CN101598852A - Oscillator arrangement, light deflector and the optical instrument that uses light deflector - Google Patents

Abstract

The optical instrument that the present invention relates to oscillator arrangement, light deflector and use light deflector can be on a large scale and carry out the adjusting of the moment of inertia or the centre of gravity place of oscillating component at a high speed.Wherein, this oscillating component is around vibration axis (17) vibration, and this oscillating component comprises moving element (11) and quality adjustment parts (19), between moving element (11) and quality adjustment parts (19), be limited with cavity (30), thereby, by quality adjusting portion part (19) is carried out laser beam irradiation, partly being removed with the adjoining part of cavity of these quality adjustment parts should want removed part to comprise in the described quality adjustment parts not by the part of laser beam irradiation.

Description

Oscillator arrangement, light deflector and the optical instrument that uses light deflector

The application be based on the applying date be that June 7, application number in 2007 are 200710109624.7, name is called the dividing an application of application of " oscillator arrangement, light deflector and the optical instrument that uses light deflector ".

Technical field

The present invention relates to: a kind of oscillator arrangement, this oscillator arrangement have the supported moving element that is used for vibratory movement; A kind of light deflector with this oscillator arrangement; A kind of optical instrument that for example uses this light deflector, for example imaging device or display device; And a kind of method of making oscillation device.Light deflector of the present invention is suitable for use in based on the light deflection scanning and the neutralization of the projection display equipment of projected image for example has in the imaging device of the laser beam printer of electrophotographic processes or digital copier.

Background technology

For such light deflector, various types of optical scanning systems or optical scanner have been proposed, in this optical scanning system or the optical scanner, the moving element with reflecting surface vibrates so that light deflection sinusoidally.Compare with the scanning optics that adopts rotating polygonal shaped mirror (polygonal catoptron), have based on resonance phenomena and the optical scanning system of the light deflector of sine-wave oscillation has following favourable feature.That is, can the size manufactured place of light deflector is very little; Energy consumption is very low; These light deflectors of particularly being made by monocrystalline silicon and being produced by semiconductor technology do not have metal fatigue in theory and have good durability.

In such light deflector,, pre-determined the frequency of the built-in oscillation pattern that expectation reaches for the driving frequency of expectation based on resonance phenomena.Exist some to be used to make the better proposal of the method for light deflector.

Open (Laid-Open) patented claim No.2002-40355 of Japanese unexamined discloses a kind of method, wherein, adopted the plane galvanic reflex mirror that comprises movable platen, this movable platen has reflecting surface and coil, and flexibly supported, carry out vibratory movement to reverse axis relatively, and wherein, the galvanic reflex mirror has the mass loading part at the opposed end place that is formed on described movable platen.Laser beam is incident upon on this mass loading part, removing its quality, thereby adjusts moment of inertia (moment of inertia).Realize required frequency thus.

Japanese unexamined publication application No.2004-219889 discloses a kind of method, and wherein, movable platen is coated with for example mass member of typical resin, adjusts frequency based on principle similar to the above.

Summary of the invention

In above-mentioned method,, then require a great deal of time and adjust process if should carry out a large amount of adjustment.In addition, adopt the adjustment principle of in these methods, using, be very difficult to rapidly and side by side adjust frequency and centre of gravity place.

According to an aspect of the present invention, these inconveniences can be eliminated by the method for making such oscillator arrangement, this oscillator arrangement has oscillating component, resiliency supported portion and support component, and this oscillating component is flexibly supported to vibrate around the vibration axis by resiliency supported portion.The method is characterized in that: the quality adjustment parts of regulating the quality of this oscillating component with moving element and being used to form described oscillating component, form cavity simultaneously between the part of this moving element and these quality adjustment parts; Adopt these quality adjustment parts of laser beam irradiation then, partly to remove the material that is adjacent to this cavity of these quality adjustment parts.The material of described such removal comprise the quality adjustment parts not by the part of laser beam irradiation.

According to a further aspect in the invention, the invention provides a kind of method of making oscillator arrangement, this oscillator arrangement comprises oscillating component, resiliency supported portion and support component, this oscillating component is flexibly supported to vibrate around the vibration axis by this resiliency supported portion, described method is characterised in that: form described oscillating component by moving element, this moving element has the teat that is used to regulate this oscillating component quality, and this teat extends along the direction that is parallel to this vibration axis from this moving element; And laser beam projected the location of cut of this teat, thereby partly remove this moving element, the part of removal comprise the scope of this teat extend to from this cutting position this teat the end not by laser beam irradiation to part; Wherein, adjust the amount of the removal that realizes by the laser beam projection by controlling this cutting position.

According to a further aspect in the invention, the invention provides a kind of method of making oscillator arrangement, this oscillator arrangement has oscillating component, resiliency supported portion and support component, this oscillating component is flexibly supported to vibrate around the vibration axis by this resiliency supported portion, described method is characterised in that: form described oscillating component by moving element, this moving element has a plurality of teats that are used to regulate the quality of this oscillating component, and described teat is arranged on the relative both sides of this vibration axis; Cut at least one described teat along line of cut, thereby partly remove this moving element, removal comprises that the scope of this teat extends to the part of the end of this teat from this line of cut; Wherein, the position of this line of cut is controlled, with moment of inertia and the center of gravity of this oscillating component and the deviation distance of this vibration axis of adjusting this oscillating component.

According to a further aspect of the invention, the invention provides a kind of oscillator arrangement, it comprises: oscillating component; Resiliency supported portion; And support component, wherein, described oscillating component is flexibly supported by described resiliency supported portion, with around the vibration of vibration axis; Wherein, described oscillating component has moving element and is used to regulate the quality adjustment parts of described oscillating component quality; And wherein, between the part of described moving element and described quality adjustment parts, form cavity.

According to another aspect of the invention, the invention provides a kind of oscillator arrangement, it comprises: oscillating component; Resiliency supported portion; And support component, wherein said oscillating component is flexibly supported by described elastomeric element, to vibrate around the vibration axis; Wherein, described oscillating component comprises moving element, and this moving element has the teat that is used to regulate described oscillating component quality; Wherein this teat extends along the direction that is parallel to this vibration axis from described moving element; And wherein, this teat is constant along the cross-sectional area that hangs down as for the plane of this vibration axis on the direction of axis of vibrating.

According to another aspect of the present invention, the present invention proposes a kind of oscillator arrangement, it comprises: oscillatory system; And the drive unit that is used to drive described oscillatory system; Wherein said oscillatory system comprises first oscillating component, the first resiliency supported portion, second oscillating component, the second resiliency supported portion; And support component; Wherein, described first oscillating component comprises first moving element, and this first moving element has the teat that is used to regulate the described first oscillating component quality; Wherein, described second oscillating component comprises second moving element, and this second moving element has the teat that is used to regulate the described second oscillating component quality; Wherein, on in described first and second moving elements each, described teat extends along the direction that is parallel to this vibration axis from its moving element, and this teat is constant along the cross-sectional area perpendicular to the plane of this vibration axis on the axis direction that vibrates; Wherein, described first moving element is supported by described second moving element via the described first resiliency supported portion, to vibrate around the vibration axis; Wherein, described second moving element via the described second resiliency supported portion by described supporting units support, with around vibration axis vibration; And wherein said oscillatory system has at least two built-in oscillation patterns that frequency is different.

According to another aspect of the invention, the invention provides a kind of oscillator arrangement, it comprises: oscillating component; Resiliency supported portion; And support component; Wherein said oscillating component is flexibly supported by described resiliency supported portion, with around the vibration of vibration axis; Wherein, described oscillating component comprises moving element, and this moving element has a plurality of teats that are used to regulate described oscillating component quality; Wherein, each teat forms in couples, and the every pair of teat is arranged on the position with respect to this vibration axis symmetry; Wherein, these teats that are arranged on the symmetric position place have configurations differing from one; And wherein, the center of gravity of described oscillating component is arranged on the vibration axis.

According to another aspect of the invention, the invention provides a kind of oscillator arrangement, it comprises: oscillatory system; And the drive unit that is used to drive described oscillatory system; Wherein said oscillatory system comprises first oscillating component, the first resiliency supported portion, second oscillating component, second resiliency supported portion and the support component; Wherein said first oscillating component comprises first moving element, and this first moving element has a plurality of first teats that are used to regulate the described first oscillating component quality; Wherein said second oscillating component comprises second moving element, and this second moving element has a plurality of second teats that are used to regulate the described second oscillating component quality; Wherein said a plurality of first teat and described a plurality of second teat are arranged on the position with respect to vibration axis symmetry respectively; Wherein, in described a plurality of first teat and/or described a plurality of second teat be arranged on the symmetric position place those have configurations differing from one; Wherein, the center of gravity of the center of gravity of described first oscillating component and described second oscillating component is arranged on the vibration axis; Wherein, described first moving element is flexibly supported by described second moving element via the described first resiliency supported portion, to vibrate around the vibration axis; Wherein, described second moving element is flexibly supported by described support component via the described second resiliency supported portion, to vibrate around the vibration axis; And wherein, described oscillatory system has at least two built-in oscillation patterns that frequency is different.

According to another aspect of the invention, the invention provides a kind of imaging device, it comprises: light source; Light deflector based on above-mentioned oscillator arrangement; And photosensitive-member, wherein said light deflector makes the light deflection from described light source, so that at least a portion of described light incides on the described photosensitive-member.

According to another aspect of the invention, the invention provides a kind of image display unit, it comprises: light source; Light deflector based on aforesaid oscillator arrangement; And image display part, wherein, described light deflector will be from the light deflection of described light source, so that at least a portion of described light incides on the described image display part.

In brief, at the oscillator arrangement of the light deflector that for example is used for carrying out optical scanning with make the method for such oscillator arrangement, oscillating component can comprise moving element and quality adjustment parts, and can form cavity between this moving element and this quality adjustment parts.Adopt this layout, can promptly remove relatively large quality.In addition, moving element can be formed with the teat that is used for quality adjustment, and this guarantees to remove apace relatively large quality.This guarantees to regulate with bigger range of adjustment and higher speed moment of inertia or its centre of gravity place of this oscillating component.

Description of drawings

Consider the following explanation of the preferred embodiment of the present invention in conjunction with the accompanying drawings, it is more apparent that these and other purposes, features and advantages of the present invention become.

Figure 1A is the planimetric map of the light deflector of first example that can work according to the present invention.

Figure 1B is the planimetric map in that side that does not have reflecting surface of the oscillatory system of first example that can work.

Fig. 2 is a cut-open view, and it shows oscillating component and drive unit in the example that the present invention first can work.

Fig. 3 is a cut-open view, has shown according to the present invention the another kind of structure of the oscillating component of first example that can work.

Fig. 4 A is the planimetric map of the light deflector of second example that can work according to the present invention.

Fig. 4 B is the planimetric map of the oscillatory system of second example that can work in a side that does not form reflecting surface.

Fig. 5 is a cut-open view, the oscillating component of the example that it is used for illustrating that the present invention second can work.

Fig. 6 is a cut-open view, the resiliency supported portion of the example that it is used for illustrating that the present invention second can work.

Fig. 7 A is a planimetric map, and it is used for illustrating a process according to laser beam process of the present invention.

Fig. 7 B is a planimetric map, and it is used for illustrating another process according to laser beam process of the present invention.

Fig. 7 C is a cut-open view, and it is used for explanation and the corresponding process of Fig. 7 B.

Fig. 8 is a synoptic diagram, and it is used to illustrate that according to the present invention second example manufacturing that can work has the process of the moving element of groove.

Fig. 9 is a synoptic diagram, and it is used to illustrate that according to the present invention second example that can work is used to make the process of torsionspring.

Figure 10 A is the planimetric map of the oscillatory system of the 3rd example that can work according to the present invention.

Figure 10 B is the planimetric map of the quality adjustment parts of the 4th example that can work according to the present invention.

Figure 11 is a curve map, and it is used for illustrating the angle of slip of first moving element of the oscillator arrangement of the 3rd example that can work according to the present invention.

Figure 12 is a curve map, and it is used for illustrating the angular velocity of first moving element of the oscillator arrangement of the 3rd example that can work according to the present invention.

Figure 13 is a partial plan layout, and it shows first moving element and the teat of the example that the present invention the 3rd can work.

Figure 14 is the planimetric map of the oscillator arrangement of the 5th example that can work according to the present invention.

Figure 15 is the planimetric map of driving substrate of the oscillator arrangement of the 5th example that can work according to the present invention.

Figure 16 is the cut-open view of the oscillator arrangement of the 5th example that can work according to the present invention.

Figure 17 is the planimetric map of the oscillator arrangement of the 6th example that can work according to the present invention.

Figure 18 is the cut-open view of the oscillator arrangement of the 6th example that can work according to the present invention.

Figure 19 is the skeleton view of the optical instrument with light deflector of the example that can work according to the present invention.

Figure 20 is the skeleton view of the light deflector of known type.

Embodiment

Referring now to accompanying drawing the preferred embodiments of the present invention are described.

Below a preferred embodiment of the present invention will be described.Oscillator arrangement according to this embodiment can have the oscillating component that at least one is arranged to center on the vibration of vibration axis.This oscillating component can comprise moving element, and this moving element has the quality adjustment parts of the quality that is used to regulate this oscillating component.Cavity can be formed between moving element and the quality adjustment parts.By this cavity, the part of these quality adjustment parts can be held in this moving element spaced apart.This cavity can be formed in groove or the notch on moving element or the quality adjustment parts.

This oscillator arrangement can comprise oscillatory system and be used to drive the drive unit of this oscillatory system.This oscillatory system can comprise for example aforesaid oscillating component, support component and resiliency supported portion.This moving element can flexibly be supported by this resiliency supported portion, thereby can vibrate with respect to support component around the vibration axis.This moving element can have reflecting surface (light deflection element), so that light deflector to be provided.

In the method for Production Example such as aforesaid oscillator arrangement, in order to carry out around the adjusting of the frequency of at least one built-in oscillation pattern of vibration axis with at least one with respect to the adjusting of vibration axis and in aiming at of the centre of gravity place of this oscillating component, can carry out following program, wherein above-mentionedly be used to make described frequency and target frequency to mate the adjusting of frequency around at least one built-in oscillation pattern of vibration axis.For example, can cut away the part on the cavity of being suspended at of quality adjustment parts by laser beam.About the shape of the described part on the described cavity of being suspended at of quality adjustment parts, the part of these quality adjustment parts can extend across cavity or it can be used as teat in this ground, cavity top extension.In the latter's situation, in case set the quality of position (leaving the distance of vibration axis) and teat, then can detect in advance by cutting off teat (for example, by adopting the base portion of laser beam cutting teat) moment of inertia that can obtain or the regulated quantity of centre of gravity place.If for example aforesaid a plurality of cavitys and teat are set, then can be very accurately and promptly regulate moment of inertia or centre of gravity place.

Especially, in this embodiment, the quality adjustment parts can be arranged on the moving element, and this does not need to enlarge the surface area of moving element.Therefore, the quality adjustment parts can be set and can during vibration axis vibration, not increase the resistance of air at moving element.

In making the method for oscillator arrangement according to another embodiment of the present invention, when making laser beam follow the usual practice tubular shape (curve of sealing) scan-type ground deflection as circumference, laser beam can project the quality adjustment parts with the separated part of moving element on, removing the material that is shone by laser beam of quality adjustment parts, thereby provide oscillating component.Since the ring that is closed of quality adjustment parts institute around zone (this zone is not by laser beam irradiation) and moving element separate, so it can be removed.This means, around the moment of inertia of vibration axis, deducted by the amount of removing the moment of inertia that is partly produced from oscillating component.Perhaps, owing to reduced and the corresponding quality of removal part, so barycentric subdivision is regulated.

Adopt this mode, can control the frequency of built-in oscillation pattern of oscillatory system or the centre of gravity place of this oscillatory system as required.That is,, can regulate moment of inertia or barycentric subdivision as required by the volume and the position of the part selecting suitably from the quality adjustment parts, to remove.Especially, density by selecting the quality adjustment parts suitably (for example, remain less by proportion or relative density with the quality adjustment parts), the resolution of frequency adjustment be can select as required, and the resolution of volume to be removed or the resolution that is used to locate do not considered.In addition, because the existence of cavity, so when laser beam is projected to along closed curve removal quality, can remove the part of the quality of surrounding simultaneously by closed curve.Therefore, can remove more quality quickly.

This has guaranteed to regulate moment of inertia or centre of gravity place in relatively large range of adjustment and with higher speed.In addition, because the existence of cavity can only accurately be removed the quality adjustment parts by laser beam irradiation, and can not be removed the material of any moving element.Therefore, guaranteed high-precision adjusting.That is,, then during laser beam irradiation, may remove the part that just in time is positioned at the moving element under the quality adjustment parts if there is not such cavity.Cavity the generation that can guarantee to avoid this situation is set.

Having the oscillator arrangement of being arranged to around the oscillating component of vibration axis vibration can be as the realization of getting off.In this embodiment, oscillating component can comprise the moving element with teat, and this teat is used for regulating the quality of oscillating component.That is, in this embodiment, the quality adjustment parts may not be independent settings, but the part of moving element itself can be used to realize the quality adjustment functions of components.About the shape of this teat, example can be along the teat that is parallel to the extension of vibration axis, and can be the teat that extends along perpendicular to the vibration axis.As a kind of replacement scheme, moving element can form trapezoidal (trapezoidal shape) or spindle (spindle like shape), and can be with its acute corners as teat.

Especially,, will throw thereon cutting position, and can make from this cutting position and be regulated to the removal amount of teat end by the adjusting laser beam about the teat that extends along the direction that is parallel to the axis that vibrate.

In addition, according to this embodiment, the size of laser beam machining area can be constant in less, and does not need to consider that removal amount is greatly or little.Therefore, even enlarged removal amount, also the heat transfer to oscillator arrangement that laser beam processing can be produced keeps lessly.

In addition, by meticulous adjusting cutting position, can improve the resolution of the amount of removing.Therefore realize wide adjusting range and resolution clearly simultaneously.In addition, about the section perpendicular to the vibration axis, teat can have uniform section shape, and this section shape is consistent on the direction of vibration axis.At this moment, length from cutting position to the teat end and oscillating component have approximately proportional relation around the moment of inertia regulated quantity of vibration axis.Therefore, can regulate moment of inertia easily.

All teats can extend on the direction that is parallel to the axis that vibrates.Extend on direction with teat this moment and compare, reduce the angle of slip of vibration or the instability of phase place perpendicular to the vibration axis.This is because this instability can be attributed to the variation that is applied to the resistance on the oscillating element from ambient atmosphere.Especially in the oscillator arrangement of about some millimeters very small dimensions, the variation of air resistance is very serious problem and is very significant (velocity of displacement height) when this equipment has a part away from the vibration axis.If all teats are parallel to the vibration axis, so not only the quick adjustment of scanning stabilization but also moment of inertia realizes simultaneously.Both made under teat only is formed at locational situation away from the oscillating element of axis of oscillation line and also can obtain this point effectively.

Little handling procedure by the based semiconductor manufacturing technology can monolithic whole ground be made the teat of moving element and oscillating component.Therefore the oscillating component with moment of inertia governor motion can very accurately be made.

Oscillator arrangement can comprise oscillatory system and in order to drive the drive unit of oscillatory system, oscillatory system has two and is arranged to around the oscillating component of vibration axis vibration.In this embodiment, first oscillating component can comprise first moving element that has at the upwardly extending teat in side that is parallel to the axis that vibrates.Similarly, second oscillating component can comprise second moving element that has at the upwardly extending teat in side that is parallel to the axis that vibrates.About the section (that is to say section perpendicular to vibration axis) of vibration axis as normal, the area of section that is formed on each teat on first and second oscillating components is constant on the direction of vibration axis.Oscillatory system can have two intrinsic mode of oscillation around the vibration axis.In this embodiment, the cutting position that the correspondingly laser beam of the teat by regulating first and second moving elements will be projected onto can be regulated the amount of removing.

Because first and second oscillating components all have and are being parallel to the upwardly extending teat in side of the axis that vibrates, this vibration axis is the common axis of oscillatory system, and identical cut direction can be used for first and second moving elements.Therefore simplify cutting equipment.

In the method for making aforesaid oscillator arrangement, for not only carry out at least one around the adjusting of the frequency of the built-in oscillation pattern of vibration axis so that this frequency and target frequency are mated, and carry out the adjusting of oscillating component center of gravity simultaneously, can carry out following program.The part of the teat that stretches out from moving element can be excised.For example it can excise by laser beam.By regulating the cutting position that laser beam will project, can regulate the amount of removing from cutting position to the teat end.A plurality of teats can be formed on about the vibration axis symmetric position on, have the symmetry shape.Certainly, these teats that are provided with in pairs have the different amounts of removing, so their net shape is different.

By removing at least a portion of teat, the moment of inertia of oscillating component can be regulated according to the amount of removing.Because the paired asymmetric relation of the amount of removing of teat, the oscillating component center of gravity can be regulated simultaneously with the offset distance of vibration axis in addition.At this moment, can obtain to produce similar favourable passing through and remove the obtainable advantage of teat as mentioned above.Owing to moment of inertia, center of gravity can utilize identical teat to regulate with offset distance, can handle very fast in addition.In addition, the quantity of the teat that is used to regulate can be less, and therefore the moment of inertia and the quality of oscillating component can be less.Therefore oscillator arrangement as a whole can be compact.Because less at the air resistance that the duration of oscillation is applied on the oscillating component, the oscillatory stability of oscillating component significantly improves.

Having the oscillator arrangement of being arranged to around the oscillating component of vibration axis vibration can followingly implement.In this embodiment, all teats of oscillator arrangement can be parallel to the vibration axis and extend, and can be constant on the direction of vibration axis perpendicular to the area of section of vibration axis.These are arranged to can have different length mutually about the locational teat of vibration axis symmetry.

According to this embodiment, the summation of removing length relates to the regulated quantity of moment of inertia, and the ratio of removing length of teat relates to the regulated quantity of the offset distance of oscillating component center of gravity and vibration axis.Therefore the shape about removing from each teat, in case determining total amount on the basis of moment of inertia regulated quantity and on the basis of offset distance regulated quantity, determining to remove the ratio of length that so not only moment of inertia but also centre-of gravity shift distance can be regulated simultaneously.At this, the moment of inertia regulated quantity is proportional relation with removing the length total amount.Therefore, moment of inertia regulated quantity and centre-of gravity shift distance adjustment amount can be determined easily and accurately.

In this case, the obtainable similar favourable result of teat that can pass and be parallel to the axis that vibrates.By little handling procedure of based semiconductor manufacturing technology, a plurality of teats of moving element and oscillating component can be made on monolithic integrated circuit ground again.Therefore, the structure that allows high precision to regulate moment of inertia and centre-of gravity shift distance provides easily.

Having the oscillator arrangement of being arranged to around the oscillating component of vibration axis vibration can followingly implement.In this embodiment, can be arranged on the moving element as the permanent magnet of drive unit, so that, can drive moving element with magnet to making response in the electromagnetic force that the oscillatory system outside applies from coil.In this embodiment, permanent magnet can be arranged on the moving element, and the center of gravity of permanent magnet can depart from the vibration axis.For example owing to handle mistake, the desired location of permanent magnet can depart from random, causes deviation of gravity center.But by removing at least a portion that is formed at the teat on the moving element by being similar to above-mentioned mode, the center of gravity of moving element can depart from the vibration axis and offset by the deviation of gravity center of moving element with the deviation of gravity center of guaranteeing permanent magnet.That is to say that by following at least a portion of removing teat, these skews can be cancelled out each other.Be that teat can be removed like this, make (i) from the permanent magnet center of gravity to the intersection point between vibrate axis and the line segment that is connected permanent magnet and moving element distance and (ii) be approximately equal to the quality inverse ratio of permanent magnet and moving element to the ratio between the distance of aforementioned intersection point from the moving element center of gravity.By this program, the center of gravity of oscillating component can be placed on the vibration axis as a whole.

As mentioned above, in the small size oscillator arrangement that comprises based on the drive unit of the electromagnetic force that can drive oscillating component significantly, the adjusting of the adjusting of frequency and the offset distance of center of gravity can be carried out simultaneously.The magnetic characteristic of permanent magnet can reduce easily by heating.Consider this point, the embodiment that the above-mentioned amount of removing does not greatly need to enlarge machining area is very useful, and benefit is to make because the heat that laser beam processing causes is transmitted less and has been to finish the moving element that has the permanent magnet with good magnetic characteristics.

Can comprise oscillatory system and in order to drive the drive unit of oscillatory system, wherein this oscillatory system comprises that two are arranged to around the oscillating components of vibration axis vibration as the oscillator arrangement that can be different from previous embodiment slightly.In this embodiment, first oscillating component can comprise having a plurality of first moving elements at the upwardly extending teat in side that is parallel to the axis that vibrates.Similarly, second oscillating component can comprise having a plurality of second moving elements at the upwardly extending teat in side that is parallel to the axis that vibrates.Oscillatory system can have two intrinsic mode of oscillation around the vibration axis.The cutting position that the laser beam of each teat by regulating first and second moving elements will project, the amount of removing of these teats can be regulated.Because first and second oscillating components have and are being parallel to the upwardly extending teat in side of the axis that vibrates, this vibration axis is the common axis of oscillatory system, and identical cut direction can be used for first and second moving elements.Therefore simplify cutting.

In one embodiment, wherein as mentioned above, oscillating component comprises that moving element and cavity with the quality adjustment parts that are used to regulate its quality are limited between moving element and the quality adjustment parts, and frequency adjustment and centre-of gravity shift distance adjustment be following carrying out simultaneously.Be the quality adjustment parts can be arranged on the vibration axis the opposite, and the amount of removing of these quality adjustment parts and with the vibration axis distance can determine as described above that this is based on moment of inertia regulated quantity and centre-of gravity shift distance adjustment amount.Determine based on this then, can remove a part of quality adjustment parts.By this program, can be simply and very accurately carry out frequency adjustment and centre-of gravity shift distance adjustment.

Moving element can be provided with reflecting surface constituting light deflector, and it can be used as the light deflector that well is tuned to desired frequency or barycentre offset, is used for imaging or image and shows.If the frequency of built-in oscillation pattern is good tuning because this light deflector can drive with high amplitude amplification coefficient, this equipment can be compactness and can drive with low power consumption.In other words, if the side-play amount of center of gravity and vibration axis is good tuning, the vibration axis is difficult to change in scan period.Therefore, the reduction of performance for example the reproducibility crooked or that reduce of sweep trace can avoid well.

Adopt the imaging device of this light polarizer can comprise light source, for example aforesaid light polarizer and photosensitive-member, wherein light polarizer can deflection from the light of light source, make at least a portion light to incide on the photosensitive-member.

Adopt the picture reproducer of this light polarizer can comprise light source, for example aforesaid light polarizer and video picture parts, wherein light polarizer can deflection from the light of light source, make at least a portion light incide on the video picture parts.

Especially, oscillatory system can comprise that two oscillating components and reflecting surface can be arranged on the moving element of one of them oscillating component so that light polarizer is provided.In this embodiment, for imaging or video picture, it is utilizable having two light polarizers around the built-in oscillation pattern of vibration axis that well are tuned to two times or treble frequency relation.This light polarizer is not only aspect its available large amplitude amplification coefficient driving but also by being favourable based on driving aspect the homogeneity of the angular velocity that improves optical scanning by the composite wave of aforementioned frequency relation of sine wave.Therefore, reflecting surface is owing to the distortion of the change of the angular velocity in the duration of oscillation can well be avoided.In addition, the heterogeneity ground of angular velocity is set because the modulation of the light source that forms for luminous point regularly can need not to worry, and simplifies modulation circuit.

If barycentre offset is good tuning in addition, may be because undesirable oscillation and fluctuation that the coupling of the independence of two built-in oscillation patterns of obstruction oscillatory system causes be good the reduction.This oscillation and fluctuation can be by lowering the center of gravity side-play amount and reduce by the relation that two built-in oscillation patterns are tuned to " integer multiply ".Because this oscillation and fluctuation can cause oscillating component and center on the change of angular velocity of vibration axis and the instability that causes optical scanning that they should be avoided.The example that specifically can work of the present invention is described with reference to the accompanying drawings.

[first example that can work]

Figure 1A, 1B and 2 show the light polarizer by first example that can work of oscillator arrangement of the present invention.Figure 1A is the planimetric map of light polarizer, and Figure 1B is the planimetric map of the oscillatory system seen from the back side of Figure 1A.Fig. 2 is the cut-open view of the line A-A in Figure 1A.In this example that can work, a pair of quality adjustment parts (mass adjusting member) 19, reflecting surface 22 and a pair of cavity 30 are formed on the moving element 11, to constitute oscillating component 41.Oscillatory system comprises this oscillating component 41, a pair of resiliency supported portion 12 and support component 13.

At first with reference to these accompanying drawings, the drive principle in this example that can work of explained later and the structure of this example.In this example, being shown in the drive unit that the oscillatory system among Figure 1A and the 1B will describe by the back produces around the torsional oscillation of vibration axis 17.Moving element 11, resiliency supported portion 12 and support component 13 are integrally made by monocrystalline silicon substrate by means of photolithography technology and etch process by semiconductor making method.Therefore can make very little oscillatory system relatively inexpensively.In addition because monocrystalline silicon has high Young modulus (Young ' smodulus) and little density, because of the conduct oneself with dignity distortion that causes of moving element very little.Therefore be implemented in the oscillatory system that has big amplitude amplification coefficient during the resonance.In this example that can work, moving element 11 has the size of 3mm on the direction perpendicular to vibration axis 17 and is being parallel to the size that has 1mm on this direction.The whole length of oscillatory system is approximately 12mm.

Moving element 11 is flexibly supported by paired resiliency supported portion 12, is used for around the torsional oscillation of vibration axis 17.Paired quality adjustment parts 19 are arranged on the relative both sides of vibration axis 17 with paired cavity 30.

Be formed on reflecting surface 22 on the moving element 11 and be used in response to reversing of moving element 11 deflection of scan-type ground from the light of light source.Reflecting surface 22 is made of aluminum and form by vacuum evaporation.Reflecting surface can for example gold or copper become by any other material.Protective film can be molded on the surface of its top.Because moving element 11 should be formed with this reflecting surface 22, its flatness (flatness) during driving is a particular importance at this.The moving element 11 of this example supports by means of paired resiliency supported portion (torsionspring) 12 at its relative two ends.Therefore compare with the support portion of single spring, because the distortion that its deadweight causes can well be avoided and can keep flatness preferably.

Fixed part 150 shown in Figure 2 and drive unit.As shown in the figure, the drive unit of this example that can work comprises the fixed coil 152 that is fixed to fixed part 150 and is arranged at permanent magnet 151 on the back of moving element 11 of oscillating component 41.Shown in Figure 1B and 2, the permanent magnet 151 of oscillating component 41 is similar Prism-Shaped metal magnets, for example has the length of about 2mm and the section size of 150 μ m * 150 μ m.The polarization of permanent magnet 151 (magnetization) direction along its length direction extend and by adhesive to moving element 11.

As shown in Figure 2, fixed part 150 is used for suitably keeping the position of oscillatory system and permanent magnet 151 and the position of fixed coil 152.In response to driving applying of AC electric current, fixed coil 152 is created in the alternating magnetic field on the direction of the arrow H that is shown among Fig. 2.Because magnetic flux density (the magnetic flux density) direction of permanent magnet 151 is on the direction of arrow B, the magnetic field that is produced by fixed coil 152 produces around the moment of vibration axis 17, and therefore oscillatory system is activated.

More specifically explain drive principle below according to the light polarizer of this example that can work.About the torsional oscillation around vibration axis 17, it is f that the oscillatory system of this example has frequency ₁The built-in oscillation pattern.This built-in oscillation pattern can be by calculating based on the relation of equation (1), the frequency of the built-in oscillation pattern of expression torsional oscillation system under this equation, wherein I is oscillating component 41 moment of inertia around vibration axis 17, and K is paired resiliency supported portion 12 spring constants around vibration axis 17.

${\mathrm{<figure-callout\; id="1"\; label="f"\; filenames="A2009101329460044H1.png,A2009101329460044H2.png"\; state="\{\{state\}\}">f</figure-callout>}}_1=1/2\mathrm{\&pi;}\&CenterDot;\sqrt{(K/I)}---\left(1\right)$

Wherein

The square root of expression (K/I).If the damping term of oscillatory system (dampingterm) (for example air resistance) is little, equation (1) provides enough being similar to.The ratio of damping of the oscillatory system of the example that this can be worked is about 0.003.Fixed coil 152 is according to reference frequency f ₀Drive oscillatory system, this reference frequency be by as the target drives frequency determined of the concrete condition of the light polarizer that applied.If frequency f ₁With reference frequency f ₀Coupling, oscillatory system can be activated at the crest amplitude amplification coefficient point place of built-in oscillation pattern.

But because various error factors for example dispersing of fabrication error or physical characteristics of materials, for example frequency f ₁May depart from reference frequency f ₀Consider this point, quality adjustment parts 19 are partly removed the moment of inertia I with the oscillating component 41 in the adjusting equation (1), so tuned frequency f ₁, make its coupling reference frequency f ₀In this example that can work, quality adjustment parts 19 are provided with to moving element 11 by adhering to the aluminium flat board, shown in Figure 1A, 1B and 2.

As mentioned above, based on from quality adjustment parts 19 remove the part volume and with the vibration axis 17 distance, the regulated quantity of moment of inertia can be increased or reduce.For example suppose frequency f ₁Certain error range, moment of inertia I and spring constant K can set like this, make the frequency f with this error range ₁Keep below reference frequency f ₀Whereby, frequency f ₁Can be tuned to reference frequency f ₀As an example, before partly removing quality adjustment parts 19, the amplitude of moving element 11 can be measured when inswept driving frequency.The suitable amount of removing of expectation can be determined thus.Therefore by suitably setting the density of quality adjustment parts 19, frequency f ₁Adjusting resolution (adjustment resolution) can with set independently about the volume of the part that will be removed and with the resolution of the distance of vibration axis 17.

In addition, in this example that can work, quality adjustment parts 19 are on the surface that is arranged on plane tabular moving element 11, and this surface is on the side relative with that side that permanent magnet 151 is installed.This structure reduces center of gravity and any skew of vibration axis 17 and the vibration that reduction is not expected of oscillating component 41 effectively.And by partly removing quality adjustment parts 19, the center of gravity of oscillating component 41 can reduce with any skew of vibration axis 17.As an example, observe laser beam and can project on the reflecting surface 22, and, can observe around the track of the torsional oscillation of vibration axis 17 by observing the track of scanning.Then by partly removing quality adjustment parts 19 so that reduce the vibration do not expect, deviation well can lower the center of gravity.

Next, with reference to the accompanying drawings the process of partly removing quality adjustment parts 19 is explained in detail.The moving element 11 of the example that this can be worked is formed with cavity 30, and as shown in Figure 1B, described cavity is formed by through hole.Owing to be provided with these cavitys 30, as shown in Figure 2, quality adjustment parts 19 have just had the zone that does not bond on the moving element 11.These cavitys 30 form by dry ecthing when forming oscillatory system by monocrystalline silicon substrate.

The synoptic diagram of Fig. 7 A-7C is used for explaining the process of partly removing quality adjustment parts 19 in this example that can work.In this example that can work, pulsed laser irradiation is partly removed quality thus to the processed part of wanting of quality adjustment parts 19.Fig. 7 A is the planimetric map of sample in the starting stage of laser beam processing.The planimetric map of Fig. 7 B shows the state of this process after Fig. 7 A condition.Fig. 7 C is the cut-open view that the hatching line C-C in Fig. 7 B obtains.Can see that from Fig. 7 C because the existence of cavity 30, quality is removed part 85-as the part that does not bond to the not bonding region on the moving element 11 of quality adjustment parts-can be removed at last.

At first, shown in Fig. 7 A, thereby processing laser beam spots 80 moves the ring (curve of sealing) of depicting an arc along rotation direction 83 along machining locus 82 scannings.Processing laser beam spots 80 is regulated the output quantity and the pulsed frequency emission of parts 19 to be suitable for crudy.As shown in FIG., by this processing laser spot 80, just form processed part 81 along machining locus 82.

Fig. 7 B shows the state processing laser spot 80 has circulated suitable number of times along machining locus 82 after.As shown in the figure, form an opening that runs through 84 along machining locus 82.To this, the form with sectional view in Fig. 7 C illustrates.Processing laser beam spots 80 further circulates along machining locus 82, thereby removes the periphery that quality is removed part 85 along the ring of described arc.Because because the existence of cavity 30, quality is removed part 85 and is not bonded to moving element 11, shown in Fig. 7 C, so with above-mentioned process, quality is removed part 85 and separated and removal from moving element 11.

In above-mentioned process, if the diameter of machining locus 82 is increased, then more quality can be removed with higher speed.In fact, the shape of machining locus 82 is not limited to above-described arc ring.

According to the above-mentioned example of working, because the result of the existence of cavity 30 can be removed fast than the volume that the volume of being removed with the laser beam direct irradiation is long-range.This can make the centre of gravity place adjustable extent of the frequency adjustable scope that is used for the built-in oscillation pattern and oscillatory system increase, and can regulate at a high speed.And the setting of cavity 30 can make processes any part of only removing quality adjustment parts 19 and not removing moving element 11 by laser beam.Thus, the center of gravity of the adjusting of the built-in oscillation mode frequency of oscillatory system and oscillatory system is regulated and can very accurately be carried out.

And, since cavity 30 in the example that originally can work with the form setting of the through hole that is formed at moving element 11, quality adjustment parts 19 can have the shape on plane.This helps bonding assembling.Quality adjustment parts 19 in this example that can work can be made by following material, and such as metal, dielectric material or semiconductor material, described material for example absorbs the processing laser beam.

Moving element 11 in this example that can work and quality adjustment parts 19 can have shape as shown in Figure 3.Fig. 3 cuts the cut-open view of acquisition open for Figure 1A Vertical Centre Line A-A.Compare with the example of Fig. 2, in the structure shown in Fig. 3, cavity 30 is formed in the quality adjustment parts 19.Even in this case, the similar advantageous effects about the quality removal aspect of using laser beam irradiation also can obtain.

Oscillator arrangement according to the example that this can be worked of the present invention is described with reference to the light deflector that is used to reflect with deflection.Yet it can be applied to sensor etc., and affiliated sensor etc. are used to survey something deposition thereon, and this detection is carried out based on measuring the variation that is deposited on the driving frequency that causes on the moving element 11 owing to any external mass.

In addition, although above-mentioned example of working is described around the situation that vibration axis 17 has a natural frequency pattern with reference to oscillatory system, but, oscillatory system can have a plurality of oscillating components, these a plurality of oscillating components resiliency supported one by one carry out torsional oscillation (torsional oscillation) for centering on vibration axis 17, thereby oscillatory system can have a plurality of built-in oscillation patterns.Even in this case, by means of the moment of inertia of regulating corresponding oscillating component according to above-mentioned job operation, the frequency of these built-in oscillation patterns can correspondingly be regulated.In addition, by means of the center of gravity of regulating these oscillating components, undesirable vibration can be reduced well.

[second example that can work]

Fig. 4 A, 4B has illustrated the light deflector according to second example that can work of oscillator arrangement of the present invention in 5 and 6.Fig. 4 A is a planimetric map, and Fig. 4 B is the planimetric map of oscillatory system when the back side of Fig. 4 A is seen.Fig. 5 and 6 is the cut-open view that obtains of the line C-C in Fig. 4 A and Fig. 4 B and line D-D respectively.In these accompanying drawings, have with first example that can work in the parts of parts similar functions illustrate with like numerals will.Hereinafter, be omitted with the description that has those parts of similar functions in first example that can work, and only described different features in detail.

As shown in Figure 4A and 4B, the light deflector of the example that this can be worked only uses a resiliency supported portion 12, and oscillatory system is supported by the fixed part 150 with cantilever beam structure.

In addition, in this example that can work, quality adjustment parts 19 are formed from a resin, and they are disposed on the surface of plane tabular moving element 11, with the relative side of permanent magnet 151 those sides is installed.As a result, be easy to reduce any skew of the center of gravity of oscillating component 41 and the axis 17 that vibrates and reduce undesirable vibration.That is, as shown in Figure 5, permanent magnet 151 and quality adjustment parts 19 are disposed on two apparent surfaces of moving element 11, clip vibration axis 17 between them.Therefore, the center of gravity of oscillating component 41 can be reduced effectively with any departing from of vibration axis 17, and this departs from and may cause owing to quality adjustment parts 19 are set.

The moving element 11, resiliency supported portion 12 and the support component 13 that constitute the oscillatory system of this example that can work are integrally made by the anisotropic etching that uses alkaline aqueous solution by monocrystalline silicon, and this will further describe hereinafter.In this example, as illustrated in Figures 5 and 6, moving element 11 and resiliency supported portion 12 have the characteristic shape that the crystal equivalent plane (surface) by monocrystalline silicon is surrounded as.

As shown in Figure 5, the moving element 11 of this example that can work is formed with and is parallel to the notch 31 that vibration axis 17 extends.Partly removing by laser beam in the process of quality adjustment parts 19, these notches 31 have and the similar effect of the cavity 30 of first example that can work.By the distance of chosen distance vibration axis 17 and the volume of wanting removed mass fraction, for example, can change and be removed quality and be removed relation between the moment of inertia.Therefore, the centre of gravity place of oscillating component 41 can be done with vibration axial alignment, the simultaneously frequency of tuning built-in oscillation pattern.

In addition, for these notches 31 that are provided with as cavity, because these cavitys can be only by using the planar member as quality adjustment parts 19 to form, so bonding assembling is very easy to.In addition, do not have cavity at the back side away from the surface that forms notch 31, the back side is done as a wholely can be used as reflecting surface except the zone that permanent magnet 151 is installed.

On the other hand, as shown in Figure 6, resiliency supported portion 12 has the X-shaped section shape that is formed by equivalent plane of monocrystalline silicon (100) and equivalent plane (111) encirclement.Therefore, resiliency supported portion 12 has big rigidity in direction shown in Fig. 6 arrow L and the direction shown in the arrow M, but relatively low around the rigidity of the direction shown in the arrow N of vibration axis 17.That is, as torsionspring, it can easily be reversed around vibration axis 17, and is difficult on other direction crooked.Therefore, can avoid effectively in undesirable vibration of arrow L and M direction.

This example that can work has been used only resiliency supported portion 12, and oscillatory system is supported by the fixed part 150 with cantilever beam structure.Therefore, even because temperature variation or any external force and in fixed part 150, deform, the direction along vibration axis 17 is delivered to oscillatory system from fixed part 150 also almost not have strain (stress).Therefore, owing to avoided well in any variation of the built-in oscillation mode frequency that strain caused of this axis direction.In addition, even fixed part 150 deforms, it also can cause the distortion of oscillatory system hardly.So, in manufacture process, be adjusted to the centre of gravity place that aligns with the axis 17 that vibrates and can not changed along with temperature variation or any external force effect, therefore, be not reduced and this temperature variation or external force no matter do not wish vibration.

Next, will be explained in the alkaline aqueous solution etch process that is used for moving element 11, resiliency supported portion 12 and support component 13 in this example that can work.Fig. 8 and 9 shows corresponding to each section in Fig. 5 and 6, the shape in alkaline aqueous solution.In Fig. 8 and 9, be in the corresponding time point place of this technology at each section shape of (a) to (f).At first, at (a), shown in orientation on the silicon chip 99 that has equivalent plane 100 and have thereon a diaphragm 101 that forms be used, and carry out the composition of diaphragm 101.In this example that can work, protection mould 101 comprises silicon nitride film.This silicon nitride film can form by using the chemical vapor mechanics.As shown in (a), based on photoetching (photolithography) and dry ecthing, pattern can be formed on the diaphragm 101.

Here, as shown in Figure 8, form opening with width W k.In addition, as shown in Figure 9, form opening with width W b and Wg.These width determine according to the angle that forms between equivalent plane 111 and equivalent plane 100 and the thickness of silicon chip 99.By suitably setting these width,, can realize required torsionspring constant and cavity size based on the specification of oscillatory system.

Next, at (b), substrate is immersed in begins etching in the alkaline aqueous solution.This example that can work is used potassium hydroxide aqueous solution.Because demonstrate at Equivalent Surface 111 places of monocrystalline silicon than at the slower etching speed in other surface such as the alkaline aqueous solution of potassium hydroxide aqueous solution, the shape of being surrounded by Equivalent Surface 111 can be formed well.Carry out along with etched, the substrate quilt is according to the order etching as figure (b) to (f).At last, at (f), the moving element 11, notch 31, resiliency supported portion 12 and the support component 13 that are surrounded by Equivalent Surface 100 and Equivalent Surface 102 are formed.After this, the diaphragm 101 at apparent surface place is removed by dry ecthing.Then, by vacuum gas deposition (vacuum vapor deposition), diaphragm 22 is formed the shape shown in Fig. 4 A, thereby described oscillatory system is provided.

As mentioned above, in this example that can work, moving element 11, notch 31, resiliency supported portion 12 and support component 13 form simultaneously by single alkaline aqueous solution etching process.As a result, manufacture process is simplified, and oscillatory system can make at an easy rate.

Particularly, the Equivalent Surface 111 of monocrystalline silicon has slower etching speed, and this can accurately form the shape of notch 31 and resiliency supported portion 12.Because the accurate processing of notch 31, the moment of inertia of moving element 11 or centre of gravity place can very accurately be determined.And because the accurate processing of resiliency supported portion 12, the torsionspring constant can very accurately be determined.The built-in oscillation mode frequency and the centre of gravity place that this means oscillatory system can very accurately be determined.As a result, the technology of partly removing quality adjustment parts 19 that is used to regulate built-in oscillation mode frequency or centre of gravity place can be carried out with fast speeds.In addition, if made by little density material so that when obtaining more accurate frequency adjustment when the regional less and quality adjustment parts that occupied by quality adjustment parts 19, the resolution of frequency adjustment can be higher.

[the 3rd example that can work]

Oscillator arrangement according to the of the present invention the 3rd example that can work will be described below.Figure 10 A is the planimetric map according to the oscillator arrangement of the 3rd example that can work, and this example has two oscillating components and is provided for doing vibratory movement around vibration axis 304.In this example that can work, these two oscillating components comprise the projection 303 that has the quality that is used to regulate oscillating component respectively and 321 first and second moving elements 302 and 320.First moving element 302 is flexibly supported by the first resiliency supported portion (torsionspring) 305, for centering on vibration axis 304 torsional oscillations with respect to second moving element 320.Second moving element 320 is flexibly supported by the second resiliency supported portion (torsionspring) 306, for center on vibration axis 304 torsional oscillations with respect to support component 301.

In this example that can work, the quality adjustment parts do not provide individually.But a moving element 302 and 320 parts own form the projection 303 and 321 of extending along the direction that is parallel to the axis 304 that vibrates, to play the effect of quality adjustment parts.By cut away the required part of each projection with laser beam, can remove proper volume from it.

According to a combination drive, described combination drive signal is based on reference frequency f by the drive unit (not shown) for the oscillator arrangement of the example that this can be worked ₀(by the determined target drives frequency of the specification of system applies) and be the frequency 2f of reference frequency twice ₀Oscillator arrangement has two natural mode frequency f around vibration axis 304 ₁And f ₂, these frequencies regulated according to the method that hereinafter will describe in detail with substantially respectively with frequency f ₀With frequency 2f ₀Coupling.Therefore, in this example that can work, based on having frequency f ₀With frequency 2f ₀The composite wave driver of two kinds of signals be achieved, utilize the high amplitude amplification factor (high amplitude amplification factor) of built-in oscillation pattern simultaneously.

The composite wave driving method will more detailed hereinafter description.

In the curve shown in Figure 11, horizontal ordinate is time t, this curve interpretation in frequency f ₀Torsional oscillation during the angle of slip of first moving element 302.Particularly, this accompanying drawing shows the one-period T with the torsional oscillation of first moving element 302 ₀Corresponding part, wherein-T ₀/ 2＜X＜T ₀/ 2.

Curve 61 has been described the reference frequency f of the torsional oscillation of first moving element 302 ₀Component sine waves.It is one at peak swing

The sine-wave oscillation of reciprocating vibration in the scope, and by following formula (2) expression, wherein, the time is t, angular frequency is w ₀=2 π f ₀

On the one hand, curve 62 has described to double frequency f in addition ₀The component sine waves of frequency, it be one at peak swing

The sine-wave oscillation of vibration in the scope, and express by following formula (3).

Curve 63 has been described the angle of slip by the torsional oscillation of first moving element 302 of above-mentioned driving generation.With regard to regard to the torsional oscillation of vibration axis 304, oscillator arrangement has frequency f ₁Built-in oscillation pattern and frequency f ₂Second level built-in oscillation pattern (second-ordernatural oscillation mode), this oscillator arrangement is by correspondingly round reference frequency f ₀With the frequency 2f that doubles reference frequency ₀Regulate, such as previously described.Therefore, by corresponding to θ ₁Drive signal excitation sympathetic response and by corresponding to θ ₂The sympathetic response of drive signal excitation all be created in this oscillator arrangement.That is, the angle of slip of first moving element 302 in curve 63 is based on the vibrations by these two sine-wave oscillation stack acquisitions; That is, having produced one can be by the vibration that is similar to sawtooth wave of following formula (4) expression.

Figure 12 shows curve 61a and 63a and straight line 64a, and by the curve among Figure 11 61,63 and straight line 64 being differentiated and obtaining, it shows the angular velocity of these curves.Curve 61a has described reference frequency f ₀The angular velocity of sine-wave oscillation, curve 63a has described the angular velocity of the reciprocating vibration that is similar to sawtooth wave of first moving element 302,61a compares with curve, curve 63a has characteristics, promptly, in N-N ' section, angular velocity be maintained at at the angular velocity V1 of maximum with at the angular velocity V at minimum place ₂In the corresponding respectively compass up and down.Therefore, in an application of following oscillator arrangement, that is, reflecting surface 22 is formed on first moving element 302 so that the deflection scanning of light to be provided, if V ₁And V ₂Be positioned at the angular velocity range of allowable error of the distance straight line 64a corresponding with Constant Angular Velocity scanning, N-N ' section can be considered to an angular velocity scanning area that cardinal principle is constant.

As mentioned above, with the oscillating phase ratio based on the angle of slip that is got by sine wave, the sawtooth wave reciprocating vibration provides a wherein zone of more widening of angular velocity substantial constant for the angular velocity of deflection scanning really.Therefore, the ratio in zone that can obtain and whole deflection scanning zone has been increased widely.In addition, owing to the modulation that is used for the light source that luminous point forms can be set the inconsistency that need not to consider angular velocity opportunity, shown in modulation circuit be simplified.

In addition, since very little in the variation of the angular velocity in the duration of oscillation, so the distortion of reflecting surface is very little when it is driven.

In addition, have rule surface sweeping line at interval and be guaranteed, printer is very favourable for for example being applied to for this.

Although the description of front is the frequency f with reference to the built-in oscillation pattern ₁And f ₂Relation with " double ", that is, the latter is the former about twice, " three times " relation still, promptly the latter is the former about three times, also can set.In this case, just as " double " relation, the vibration by based on the stack of sine wave provides the vibration that is similar to copped wave.Because this can utilize the shuttle-scanning of light, can be by double in a certain quantity that obtains the sweep trace at frequency place.

Incidentally, encourage simultaneously on the torsional oscillation direction in the oscillator arrangement of two or more built-in oscillation patterns simultaneously in this driving, the pattern attenuation ratio of every kind of pattern is more little, and energy consumption is just more little.In addition on the one hand, if the pattern attenuation ratio is little, be used for the target frequency (frequency f of the light deflector of this example that can work for example of a plurality of natural mode shapes ₁And f ₂) setting range just narrow.Therefore, when the energy consumption of light deflector reduced, the frequency of built-in oscillation pattern should very accurately be regulated.

With reference to Figure 13, will explain the natural mode frequency f ₁And f ₂Be tuned to frequency f ₀And 2f ₀Method.Figure 13 is first moving element 302 of the oscillator arrangement shown in Figure 10 A and the partial enlarged view of a projection 303.Extend through thickness (that is, its length on the normal direction of the accompanying drawing page) center of the central axis C of projection 303 through projection 303, this central axis is parallel to vibration axis 304.Projection 303 (along with the section of central axis C as normal) have the uniform section shape or the area of section, no matter and the position how.That is, at position A and position B, for example, it has identical section shape.

About the removal of projection 303, the volume that remove is according to frequency f ₁(or frequency f ₂) with respect to reference frequency f ₀(or 2f ₀) poor (remainder) come to determine.For described removal, along with central axis C as the described projection 303 of the cutting section (that is, along cross section) of normal cutting perpendicular to described center line C.At this,, removal amount is regulated by regulating cutting position.For example, according to said frequencies poor (remainder), cut described projection 303 at position A or position B.Length L a that removes or the moment of inertia of Lb equal the quality removed and central axis C and the distance D c between the axis 304 of vibrating square product.Equal the ratio of length L a and Lb at the ratio of the moment of inertia regulated quantity at position A and B place.Therefore, described removal amount and length are proportional, thereby, can infer the amount of removal soon.

And then because the part of end from cutting position to described projection is removed by cutting operation, and this part is wider than the laser beam machining area far away, therefore, can finish removal technology very fast.This not only helps shortening the process time, and helps reducing the heat that transmits to oscillator arrangement in the laser beam process.Therefore, the undesirable fire damage of oscillator arrangement or the change of performance have been avoided well.And then, reduced to come from and will process the chip or the grit of production projection by laser beam, thereby, the pollution of oscillator arrangement avoided well.And then, be consistent owing to be used to reach the laser beam processing length of required removal amount, and irrelevant with position A or position B, so process time and technology amount of movement (processing laser scanning length or machine table amount of movement) they all are constants.This makes that the adjusting of oscillator arrangement is quite simple and cheap.

First and second moving elements 302 and 320 projection 303 and 321 all are parallel to vibration axis 304.Therefore, the cutting section to projection 302 and 320 is parallel to each other.Therefore, laser beam processing can be carried out along identical direction, and can simplify the structure of laser-beam working device.

In the manner described above, even residual in the first and second resiliency supported portions 305 and 306 etc. have mismachining tolerance, and two natural frequency f ₁And f ₂With respect to frequency f ₀And 2f ₀Have big difference, still can accurately carry out tuning these frequencies.

[the 4th example that can work]

Now, with the oscillator arrangement of describing according to the of the present invention the 4th example that can work.Figure 10 B is arranged on the floor map of the quality adjustment parts 419 on the moving element, and described moving element is arranged to around the vibration of vibration axis.Originally the quality adjustment parts 419 of the example that can work have a plurality of projections 420, and described projection 420 is stretched out from described quality adjustment parts 419, are suspended from (hang over) cavity 430.In this example,, perhaps the centre of gravity place of oscillating component is adjusted to and vibrates axial alignment, shown in the dotted line among Figure 10 B, utilize the base portion excision of laser beam projection 430 in order to be transferred to target frequency around the frequency of built-in oscillation pattern of vibration axis.More specifically, excise the projection 430 of right quantity with suitable removal volume.In case the position of each projection (apart from the distance of vibration axis) and quality thereof are set, then can pre-determine will be by the moment of inertia of the described projection acquisition of cutting or the adjustment amount of centre of gravity place.Therefore, can very accurately control moment of inertia or centre of gravity place.

[the 5th example that can work]

Figure 14,15 and 16 light deflectors of representing according to the 5th example that can work of oscillator arrangement of the present invention.Figure 14 is the planimetric map of the oscillatory system of this light deflector, and Figure 15 is the planimetric map with driving substrate of the drive unit that is used to drive described oscillatory system.Figure 16 is the cut-open view that the A-A line in Figure 14 is cut open, and expression has been assembled oscillatory system and driven the structure of substrate.In the example that originally can work, as shown in the figure, moving element 513 is formed with projection 503a, 503b, 503c and 503d, and this provides oscillating component.Oscillatory system comprises this oscillating component, a pair of resiliency supported portion 512 and support component 511.Moving element 513 for example has the size of 1.5mm on the direction perpendicular to vibration axis 517, have the size of 1mm on the direction that is parallel to the axis that vibrates.

In the example that originally can work, moving element 513 is by described a pair of resiliency supported portion 512 resiliency supported, so that around vibration axis 517 torsional oscillations.As shown in the figure, projection 503a and 503b and projection 503c and 503d couple together at the symmetric position place and the moving element 513 that clip the vibration axis.All these projections are all extended along the direction that is parallel to the axis 517 that vibrates.Described paired projection 503a and 503b (or 503c and 503d) are compared mutually, and they have different length as can be seen.That is, the projection that is connected with moving element in the position of symmetry has and is relevant to vibration axis 517 asymmetric shapes.

Figure 15 represents to drive substrate 518 and a pair of drive electrode 519.As shown in the figure, drive electrode 519 be relevant to the vibration axis 517 form symmetrically.And then, as shown in figure 16, drive substrate 518 and oscillatory system and assemble, between them, be inserted with distance piece 520, so that between them, keep proper spacing.Therefore, moving element 513 is opposed with drive electrode 519, and cavity is arranged between them at interval.Moving element 513 electrical ground.Therefore, by alternately applying high pressure, at moving element 513 with applied between the drive electrode 519 of voltage and produce electrostatic attraction to symmetrically arranged drive electrode 519.This has caused around the torque of vibration axis 517, and it drives oscillatory system.

Originally the drive principle of the light deflector in the example that can work is identical with first example that can work.Yet, because such as various error components such as the deviation of physical characteristics of materials or technologic errors, for example, frequency f ₁May depart from reference frequency f ₀In structure shown in Figure 14, exist because the fabrication error flaw 400 that the mask shape error causes in the dry etching process process.Because the unexpected factor in semiconductor fabrication process might cause this fabrication error flaw, and therefore the yield rate of product will reduce.This fabrication error flaw 400 may be the similar projection shown in here or the shape flaw of recess, perhaps may be the disintegrating slag that adheres to etc.

For the moment of inertia of whole oscillating component, this fabrication error flaw shown in 400 will become error component.In these cases, as finding out, in the frequency f of the built-in oscillation pattern of oscillatory system from formula (1) ₁In also will produce error, and, will again can't obtain good amplitude amplification coefficient.And then, the centre of gravity place that fabrication error flaw 400 will cause whole oscillating component from design attitude along beyond thought deviation in driction.If produce this deviation distance, then can cause undesirable vibration, this is highly undesirable for the vibration of oscillatory system.Because this may cause the droop error of the reflecting surface of moving element 513, so therefore scan characteristic will reduce.

Do not having under the perfect condition of this centre-of gravity shift, moving element 513 is according to frequency f ₀Drive signal around vibration axis 517 torsional oscillations.On the other hand, if deviation of gravity center vibration axis 517 according to described torsional oscillation, produces inertial force along the direction from vibration axis 517 to centre of gravity place on moving element.This inertial force causes the vibration of the undesirable characteristic frequency on the deviation of gravity center direction again.The result is that scan characteristic is lowered.

The reduction of above-mentioned scan characteristic can be by the frequency f to the built-in oscillation pattern ₁Adjust apart from both with deviation of gravity center and to avoid, and therefore obtain the low-power consumption light deflector.

Referring again to the Figure 13 that had described with reference to the 3rd example that can work, will be to adjusting the frequency f of built-in oscillation pattern simultaneously ₁Describe with the method for deviation of gravity center apart from both.Here, for the moving element 513 of Figure 14, the Reference numeral 302 among Figure 13 should be pronounced " 513 ", and for the projection 503c of Figure 14, Reference numeral 303 should be pronounced " 503c ".

The central axis C that extends through projection 503c pass the thickness of projection 503c (that is) center, its length on accompanying drawing paper normal direction, and, be parallel to vibration axis 517.Projection 503c and location independent, (along with the cross section of central axis C as normal) have unified cross sectional shape.That is, for example, at position A and position B, it has identical cross sectional shape.

About the removal of projection 503c, the volume that remove is according to frequency f ₁With respect to reference frequency f ₀Poor (remainder) and the deviation distance of centre of gravity place determine.For described removal, along with central axis C as the described projection 503c of the cutting section (that is, along cross section) of normal cutting perpendicular to described center line C.At this,, removal amount is adjusted by adjusting cutting position.

For example, by laser beam irradiation, cut described projection 503c at position A or position B.Length L a that removes or the moment of inertia of Lb equal the quality removed and central axis C and the distance D c between the axis 517 of vibrating square product.Because removal amount and described length are proportional, so, equal the ratio of length L a and Lb by the ratio that the quality removal provides at the moment of inertia adjustment amount at position A and B place.

On the other hand, as shown in figure 14, forming described projection with respect to vibration axis 517 symmetrical positions.Figure 14 represents partly to remove according to the method described above described projection structure afterwards.Before this quality is removed, can form described paired projection 503a and 503b and described paired projection 503c and 503d with identical width and identical length.Therefore, for paired projection 503a and 503b and paired projection 503c and 503d, the length of removal is different.By adjusting this ratio, can be to the deviation distance of the center of gravity of oscillating component.

In this example that can work, at first measure the frequency of the built-in oscillation pattern of oscillatory system, and, infer the adjustment amount that is used for this frequency is transferred to the required moment of inertia of its design load.Frequency measurement can be carried out according to waiting about the information of the scanning beam that detects with light receiving element, by the detected information of Piezoelectric Impedance in the described resiliency supported portion of can being arranged on.According to the amount of inferring, can determine the summation of the length of the projection 503a-503d that will remove.Have in the method for oscillator arrangement of at least one example that can work around basis of vibration axis built-in oscillation pattern in manufacturing, this technology comprises the steps.That is, comprising: the step of the frequency of the built-in oscillation pattern that centers on the vibration axis of measuring oscillator device; And, determine the step of summation of the removal amount of a plurality of projections according to the frequency of measuring.

Subsequently, according to the deviation distance of centre of gravity place, determine the ratio of the removal length of described paired projection 503a and 503b or paired projection 503c and 503d.Can also calculate the deviation distance of determining described centre of gravity place with poor (remainder) of desirable track while scan by the track while scan of measuring scanning light beam.Have in the method for oscillation device of at least one example that can work around basis of built-in oscillation pattern of vibration axis in production, this technology comprises the steps.That is, comprising: the step of driving oscillator device; The oscillatory regime of the oscillating component of detection oscillator or the step of drive waveforms; And, detected oscillatory regime and target oscillatory regime compared and according to this ratio of removal amount of relatively determining projection so that reduce the step of deviation distance.

The step of the ratio of the step of the summation of definite removal amount above-mentioned and definite removal amount can be summarized as the operation that comprises the steps: promptly, and the step of driving oscillator device; The step of the oscillatory regime of the oscillating component of detection oscillator arrangement; And, with detected oscillatory regime and the target oscillatory regime compares and relatively determine step to the shape that will remove from described projection according to this.

According to the length of the removal of determining as mentioned above, change the irradiation position of laser beam, and projection 503a-503d is processed into respect to vibration axis 517 has asymmetrical length.By this operation, in the example that originally can work, can carry out the adjustment of frequency of built-in oscillation pattern and the adjustment of deviation of gravity center distance simultaneously.Particularly, in the example that originally can work, the adjustment amount and the processing length of moment of inertia are proportional, can determine the editing objective value simultaneously.

[the 6th example that can work]

Below, with oscillator arrangement and the manufacture method of describing according to the 6th example that can work of the present invention thereof.Figure 17 is the planimetric map of the oscillator arrangement of this example, and described oscillator arrangement comprises that two are used for around the oscillating component of vibration axis 604 vibrations.In the example that originally can work, described two oscillating components comprise first and second moving elements 602 and 620 with first and second projections 603 and 621 respectively, are respectively applied for the quality of regulating oscillating component.First moving element 602 is by the first resiliency supported portion (torque spring), 605 resiliency supported, so that carry out torsional oscillation with respect to second moving element 620 around vibration axis 604.Second moving element 620 is by the second resiliency supported portion (torque spring), 606 resiliency supported, so that vibrate around vibration axis 604 with respect to support portion 601.On second moving element 620, be fixed with permanent magnet 651.These permanent magnets 651 have been expressed a surface in Figure 17 on two surfaces opposite to each other of second moving element 620.

In the example that originally can work, first and second moving elements 602 and 620 self parts form along the projection 603 and 621 of the direction extension that is parallel to the axis 604 that vibrate.With the 5th example class that can work seemingly, these projections 603 and 621 are formed at first the positions of symmetry with the shape of symmetry with respect to vibration axis 604.Then, with the 5th example class that can work seemingly, utilize laser beam that the part of the hope of described projection is cut away, whereby, get rid of the asymmetric length of appropriate amount from these projections.

First moving element 602 and first projection 603 constitute first oscillating component, and second moving element 620, second projection 621 and permanent magnet 651 constitute second oscillating component.These oscillating components can vibrate integrally around vibration axis 604.

Originally the oscillator arrangement of the example that can work is driven according to comprehensive drive signal by the drive unit that comprises permanent magnet 651 and fixed coil 652, and described comprehensive drive signal is with reference frequency f ₀(the target drives frequency of determining by the specification of employed system) and be the frequency 2f of the twice of this reference frequency ₀Be the basis.Figure 18 is the cut-open view of cutting open along the A-A line of Figure 17.As shown in figure 18, described fixed coil produces magnetic field along the direction of arrow H.This action of a magnetic field is to the permanent magnet 651 that is installed on second moving element, so that produce around 304 torques of vibration axis, the described oscillatory system of torque actuated whereby.

Oscillator arrangement has around two natural frequency f of vibration axis 604 ₁And f ₂, and these oscillation frequency are transferred to and frequency f ₀And 2f ₀Approximate match.Therefore, in the example that originally can work, when adopting the high amplitude amplification coefficient of built-in oscillation pattern, realized based on having frequency f ₀And 2f ₀Drive with the composite wave of two signals.Described composite wave driving method is with 11 and 12 the 3rd examples of describing that can work are identical in conjunction with the accompanying drawings.

In the example that originally can work, oscillatory system is around the frequency f of two built-in oscillation patterns of vibration axis 604 ₁And f ₂Relation with " integral multiple ".Therefore, the moment of inertia of first and second oscillating components should satisfy the relation of following formula (5).

I ₂/I ₁≥4n ²/(n ⁴-2n ²+1) ...(5)

Wherein, I ₁And I ₂Be respectively the moment of inertia of first and second oscillating components, n represents f ₂/ f ₁Integer.

Originally the oscillatory system of the example that can work is in frequency f ₁And f ₂Between have two times relation, therefore, satisfy the relation of following formula (6).

I ₂/I ₁≥1.78 ...(6)

That is, in the example that originally can work, second oscillating component has the moment of inertia bigger than first oscillating component.By permanent magnet 651 (drive unit) only is placed on second moving element 620, provide the relation of this magnitude of moment of inertia effectively.Therefore, utilize permanent magnet 651, obtained to be suitable for realizing the oscillating component structure of two built-in oscillation patterns.

Here, will consider a kind of situation, wherein, shown in Figure 17 and 18, permanent magnet 651 is adhered to by left deviation in driction ground in figure or is provided with.The center of gravity 668 of permanent magnet 651 departs from vibration axis 604 left.On the other hand, for projection 621, as shown in figure 17, one the removal amount that is positioned at that side that permanent magnet 651 is partial in the projection 621 is bigger.For example, can be according to the ratio of determining based on the method for measuring track while scan with respect to the removal length of vibration axis 604 asymmetric asymmetric projections 621, described method was described with reference to the 5th embodiment.

The center of gravity of point 669 expressions second moving element wherein, is partly removed projection 621 with asymmetric length as described above.The line segment that connects center of gravity 668 and center of gravity 669 passes vibration axis 604.The ratio of the deviation distance of the distance of centre of gravity vibration axis 604 of the permanent magnet 651 and second moving element 620 is substantially equal to the inverse ratio of the quality of the permanent magnet 651 and second moving element 620.Because these relations, the center of gravity of whole second oscillating component are placed on the vibration axis 604.

May there be different factors in factor as for causing deviation of gravity center vibration axis 604, for example with reference to the 5th the technologic error that the example that can work was described.In a word, according to the method for above-described the example that can work, can adjust this range deviation of the center of gravity of oscillating component.

When oscillatory system comprised the oscillatory system of a plurality of degree of freedom, undesirable vibration that the center of gravity deviation of above-mentioned oscillating component is caused can cause being coupled between a plurality of built-in oscillation patterns, and the scanning repeatability will reduce therefore and greatly.Particularly, because in the example that originally can work, the frequency of two built-in oscillation patterns has " two times relations ", so the frequency of undesirable vibration above-mentioned will be the twice of reference frequency, that is, equals another frequency.Therefore, two built-in oscillation patterns will be coupled forcefully.Except the track while scan bending, this repeatability that also will cause scanning seriously reduces.

In the example that originally can work, projection 603 and 621 is asymmetricly removed, and by doing like this, has two frequency f of the oscillatory system of two built-in oscillation patterns ₁And f ₂And the deviation of gravity center of two oscillating components distance can be adjusted simultaneously.This makes becomes possibility with the composite wave of low power consumption driving and good scanning repeatability.In this manner, can be simultaneously and promptly adjust the moment of inertia and the centre of gravity place of oscillating component.

[the 7th example that can work]

Figure 19 is schematic skeleton view, and expression is combined with the example of working according to the optical instrument of light deflector of the present invention.In this example, imaging device is represented as optical instrument.In Figure 19,3003 expressions be according to light deflector of the present invention, and it is used for being scanned into one-dimensionally the light that is mapped on it.3001 the expression be lasing light emitter, 3002 the expression be lens or lens combination.3004 the expression be writing lens or lens combination, 3005 the expression be the cydariform photosensitive-member.

Modulate from the laser beam that lasing light emitter 3001 sends by predetermined strength with respect to the light deflection scanning time.The light of this process intensity modulated passes lens or lens combination 3002, and by optical scanning system (light deflector) 3003, by one-dimensional scanning deflection.Utilize writing lens or lens combination 3004, the laser beam of scan deflection is focused on the photosensitive-member 3005, so that form image thereon.

Photosensitive-member 3005 rotates on the direction perpendicular to the direction of scanning around rotation, and by not shown charger uniform charging.Surface by with the photoscanning photosensitive-member forms electrostatic latent image in the surface portion that is scanned.Subsequently, by adopting not shown developing apparatus, form toner image according to this electrostatic latent image, and subsequently with this toner image transfer printing and photographic fixing to not shown transfer sheet, thereby on this sheet material, form image.

According to the example that originally can work, can adopt the light deflector of being transferred to required frequency well.Therefore, can drive with high amplitude amplification coefficient, and therefore, can make the device compactness, and can reduce power consumption.And then, can make angular velocity approximate equality in the effective coverage on photosensitive-member 3005 surfaces of the deflection scanning of light.In addition,, reduced the change of scanning position, and realized to form the imaging device of picture rich in detail by adopting light deflector of the present invention.

Although describe the present invention with reference to structure disclosed herein, the invention is not restricted to aforementioned details, and the application should cover the remodeling or the variation that can draw in the improvement purpose of claims or the scope.

Claims (11)

1. method of making oscillator arrangement, described oscillator arrangement has oscillating component, resiliency supported portion and support component, and described oscillating component is flexibly supported by described resiliency supported portion, so that can vibrate around the vibration axis, described method comprises:

Form described oscillating component by moving element, described moving element has the projection that is used to regulate described oscillating component quality, described projection is along extending from described moving element with the direction of described axis of oscillation line parallel, and, described projection forms in couples, every pair of projection is arranged at the position of described relatively vibration axis symmetry, and the edge of each projection is constant with the sectional area on the plane of described vibration axis normal on described vibration axis direction, and

Laser beam is projected the cutting position of described projection, partly removing described moving element, described removal comprise in the described projection not by laser beam irradiation, scope relates to the part of the terminal part from described cutting position to this projection,

Wherein, described projection is cut, and causes the total amount of removing length of described projection to equal predetermined length, so that regulate the moment of inertia of described oscillating component thus.

2. the method for claim 1, wherein according to around the frequency of the intrinsic concussion pattern of the vibration axis of described oscillator arrangement and the total amount of removing length that the difference between the target frequency is determined described projection.

3. method as claimed in claim 2, wherein, the ratio that is in respect to the amount of removing of the projection of the position of described concussion axis symmetry is determined, so that reduce the deviation distance of the described vibration axis of the deviation of gravity center of described concussion parts.

4. method as claimed in claim 3, wherein, each in the described projection all only is formed on the described oscillating component the position away from described vibration axis.

5. method as claimed in claim 4, wherein, described oscillator arrangement has permanent magnet and the coil that is used to drive described oscillating component, and described permanent magnet is arranged on the described oscillating component.

6. method of making oscillator arrangement, described oscillator arrangement has first oscillating component, the first resiliency supported portion, second oscillating component, second resiliency supported portion and the support component, described first oscillating component is flexibly supported by described second oscillating component by the described first resiliency supported portion, so that can be around the vibration of vibration axis, described second oscillating component is flexibly supported by described support component by the described second resiliency supported portion, so that can be around described vibration axis vibration, described oscillator arrangement has at least two built-in oscillation patterns, described two built-in oscillation patterns have different frequencies, and described method comprises:

Form described first oscillating component by first moving element, described first moving element has the projection that is used to regulate the described first oscillating component quality, describedly be used to regulate the projection of the described first oscillating component quality along extending from described first moving element with the direction of described axis of oscillation line parallel, and, the described projection that is used to regulate the described first oscillating component quality forms in couples, every pair of projection that is used to regulate the described first oscillating component quality is arranged at the position of described relatively vibration axis symmetry, each sectional area on edge and the plane of described vibration axis normal that is used to regulate the projection of the described first oscillating component quality is constant on described vibration axis direction, and form described second oscillating component by second moving element, described second moving element has the projection that is used to regulate the described second oscillating component quality, describedly be used to regulate the projection of the described second oscillating component quality along extending from described second moving element with the direction of described axis of oscillation line parallel, and, the described projection that is used to regulate the described second oscillating component quality forms in couples, every pair of projection that is used to regulate the described second oscillating component quality is arranged at the position of described relatively vibration axis symmetry, and each sectional area on edge and the plane of described vibration axis normal that is used to regulate the projection of the described second oscillating component quality is constant on described vibration axis direction;

Laser beam is projected the cutting position of described projection, partly to remove at least one in described first moving element and second moving element, described removal comprise in the described projection not by laser beam irradiation, scope relates to the part of the terminal part from described cutting position to this projection

Wherein, described projection is cut, and causes the total amount of removing length of described projection to equal predetermined length, so that regulate at least one the moment of inertia in described first moving element and described second moving element thus.

7. method as claimed in claim 6, wherein, according to around the frequency of the intrinsic concussion pattern of the vibration axis of described oscillator arrangement and the total amount of removing length that the difference between the target frequency is determined described projection.

8. method as claimed in claim 7, wherein, the ratio that is in respect to the amount of removing of the projection of the position of described concussion axis symmetry is determined, so that reduce the deviation distance of the described vibration axis of the deviation of gravity center of described concussion parts.

9. method as claimed in claim 8, wherein, each in the described projection all only is formed on the described oscillating component the position away from described vibration axis.

10. method as claimed in claim 9, wherein, described oscillator arrangement also comprises permanent magnet and the coil that is used to drive described oscillating component, described permanent magnet is set on the described oscillating component.

11. method as claimed in claim 10, wherein, be formed on respect to the position of described concussion axis symmetry and the ratio that is arranged on the amount of removing of the projection on described second oscillating component and be determined, so that reduce the deviation distance of the described vibration axis of deviation of gravity center of the described second concussion parts.

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