CN101587928B - Light-emitting diode packaging structure - Google Patents

Light-emitting diode packaging structure Download PDF

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Publication number
CN101587928B
CN101587928B CN 200810100668 CN200810100668A CN101587928B CN 101587928 B CN101587928 B CN 101587928B CN 200810100668 CN200810100668 CN 200810100668 CN 200810100668 A CN200810100668 A CN 200810100668A CN 101587928 B CN101587928 B CN 101587928B
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emitting diode
surface
light emitting
body
optical
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CN 200810100668
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Chinese (zh)
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CN101587928A (en )
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汤钧汶
陈俊玮
骆昆宏
黄秉钧
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阳杰科技股份有限公司
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Abstract

The invention provides a light-emitting diode packaging structure comprising a loader, a light-emitting diode wafer and an optical structure. The light-emitting diode wafer is configured on the loader; the light-emitting diode wafer is electrically connected with the loader; the optical structure is configured on the loader and comprises a body and a raised part; the body covers the light-emittingdiode wafer and part of the loader and is provided with a first surface which is a conical surface and a second surface; and the raise part can change the light-emitting angle distribution of the light-emitting diode packaging structure so as to improve the uniformity of light emitted on an illuminated surface by the light-emitting diode packaging structure.

Description

发光二极管封装结构技术领域 BACKGROUND LED package structure

[0001] 本发明是有关于一种发光二极管封装结构,且特别是有关于一种具有较高的照明面均勻度的发光二极管封装结构。 [0001] The present invention relates to a light emitting diode package, and more particularly relates to an LED package structure with high uniformity of surface illumination. 背景技术 Background technique

[0002] 由于发光二极管封装结构的发光效率不断提升,使得发光二极管封装结构在某些领域已渐渐取代日光灯与白炽灯泡,例如需要高速反应的扫描器灯源、液晶显示器的光源、 汽车的仪表板照明、交通号志灯以及一般的照明装置等。 [0002] Since the light emitting efficiency of the LED package structure rising, so that the light emitting diode package in some areas has gradually replaced fluorescent lamp and incandescent bulbs, such as the need of high-speed response scanner light source, a liquid crystal display light source, car dashboard lighting, traffic lights, and general illumination devices. 发光二极管封装结构与传统灯泡相较的下具有绝对的优势,例如体积小、寿命长、低电压/电流驱动、不易破裂、不含水银(没有污染问题)以及发光效率佳(省电)等特性。 The LED package structure compared with a conventional lamp having an absolute advantage, such as small size, long life, low voltage / current drive, easy to break, good mercury-free (no pollution), and luminous efficiency (power) and the like characteristics .

[0003] 然而,发光二极管的发光强度的角度分布(即配光曲线)多为余弦分布,也就是说,在角度为O度时光强度为最大,且在角度为90度时光强度为0。 [0003] However, the angle of emission intensity distribution of the light emitting diode (i.e., a light distribution curve) mostly cosine distribution, i.e., the angle O of the maximum in light intensity, and at an angle of 90 degrees in light intensity is zero. 因此当以发光二极管做为路灯时,将只能照亮少部分的路面。 Therefore, when the lights as a light emitting diode, to illuminate the road surface only a small portion. 或者是,以发光二极管做为液晶显示器的直下式背光模组的灯源时,液晶显示器的显示画面易有亮度不均勻的问题产生(即显示画面出现一些过亮区域)。 Alternatively, when the light emitting diode as a light source of a liquid crystal display backlight module, the display screen of the liquid crystal display brightness unevenness tend to have problems (i.e., some display area is too bright). 因此,如何提升发光二极管封装结构照射于照明面的均勻度(也就是使发光二极管封装结构的发光强度可较均勻的分布在一较大的角度范围内,而非余弦分布)是目前亟待解决的课题。 Therefore, how to improve the light emitting diode package structure is irradiated to the uniformity of illumination of the surface (i.e. the emission intensity of the LED package structure can be more evenly distributed over a large angular range, instead of the cosine distribution) is solved subject. 发明内容 SUMMARY

[0004] 本发明提供一种发光二极管封装结构,其照射于照明面的均勻度较高。 [0004] The present invention provides an LED package structure, which is irradiated to the high uniformity of surface illumination.

[0005] 本发明提出的一种发光二极管封装结构包括一承载器、一发光二极管晶片以及配置于承载器上的一光学结构。 A light emitting diode package set forth [0005] The present invention comprises a carrier, an LED chip and is disposed on an optical structure on the carrier. 其中,发光二极管晶片配置于承载器上,且发光二极管晶片电性连接至承载器。 Wherein the light emitting diode chip disposed on the carrier, and the light emitting diode chip is electrically connected to the carrier. 光学结构包括一本体以及多个凸起部。 The optical structure comprises a body and a plurality of convex portions. 其中,本体覆盖发光二极管晶片以及部分承载器。 Wherein the body portion covering the LED chip and the carrier. 本体具有一第一表面以及一第二表面,且第一表面为一圆锥曲面。 A body having a first surface and a second surface, and the first surface is a cone surface. 凸起部以该本体的第一对称轴为轴心环状排列,配置于本体的第一表面上,且每一凸起部具有一光学面以及一曲面,光学面的法向量与本体的第一对称轴的夹角介于10°至70°之间。 A first protrusion axis of symmetry as the axis of the annular body is arranged, disposed on the first surface of the body, and each protrusion portion having a first optical surface and a curved surface, the normal vector of the surface of the optical body an angle between the symmetry axis 10 ° to 70 °. 其中,凸起部的总数为二,且凸起部的光学面各自的对称面相互重合,而本体的第一对称轴同时位于光学面各自的对称面上。 Wherein the total number of projections is two, and the optical surface of the projection portion of each of the plane of symmetry coincide with each other, and the first axis of symmetry of the body at the same time located in a respective plane of symmetry of the optical surface. 或者凸起部的总数至少为三,且凸起部的光学面各自的对称面相交于同一轴线,而轴线与本体的第一对称轴重合。 Or the total number of projections is at least three, and the optical surface of the convex portion of each of the same plane of symmetry intersecting the axis and the first axis of symmetry coincides with the axis of the body.

[0006] 在本发明的一实施例中,光学面为一曲面。 [0006] In an embodiment of the present invention, the optical surface is a curved surface.

[0007] 在本发明的一实施例中,光学面为一平面。 [0007] In an embodiment of the present invention, the optical surface is a plane.

[0008] 在本发明的一实施例中,凸起部相邻。 [0008] In an embodiment of the present invention, adjacent projections.

[0009] 在本发明的一实施例中,本体的第二表面具有一凹槽,其中凹槽的第二对称轴与本体的第一对称轴重合,且凹槽朝向凸起部凹陷。 [0009] In an embodiment of the invention, the second surface of the body has a recess, wherein the first symmetry axis and the second axis of symmetry coincides with the main body groove, the groove and the projection portion toward the recess. 此外,发光二极管晶片以及部分承载器配置于凹槽中。 Further, the light emitting diode chip carrier and a portion disposed in the groove.

[0010] 在本发明的一实施例中,还包括一封装胶体,且封装胶体配置于凹槽中,并充填于凹槽与发光二极管晶片以及部分承载器之间的空隙。 [0010] In an embodiment of the present invention, further comprising an encapsulant, and the encapsulant disposed in the groove, and fills in the gap between the grooves and a portion of the light emitting diode chip carrier.

[0011] 以下举出同时适用于上述发光二极管封装结构的实施例。 [0011] The following apply to the embodiments include the light emitting diode package structure.

[0012] 在本发明的一实施例中,封装胶体的材质与光学结构的材质相同。 [0012] In an embodiment of the present invention, the same material as the optical material and the encapsulant structure.

[0013] 在本发明的一实施例中,封装胶体的材质为硅氧树脂、环氧树脂、玻璃或前述的组合。 [0013] In an embodiment of the present invention, the encapsulant is made of a combination of silicone resin, epoxy resin, glass, or combinations thereof.

[0014] 在本发明的一实施例中,光学结构的材质为硅氧树脂、环氧树脂、玻璃或前述的组合。 [0014] In an embodiment of the present invention, the material of the optical structure is a combination of silicone resin, epoxy resin, glass, or combinations thereof.

[0015] 在本发明的一实施例中,光学结构的本体与凸起部为一体成型。 [0015] In an embodiment of the present invention, the body and the projection optical structures are integrally formed.

[0016] 本发明的发光二极管封装结构借由凸起部来改变透出光学结构的光束的分布,进而使发光二极管照射于照明面的均勻度提升。 [0016] LED package structure according to the present invention, the projection portion is changed by means of revealing the structure of the distribution of the optical beam, thereby enabling to enhance the light emitting diode is irradiated to the surface of the illumination uniformity. 附图说明 BRIEF DESCRIPTION

[0017] 为让本发明的上述目的、特征和优点能更明显易懂,以下结合附图对本发明的具体实施方式作详细说明,其中: [0017] In order to make the above-described objects, features and advantages of the present invention can be more fully understood in conjunction with the following drawings of specific embodiments of the present invention will be described in detail, in which:

[0018] 图IA为本发明一实施例的发光二极管封装结构的立体图。 [0018] FIG IA present a perspective view of an LED package structure according to an embodiment of the invention.

[0019] 图IB为图IA的发光二极管封装结构的正视图。 [0019] FIG IB is a front view of the LED package of FIG IA.

[0020] 图IC为图IA的发光二极管封装结构的侧视图。 [0020] FIG IC side view LED package of FIG IA.

[0021] 图ID为图IA的发光二极管封装结构的俯视图。 [0021] FIG ID is a top view of FIG IA LED package structure.

[0022] 图2为本发明一实施例的发光二极管封装结构的发光强度的角度分布图。 [0022] FIG. 2 emission angle intensity LED package structure according to an embodiment of the present invention profile.

[0023] 图3A为本发明另一实施例的发光二极管封装结构的立体图。 Perspective view of the LED package structure according to [0023] another embodiment of the present invention in FIG. 3A.

[0024] 图;3B为图3A的发光二极管封装结构的正视图。 [0024] FIG.; FIG. 3B is a front view of a light emitting diode package of FIG. 3A.

[0025] 图3C为图3A的发光二极管封装结构的侧视图。 [0025] FIG 3C is a side view of a light emitting diode package of FIG. 3A.

[0026] 图3D为图3A的发光二极管封装结构的俯视图。 [0026] FIG 3D is a top view of a light emitting diode package of FIG. 3A.

[0027] 图4为本发明另一实施例的发光二极管封装结构的发光强度的角度分布图。 [0027] FIG. 4 angular luminous intensity LED package structure according to another embodiment of the present invention profile.

[0028] 图5A为本发明又一实施例的发光二极管封装结构的立体图。 [0028] FIG. 5A present invention further perspective view of a light emitting diode package according to an embodiment.

[0029] 图5B为图5A的发光二极管封装结构的俯视图。 [0029] FIG 5B is a top view of a light emitting diode package of FIG. 5A.

[0030] 图6A为本发明再一实施例的发光二极管封装结构的立体图。 [0030] FIG 6A to FIG perspective light emitting diode package structure according to another embodiment of the present invention.

[0031] 图6B为图6A的发光二极管封装结构的俯视图。 [0031] FIG. 6B is a plan view of a light emitting diode package of FIG. 6A.

[0032] 主要元件符号说明: [0032] Description of Symbols principal elements:

[0033] 100、300 :发光二极管封装结构 [0033] 100, 300: a light emitting diode package

[0034] 110、310:承载器 [0034] 110, 310: carrier

[0035] 120、320 :发光二极管晶片 [0035] 120, 320: light emitting diode chip

[0036] 130,330 :光学结构 [0036] 130, 330: optical structures

[0037] 130a、330a:本体 [0037] 130a, 330a: main body

[0038] 130b、330b :凸起部 [0038] 130b, 330b: protrusion

[0039] 132a、332a :第一表面 [0039] 132a, 332a: first surface

[0040] l!Ma、334a :第二表面 [0040] l Ma, 334a:! A second surface

[0041] 13¾:第一凹槽 [0041] 13¾: a first groove

[0042] 134b,334b :弧面[0043] 140、340 :封装胶体 [0042] 134b, 334b: arc [0043] 140, 340: encapsulant

[0044] 332b :光学面 [0044] 332b: optical surface

[0045] A、B、C、E :对称轴 [0045] A, B, C, E: axis of symmetry

[0046] D:直径 [0046] D: Diameter

[0047] DE :深度 [0047] DE: Depth

[0048] F:第二凹槽 [0048] F: a second recess

[0049] Fl :凹槽 [0049] Fl: groove

[0050] L:光束 [0050] L: beam

[0051] N:法向量 [0051] N: normal vector

[0052] P :对称面 [0052] P: the plane of symmetry

[0053] Z:轴线 [0053] Z: axis

[0054] Θ、Θ 1、Θ2 :角度具体实施方式 [0054] Θ, Θ 1, Θ2: angle DETAILED DESCRIPTION

[0055] 本发明主要是借由改变发光二极管的光学结构的外型,使发光二极管照射于照明面的均勻度提升。 [0055] The present invention mainly by means of changing the appearance of the optical configuration of a light emitting diode, light emitting diode is irradiated to improve the uniformity of illumination of the surface.

[0056] 图IA为本发明一实施例的发光二极管封装结构的立体图,而图IB为图IA的发光二极管封装结构的正视图。 [0056] FIG IA present a perspective view of an LED package structure according to an embodiment of the invention, and FIG IB is a front view of the LED package of FIG IA. 图IC为图IA的发光二极管封装结构的侧视图,而图ID为图IA 的发光二极管封装结构的俯视图。 IC is a side view of FIG LED package of FIG IA, FIG. IA and FIG. ID is a top view of a light emitting diode package structure.

[0057] 请同时参照图IA〜图1D,本实施例的发光二极管封装结构100包括一承载器110、一发光二极管晶片120及一光学结构130。 [0057] Referring to FIG IA~ while FIG. 1D, the light emitting diode package structure 100 of the present embodiment includes a carrier 110, a light emitting diode chip 120 and an optical structure 130. 其中,发光二极管晶片120配置于承载器110上,且发光二极管晶片120电性连接至承载器110。 Wherein the LED chip 120 is disposed on the carrier 110, and the light emitting diode chip 120 is electrically connected to the carrier 110.

[0058] 另外,光学结构130配置于承载器110上,光学结构130包括一本体130a以及一凸起部130b。 [0058] Further, the optical structure 130 is disposed on the carrier 110, the optical structure 130 includes a body 130a and a protrusion 130b. 本体130a覆盖发光二极管晶片120以及部分承载器110。 Covering the LED chip 130a of the body 120 and a portion of the carrier 110. 本体130a具有一第一表面13¾以及一第二表面134a,其中第一表面13¾为一圆锥曲面。 A body having a first surface 130a and a second surface 13¾ 134a, wherein the first surface is a cone surface 13¾. 凸起部130b配置于本体130a的第一表面13¾上并位于本体130a的对称轴A上。 A first upper surface portion 130b 13¾ projection 130a disposed at the body and located on the axis of symmetry A of the body 130a. 凸起部130b具有一第一凹槽132b以及一弧面134b。 A first boss portion 130b has a recess 132b, and a curved surface 134b.

[0059] 第一凹槽132b的形状可为圆锥状、半球状、半椭球状或是其他适合的形状。 [0059] The shape of the first grooves 132b may be conical, hemispherical, semi-ellipsoidal, or other suitable shape. 于本实施例中,是以圆锥状的第一凹槽132b为例,然本发明并不以此为限。 In this embodiment, the first groove is conical 132b as an example, however the present invention is not limited thereto. 其中,第一凹槽132b 的对称轴B、弧面134b的对称轴C与本体130a的对称轴A重合,且第一凹槽132b朝向本体130a凹陷。 Wherein the first axis of symmetry B of the groove 132b, 134b of the arc C with the symmetry axis of the body 130a coincides with the axis of symmetry A, and the first recessed grooves 132b toward the body 130a. 此外,第一凹槽132b的开口的直径D与第一凹槽132b的深度DE的比值介于0.7至10之间。 Further, the opening ratio of the diameter D of the depth of the first groove 132b and 132b of the first recess DE between 0.7 to 10.

[0060] 请参照图1B,于本实施例中,角度θ 1是指由发光二极管晶片120所发出的光束L 与对称轴A的夹角,而角度θ 2是代表光束L透出光学结构130时,光束L与对称轴A的夹角。 [0060] Referring to Figure 1B, in the present embodiment, the angle refers to the angle θ 1 by the light beam L emitted from the LED chip 120 and the axis of symmetry A, and the angle θ 2 is representative of the light beam L optical configuration 130 revealed when, the light beam L and the angle of the axis of symmetry a. 凸起部130b位于本体130a的对称轴A上,且凸起部130b的第一凹槽132b的对称轴B、弧面134b的对称轴C与本体130a的对称轴A重合。 Boss portion 130b is located on the axis of symmetry A of the body 130a, and the projection axis of symmetry B of the first portion 130b of the groove 132b, and 134b arc symmetry axis C of the body 130a coincides with an axis of symmetry A. 因此,角度θ 1达到光学结构130 的全反射角度的光束L,会先被凸起部130b的第一凹槽132b反射,然后才以角度θ 2透出光学结构130。 Thus, the angle θ 1 reach the total reflection angle of the light beam L optical structure 130 will first be raised a first recess portion 130b, 132b is reflected at an angle θ 2 before revealing the optical structure 130. 由图IB可知,角度θ 2大于角度Θ1。 It is seen from FIG. IB, an angle θ 2 larger than the angle Θ1. 因此,凸起部130b有助于增加透出光学结构130的光束L的角度θ 2,进而提升发光二极管封装结构100照射于照明面的均勻[0061] 请再同时参照图IA〜图1D,于本实施例中,本体130a与凸起部130b可为一体成型。 Thus, the projection portion 130b of L helps to increase the angle of the beam 130 of the optical structure revealed θ 2, thereby improving the light emitting diode package structure 100 is irradiated to the surface of the uniform illumination [0061] Referring again to FIG IA~ while FIG. 1D, in embodiment, the body portion 130a and the projection 130b of the present embodiment may be integrally molded. 而于其他实施例中,本体130a与凸起部130b亦可为相互独立的两个构件。 While in other embodiments, the body portion 130a and the projection 130b may also be independent of the two members. 另外,于本实施例中,本体130a的第二表面13½可具有一第二凹槽F。 Further, in the present embodiment, the second surface 13½ body 130a may have a second recess F. 其中,第二凹槽F的对称轴E 与本体130a的对称轴A重合,且第二凹槽F朝向凸起部130b凹陷。 Wherein the axis of symmetry E and F of the second recess body 130a coincides with the axis of symmetry A, and a second recess portion 130b recessed F toward the projection. 而且,发光二极管晶片120以及部分承载器110配置于第二凹槽F中。 Further, the light emitting diode chip 120 and a portion of the carrier 110 is disposed in the second recess F.

[0062] 另外,于本实施例中,发光二极管封装结构100还包括一封装胶体140。 [0062] Further, in the present embodiment, the LED package structure 100 further includes an encapsulant 140. 封装胶体140可配置于第二凹槽F中,并充填于第二凹槽F与发光二极管晶片120以及部分承载器110之间的空隙。 Encapsulant 140 may be disposed in the second groove F, and filled in a gap between the second groove 110 F and the LED chip 120 and the carrier portion. 封装胶体140的材质为硅氧树脂、环氧树脂、玻璃、或其他适合的材料,或前述的组合。 Encapsulant material 140 of silicone resin, epoxy resin, glass, or other suitable materials, or combinations thereof.

[0063] 此外,光学结构130的材质为硅氧树脂、环氧树脂、玻璃、或其他适合的材料,或前述的组合。 [0063] Further, the structure of the optical material 130 of silicone resin, epoxy resin, glass, or other suitable materials, or combinations thereof. 光学结构130的材质可以和封装胶体140的材质相同,然本发明不限于此。 The optical structure 130 may be a material and encapsulant material 140 is the same, however the present invention is not limited thereto. 举例来说,光学结构130和封装胶体140也可以是由不同的材质所构成的。 For example, the optical structure 130 and encapsulant 140 may be made of different materials constituted.

[0064] 接着,请参考图2,图2为本发明一实施例的发光二极管封装结构的发光强度的角度分布图(即配光曲线),其中角度θ 2为发光二极管封装结构所发射的光束与本体的对称轴的夹角。 [0064] Next, referring to FIG. 2, FIG. 2 is an angle profile (i.e., a light distribution curve) of the light emission intensity of the LED package structure according to an embodiment of the invention, wherein the angle [theta] 2 of the light beam emitted by the LED package structure of the angle between the symmetry axis of the body. 由图2可知,本实施例的发光二极管封装结构100在角度θ 2介于15°〜75° 之间与-20°〜-71°之间时,具有大于60%的发光强度。 As seen from FIG. 2, the light emitting diode package structure of the present embodiment is between 100 θ 2 of between 15 ° ~75 ° and -20 ° ~-71 ° angle, having greater than 60% of the emission intensity. 当角度θ 2介于25°〜70°之间与-30°〜-65°之间,发光二极管封装结构100更具有大于75%的发光强度。 When the angle θ 2 of between -30 ° ~-65 ° and the LED package structure 100 further having a luminous intensity greater than 75% between 25 ° ~70 °. 由前述可知,发光二极管封装结构100具有大于60%的发光强度的角度Θ2范围较大。 From the foregoing, the light emitting diode package structure 100 having an angle Θ2 range of luminous intensity greater than 60%. 因此,发光二极管封装结构100照射于照明面的均勻度较高。 Thus, the LED package structure 100 is irradiated to the surface of the high uniformity of illumination. 也由此可知,光学结构130可有助于提升由发光二极管封装结构100照射于照明面的均勻度。 It can be seen also, the optical structure 130 may help to improve the uniformity of the illumination by the LED package structure 100 of the illumination surface.

[0065] 图3Α为本发明另一实施例的发光二极管封装结构的立体图,而图:3Β为图3Α的发光二极管封装结构的正视图。 [0065] FIG 3Α present a perspective view of an LED package structure according to another embodiment of the invention, and Fig: 3Β is a front view of the LED package of FIG 3Α. 图3C为图3Α的发光二极管封装结构的侧视图,而图3D为图3Α的发光二极管封装结构的俯视图。 3C is a side view of a light emitting diode package of FIG 3Α, and FIG. 3D is a plan view showing a light emitting diode package structure of 3Α.

[0066] 请同时参照图3Α〜图3D,本实施例的发光二极管封装结构300包括一承载器310、一发光二极管晶片320及一光学结构330。 [0066] Referring to FIG 3Α~ FIG. 3D Meanwhile, the LED package structure 300 of the present embodiment comprises a carrier 310, a light emitting diode chip 320 and an optical structure 330. 其中,发光二极管晶片320配置于承载器310上,且发光二极管晶片320电性连接至承载器310。 Wherein the LED chip 320 disposed on the carrier 310, and the light emitting diode chip 320 is electrically connected to the carrier 310.

[0067] 另外,光学结构330配置于承载器310上,光学结构330包括一本体330a以及多个凸起部330b。 [0067] Further, the optical structure 330 is disposed on the carrier 310, the optical structure body 330 includes a plurality of convex portions 330a and 330b. 于本实施例中,是以两个凸起部330b为代表,然本发明不限于此。 In this embodiment, the two projections 330b are represented, however the present invention is not limited thereto. 而且,本发明并不限制凸起部330b的尺寸,也就是说,这些凸起部330b的尺寸可以是相同的也可以是不同的。 Further, the present invention is not limited by the size of the boss portion 330b, that is, the size of the projection portion 330b which may be the same or may be different. 本体330a具有一第一表面33¾以及一第二表面33½,其中第一表面33¾为一圆锥曲面。 A body having a first surface 330a and a second surface 33¾ 33½, wherein the first surface is a cone surface 33¾. 凸起部330b配置于本体330a的第一表面33¾上,且每一凸起部330b均具有一光学面332b以及一弧面334b。 Boss portion 330b disposed on the first surface of 33¾ body 330a, 330b and each has a projection portion 332b and the optical surface of a curved surface 334b. 而且,光学面332b的法向量N与本体330a的对称轴A 的夹角θ介于10°至70°之间。 Further, the angle θ of the axis of symmetry A vector N optical surface 332b of the body 330a of the method is between 10 ° and 70 °. 光学面332b可以是曲面也可以是平面。 Optical surface 332b may be curved or may be planar.

[0068] 请参照图3C,于本实施例中,当发光二极管晶片320以角度θ 1射出光束L时,光束L可以角度θ 2透出光学结构130,且角度θ 2大于角度Θ1。 [0068] Referring to Figure 3C, in this embodiment, when the light emitting diode chip 320 at an angle θ 1 during injection beam L, light beam L can be revealed an angle θ 2 of the optical structure 130, and an angle θ 2 larger than the angle Θ1. 由于本实施例的发光二极管封装结构300具有两个凸起部330b,因此将所有透出光学结构130的光束L投影在与对称轴A垂直的平面(未绘示)上时,光束L投影的形状将近似一长条状。 Due LED package 300 of the present embodiment has two convex portions 330b, thus revealing all of the light beam L projected optical structure 130 in a plane perpendicular to the axis of symmetry A (not shown), the projection of the light beam L the approximate shape of a long strip. 因此,本实施例的发光二极管封装结构300适于用来做为路灯等需特定光束投影形状的照明系统。 Thus, the LED package structure 300 of the present embodiment is adapted for an illumination system used as the particular shape of the beam lights projected like. [0069] 请再参照图3A〜图3D,于本实施例中,本体330a与凸起部330b可为一体成型。 [0069] Referring again to FIG 3A~ 3D, the embodiment in the present embodiment, the body portion 330a and the projection 330b may be integrally formed. 而于其他实施例中,本体330a与凸起部330b亦可为相互独立的两个构件。 While in other embodiments, the body portion 330a and the projection 330b may also be independent of the two members. 另外,于本实施例中,本体330a的第二表面33½可具有一凹槽Fl。 Further, in the present embodiment, the second surface 33½ body 330a may have a recess Fl. 其中,凹槽Fl的对称轴E与本体330a 的对称轴A重合,且凹槽Fl朝向凸起部330b凹陷。 Wherein the axis of symmetry E Fl recess 330a of the body symmetry axis A coinciding, and Fl groove portion 330b toward the boss recess. 而且,发光二极管晶片320以及部分承载器310配置于凹槽Fl中。 Further, the light emitting diode chip carrier portion 320 and a groove 310 disposed in Fl. 于本实施例中,凸起部330b以对称轴A为轴心环状排列,然本发明不限于此。 In the present embodiment, the projection portion 330b to the axis of symmetry axis A of the annular arrangement, however the present invention is not limited thereto. 此外,于本实施例中,凸起部330b相邻,然本发明不限于此。 Further, in the present embodiment, the raised portion 330b adjacent, then the present invention is not limited thereto.

[0070] 另外,于本实施例中,发光二极管封装结构300还包括一封装胶体340。 [0070] Further, in the present embodiment, the light emitting diode package 300 further includes an encapsulant 340. 封装胶体340可配置于凹槽Fl中,并充填于凹槽Fl与发光二极管晶片320以及部分承载器310之间的空隙。 Encapsulant 340 may be disposed in the recess Fl, and filled in a gap between the recess 310 and Fl 320 and a portion of the light emitting diode chip carrier. 封装胶体340的材质例如为硅氧树脂、环氧树脂、玻璃、或其他适合的材料,或前述的组合。 Encapsulant material 340, for example, silicone resin, epoxy resin, glass, or other suitable materials, or combinations thereof.

[0071] 光学结构330的材质例如为硅氧树脂、环氧树脂、玻璃、或其他适合的材料,或前述的组合。 [0071] The material of the optical structure 330, for example, silicone resin, epoxy resin, glass, or other suitable materials, or combinations thereof. 光学结构330的材质可以和封装胶体340的材质相同,然本发明不限于此。 The optical structure 330 and the material of the encapsulant material 340 may be the same, however the present invention is not limited thereto. 举例来说,光学结构330和封装胶体340也可以是由不同的材质所构成的。 For example, the optical structure 330 and encapsulant 340 may be made of different materials constituted.

[0072] 接着,请参考图4,图4为本发明另一实施例的发光二极管封装结构的发光强度的角度分布图,其中角度θ 2为发光二极管封装结构所发射的光束与本体的对称轴的夹角。 [0072] Next, referring to FIG. 4, FIG. 4 is the angle of emission intensity of light emitting diode package structure according to another embodiment of the invention profile, wherein the angle θ 2 is the beam axis of symmetry of the body of the LED package emitted angle. 由图4可知,本实施例的发光二极管封装结构300在角度θ 2介于20°〜72°之间与-18°〜-70°之间时,具有大于60%的发光强度。 As seen from FIG. 4, the LED package structure 300 of the present embodiment in the angle θ between 20 ° ~72 ° and -18 ° ~-70 ° 2 is interposed, having greater than 60% of the emission intensity. 当角度θ 2介于30°〜65°之间与-27°〜-65°之间,发光二极管封装结构300更具有大于75%的发光强度。 When the angle θ 2 between -27 ° ~65 ° and the LED package structure 300 further having a luminous intensity greater than 75% between 30 ° ~65 °. 由前述可知,发光二极管封装结构300具有大于60%的发光强度的角度θ 2范围较大。 From the foregoing, the light emitting diode package structure 300 having an angle greater than 60% of the emission intensity of 2 θ larger range. 因此,发光二极管封装结构300照射于照明面的均勻度较高。 Thus, the light emitting diode package 300 is irradiated to the surface of the high uniformity of illumination. 也由此可知,光学结构330可有助于提升发光二极管封装结构300照射于照明面的均勻度。 It can be seen also, the optical structure 330 can help to improve the light emitting diode package 300 is irradiated to the surface of the illumination uniformity.

[0073] 此外,于本实施例中,当凸起部330b的总数为二时,凸起部330b的光学面332b各自的对称面P相互重合,且本体330a的对称轴A位于光学面332b的对称面P上。 [0073] Further, in the present embodiment, when the optical surface of the convex portion 330b is the total number of Second, the respective protrusion portions 332b and 330b of the plane of symmetry P coincide with each other, and the body of the axis of symmetry A 330a of the optical surface 332b of the plane of symmetry P.

[0074] 另外,于其他实施例中,请同时参照图5A与图5B,图5A为本发明又一实施例的发光二极管封装结构的立体图,而图5B为图5A的发光二极管封装结构的俯视图。 [0074] Further, in other embodiments, please 5B, FIG 5A are perspective view of an LED package structure according to another embodiment of the invention with reference to FIG. 5A and FIG., While FIG 5B is a top view of a light emitting diode package of FIG. 5A . 当凸起部330b的总数为三时,凸起部330b的光学面332b各自的对称面P相交于同一轴线Z,而且轴线Z与本体330a的对称轴A重合。 332b when the respective optical surface plane of symmetry of the total number of projections is three 330b, 330b projecting portion P of the same intersects the axis Z, and Z axis of the body 330a of the symmetry axis A coincide.

[0075] 此外,当凸起部330b的总数为四时(请同时参照图6A与图6B),也是每个凸起部330b的光学面332b的对称面P相交于同一轴线Z,而且轴线Z与本体330a的对称轴A重合,然本发明不限于此。 [0075] Further, when the total number is four protrusion 330b (refer to FIGS. 6A and 6B), each projection is symmetric surface 330b of the optical surface 332b of the same P intersects the axis Z, and axis Z a main body 330a and the axis of symmetry coincides, then the present invention is not limited thereto. 也就是说,只要当凸起部的总数至少为三时,每一凸起部的光学面的对称面相交于同一轴线,且此一轴线与本体的对称轴重合,即符合本发明的精神。 That is, whenever the total number of projections is at least three, each optical surface of the projection plane of symmetry intersecting portions on the same axis and this axis is coincident with the axis of symmetry of the body, i.e., in line with the spirit of the present invention. 因此熟习此技艺者,可以依照实际需要来决定凸起部的总数。 Thus those skilled in this art, the total number of protrusions may be determined in accordance with the actual needs.

[0076] 综上所述,本发明的发光二极管封装结构可借由凸起部来改变发光二极管的发光强度的角度分布,进而提升发光二极管照射于照明面的均勻度。 [0076] In summary, the LED package structure according to the present invention may by angular luminous intensity is changed by the protrusion distribution of the light emitting diode, thereby improving the uniformity of the illumination light-emitting diode is irradiated surface. 此外,可借由改变发光二极管封装结构的凸起部的形状或数目,以改变发光二极管封装结构所发出的光束照射于照明面上的投影形状。 Further, by means of a shape or changing the number of projections of the light emitting diode package structure, the shape of the projected light beam is irradiated to change a light emitting diode package is emitted to the illumination surface.

[0077] 虽然本发明已以较佳实施例揭示如上,然其并非用以限定本发明,任何本领域技术人员,在不脱离本发明的精神和范围内,当可作些许的修改和完善,因此本发明的保护范围当以权利要求书所界定的为准。 [0077] While the present invention has been disclosed in the preferred embodiment described above, they are not intended to limit the present invention, anyone skilled in the art, without departing from the spirit and scope of the present invention, can make some modifications and improvement, Therefore, the scope of the invention as defined in the claims and their equivalents.

Claims (11)

  1. 1. 一种发光二极管封装结构,其特征在于,包括:一承载器;一发光二极管晶片,配置于该承载器上,且电性连接至该承载器;以及一光学结构,配置于该承载器上,包括:一本体,覆盖该发光二极管晶片以及部分该承载器,该本体具有一第一表面以及一第二表面,其中该第一表面为一圆锥曲面;以及多个凸起部,以该本体的第一对称轴为轴心环状排列,配置于该本体的该第一表面上, 其中每一凸起部具有一光学面以及一弧面,该些光学面的法向量与该本体的第一对称轴的夹角介于10°至70°之间,当该凸起部的总数为二,且该些凸起部的该些光学面各自的对称面相互重合,而该本体的第一对称轴同时位于该些光学面各自的对称面上,或当该凸起部的总数至少为三,且该些凸起部的该些光学面各自的对称面相交于同一轴线,而该轴线与该本体的第一 1. A light emitting diode package structure, comprising: a carrier; a light emitting diode chip, disposed on the carrier and electrically connected to the carrier; and an optical structure disposed on the carrier on, comprising: a body, covering the LED chip and a portion of the carrier, the body having a first surface and a second surface, wherein the first surface is a conical surface; and a plurality of raised portions, to the first symmetry axis as the axis of the annular body is arranged on the first surface disposed on the body, wherein each protrusion has an optical surface and a curved surface, the plurality of optical surface normal vector with the body a first angle between the axis of symmetry 10 ° to 70 °, when the total number of the projection portions is two, and the plurality of optical surfaces of the projection portion of each of these plane of symmetry coincide with each other, and the body of at the same time the axis of symmetry is located in a plane of symmetry of each of the plurality of optical surfaces, or when the total number of the axis of the boss portion is at least three, and the plurality of optical surfaces of the projection portion of each of these faces meet on the same axis of symmetry, and the first body 称轴重合。 He said axis coincide.
  2. 2.如权利要求1所述的发光二极管封装结构,其特征在于,该光学面为一弧面。 The light emitting diode package structure as claimed in claim 1, wherein the optical surface is a curved surface.
  3. 3.如权利要求1所述的发光二极管封装结构,其特征在于,该光学面为一平面。 The light emitting diode package structure as claimed in claim 1, wherein the optical surface is a plane.
  4. 4.如权利要求1所述的发光二极管封装结构,其特征在于,该些凸起部相邻。 The light emitting diode package structure as claimed in claim 1, wherein the plurality of adjacent projections.
  5. 5.如权利要求1所述的发光二极管封装结构,其特征在于,该本体的第二表面具有一凹槽,其中该凹槽的第二对称轴与该本体的第一对称轴重合,且该凹槽朝向该第一表面凹陷,此外该发光二极管晶片以及部分该承载器配置于该凹槽中。 The light emitting diode package according to claim 1, wherein the second surface of the body has a recess, wherein the second axis of symmetry coincides with the first recess symmetry axis of the body, and the recessed groove toward the first surface, in addition to the LED chip and the carrier part is disposed in the recess.
  6. 6.如权利要求5所述的发光二极管封装结构,其特征在于,还包括一封装胶体,配置于该凹槽中,并充填于该凹槽与该发光二极管晶片以及部分该承载器之间的空隙。 The light emitting diode package according to claim 5, characterized in that, further comprising an encapsulant disposed in the recess, and the recess is filled in between the LED chip and the portion of the carrier gap.
  7. 7.如权利要求6所述的发光二极管封装结构,其特征在于,该封装胶体的材质与该光学结构的材质相同。 The light emitting diode package according to claim 6, characterized in that the same material as the optical material and the structure of the encapsulant.
  8. 8.如权利要求6所述的发光二极管封装结构,其特征在于,该封装胶体的材质为硅氧树脂、环氧树脂、玻璃或前述的组合。 The light emitting diode package according to claim 6, wherein the encapsulant is made of silicone resin, epoxy resin, glass, or combinations thereof.
  9. 9.如权利要求6所述的发光二极管封装结构,其特征在于,该光学结构的材质为硅氧树脂、环氧树脂、玻璃或前述的组合。 The LED package structure according to claim 6, characterized in that the material of the optical structure is a combination of silicone resin, epoxy resin, glass, or combinations thereof.
  10. 10.如权利要求1所述的发光二极管封装结构,其特征在于,该光学结构的材质为硅氧树脂、环氧树脂、玻璃或前述的组合。 10. The LED package structure according to claim 1, wherein the material of the optical structure is a silicone resin, epoxy resin, glass, or combinations thereof.
  11. 11.如权利要求1所述的发光二极管封装结构,其特征在于,该光学结构的该本体与该些凸起部为一体成型。 11. The LED package structure according to claim 1, characterized in that the body of the optical structure and the plurality of boss portions formed integrally.
CN 200810100668 2008-05-20 2008-05-20 Light-emitting diode packaging structure CN101587928B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006309242A (en) 2005-04-26 2006-11-09 Lg Electronics Inc Optical lens, light emitting element package using same, and backlight unit
CN1905227A (en) 2005-07-26 2007-01-31 三星电机株式会社 Light emitting diode package with diffuser and method of manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006309242A (en) 2005-04-26 2006-11-09 Lg Electronics Inc Optical lens, light emitting element package using same, and backlight unit
CN1905227A (en) 2005-07-26 2007-01-31 三星电机株式会社 Light emitting diode package with diffuser and method of manufacturing the same

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