CN101592681A - The probe of measurement jig - Google Patents
The probe of measurement jig Download PDFInfo
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- CN101592681A CN101592681A CN 200810109528 CN200810109528A CN101592681A CN 101592681 A CN101592681 A CN 101592681A CN 200810109528 CN200810109528 CN 200810109528 CN 200810109528 A CN200810109528 A CN 200810109528A CN 101592681 A CN101592681 A CN 101592681A
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- probe
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- measurement jig
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Abstract
The present invention discloses a kind of probe (probe) of measurement jig, technological means of the present invention mainly is on the surface with the probe tip place, plating nano-coating thickness is the high conductivity macromolecular material of 1～20 nanometer, by this coating process, the fine quality that the probe nano plated film of measurement jig of the present invention can make probe possess not to be stained with effectively is sticking, electric conductivity is high, contact resistance is stable, the life-span is long, therefore can promote IC module testing yield, reduce the frequency of probe cleaning, and reduce the integrated testability cost.And, make originally probe metal material only need 1/5th gold plating thickness can reach the identical conduction degree, thereby reach the purpose that reduces whole probe material cost because nano-coating has high conductivity.
Description
[technical field]
The invention relates to a kind of measurement jig probe that is used for the survey of integrated circuit package pin, and particularly relevant for a kind of probe with conducting polymer nano-coating.
[background technology]
The measurement jig probe that is used to test is mainly beryllium copper metal material surface gold-plating and constitutes, and its size and shape are different according to the integrated circuit package that will test, but basic structure is identical, is mainly probe, sleeve pipe, spring or line pin.Wherein, the application of measurement jig probe is very extensive, for example: printed circuit board (PCB) (hollow plate and real plate) test pin, semiconductor test pin, display apparatus test pin; And the module testing pin of communication products.For example: the connector of antenna for mobile phone, battery, loudspeaker, Vib., LCD... etc. and can extend to personal digital assistant (Personal Digital Assistant, PDA), digital camera, GPS (Global Position System, GPS), notebook computer (Notebook, NB) ... wait on the product.Test probe is aspect the wafer detecting in addition, it is the part of probe, for be applied in integrated circuit (IC) as yet the encapsulation before, at the crystal grain (Die) that comes by wafer (Wafer) cutting, with probe it is done the function test, filter out defective products, the encapsulation engineering after carrying out again, therefore, the survey of wafer pin is in the integrated circuit manufacturing manufacturing cost to be influenced one of sizable important manufacture process.
The precision requirement that design, the material of measurement jig probe in manufacture process selected, processed, the process of assembling all influence the quality and the test performance of whole probe; But owing to all plate one deck gold at the beryllium copper material surface for promoting the probe electrical conductivity in the manufacture process, the thickness of this layer gold is according to client and test products and the thickness difference, general about 2～100 microns (um).
When probe is used in test, need probe stationary in measurement jig, owing to need expend a large amount of artificial and times, and more cause cost of manufacture high because utilizing the mode of batch manufacturing, for instance, in the step of utilizing measurement jig with stationary probe, it must see through manual mode, after confirming the position of weld pad on the printed circuit board (PCB) earlier, one by one probe is utilized the design of measurement jig to be fixed on the printed circuit board (PCB) with manual type again, one end of probe can be electrically connected with printed circuit board (PCB), an exposed end then is used for contacting with chip to be measured or the weld pad on the IC assembly carrying out testing electrical property, and these complicated processes make and become one of factor that influences manufacturing cost serviceable life of probe of measurement jig.
In addition; along with the increase of number of probes certainly will cause lower coplane degree; therefore the size for the integrated testability tester probe has caused certain restriction, thereby when testing several crystal grain to be measured or IC assembly simultaneously, keep consistent yield and degree of stability and be quite difficulty.
In addition; for the probe that makes the integrated testability tool contacts to reach good test yield and quality with the good of crystal grain to be measured; probe tip can pierce through the oxide layer surface of crystal grain to be measured or IC assembly to reach excellent contact; pierce through the surface of crystal grain to be measured when the probe repeated multiple times; the needle point of probe just easily is stained with sticking; and make test quality variation or mistake survey, cause testing yield and glide rapidly.Be generally this problem of solution, mostly adopt increasing contact force (Overdrive) to make probe tip more go deep into the surface of crystal grain to be measured, to reach preferable contact and good test quality, yet when adopting the increase contact force to be solution, though certain effect is arranged for the test yield, but the understructure of destructible crystal grain to be measured like this, especially at wafer advanced process technology (0.13um, 90nm, 65nm... or the like) when importing frangible low dielectric (low-kdielectrics) material, this situation survey for the wafer pin that with the increase contact force is solution and follow-up encapsulation for be an obstacle, be used for the following IC processing procedure of 0.13um because of hanging down dielectric and ultralow dielectric (ultra-low-k) material, need ask wafer pin survey technology can not make dielectric materials and subsurface material or structure thereof cause distortion or destruction.In addition, when adopting the cleaning probe to be solution, may be because number of probes increase or problem such as probe spacing minimizing, and the frequency that faces the cleaning probe increases rapidly, and its shortcoming is to reduce tester table utilization rate and attenuating probe life-span.
Present probe all plates one deck gold at the beryllium copper material surface for promoting electrical conductivity, and general about 2～100 microns (um), thereby increase whole probe cost to hard iron.And above-mentioned probe ubiquity probe easily is stained with sticking problem, though industry research and development metal coating is also arranged recently in detecting probe surface, can't solve probe yet it solves the problem in life-span mostly and be stained with sticking problem, be insurmountable to the problem that promotes test yield and stable testing degree therefore.
[summary of the invention]
Purpose of the present invention is providing a kind of probe exactly, and it can make the wafer sort stay in grade, reduces clear pin frequency, improves the tester table mobility and promote the test yield, and then reduces the integrated testability cost.
The present invention proposes a kind of probe, comprise device on measurement jig, material belongs to several probes of metal material, and is plated in the conducting polymer nano-coating on these probes.
According to the described probe of preferred embodiment of the present invention, above-mentioned conducting polymer nano-coating is for example for having a conductive polymer material of not being stained with stick nature.And the thickness of conducting polymer nano-coating for example is 1～20 nanometer.
According to the described probe of preferred embodiment of the present invention, above-mentioned metal material in order to the manufacturing probe for example is metal material or its alloy of nickel, gold, copper, tungsten, rhenium, titanium, beryllium, tool electric conductivity.And the structure example of probe metal Microspring or metal wire pin or single-head needle or double-ended needle in this way.
According to the described probe of preferred embodiment of the present invention, the above-mentioned method that the conducting polymer nano-coating is plated on these probes for example is the plated film manufacturing method thereof.And the conducting polymer nano-coating for example is to be plated on the surface at needle point place of these probes.
The present invention is a kind of probe, owing to use the electrical-conductive nanometer material film plating at detecting probe surface, makes probe of the present invention possess not to be stained with sticking (No Clean), electric conductivity height, the fine quality that contact resistance stable (Contact Resistance) is low, the life-span is long.
Probe provided by the present invention; can make test article matter stable; it utilizes probe and crystal grain to be measured or IC inter-module to produce the principle of attractive force hardly; make probe have and be not stained with sticking characteristic; reduce clear pin frequency and reach; improve the tester table mobility, promote the test yield, and the purpose that reduces the integrated testability cost.By the conducting polymer nano-coating, making only needs the gold plating thickness of script beryllium copper material surface 1/5th can reach the identical conduction degree, and then reaches the purpose that significantly reduces whole probe material cost.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
[description of drawings]
Fig. 1 is the preferred embodiment structural representation of the probe of measurement jig of the present invention.
Fig. 2 is the enlarged diagram of the probe tip nano-coating of measurement jig among Fig. 1.
[embodiment]
Below enumerate specific embodiment describing content of the present invention in detail, and with icon as aid illustration.
The present invention discloses a kind of probe, comprises several probes and conducting polymer nano-coating, and wherein these probes are to be made by metal material, and device is on measurement jig, and the conducting polymer nano-coating is plated on these probes.
Above-mentioned conducting polymer nano-coating for example is to have the conductive polymer material of not being stained with stick nature.Wherein conductive polymer material for example is to select a composition or derivatives thereof of selecting in polypyrrole (Polypyrrole), poly-phenylene vinylene (ppv) (Polyparaphenylene), polythiophene (Polythiophene), polyaniline (Polyaniline) or the above-mentioned group at least.And the thickness of conducting polymer nano-coating for example is 1～20 nanometer, can for example be 1～10 nanometer also.
The material of above-mentioned probe is a metal material, for example be metal material or its alloy of nickel, gold, copper, tungsten, rhenium, titanium, beryllium, tool electric conductivity, and alloy can for example be rhenium tungsten or beryllium copper.Wherein, the structure example of probe metal Microspring or metal wire pin or single-head needle or double-ended needle in this way.
The method that above-mentioned conducting polymer nano-coating is plated on these probes for example is the plated film manufacturing method thereof.Wherein, this conducting polymer nano-coating for example is to be plated on the surface at the needle point place of these probes.
Fig. 1 is the probe preferred embodiment structural representation of measurement jig of the present invention, because the probe of measurement jig mainly is the designing technique that sees through measurement jig tens of to hundreds of probe is placed on the substrate, as shown in Figure 1, in the structure of the probe integral body of this measurement jig, mainly comprise probe 11, substrate 10, ceramic ring 13 and reinforcement body 15 4 major parts, the probe 11 that present embodiment disclosed in Fig. 1 is probes of measurement jig, the central hollow out of substrate 10 is to put several above-mentioned probes 11, and above-mentioned these a little assemblies are respectively through after design and the machine drilling, the upright adhesion gummed of the follow-up group of arranging in pairs or groups, lead and the thin portion of each class's probe location adjustments stage such as grade, and finish the probe structure of a measurement jig.
Fig. 2 is the enlarged diagram of the probe tip nano-coating of measurement jig among Fig. 1, the present invention still keeps copline with the probe of former measurement jig at this probe of implementing in the aspect, and because nano-coating thickness is between 1～20nm, the influence in the time of can not causing the change of probe size and high frequency to measure.But, by this enforcement aspect as can be known, no matter the structure of the probe of measurement jig how, according to the amplifier section structure of institute's exposure probe 11 among Fig. 2 as can be known,, surface, probe tip place can reach effectiveness of the presently claimed invention as long as being imposed conducting polymer nano-coating 110.
And above-mentioned substrate 10 can be selected from printed circuit board (PCB) or silicon substrate, but the material of the probe 11 of measurement jig then is the metal material or the alloy of electric conductivity, and common alloy material is the beryllium copper surface gold-plating for example.
In addition, with regard to the process of signal transmission, when the probe of measurement jig when carrying out the transmission of signal, because having, conducting polymer nano-coating probe is not stained with glutinous characteristic, therefore probe is easy to the correct test position of contact measured crystal grain, and than inclusion-free, and make probe carry out signal Ke Bi Mian Miscellaneous News and reach signal transmission more accurately when transmitting, improve the stability and the yield of test simultaneously.
In addition, the probe nano coating structure of the disclosed measurement jig of the present invention can be by for example plated film manufacturing method thereof, on detecting probe surface, directly form, therefore only need be by accurate film coating jig control probe plated film length, and owing to only need utilize printed circuit board (PCB) or the size of silicon substrate and probe relative distance, design parameter as accurate film coating jig, therefore relatively also make disclosed measurement jig probe the probe copline not the reason nano-coating processing procedure and change, like this for the yield of nano-coating processing procedure, on the output, apparent help is all arranged, thereby also reduced required man-hour of expending of overall process and cost.
In sum, a kind of probe proposed by the invention is because its nano-coating that has can make test The probe of tool adopts in having high integration, high pin number, and the chance of close spacing, and in conjunction with accurate plated film Tool design and process technique are so that the probe nano plated film cost of manufacture of measurement jig of the present invention and good Rate all obtains the progress that showing.
The present invention discloses a kind of probe, this probe that is installed on a bit measurement jig mainly be applied to semiconductor, IC module testing in the display industry, because this type of probe has the problem that sticks often doing test, this Invention just plates the conducting polymer nano-coating at detecting probe surface in mode not seen before, can make Probe and IC inter-module to be measured produce attraction hardly, so that probe has the characteristic of not sticking, and make this Invention has the clear pin frequency of reduction, improves the tester table mobility, promotes the test yield, and reduces whole The advantage of body examination examination cost. And utilize the conducting polymer nano-coating, only make need 1/5th gold-plated Thickness can reach the identical conduction degree, and reaches the purpose that reduces whole probe material cost.
Claims (11)
1. a probe is to be made by metal material, is installed on the measurement jig; It is characterized in that: described probe also comprises a conducting polymer nano-coating, is plated on those probes.
2. probe as claimed in claim 1 is characterized in that: described conducting polymer nano-coating comprises having a conductive polymer material of not being stained with stick nature.
3. probe as claimed in claim 2 is characterized in that: described conductive polymer material comprises selects a composition or derivatives thereof of selecting at least in polypyrrole (Polypyrrole), poly-phenylene vinylene (ppv) (Polyparaphenylene), polythiophene (Polythiophene), polyaniline (Polyaniline) or the above-mentioned group.
4. as claim 1 or 3 described probes, it is characterized in that: the thickness of described conducting polymer nano-coating is 1～20 nanometer (nm).
5. as claim 1 or 3 described probes, it is characterized in that: the thickness of described conducting polymer nano-coating is 1～10 nanometer.
6. probe as claimed in claim 1 is characterized in that: described metal material comprises metal material or its alloy or its metal coating of nickel, gold, copper, tungsten, rhenium, titanium, beryllium, tool electric conductivity.
7. probe as claimed in claim 6 is characterized in that: described alloy comprises rhenium tungsten or beryllium copper.
8. probe as claimed in claim 6 is characterized in that: described metal material is a beryllium copper, and gold-plated on the surface of beryllium copper.
9. probe as claimed in claim 1 is characterized in that: the structure of those probes can be a metal Microspring or a metal wire pin or metal wire pin or single-head needle or double-ended needle.
10. probe as claimed in claim 1 is characterized in that: described conducting polymer nano-coating is a kind of chemical vapor deposition plated film.
11. probe as claimed in claim 1 is characterized in that: described conducting polymer nano-coating is plated on the surface at needle point place of those probes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810109528 CN101592681A (en) | 2008-05-27 | 2008-05-27 | The probe of measurement jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810109528 CN101592681A (en) | 2008-05-27 | 2008-05-27 | The probe of measurement jig |
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| CN101592681A true CN101592681A (en) | 2009-12-02 |
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| CN 200810109528 Pending CN101592681A (en) | 2008-05-27 | 2008-05-27 | The probe of measurement jig |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113504456A (en) * | 2021-07-05 | 2021-10-15 | 深圳市有方科技股份有限公司 | Jig and equipment for radio frequency test |
-
2008
- 2008-05-27 CN CN 200810109528 patent/CN101592681A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113504456A (en) * | 2021-07-05 | 2021-10-15 | 深圳市有方科技股份有限公司 | Jig and equipment for radio frequency test |
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Open date: 20091202 |