1: 4-6: 5-8.
Except above-mentioned silver powder, also comprise organic principle according to electrocondution slurry of the present invention, these organic principles have been used to the preparation of the electrocondution slurry of plasma display in the prior art.These organic principles generally include following composition:
Glass powder
Add glass powder and be in order to improve electrocondution slurry and to be used for cementability between the glass substrate of PDP substrate.And glass powder can make silver-colored particle low-temperature sintering.Average grain diameter is generally 0.1 micron to 10 microns.Usually use the flint glass material, the example of flint glass material comprises the lead borosilicate system combination, such as PbO, B
2O
3And SiO2.Lead borosilicate system frit can also contain other metallic compound.The example of other metallic compound comprises: Al
2O
3, ZnO, ZrO
2, CaO, CuO, Bi
2O
3, BaO, MOO
3, MgO, La
2O
3, Nb
2O
5, Na
2O, Li
2O, GeO
2, P
2O
5, WO
3, Li
2SO
4, K
2O, TiO
2, Ag
2O, CeO
2, Cs
2O, CdO, Cr
2O
3, SnO
2, NiO, FeO, COO, RuO
2, V
2O
5And Y
2O
3These metallic compounds can join in the composition according to application target.The content of glass powder in electrocondution slurry is 0.01-25% with respect to conductive particle generally.
In preferred implementation of the present invention, above-mentioned glass powder is that low-melting PbO-SiO2 is a glass, or unleaded Bi2O3-ZnO is glass powder with low melting point, and its particle size distribution is at 1-8 μ m, glass transition temperature is at 300-500 ℃, and softening point is 400-600 ℃.
In a kind of embodiment of the present invention, above-mentioned glass powder is by 57.8% Bi
2O
3, 11.2% B
2O
3, 24.5% SiO
2, and 6.5%ZnO constitute.
Organic polymer binder
Add organic polymer binder and be in order when screen printing or correlation technique are applied to electrocondution slurry on the substrate by using known conventional method, to improve the stability of coating character and coated film.Organic polymer binder is removed when forming electrode by the sintering electrocondution slurry.
The example of organic polymer binder comprises that those contain the organic polymer binder of nonacid comonomer or acidic comonomer.Preferably by the copolymer or the mixed polymers of the preparation of component hereinafter described.
(1) nonacid comonomer is selected from C
1-C
10Alkyl acrylate, C
1-C
10The styrene of alkyl methacrylate, styrene, replacement or these combination of compounds; With
(2) acid monomer, it contains the ethylene linkage unsaturated carboxylic acid.
The content of acidic comonomer is that benchmark is at least 15% in the total weight of organic polymer binder, perhaps is preferably 15-30%.When acidic comonomer exist concentration to be lower than 15% the time, then be difficult to wash this slurry off with alkaline aqueous solution.When organic acidic comonomer exist concentration to surpass 30% the time, then this slurry stability under development conditions is low, and in the image developing process just part develop.The example of suitable acidic comonomer comprises: ethylene linkage type unsaturated monocarboxylic acid, such as acrylic acid, methacrylic acid and crotonic acid: ethylene linkage type unsaturated dicarboxylic acid, such as fumaric acid, itaconic acid, citraconic acid, vinyl succinic acid and maleic acid; The half ester of these compounds; And, in some cases, the acid anhydrides of these compounds or their mixture.Methacrylate polymer analogy acrylate copolymer class more preferably because the former can burnout under hypoxic atmosphere fully.
When nonacid comonomer was above-mentioned alkyl acrylate or alkyl methacrylate, preferably, this nonacid comonomer occupied at least 50% of organic polymer adhesive, perhaps preferably occupies the 75-85% of organic polymer adhesive.
When nonacid comonomer was styrene or substituted phenylethylene, preferably, this nonacid comonomer occupied 50% of organic polymer adhesive, and remaining 50% is the half ester of acidic comonomer such as maleic anhydride.Preferred substituted phenylethylene is an AMS.
When the nonacid part of organic polymer adhesive is alkyl acrylate, alkyl methacrylate, styrene or substituted phenylethylene, can replace this part with other monomer.The example of substituted monomer comprises acrylonitrile, vinyl acetate and acrylamide.Nonacid composition can contain and is equal to or less than about 50% this substituted monomer.But when the organic polymer adhesive contained this substituted monomer, the difficulty of removing organic polymer binder in sintering process fully was higher.Therefore, this class monomer preferably accounts for approximately less than 25% in the organic polymer binder total weight.
Organic polymer binder can be by single copolymer or by the combined preparation of copolymer, as long as can satisfy the standard of above-mentioned development character and sintering property aspect.When copolymer in combination is used, except above-mentioned copolymer, can also add a small amount of other organic polymer binder.As an example, above-mentioned copolymer is 95: 5 to the ratio of this other organic polymer binder.The example of other organic polymer binder comprises polyolefin, such as polyethylene, polypropylene, polybutene, polyisobutene and Ethylene propylene copolymer and rudimentary alkylene oxide polymer.
A kind of preferred embodiment in, use methyl methacrylate and methacrylic acid copolymer to prepare organic polymer binder.The high molecular skeleton structure of this copolymer has excellent ultraviolet light permeability, has good film forming when printing, and is fully volatilizing during sintering below 600 ℃ more than 500 ℃, residual few.
When the organic polymer adhesive is above-mentioned preferred type, the organic polymer binder that can in electrocondution slurry of the present invention, use can be by acrylic ester polymerization in solution polymerization process commonly used prepare.
Usually, above-mentioned acid acrylate's polymer can prepare by following steps: the α or the β-alkene type unsaturated acids (acidic comonomer) of copolymerization mix mutually with one or more vinyl monomers (nonacid comonomer) in can the organic solvent of lower at boiling point (75-150 ℃), obtain the monomer mixture solution of 10-60%; Then, the mixture with gained heats under the temperature under the normal pressure, at solvent refluxing.After polymerization reaction is finished basically, make the acidic polymer solution cool to room temperature of gained, collect product.Then, measure viscosity, molecular weight and acid equivalent.
In addition, the molecular weight of above-mentioned organic polymer binder remains between the 10000-50000, or preferably less than 25000.
Total weight with the electrocondution slurry of drying (that is, removing the electrocondution slurry behind the organic media) is the benchmark meter, and the content of organic polymer binder in electrocondution slurry is generally 5-50%.
Electrocondution slurry of the present invention can be formulated as photo-sensitive composition.In the case, said composition also contains photo-polymerization type monomer and Photoepolymerizationinitiater initiater at least except containing mentioned component.For example, after formation is filmed, according to composition of the present invention can be because of light radiation (for example, ultraviolet radiation) photo-polymerization type monomer generation light polymerization.This polymer is also as the adhesive resin of addressing electrode.
The photo-polymerization type monomer
The photo-polymerization type monomer can use separately or use with a plurality of combination of monomers.Preferred examples of monomers comprises: (methyl) tert-butyl acrylate, two (methyl) acrylic acid 1, the 5-pentadiol ester, (methyl) acrylic acid N, N-dimethyl aminoethyl ester, two (methyl) acrylic acid glycol ester, two (methyl) acrylic acid 1, the 4-butanediol ester, two (methyl) acrylic acid diethylene glycol (DEG) ester, two (methyl) acrylic acid 1,6-hexylene glycol ester, two (methyl) acrylic acid 1, the ammediol ester, two (methyl) acrylic acid 1,10-decanediol ester, two (methyl) acrylic acid 1,4-cyclohexanediol ester, 2,2-dihydroxy methylpropane two (methyl) acrylate, two (methyl) acrylic acid glycerine ester, two (methyl) acrylic acid tripropylene glycol ester, three (methyl) acrylic acid glycerine ester, trimethylolpropane tris (methyl) acrylate, the compound that is disclosed in No. the 3380381st, the United States Patent (USP), 2,2-two (to hydroxyphenyl) propane two (methyl) acrylate, four (methyl) acrylic acid pentaerythritol ester, the diacrylate triethyleneglycol ester, bisphenol-A-two [3-(methyl) acryloxy-2-hydroxypropyl] ether, bisphenol-A-two [2-(methyl) acryloxy ethyl] ether, 1,4-butanediol two-3-(methacryloxy-2-hydroxypropyl] ether, the dimethacrylate triethyleneglycol ester, the polyoxyethyl propyl trimethylolpropane triacrylate, two (methyl) acrylic acid butanediol ester, three (methyl) acrylic acid 1,2, the 4-butanediol ester, two (methyl) acrylic acid 2,2,4-trimethyl-1, the 3-pentadiol ester, 1-phenyl ethene-1, the 2-dimethylacrylate, the diallyl fumaric acid, styrene, dimethacrylate 1,4-Benzenediol ester, 1,4-diallyl benzene, 1,3,5-three isopropenylbenzenes, (methyl) acrylic acid glycidol ether, allyl glycidyl ether, (methyl) acrylic acid Alpha-Methyl epoxy propyl ester, (methyl) acrylic acid α-ethyl epoxy propyl ester.In the literary composition, (methyl) acrylate is represented acrylate or methacrylate.
Part carboxyl in the above-mentioned organic polymer binder and above-mentioned photo-polymerization type monomer react, and double bond structure is introduced in the macromolecule, thereby had photosensitive property.
Total weight in the electrocondution slurry of drying (promptly remove organic media after electrocondution slurry) is a benchmark, and the content of photo-polymerization type monomer in electrocondution slurry is generally 1-25%.
Photoepolymerizationinitiater initiater
The light trigger that can select for use comprises: benzophenone, alpha, alpha-dimethyl oxygen base-α-phenyl acetophenone, α; α-diethoxy acetophenone, 2-hydroxy-2-methyl-1-phenylacetone, 2-phenyl-2-dimethylamino-1-(4-morpholinyl phenyl)-butanone-1,1-hydroxyl-cyclohexyl benzophenone, α-amine alkyl phenones, two benzoyl phenyl phosphine oxide, tetramethyl Michler's keton, 4,4 '-two phenoxy group benzophenone.Can be that a kind of initator causes, also can cause by two or more composite initiators.Preferred 2-phenyl-2-dimethylamino-1-(4-morpholinyl phenyl)-butanone-1, and contain the composite initiator of this initator.The content of light trigger in electrocondution slurry is preferably 1-8%.
Diluent:
Electrocondution slurry of the present invention can contain diluent, and it can be reactive diluent or non-activated thinner, wherein preferred reactive diluent.So-called reactive diluent is meant that it participates in polymerization at solidification process, and non-activated thinner is meant and does not participate in reaction and only play diluting effect in solidification process.Reactive diluent includes but not limited to styrene, butyl acrylate, vinylacetate, 1,6-hexylene glycol double methacrylate, two contracts/the two acrylic acid esters, two of tripropylene glycol contract/and the two acrylic acid esters of triethylene Glycol, ethoxyquin bisphenol-A double methacrylate, polyethylene glycol double methacrylate.Reactive diluent can use separately also and can severally use with.The preferred 20-60% of its content.Non-activated thinner includes but not limited to aliphatic alcohol and aliphatic alcohol esters, such as acetic acid esters and propionic ester; The terpenes of pine resin, a-or β-terpineol or their mixture system; Ethylene glycol and L-alcohol ester, such as ethylene glycol monobutyl ether and butyl cellosolve acetate: butyl carbitol and carbitol ester, such as acetate of butyl carbitol and carbitol acetic acid esters: Texanol (2,2,4-trimethyl-1,3-pentanediol mono isobutyrate).
Total weight in electrocondution slurry is a benchmark, and the content of organic media in electrocondution slurry is 10-30%.
Other composition
Can contain other composition well known to those skilled in the art in the slurry of the present invention, such as dispersant, stabilizer, plasticizer, release agent, back washing agent, defoamer and wetting agent.Can select appropriate ingredients according to routine techniques.
Especially, when printing, have good levelability and tack, can add certain defoamer and surfactant in order to make this photosensitive silver slurry; In order to have excellent storage stability, the pH value of the ester class adjustment slurry of available acidity or alkalescence.These auxiliary agents are very useful in the manufacturing process of slurry, and these auxiliary agents are in press commercialization all, and its application process also is known in the art, and emphasis of the present invention is not at this, so do not do too much elaboration.
Can electrocondution slurry of the present invention be applied on the substrate by method known in silk screen print method, rubbing method, laminating and other this studying technological domain.These methods can be used to slurry of the present invention is applied on the whole base plate.In the case, slurry of the present invention can be made into to contain the composition of above-mentioned various compositions.In addition, when being printed onto the pattern of composition on the substrate, can omit the mapping process such as exposure in the mode of silk screen printing.Therefore, can use the composition that does not contain above-mentioned light sensitivity composition.
Slurry according to the present invention can be used for making addressing electrode and the bus electrode that is used among the PDP.When using photosensitive composition of the present invention to make electrode, owing to used the higher silver powder combination of conductivity, therefore can reduce the silver powder content in the composition, reach electric action preferably simultaneously.
The material that conductivity is provided behind the sintering is a silver powder particles, and the weight content of silver powder particles in whole photosensitive paste is 40-65%.
Disclose method of the present invention below in conjunction with accompanying drawing.
Fig. 1 promptly is the making flow chart of addressing electrode.
At first, slurry of the present invention is coated on the glass substrate 101.Then, the dry electrocondution slurry 102 that has been coated with.Condition to drying is not done special restriction.For example, can use infrared dryer to make this pulp layer at 100 ℃ of dry 18-20 minutes.。
Then, the electrocondution slurry of drying is carried out to pattern handles, that is, make the electrocondution slurry exposure 103 of drying and develop 104.In exposure process, the mask mother matrix that will have an electrode pattern is placed on the conductive paste bed of material of drying, to its radiation ultraviolet rays.Conditions of exposure is 500mJ/cm2, and exposure distance (being the distance between mask mother matrix and the electrode layer) is 500 microns; Then use 0.4% sodium carbonate liquor that electrode layer surface is sprayed.
At last, carry out sintering 105 to passing through the electrocondution slurry of handling into pattern.This slurry can carry out sintering in having the sintering furnace of predetermined temperature profile.Maximum temperature in the sintering process is preferably 400-600 ℃, perhaps more preferably 500-600 ℃.Sintering time is preferably 15-40min.After sintering and cooling procedure, can obtain addressing electrode.
Embodiment 1-5 and comparative example 1-3
The process for preparation of pasty slurry is as follows: earlier be that to be dissolved in the Yi Shi Man trade mark be Texanol (2 for 15000 acrylic resin with weight average molecular weight, 2,4-trimethyl-1, the 3-pentanediol mono isobutyrate) in the solvent, add active component subsequently, the SR454 (trimethylolpropane triacrylate of triethoxy modification) of 36.15% the Sartomer company of consisting of of active component, the light trigger 907 of PEGDA of Changxing chemical company of 32.4% (four polyethylene glycol double methacrylates) and 31.45% Ciba company, and the BYK111 of Bi Ke chemical company adds as other organic principle.
In the inorganic constituents, add glass dust mainly by following each component preparation: 57.8%Bi2O3,11.2%B2O3,24.5%SiO2,6.5%ZnO.
According to each embodiment of formulated of table 1 and the silver powder of comparative example.
Said components is fully mixed, and after three beaming rollers roll, filter the pastel that obtains having light sensitivity.
Performance evaluation:
Definition according to resistance
R＝ρL/S
Wherein, R is a resistance, and ρ is a resistivity, and L is a lines length, and S is the sectional area of lines, because the interface of the electrode line that makes is approximate rectangle, so S=H*D, wherein H is the lines height, and D is a line thickness, and bringing following formula into can get
R＝ρL/HD
Therefore can calculate electricalresistivity=RHD/L, the electrode line that obtains according to above-mentioned engineer testing, lines resistance under the SP2002 type resistance instrument test certain-length of use Shanghai Qian Feng instrument, and use U.S. Dektak150 type step instrument to measure lines thickness, use Japanese Sokkia three-coordinates measuring machine to measure line thickness, calculate the lines resistivity of 5 embodiment and 3 Comparative Examples respectively according to above-mentioned formula, the result is as shown in table 2.
Table 2
| Project | Silver powder content | Resistivity (Ω cm) |
| Embodiment 1 | ??65％ | ??2.45×10-6 |
| Embodiment 2 | ??64％ | ??2.43×10-6 |
| Embodiment 3 | ??65％ | ??2.53×10-6 |
| Embodiment 4 | ??65％ | ??2.37×10-6 |
| Embodiment 5 | ??65％ | ??2.41×10-6 |
| Comparative example 1 | ??68％ | ??2.55×10-6 |
| Comparative example 2 | ??68％ | ??2.61×10-6 |
| Comparative example 3 | ??68％ | ??2.84×10-6 |
As can be seen from Table 2, embodiment 1-5 has reduction in various degree on silver powder content, use the Comparative Examples 1-3 of single particle size silver powder but on resistivity, compare, decrease to some degree, therefore, use the collocation of different-grain diameter scope and dissimilar silver powder, can reach on an equal basis even more in the high conductivity, reduce the silver powder consumption, thereby save cost.
Claims (14)
1. one kind is used for the plasma display electrocondution slurry, comprises conductive metal powder, organic components and glass powder with low melting point, it is characterized in that, described conducting metal is made up of the metal dust of particle diameter different size between 0.2 to 3.5.
2. electrocondution slurry according to claim 1 is characterized in that, described conductive metal powder is a silver powder, and it is formed by two kinds that are selected from following group at least:
Silver powder A: particle size distribution is at the ball shape silver powder of 0.2-0.5 micron;
Silver powder B: particle size distribution is at the ball shape silver powder of 0.7-0.9 micron;
Silver powder C: particle size distribution is at the ball shape silver powder of 1-1.5 micron;
Silver powder D: particle size distribution is at the ball shape silver powder of 1.5-2 micron;
Silver powder E: particle size distribution is at the ball shape silver powder of 2-2.5 micron;
Silver powder F: the flake silver powder of particle size distribution about 1.5 microns;
Silver powder G: the flake silver powder of particle size distribution about 2.5 microns; And
Silver powder H: the flake silver powder of particle size distribution about 3.5 microns.
3. electrocondution slurry according to claim 2 is characterized in that, described silver powder is formed by three kinds among the described silver powder A-H at least, and wherein a kind of be silver powder A.
4. electrocondution slurry according to claim 3 is characterized in that, described silver powder is formed by four kinds among the described silver powder A-H at least, and wherein a kind of be silver powder B, a kind of is silver powder C, a kind of silver powder is G.
5. electrocondution slurry according to claim 4 is characterized in that, wherein the relative weight ratio of silver powder A, silver powder B, silver powder C and silver powder G is respectively 1: 4-12: 10-20: 0.1-0.5.
6. electrocondution slurry according to claim 2 is characterized in that described silver powder is formed by three kinds among the silver powder A-H at least, and wherein a kind of is silver powder A, a kind of is silver powder C, and a kind of is silver powder E, and the relative weight ratio of described silver powder A, silver powder C and silver powder E is respectively 1: 8-25: 5-9.
7. electrocondution slurry according to claim 2 is characterized in that described silver powder is formed by three kinds among the silver powder A-H at least, and wherein a kind of is silver powder A, a kind of is silver powder B, and a kind of is silver powder C, and the relative weight ratio of described silver powder A, silver powder B and silver powder C is respectively 1: 4-6: 5-8.
8. plasma display, its electrocondution slurry that is used to form bus electrode and addressing electrode is made up of conducting metal, organic components and glass powder with low melting point, it is characterized in that described conducting metal is made up of the metal dust of particle diameter different size between 0.2 to 3.5.
9. plasma display according to claim 8 is characterized in that, described conductive metal powder is a silver powder, and it is formed by two kinds that are selected from following group at least:
Silver powder A: particle size distribution is at the ball shape silver powder of 0.2-0.5 micron;
Silver powder B: particle size distribution is at the ball shape silver powder of 0.7-0.9 micron;
Silver powder C: particle size distribution is at the ball shape silver powder of 1-1.5 micron;
Silver powder D: particle size distribution is at the ball shape silver powder of 1.5-2 micron;
Silver powder E: particle size distribution is at the ball shape silver powder of 2-2.5 micron;
Silver powder F: the flake silver powder of particle size distribution about 1.5 microns;
Silver powder G: the flake silver powder of particle size distribution about 2.5 microns; And
Silver powder H: the flake silver powder of particle size distribution about 3.5 microns.
10. plasma display according to claim 9 is characterized in that, described silver powder is formed by three kinds among the silver powder A-H at least, and wherein a kind of be silver powder A.
11. plasma display according to claim 10 is characterized in that, described silver powder is formed by four kinds among the silver powder A-H at least, and wherein a kind of be silver powder B, a kind of is silver powder C, a kind of is silver powder G.
12. plasma display according to claim 9 is characterized in that, wherein the relative weight ratio of silver powder A, silver powder B, silver powder C and silver powder G is respectively 1: 4-12: 10-20: 0.1-0.5.
13. plasma display according to claim 9, it is characterized in that, described silver powder is formed by three kinds among the described silver powder A-H at least, and wherein a kind of is silver powder A, a kind of is silver powder C, a kind of is silver powder E, and the relative weight ratio of described silver powder A, silver powder C and silver powder E is respectively 1: 8-25: 5-9.
14. plasma display according to claim 9, it is characterized in that, described silver powder is formed by three kinds among the described silver powder A-H at least, and wherein a kind of is silver powder A, a kind of is silver powder B, a kind of is silver powder C, and the relative weight ratio of described silver powder A, silver powder B and silver powder C is respectively 1: 4-6: 5-8.
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