CN101599609A - A kind of interconnecting method of flexible device and used flexible connector - Google Patents
A kind of interconnecting method of flexible device and used flexible connector Download PDFInfo
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- CN101599609A CN101599609A CNA2009100551022A CN200910055102A CN101599609A CN 101599609 A CN101599609 A CN 101599609A CN A2009100551022 A CNA2009100551022 A CN A2009100551022A CN 200910055102 A CN200910055102 A CN 200910055102A CN 101599609 A CN101599609 A CN 101599609A
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Abstract
The present invention relates to a kind of interconnecting method of flexible device and used flexible connector.The interconnecting method that it is characterized in that flexible device comprises step: a) make the flexible connector with through hole feature welding site according to the size of flexible device; B), realize connecting conducting in welding site spot printing conducting resinl with the through hole welding site of flexible connector and the welding site alignment and the applying of flexible device to be connected; C) in welding site coating or deposited polymer with the junction insulation-encapsulated.Described flexible connector is the strip film, has polymer-metal-polymeric layer three-decker; Two ends are welding site or the connection site that metal level exposes, and the centre is the metal connecting line of embedding.But the microelectrode connector based on flexible polymeric materials that provides has the characteristics with traditional micro-electromechanical processing technology compatibility standard batch manufacturing.Guarantee to transmit flexible device and effective connection the between equipment or the flexible device, solve the reliability problems that flexible device connects with signal.
Description
Technical field
The present invention relates to a kind of interconnecting method of flexible device and used flexible connector.
Background technology
Along with the development of flexible micrographics forming technique in the Micrometer-Nanometer Processing Technology, the research application development of flexible device is rapid.Because it is flexible, collapsible that flexible device has, even wearable, be difficult for infringement, light weight, plurality of advantages such as volume is little, the development and application of flexible device has become a focus of international research.In the existing application of biomedicine, space flight and aviation, transducer and organic elctroluminescent device numerous areas such as (OLED).Flexible device need be connected with the equipment of necessity could realize its function.But present several methods of attachment remain in some shortcomings.
People such as Stieglitz exploitation MFI technology (Microflex InterconnectionTechnology) by the spun gold press welding method realize the flexibly connecting of device [
-Uwe Meyer, Thomas Stieglitz. " High Density Interconnects and Flexible HybridAssemblies for Active Biomedical Implants " IEEE TRANSACTIONS ONADVANCED PACKAGING, 2001,366-374], but this method needs the chip of rigidity and does substrate and connect, if directly to the flexible device pressure welding, then can on flexible device, form pit, be difficult for connecting.For some application scenario, as biomedical aspect, particularly need the flexible device that implants, can not use by the chip of rigidity and do substrate, so this method has certain limitation.Flip chip bonding connection technology (Flip Chip) is a kind of encapsulation technology commonly used in the MEMS (micro electro mechanical system), but the substrate and the soldered ball of welding had requirement, in connection procedure traditional soldered ball is replaced with conducting resinl, though also can realize the connection on the flexible circuit board.But need to make the conducting resinl soldered ball, the equipment of flip chip bonding is also had requirement, operating difficulties, cost are also higher.Directly the method cost of scolding tin welding lead is minimum, but homogeneity between the solder joint and less stable, rate of finished products is lower, and precision is low, can not realize the connection of high density micro-structural, and temperature height in the welding process, causes curling of flexible device easily.Therefore, how to realize low cost, the flexible device that does stability connects has become the technical task that those skilled in the art need to be resolved hurrily
Summary of the invention
The interconnecting method that the purpose of this invention is to provide a kind of flexible device by making flexible connector, is fitted the welding site alignment of flexible device and flexible connector, and is used conducting resinl to be connected and fixed, and uses polymer-coated or deposition welded encapsulation site.Guarantee between the flexible device or flexible device and equipment between be connected, improve the reliability, the stability that connect.
The interconnecting method of flexible device of the present invention is characterized in that comprising step: a) make the flexible connector with through hole feature welding site according to the size of flexible device; B), realize connecting conducting in welding site spot printing conducting resinl with the through hole welding site of flexible connector and the welding site alignment and the applying of flexible device to be connected; C) in welding site coating or deposited polymer with the junction insulation-encapsulated.
Flexible connector places on the flexible device to be connected in the described step b), realizes that both weld the aligning in site.
Described step b) conductive adhesive therewith is based on the epoxide resin conductive adhesive of hot curing or a kind of based in the epoxy acrylic resin conducting resinl of photo-curing.
The described insulation-encapsulated of described step c) adopts coating polyimide or polydimethylsiloxanepolymer polymer, or polymer such as vapour deposition Parylene is realized between each welding site of flexible device and with the insulation of surrounding environment.
Be used for the flexible connector of flexible device interconnection, it is characterized in that described flexible connector is the strip film, have polymer-metal-polymeric layer three-decker; Two ends are welding site or the connection site that metal level exposes, and the centre is the metal connecting line of embedding.It is that plated metal sacrifice layer, photolithography patterning base insulating layer, splash-proofing sputtering metal, Lift-off (peeling off) technology are made metal level, photolithography patterning top insulating layer, electrochemical corrosion release flexible connector on silicon chip; Secondly, the use conductive silver glue is connected flexible device and solidifies with corresponding connector, use insulating cement package interface part again, finishes connection.
At least one end of described flexible connector has through hole welding site, and the other end is through hole welding site or is the metal bus-bar construction.
The shape of through holes of described flexible connector is any in circle, ellipse and the polygon, and through hole welding site, and its bottom polymer perforated area is less than upper strata polymer perforated area.
Described flexible connector partly exposes at through hole welding site intermetallic metal.
Described polymer is any in polyimides, Parylene, polymethyl methacrylate and the dimethyl silicone polymer, and its thickness is 1 μ m～200 μ m.
Described metal is any in platinum, gold, silver, copper, aluminium, titanium and the chromium, and its thickness is
1 μ m.
Utilize flexible binding the provided by the invention to connect the interconnection that can realize flexible device and equipment or the interconnection between flexible device and flexible device.
The present invention compares with flexible device interconnecting method commonly used at present, has higher reliability, stability.By the flexible connector that method provided by the invention is made, satisfactory mechanical property, not easy fracture, compare with spun gold have more firm, have higher reliability, nor the problem that the spun gold pressure welding causes flexible device to produce pit or break can occur, do not need rigid basement as supporter; And the curing temperature of conducting resinl is lower, can not make flexible device that the phenomenon of curling takes place; Compare with the method for direct scolding tin welding, the homogeneity and the stability of this method are higher, and are more suitable for small size, and highdensity flexible device connects.Flexible connector in this method can change every size according to concrete flexible device needs, and manufacturing process in this method and traditional MEMS technique compatibility, can produce in batches.That can realize flexible device and equipment is connected the perhaps interconnection between the flexible device.
Description of drawings
Fig. 1 is the structural representation that flexible connector is aimed at flexible device;
Fig. 2 is flexible connector and flexible device bonding structure schematic diagram;
Fig. 3 is a flexible connector and structural representation after flexible device is connected with conducting resinl;
Fig. 4 is the structural representation in insulating polymer welded encapsulation site;
Fig. 5 is the structural representation that flexible connector is aimed at two flexible devices;
Fig. 6 is flexible connector and two process schematic diagrames that flexible device is fitted;
Fig. 7 is a flexible connector and structure schematic diagram after two flexible devices are connected with conducting resinl;
Fig. 8 is the structural representation in insulating polymer welded encapsulation site.
Among the figure,
Embodiment
Embodiment 1
This embodiment is example with the flexible nervus, and concrete described flexible connector will be realized the interconnection of flexible device (flexible nervus) and equipment.Welding position spot size (the welding site is 4 * 4 dot matrix, and the size in each site is 400 * 400 microns) according to flexible micro-electrode.Utilize the MEMS micro fabrication to make corresponding flexible connector.The link of flexible device and equipment is designed to flat flexible winding displacement interface, can directly be connected with the flexible bus bar connector of equipment, and be convenient to change.Be designed to through-hole structure with the link of flexible device, as shown in Figure 1.
1. the flexible connector 1 of respective production is aimed at flexible device 2, as shown in Figure 1, the device that flexibly connects with through-hole structure places flexible device (flexible nervus) top, will weld site alignment.
2. use a spot of adhesive or glue that flexible device and flexible connector are fitted, as shown in Figure 2, guarantee that the welding site of flexible device and flexible connector does not misplace in follow-up operating process.
3. at the welding site drop hot curing conducting resinl of each correspondence, conducting resinl is communicated with the metal solder site of lower floor's flexible device and upper strata flexible connector, realizes conducting.As shown in Figure 3.
4. insert in 150 ℃ the baking oven, 30 minutes, conducting resinl is solidified, realize stable connection.
5. apply PDMS (dimethyl silicone polymer) in the welding site, the insulation that realizes respectively welding between the site is independent.If shown in 4.
The electric property of test nerve microelectrode, the conducting of each point and equipment is good, separate work insulated from each other between the each point.
This embodiment specifically describes flexible connector is connected flexible device with flexible device process.Utilize the MEMS micro fabrication to make corresponding flexible connector.The two ends of flexible connector all are designed to through-hole structure, are connected with two flexible devices, as shown in Figure 5.
1. the flexible connector of respective production is aimed at flexible device, as shown in Figure 5, the flexible device with through-hole structure places the flexible device top, will weld site alignment.
2. use a spot of adhesive or glue that flexible device and flexible connector are fitted, as shown in Figure 6, guarantee that the welding site of flexible device and flexible connector does not misplace in follow-up operating process.
3. at the welding site drop hot curing conducting resinl of each correspondence, conducting resinl is communicated with the metal solder site of lower floor's flexible device and upper strata flexible connector, realizes conducting.As shown in Figure 7.
4. insert in 150 ℃ the baking oven, 30 minutes, conducting resinl is solidified, realize stable connection.
5. apply PDMS (dimethyl silicone polymer) in the welding site, the insulation that realizes respectively welding between the site is independent.If shown in 8.Realize the connection between the flexible device.
In sum, flexible device interconnecting method of the present invention adopts the flexible connector with through-hole structure Realize being electrically connected of flexible device and external equipment or two kinds of flexible devices in conjunction with conducting resinl, with spun gold The ball bond technology is compared, and the pad structure is more firm, has higher reliability, nor can occur The problem that the spun gold pressure welding causes flexible device to produce pit or break need not stiff base as supporter; Compare with the method for direct scolding tin welding, homogeneity and the stability of this method are higher, and are more suitable for little Size, highdensity flexible device connects; And whole manufacture craft is simple, ripe, is easy to give birth in batches Produce.
Claims (10)
1, a kind of interconnecting method of flexible device is characterized in that comprising step: a) make the flexible connector with through hole feature welding site according to the size of flexible device; B), realize connecting conducting in welding site spot printing conducting resinl with the through hole welding site of flexible connector and the welding site alignment and the applying of flexible device to be connected; C) in welding site coating or deposited polymer with the junction insulation-encapsulated.
2, flexible device interconnecting method according to claim 1 is characterized in that flexible connector places on the flexible device to be connected in the described step b), realizes that both weld the aligning in site.
3, flexible device interconnecting method according to claim 1 is characterized in that described step b) conductive adhesive therewith is for based on the epoxide resin conductive adhesive of hot curing or a kind of based in the epoxy acrylic resin conducting resinl of photo-curing.
4, flexible device interconnecting method according to claim 1, it is characterized in that the described insulation-encapsulated of described step c) adopts coating polyimide or polydimethylsiloxanepolymer polymer, or polymer such as vapour deposition Parylene is realized between each welding site of flexible device and with the insulation of surrounding environment.
5, be used for flexible connector, it is characterized in that described flexible connector is the strip film, have polymer-metal-polymeric layer three-decker by the interconnection of the described flexible device of claim 1; Two ends are welding site or the connection site that metal level exposes, and the centre is the metal connecting line of embedding.
6, flexible connector according to claim 5 is characterized in that at least one end of described flexible connector has through hole welding site, and the other end is through hole welding site or is the metal bus-bar construction.
7, flexible connector according to claim 6, the shape of through holes that it is characterized in that described flexible connector is any in circle, ellipse and the polygon, and through hole welding site, its bottom polymer perforated area is less than upper strata polymer perforated area.
8,, it is characterized in that described flexible connector partly exposes at through hole welding site intermetallic metal according to claim 6 or 7 described flexible connectors.
9, flexible connector according to claim 5 is characterized in that:
(1) described polymer is any in polyimides, Parylene, polymethyl methacrylate and the dimethyl silicone polymer, and its thickness is 1 μ m～200 μ m;
(2) described metal is any in platinum, gold, silver, copper, aluminium, titanium and the chromium, and its thickness is
10, the application of flexible device connector according to claim 5 is characterized in that realizing the interconnection of flexible device and equipment or the interconnection between flexible device and flexible device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100551022A CN101599609A (en) | 2009-07-21 | 2009-07-21 | A kind of interconnecting method of flexible device and used flexible connector |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2009100551022A CN101599609A (en) | 2009-07-21 | 2009-07-21 | A kind of interconnecting method of flexible device and used flexible connector |
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| CN101599609A true CN101599609A (en) | 2009-12-09 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106799538A (en) * | 2016-12-09 | 2017-06-06 | 上海交通大学 | A kind of hot pressing connects method of flexible soft arranging wire and Parylene flexible electrode |
| CN112421257A (en) * | 2019-08-23 | 2021-02-26 | 日本航空电子工业株式会社 | Connector and connecting method |
| CN113658741A (en) * | 2021-07-26 | 2021-11-16 | 哈尔滨工业大学（深圳） | Connection structure, method for manufacturing connection structure, and flexible device |
-
2009
- 2009-07-21 CN CNA2009100551022A patent/CN101599609A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106799538A (en) * | 2016-12-09 | 2017-06-06 | 上海交通大学 | A kind of hot pressing connects method of flexible soft arranging wire and Parylene flexible electrode |
| CN106799538B (en) * | 2016-12-09 | 2019-11-01 | 上海交通大学 | A kind of hot pressing connects method of flexibility soft arranging wire and Parylene flexible electrode |
| CN112421257A (en) * | 2019-08-23 | 2021-02-26 | 日本航空电子工业株式会社 | Connector and connecting method |
| CN113658741A (en) * | 2021-07-26 | 2021-11-16 | 哈尔滨工业大学（深圳） | Connection structure, method for manufacturing connection structure, and flexible device |
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Application publication date: 20091209 |