CN101587928B - Light-emitting diode packaging structure - Google Patents
Light-emitting diode packaging structure Download PDFInfo
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- CN101587928B CN101587928B CN2008101006688A CN200810100668A CN101587928B CN 101587928 B CN101587928 B CN 101587928B CN 2008101006688 A CN2008101006688 A CN 2008101006688A CN 200810100668 A CN200810100668 A CN 200810100668A CN 101587928 B CN101587928 B CN 101587928B
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Abstract
The invention provides a light-emitting diode packaging structure comprising a loader, a light-emitting diode wafer and an optical structure. The light-emitting diode wafer is configured on the loader; the light-emitting diode wafer is electrically connected with the loader; the optical structure is configured on the loader and comprises a body and a raised part; the body covers the light-emittingdiode wafer and part of the loader and is provided with a first surface which is a conical surface and a second surface; and the raise part can change the light-emitting angle distribution of the lig ht-emitting diode packaging structure so as to improve the uniformity of light emitted on an illuminated surface by the light-emitting diode packaging structure.
Description
Technical field
The invention relates to a kind of package structure for LED, and particularly relevant for a kind of package structure for LED with higher illuminated area uniformity.
Background technology
Because the luminous efficiency of package structure for LED constantly promotes, make package structure for LED replace fluorescent lamp and incandescent lamp bulb gradually, for example need the Dashboard illumination, traffic signal light of light source, the automobile of scanner lamp source, the LCD of at a high speed reaction and general lighting device etc. in some field.Package structure for LED and conventional bulb are compared has an absolute advantage down, and for example volume is little, life-span length, low-voltage/current drives, be difficult for breaking, do not contain mercury (not having pollution problem) and the good characteristics such as (power savings) of luminous efficiency.
Yet the angular distribution of the luminous intensity of light-emitting diode (being distribution curve flux) mostly is cosine distribution, that is to say, angle be 0 luminous intensity when spending for maximum, and be that 90 luminous intensities when spending are 0 in angle.Therefore when during as street lamp, illuminating the road surface of small part with light-emitting diode.Or with light-emitting diode during as the lamp source of the down straight aphototropism mode set of LCD, the display frame of LCD easily has the problem of brightness irregularities to produce (be display frame some occur cross bright area).Therefore, how promoting package structure for LED, to shine the uniformity in illuminated area (luminous intensity of package structure for LED can be evenly distributed in the bigger angular range, but not cosine distribution) be the problem that needs to be resolved hurrily at present.
Summary of the invention
The invention provides a kind of package structure for LED, it shines in the uniformity of illuminated area higher.
A kind of package structure for LED that the present invention proposes comprises a carrier, a LED wafer and is disposed at a optical texture on the carrier.Wherein, LED wafer is disposed on the carrier, and LED wafer is electrically connected to carrier.Optical texture comprises a body and a plurality of lug boss.Wherein, body covers LED wafer and part carrier.Body has a first surface and a second surface, and first surface is a conical surface.Lug boss is the axle center annular arrangement with first symmetry axis of this body, be disposed on the first surface of body, and each lug boss has an optical surface and a curved surface, and the angle of first symmetry axis of the normal vector of optical surface and body is between 10 ° to 70 °.Wherein, lug boss add up to two, and the optical surface of the lug boss plane of symmetry separately overlaps, and first symmetry axis of body is positioned on the optical surface plane of symmetry separately simultaneously.Perhaps the sum of lug boss is at least three, and the optical surface of the lug boss plane of symmetry separately intersects at same axis, and axis overlaps with first symmetry axis of body.
In one embodiment of this invention, optical surface is a curved surface.
In one embodiment of this invention, optical surface is a plane.
In one embodiment of this invention, lug boss is adjacent.
In one embodiment of this invention, the second surface of body has a groove, and second symmetry axis of its further groove overlaps with first symmetry axis of body, and groove caves in towards lug boss.In addition, LED wafer and part carrier are disposed in the groove.
In one embodiment of this invention, also comprise a packing colloid, and packing colloid is disposed in the groove, and the space of filling between groove and LED wafer and part carrier.
Below enumerate the embodiment that is applicable to above-mentioned package structure for LED simultaneously.
In one embodiment of this invention, the material of packing colloid is identical with the material of optical texture.
In one embodiment of this invention, the material of packing colloid is silica resin, epoxy resin, glass or aforesaid combination.
In one embodiment of this invention, the material of optical texture is silica resin, epoxy resin, glass or aforesaid combination.
In one embodiment of this invention, the body of optical texture and lug boss are formed in one.
Package structure for LED of the present invention changes the distribution of the light beam that appears optical texture by lug boss, and then makes light-emitting diode shine improving uniformity in illuminated area.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, below in conjunction with accompanying drawing the specific embodiment of the present invention is elaborated, wherein:
Figure 1A is the stereogram of the package structure for LED of one embodiment of the invention.
Figure 1B is the front view of the package structure for LED of Figure 1A.
Fig. 1 C is the end view of the package structure for LED of Figure 1A.
Fig. 1 D is the vertical view of the package structure for LED of Figure 1A.
Fig. 2 is the angular distribution figure of luminous intensity of the package structure for LED of one embodiment of the invention.
Fig. 3 A is the stereogram of the package structure for LED of another embodiment of the present invention.
Fig. 3 B is the front view of the package structure for LED of Fig. 3 A.
Fig. 3 C is the end view of the package structure for LED of Fig. 3 A.
Fig. 3 D is the vertical view of the package structure for LED of Fig. 3 A.
Fig. 4 is the angular distribution figure of luminous intensity of the package structure for LED of another embodiment of the present invention.
Fig. 5 A is the stereogram of the package structure for LED of further embodiment of this invention.
Fig. 5 B is the vertical view of the package structure for LED of Fig. 5 A.
Fig. 6 A is the stereogram of the package structure for LED of yet another embodiment of the invention.
Fig. 6 B is the vertical view of the package structure for LED of Fig. 6 A.
The main element symbol description:
100,300: package structure for LED
110,310: carrier
120,320: LED wafer
130,330: optical texture
130a, 330a: body
130b, 330b: lug boss
132a, 332a: first surface
134a, 334a: second surface
132b: first groove
134b, 334b: cambered surface
140,340: packing colloid
332b: optical surface
A, B, C, E: symmetry axis
D: diameter
DE: the degree of depth
F: second groove
F1: groove
L: light beam
N: normal vector
P: the plane of symmetry
Z: axis
θ, θ 1, θ 2: angle
Embodiment
The present invention mainly is the external form by the optical texture that changes light-emitting diode, makes light-emitting diode shine improving uniformity in illuminated area.
Figure 1A is the stereogram of the package structure for LED of one embodiment of the invention, and Figure 1B is the front view of the package structure for LED of Figure 1A.Fig. 1 C is the end view of the package structure for LED of Figure 1A, and Fig. 1 D is the vertical view of the package structure for LED of Figure 1A.
Please be simultaneously with reference to Figure 1A～Fig. 1 D, the package structure for LED 100 of present embodiment comprises a carrier 110, a LED wafer 120 and an optical texture 130.Wherein, LED wafer 120 is disposed on the carrier 110, and LED wafer 120 is electrically connected to carrier 110.
In addition, optical texture 130 is disposed on the carrier 110, and optical texture 130 comprises a body 130a and a lug boss 130b.Body 130a covers LED wafer 120 and part carrier 110.Body 130a has a first surface 132a and a second surface 134a, and wherein first surface 132a is a conical surface.The first surface 132a that lug boss 130b is disposed at body 130a goes up and is positioned on the symmetry axis A of body 130a.Lug boss 130b has one first a groove 132b and a cambered surface 134b.
That the shape of the first groove 132b can be is coniform, hemispherical, semielliptical shape or other shapes that is fit to.In present embodiment, be to be example with the cone shape first groove 132b, right the present invention is not as limit.Wherein, the symmetry axis C of symmetry axis B, the cambered surface 134b of the first groove 132b overlaps with the symmetry axis A of body 130a, and the first groove 132b caves in towards body 130a.In addition, the ratio of the depth D E of the diameter D of the opening of the first groove 132b and the first groove 132b is between 0.7 to 10.
Please refer to Figure 1B, in present embodiment, angle θ 1 is meant the light beam L that sent by LED wafer 120 and the angle of symmetry axis A, and angle θ 2 is when representing light beam L to appear optical texture 130, the angle of light beam L and symmetry axis A.Lug boss 130b is positioned on the symmetry axis A of body 130a, and the symmetry axis C of symmetry axis B, the cambered surface 134b of the first groove 132b of lug boss 130b overlaps with the symmetry axis A of body 130a.Therefore, angle θ 1 reaches the light beam L of the total reflection angle of optical texture 130, can just appear optical texture 130 with angle θ 2 then earlier by the first groove 132b of lug boss 130b reflection.By Figure 1B as can be known, angle θ 2 is greater than angle θ 1.Therefore, lug boss 130b helps to increase the angle θ 2 of the light beam L that appears optical texture 130, and then lifting package structure for LED 100 shines the uniformity in illuminated area.
Please more simultaneously with reference to Figure 1A～Fig. 1 D, in present embodiment, body 130a and lug boss 130b can be formed in one.And in other embodiment, body 130a and lug boss 130b also can be two separate members.In addition, in present embodiment, the second surface 134a of body 130a can have one second groove F.Wherein, the symmetry axis E of the second groove F overlaps with the symmetry axis A of body 130a, and the second groove F caves in towards lug boss 130b.And LED wafer 120 and part carrier 110 are disposed among the second groove F.
In addition, in present embodiment, package structure for LED 100 also comprises a packing colloid 140.Packing colloid 140 is configurable in the second groove F, and the space of filling between the second groove F and LED wafer 120 and part carrier 110.The material of packing colloid 140 is silica resin, epoxy resin, glass or other materials that is fit to, or aforesaid combination.
In addition, the material of optical texture 130 is silica resin, epoxy resin, glass or other materials that is fit to, or aforesaid combination.The material of optical texture 130 can be identical with the material of packing colloid 140, so the invention is not restricted to this.For instance, optical texture 130 is made of different materials with packing colloid 140.
Then, please refer to Fig. 2, Fig. 2 is the angular distribution figure (being distribution curve flux) of the luminous intensity of the package structure for LED of one embodiment of the invention, and wherein angle θ 2 is the angle of the symmetry axis of package structure for LED institute's emitted light beams and body.As shown in Figure 2, the package structure for LED 100 of present embodiment has the luminous intensity greater than 60% when angle θ 2 is between 15 °～75 ° and between-20 °～-71 °.When angle θ 2 between between 25 °～70 ° and between-30 °～-65 °, package structure for LED 100 has more the luminous intensity greater than 75%.By as can be known aforementioned, package structure for LED 100 has greater than angle θ 2 scopes of 60% luminous intensity bigger.Therefore, package structure for LED 100 shines in the uniformity of illuminated area higher.Also hence one can see that, and optical texture 130 can help to promote by package structure for LED 100 and shines the uniformity in illuminated area.
Fig. 3 A is the stereogram of the package structure for LED of another embodiment of the present invention, and Fig. 3 B is the front view of the package structure for LED of Fig. 3 A.Fig. 3 C is the end view of the package structure for LED of Fig. 3 A, and Fig. 3 D is the vertical view of the package structure for LED of Fig. 3 A.
Please be simultaneously with reference to Fig. 3 A～Fig. 3 D, the package structure for LED 300 of present embodiment comprises a carrier 310, a LED wafer 320 and an optical texture 330.Wherein, LED wafer 320 is disposed on the carrier 310, and LED wafer 320 is electrically connected to carrier 310.
In addition, optical texture 330 is disposed on the carrier 310, and optical texture 330 comprises a body 330a and a plurality of lug boss 330b.In present embodiment, be to be representative with two lug boss 330b, so the invention is not restricted to this.And the present invention does not limit the size of lug boss 330b, that is to say, the size of these lug bosses 330b can be identical also can be different.Body 330a has a first surface 332a and a second surface 334a, and wherein first surface 332a is a conical surface.Lug boss 330b is disposed on the first surface 332a of body 330a, and each lug boss 330b all has an optical surface 332b and a cambered surface 334b.And the angle theta of the normal vector N of optical surface 332b and the symmetry axis A of body 330a is between 10 ° to 70 °.Optical surface 332b can be that curved surface also can be the plane.
Please refer to Fig. 3 C, in present embodiment, when LED wafer 320 during with angle θ 1 outgoing beam L, light beam L can appear optical texture 130 by angle θ 2, and angle θ 2 is greater than angle θ 1.Because the package structure for LED 300 of present embodiment has two lug boss 330b, when the light beam L that therefore all is appeared optical texture 130 is projected in the plane vertical with symmetry axis A (not illustrating) and goes up, the shape of light beam L projection will be similar to a strip.Therefore, the package structure for LED 300 of present embodiment is suitable for being used for needing as street lamp etc. the illuminator of particular beam projection of shape.
Referring again to Fig. 3 A～Fig. 3 D, in present embodiment, body 330a and lug boss 330b can be formed in one.And in other embodiment, body 330a and lug boss 330b also can be two separate members.In addition, in present embodiment, the second surface 334a of body 330a can have a groove F1.Wherein, the symmetry axis E of groove F1 overlaps with the symmetry axis A of body 330a, and groove F1 caves in towards lug boss 330b.And LED wafer 320 and part carrier 310 are disposed among the groove F1.In present embodiment, lug boss 330b is the axle center annular arrangement with symmetry axis A, so the invention is not restricted to this.In addition, in present embodiment, lug boss 330b is adjacent, so the invention is not restricted to this.
In addition, in present embodiment, package structure for LED 300 also comprises a packing colloid 340.Packing colloid 340 is configurable in groove F1, and the space of filling between groove F1 and LED wafer 320 and part carrier 310.The material of packing colloid 340 for example is silica resin, epoxy resin, glass or other materials that is fit to, or aforesaid combination.
The material of optical texture 330 for example is silica resin, epoxy resin, glass or other materials that is fit to, or aforesaid combination.The material of optical texture 330 can be identical with the material of packing colloid 340, so the invention is not restricted to this.For instance, optical texture 330 is made of different materials with packing colloid 340.
Then, please refer to Fig. 4, Fig. 4 is the angular distribution figure of luminous intensity of the package structure for LED of another embodiment of the present invention, and wherein angle θ 2 is the angle of the symmetry axis of package structure for LED institute's emitted light beams and body.As shown in Figure 4, the package structure for LED 300 of present embodiment has the luminous intensity greater than 60% when angle θ 2 is between 20 °～72 ° and between-18 °～-70 °.When angle θ 2 between between 30 °～65 ° and between-27 °～-65 °, package structure for LED 300 has more the luminous intensity greater than 75%.By as can be known aforementioned, package structure for LED 300 has greater than angle θ 2 scopes of 60% luminous intensity bigger.Therefore, package structure for LED 300 shines in the uniformity of illuminated area higher.Also hence one can see that, and optical texture 330 can help to promote package structure for LED 300 and shine the uniformity in illuminated area.
In addition, in present embodiment, when lug boss 330b add up to two the time, the optical surface 332b of lug boss 330b plane of symmetry P separately overlaps, and the symmetry axis A of body 330a is positioned on the plane of symmetry P of optical surface 332b.
In addition, in other embodiment, please be simultaneously with reference to Fig. 5 A and Fig. 5 B, Fig. 5 A is the stereogram of the package structure for LED of further embodiment of this invention, and Fig. 5 B is the vertical view of the package structure for LED of Fig. 5 A.When lug boss 330b add up to three the time, the optical surface 332b of lug boss 330b plane of symmetry P separately intersects at same axis Z, and axis Z overlaps with the symmetry axis A of body 330a.
In addition, when lug boss 330b add up to four the time (please simultaneously with reference to Fig. 6 A and Fig. 6 B), also be that the plane of symmetry P of the optical surface 332b of each lug boss 330b intersects at same axis Z, and axis Z overlaps with the symmetry axis A of body 330a, so the invention is not restricted to this.That is to say that as long as when the sum of lug boss is at least three, the plane of symmetry of the optical surface of each lug boss intersects at same axis, and this axis overlaps spirit promptly according to the invention with the symmetry axis of body.Therefore have the knack of this skill person, can decide the sum of lug boss according to actual needs.
In sum, package structure for LED of the present invention can change the angular distribution of the luminous intensity of light-emitting diode by lug boss, and then the lifting light-emitting diode shines the uniformity in illuminated area.In addition, can be by the shape or the number of the lug boss that changes package structure for LED, to change the projection of shape of light beam irradiates on illuminated area that package structure for LED was sent.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing a little modification and perfect, so protection scope of the present invention is when with being as the criterion that claims were defined.
Claims (11)
1. a package structure for LED is characterized in that, comprising:
One carrier;
One LED wafer is disposed on this carrier, and is electrically connected to this carrier; And
One optical texture is disposed on this carrier, comprising:
One body covers this LED wafer and this carrier of part, and this body has a first surface and a second surface, and wherein this first surface is a conical surface; And
A plurality of lug bosses, first symmetry axis with this body is the axle center annular arrangement, be disposed on this first surface of this body, wherein each lug boss has an optical surface and a cambered surface, the angle of first symmetry axis of the normal vector of those optical surfaces and this body is between 10 ° to 70 °, add up to two when this lug boss, and those optical surfaces plane of symmetry separately of those lug bosses overlaps, and first symmetry axis of this body is positioned on those optical surfaces plane of symmetry separately simultaneously, maybe the sum when this lug boss is at least three, and those optical surfaces plane of symmetry separately of those lug bosses intersects at same axis, and this axis overlaps with first symmetry axis of this body.
2. package structure for LED as claimed in claim 1 is characterized in that, this optical surface is a cambered surface.
3. package structure for LED as claimed in claim 1 is characterized in that, this optical surface is a plane.
4. package structure for LED as claimed in claim 1 is characterized in that those lug bosses are adjacent.
5. package structure for LED as claimed in claim 1, it is characterized in that, the second surface of this body has a groove, wherein second symmetry axis of this groove overlaps with first symmetry axis of this body, and this groove is towards this first surface depression, and this LED wafer and this carrier of part are disposed in this groove in addition.
6. package structure for LED as claimed in claim 5 is characterized in that, also comprises a packing colloid, be disposed in this groove, and the space of filling between this groove and this LED wafer and this carrier of part.
7. package structure for LED as claimed in claim 6 is characterized in that, the material of this packing colloid is identical with the material of this optical texture.
8. package structure for LED as claimed in claim 6 is characterized in that, the material of this packing colloid is silica resin, epoxy resin, glass or aforesaid combination.
9. package structure for LED as claimed in claim 6 is characterized in that, the material of this optical texture is silica resin, epoxy resin, glass or aforesaid combination.
10. package structure for LED as claimed in claim 1 is characterized in that, the material of this optical texture is silica resin, epoxy resin, glass or aforesaid combination.
11. package structure for LED as claimed in claim 1 is characterized in that, this body and those lug bosses of this optical texture are formed in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101006688A CN101587928B (en) | 2008-05-20 | 2008-05-20 | Light-emitting diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101006688A CN101587928B (en) | 2008-05-20 | 2008-05-20 | Light-emitting diode packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101587928A CN101587928A (en) | 2009-11-25 |
| CN101587928B true CN101587928B (en) | 2011-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101006688A Expired - Fee Related CN101587928B (en) | 2008-05-20 | 2008-05-20 | Light-emitting diode packaging structure |
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| CN (1) | CN101587928B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006309242A (en) * | 2005-04-26 | 2006-11-09 | Lg Electronics Inc | Optical lens, light emitting element package using same, and backlight unit |
| CN1905227A (en) * | 2005-07-26 | 2007-01-31 | 三星电机株式会社 | Light emitting diode package with diffuser and method of manufacturing the same |
-
2008
- 2008-05-20 CN CN2008101006688A patent/CN101587928B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006309242A (en) * | 2005-04-26 | 2006-11-09 | Lg Electronics Inc | Optical lens, light emitting element package using same, and backlight unit |
| CN1905227A (en) * | 2005-07-26 | 2007-01-31 | 三星电机株式会社 | Light emitting diode package with diffuser and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101587928A (en) | 2009-11-25 |
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Granted publication date: 20110511 Termination date: 20140520 |