CN101577240B - Wafer fixing device and wafer fixing method - Google Patents
Wafer fixing device and wafer fixing method Download PDFInfo
- Publication number
- CN101577240B CN101577240B CN2008100961709A CN200810096170A CN101577240B CN 101577240 B CN101577240 B CN 101577240B CN 2008100961709 A CN2008100961709 A CN 2008100961709A CN 200810096170 A CN200810096170 A CN 200810096170A CN 101577240 B CN101577240 B CN 101577240B
- Authority
- CN
- China
- Prior art keywords
- wafer
- hole
- ring
- adsorbent equipment
- wafer fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The invention discloses a wafer fixing device and a wafer fixing method, which are used for solving the problems of twisted crystal grain arrangement, poor wafer flatness and poor space usage rate in the prior art. The wafer fixing device comprises a vacuum source, an adsorption device and a wafer fixing ring, wherein a first through hole is formed in the adsorption device, and the first through hole is connected to the vacuum source; the wafer fixing ring is arranged on the adsorption device and is fixed on the adsorption device through a clamping device; and the wafer fixing ring comprises an inner ring, an outer ring and an annular base, wherein the inner ring and the outer ring are formed on the annular base, an adsorption space is formed between the inner ring and the outer ring, and the annular base comprises a second through hole which is used for connecting the first through hole and the adsorption space. The wafer fixing method comprises the following steps: preparing the adsorption device; putting the wafer fixing ring on the adsorption device, and then, clamping the wafer fixing ring and the adsorption device through the clamping device; forming a vacuum state in the wafer fixing ring and the adsorption device; and putting a blue film pasted with a wafer on the wafer fixing ring.
Description
Technical field
The present invention relates to a kind of wafer fixing apparatus, particularly a kind of wafer fixing apparatus and method thereof of utilizing vacuum suction.
Background technology
Light-emitting diode (Light emitting diode, application LED) is extensive day by day, and a plurality of light-emitting diodes of existing at present employing are lined up the application that the array mode presents light source or display; And on the wafer of identical light-emitting diode, the color wavelength and the brightness of intergranule are inequality.In order to satisfy the consistency of product, need in fabrication steps, choose brilliant processing procedure to LED crystal particle for color wavelength and luminosity sensitivity requirement.And before choosing brilliant fabrication steps, the light-emitting diode wafer need be attached on the blue film, with fixing crystal grain when cutting apart wafer and become crystal grain.Afterwards, need logical blue toner expansion and use tensioner ring to be fastened in blue film edge,, be beneficial to choose the convenience of brilliant fabrication steps to strengthen the gap (Pitch) of crystal grain and intergranule.Need use the fixing blue film of wafer fixing apparatus choosing on the brilliant device and choose brilliant fabrication steps, so that carry out continuous fabrication steps.
Traditional wafer fixing apparatus adopts mechanical means, mechanical wafer fixture such as gripping mechanism for example, so that the tensioner ring of blue film periphery is fixed, promptly with a ring tool with otch, be surrounded on the tensioner ring periphery, by one group of Fastener reduction close incisions, will encircle tool fastening and fixing tensioner ring.Because the mechanical wafer fixture directly tightens tensioner ring, also promptly directly tensioner ring is bestowed mechanical stress with fixing, so the crystal grain in the as easy as rolling off a log wafer that causes on the blue film produces the arrangement position distortion, and then the problem of misalignment when producing the crystal grain selection and reduce the wafer evenness.
In manufacture of semiconductor, develop with the fixing technology of wafer of the mode of vacuum suction.For example, U.S. Pat 6,803, No. 780 the patent case proposes a kind of support semiconductor wafer slide holder (chuck) structure, utilize the solid construction of upper strata and lower floor to coincide mutually, and on the upper strata and lower floor connect vacuum source with vacuum passage, by the fixing semiconductor crystal wafer of vacuum suction.Yet, US 6,803, No. 780 slide holder structure is solid framework, and slide holder only reaches fixedly semiconductor crystal wafer as carrying, test suite can't be set below wafer, if it is use in the processing procedure of light-emitting diode, and can't put the thimble device, brilliant to carry out choosing of crystal grain in the slide holder middle part, so its space utilization rate of limitation is impelled the flexibility that can't below wafer test suite be set and reduce process design in the silicon wafer process flow process.
Therefore, still need one can solve above-mentioned crystal grain arrangement distortion now, the wafer evenness is not good and the device or the system of the problem that the space utilization rate is not good, to promote the production qualification rate.
Summary of the invention
The purpose of this invention is to provide a kind of crystal grain and arrange non-warping, that the wafer evenness is good and the space utilization rate is high wafer fixing apparatus and method thereof.
For achieving the above object, the present invention adopts following technical scheme:
On the one hand, wafer fixing apparatus provided by the invention comprises vacuum source; Adsorbent equipment, it comprises first annulus, comprises a hollow space in annulus, and one first through hole is formed in this annulus, and first through hole is connected to vacuum source; And wafer retainer ring, it places on the adsorbent equipment, by clamping close device fixedly the wafer retainer ring on adsorbent equipment, the wafer retainer ring comprises interior ring, outer shroud and cyclic group bottom, interior ring and outer ring are formed on the cyclic group bottom, form an adsorption space between interior ring and the outer shroud, the cyclic group bottom comprises second through hole, in order to connect first through hole and adsorption space.
Further, described adsorption space comprises a space.
Described adsorption space comprises a plurality of intercommunicating pores.
Described wafer retainer ring fix that a blue film encircles in this and this outer shroud on.
The material of described wafer retainer ring comprises plastics or metal.
Ring, outer shroud and cyclic group bottom are one-body molded in described.
Described clamping close device comprises:
Two fasteners are formed on this adsorbent equipment; And
Two connecting holes form through this cyclic group bottom, and this connecting hole is to should fastener, insert behind the connecting hole fixing for fastener.
Wherein, described connecting hole comprises an insertion section, a moving part and a fixed part.
Described clamping close device comprises: two-screw; And
The four-way hole, two through holes in this four-way hole form through this cyclic group bottom, two through holes in addition in the four-way hole form through this adsorbent equipment, two through-hole alignments of this cyclic group bottom also are overlapped in two through holes of this adsorbent equipment, two-screw wears through hole and locking, in order to fixedly wafer retainer ring and adsorbent equipment.
Described wafer retainer ring comprises hollow space and is formed among the interior ring.
Described adsorbent equipment comprises an annulus, and this first through hole is formed in this annulus.
Wherein, described adsorbent equipment also comprises a hollow space and is formed among this annulus.
Described adsorbent equipment comprises an annulus, and described fastener is formed on the upper surface of annulus.
Described vacuum source comprises a vacuum pump.
On the other hand, wafer fixing method provided by the invention comprises and purchases adsorbent equipment, and it comprises an annulus, comprises a hollow space in annulus, and one first through hole is formed in this annulus, and this first through hole is connected to a vacuum source; Place the wafer retainer ring on adsorbent equipment with by clamping close device engaging wafer retainer ring and adsorbent equipment, this wafer retainer ring comprises ring in, an outer shroud and cyclic group bottom, ring and this outer ring are formed on this cyclic group bottom in being somebody's turn to do, form an adsorption space in being somebody's turn to do between ring and this outer shroud, this cyclic group bottom comprises one second through hole, in order to connect this first through hole and this adsorption space; In wafer retainer ring and adsorbent equipment, form vacuum state; And place stick together wafer is arranged blue film on the wafer retainer ring.
The present invention has following beneficial effect:
Wafer fixing apparatus provided by the invention and method thereof can promote the evenness reliability after the wafer set, can increase the fixedly convenience of wafer, can keep the crystal grain arrangement position not twisted, and then the problem of misalignment that is produced when avoiding the crystal grain selection; Can also save the production pull-down time; Simultaneously, the present invention must be arranged in the hollow space of this wafer fixing apparatus some test suites in the silicon wafer process flow process, to improve the flexibility and the space utilization rate of silicon wafer process design.
Description of drawings
The present invention can and be described in detail and accompanying drawing is understood by some preferred embodiments in the specification, yet those skilled in the art should understand all preferred embodiments of the present invention in order to explanation but not in order to limit claim of the present invention, wherein:
Fig. 1 is the exploded view of wafer fixing apparatus of the present invention;
Fig. 2 is the top view of the wafer retainer ring of wafer fixing apparatus of the present invention;
Fig. 3 is the following view of the wafer retainer ring of wafer fixing apparatus of the present invention;
Fig. 4 is the schematic diagram of wafer fixing apparatus of the present invention;
Fig. 5 is the profile of the adsorbent equipment of wafer fixing apparatus of the present invention;
Fig. 6 is the profile of wafer fixing apparatus of the present invention;
The profile of Fig. 7 blue film and wafer wafer fixing apparatus thereon for the present invention is adsorbed with;
Topic; Can also save the production pull-down time; Simultaneously, the present invention must be arranged in the hollow space of this wafer fixing apparatus some test suites in the silicon wafer process flow process, to improve the flexibility and the space utilization rate of silicon wafer process design.
Fig. 9 is the flow chart of wafer fixing method of the present invention.
Embodiment
In order to make those skilled in the art person understand the present invention program better, and above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with drawings and Examples.
The invention provides a wafer fixing apparatus, will carry the blue film set in addition of wafer to utilize the vacuum suction mode.As shown in Figure 1, in preferred embodiment of the present invention, wafer fixing apparatus 10 comprises wafer retainer ring 101 and adsorbent equipment 102, and wafer retainer ring 101 and adsorbent equipment 102 are fixed in wafer retainer ring 101 on the adsorbent equipment 102 by a clamping close device.Ring 1011, outer shroud 1012 and cyclic group bottom 1014 in wafer retainer ring 101 comprises.In one embodiment, interior ring 1011, outer shroud 1012 and cyclic group bottom 1014 are formed in one.Wafer retainer ring 101 also comprise a hollow space 1013 be formed in the ring 1011 in.The below of ring 1011 and outer shroud 1012 in cyclic group bottom 1014 is formed at, and outwards outstanding.In one embodiment, interior ring 1011 and outer shroud 1012 can be made by metal, plastics or any other suitable material.
As shown in Figure 1, adsorbent equipment 102 comprises annulus 1022, adsorbent equipment 102 comprise one or multi-through hole 1021 form through annulus 1022, above-mentioned through hole 1021 is connected with a vacuum source (will be described in afterwards).Annulus 1022 has hollow space 1023; And one or the multi-through hole 1021 of adsorbent equipment 102 can be provided with pipeline to be connected to vacuum source (will be described in the back), forms vacuum state whereby in through hole 1021.In one embodiment, vacuum source can be vacuum pump.
The top view that Fig. 2, Fig. 3 are respectively wafer retainer ring 101 of the present invention reaches view down; Because interior ring 1011 and outer shroud 1012 are formed on the cyclic group bottom 1014, so be formed with space 1016 between interior ring 1011 and the outer shroud 1012; Be clear expression space, diagram is partly through exaggerating purposely demonstration, and in fact space 1016 for very little; In addition, cyclic group bottom 1014 also comprises one or multi-through hole 1017, and it is formed on the lower surface 1018 of cyclic group bottom 1014.Please contrast Fig. 2 and Fig. 3, through hole 1017 forms in alignment with space 1016, and is connected with space 1016.
Please contrast Fig. 1～Fig. 3, the connecting hole 1015 of wafer retainer ring 101 and the fastener 1024 of adsorbent equipment 102 are the embodiment of the present invention's one clamping close device; Cyclic group bottom 1014 at wafer retainer ring 101 comprises at least two connecting holes 1015, its upper surface from cyclic group bottom 1014 runs through the lower surface of cyclic group bottom 1014 to cyclic group bottom 1014, connecting hole 1015 is made up of an insertion section 1015a, a moving part 1015b and a fixed part 1015c, as shown in Figure 2.Adsorbent equipment 102 comprises at least two fasteners 1024, and it is formed on the upper surface of annulus 1022 and projects upwards.
Fig. 4 is the schematic diagram of wafer fixing apparatus, please contrast Fig. 2 simultaneously, in wafer fixing apparatus 10, wafer retainer ring 101 is placed on the adsorbent equipment 102, simultaneously fastener 1024 is inserted the insertion section 1015a of connecting hole 1015, moving part 1015b via connecting hole 1015 enters fixed part 1015c again, by fixed part 1015c fixed card component 1024, with wafer retainer ring 101 engaging and be fixed on the adsorbent equipment 102.The present invention utilize the configuration of clamping close device make in the ring 1011 and the diameter dimension change on demand of outer shroud 1012 so that the blue film of set different size.Clamping close device of the present invention, except that the embodiment of fastener 1024 and connecting hole 1015, also can finish other execution mode, for example in Fig. 4, fastener 1024 and connecting hole 1015 places all replace with through hole, at the through hole of the through-hole alignment adsorbent equipment 102 of wafer retainer ring 101 and after overlapping, wear the through hole locking by screw, to reach wafer retainer ring 101 is fixed on purpose on the adsorbent equipment 102.
Please contrast Fig. 1～Fig. 4, after engaging wafer retainer ring 101, through hole 1021 and through hole 1017 be for being interconnected, and then through hole 1021 is connected with through hole 1017 and space 1016; By as mentioned above through hole 1021 being connected to vacuum source, and then make through hole 1017, space 1016 and the through hole 1021 of connection form a vacuum path.So, utilize the vacuum state that forms in the space 1016 of ring-type the edge of blue film (will be described in the back) can be adsorbed on space 1016, interior ring 1011 and the outer shroud 1012.
Fig. 5～Fig. 7 is each assembly profile of wafer fixing apparatus, and its demonstration utilizes the step procedure of this wafer fixing apparatus 10 set wafers.As shown in Figure 5, at first get adsorbent equipment 102 ready, can be provided with one or multi-through hole 1021 in the adsorbent equipment 102, to be connected to vacuum source 105 by exterior tubing; In one embodiment, vacuum source 105 can be vacuum pump.As shown in Figure 6, wafer retainer ring 101 then places on the adsorbent equipment 102 and the function by fastener 1024 and connecting hole 1015 engages.Space 1016 is formed between interior ring 1011 and the outer shroud 1012, and space 1016, through hole 1017 and through hole 1021 interconnect; Therefore, can make between space 1016, through hole 1017 and the through hole 1021 and form vacuum state by opening vacuum source 105.As shown in Figure 7, thereafter, stick together the blue film 103 that wafer 104 is arranged and be positioned on interior ring 1011, outer shroud 1012 and the space 1016.The vacuum state that forms in the space 1016 by ring-type can evenly open on the hollow space 1013 of interior ring 1011 blue film 103 the edge absorption of blue film 103.In addition, as shown in Figures 7 and 8, in one embodiment, wafer 104 attaches on the blue film 103, with fixing crystal grain when wafer 104 is cut into crystal grain, then blue film 103 is expanded and passed through the edge of the blue film 103 of tensioner ring 106 fixings, strengthen the gap of crystal grain and intergranule, be beneficial to the brilliant fabrication steps of choosing subsequently.Know as those skilled in the art, blue film 103 is transparent, thus set have wafer 104 wafer fixing apparatus 10 stereogram as shown in Figure 8, blue film 103 because of transparent so can't be shown among Fig. 8.
Therefore, as mentioned above, wafer fixing apparatus of the present invention 10 utilizes the vacuum state that forms and blue film 103 is adsorbed thereon and in addition set the space 1016 of ring-type in, since wafer fixing apparatus 10 need not be on wafer stress application, thereby promote evenness reliability after the wafer set, and keep the crystal grain arrangement position not twisted, and then the problem of misalignment that is produced when avoiding the crystal grain selection and improve the production qualification rate, also increase the fixedly convenience of wafer, save pull-down time; And, because wafer retainer ring 101 and adsorbent equipment 102 that this wafer fixing apparatus 10 is comprised all have hollow space 1013,1023, so also have hollow space as Fig. 4 and the wafer fixing apparatus 10 that combines shown in Figure 8, therefore some test suites can be arranged in the above-mentioned hollow space in the silicon wafer process program, to improve the flexibility and the space utilization rate of silicon wafer process design.
In wafer fixing method of the present invention, as shown in Figure 9, at first purchase adsorbent equipment in step 201, adsorbent equipment is connected to vacuum source; In step 202 wafer retainer ring be positioned over adsorbent equipment on by clamping close device to engage above-mentioned wafer retainer ring and adsorbent equipment thereafter; Then, in wafer retainer ring and adsorbent equipment, form vacuum state in step 203; Afterwards, will stick together in step 204 and have the blue film of wafer to be positioned on the wafer retainer ring.
The above; only for the preferable embodiment of the present invention, but protection scope of the present invention is not limited thereto, and anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement, all should be encompassed in protection scope of the present invention in.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (13)
1. a wafer fixing apparatus is characterized in that, comprises:
One vacuum source;
One adsorbent equipment, it comprises an annulus, comprises a hollow space in annulus, and one first through hole is formed in this annulus, and this first through hole is connected to this vacuum source; And
One wafer retainer ring, it places on this adsorbent equipment, fix this wafer retainer ring on this adsorbent equipment by a clamping close device, this wafer retainer ring comprises ring in, an outer shroud and cyclic group bottom, ring and this outer ring are formed on this cyclic group bottom in being somebody's turn to do, form an adsorption space in being somebody's turn to do between ring and this outer shroud, this cyclic group bottom comprises one second through hole, in order to connect this first through hole and this adsorption space.
2. wafer fixing apparatus according to claim 1 is characterized in that described adsorption space comprises a space.
3. wafer fixing apparatus according to claim 1 is characterized in that described adsorption space comprises a plurality of intercommunicating pores.
4. wafer fixing apparatus according to claim 1 is characterized in that, described wafer retainer ring fix that a blue film encircles in this and this outer shroud on.
5. wafer fixing apparatus according to claim 1 is characterized in that the material of described wafer retainer ring comprises plastics or metal.
6. wafer fixing apparatus according to claim 1 is characterized in that, described interior ring, outer shroud and cyclic group bottom are one-body molded.
7. wafer fixing apparatus according to claim 1 is characterized in that, described clamping close device comprises:
Two fasteners are formed on this adsorbent equipment; And
Two connecting holes form through this cyclic group bottom, and this connecting hole is to should fastener, insert behind the connecting hole fixing for fastener.
8. wafer fixing apparatus according to claim 7 is characterized in that, described connecting hole comprises an insertion section, a moving part and a fixed part.
9. wafer fixing apparatus according to claim 1 is characterized in that, described clamping close device comprises:
Two-screw; And
The four-way hole, two through holes in this four-way hole form through this cyclic group bottom, two through holes in addition in the four-way hole form through this adsorbent equipment, two through-hole alignments of this cyclic group bottom also are overlapped in two through holes of this adsorbent equipment, two-screw wears through hole and locking, in order to fixedly wafer retainer ring and adsorbent equipment.
10. wafer fixing apparatus according to claim 1 is characterized in that, described wafer retainer ring comprises a hollow space and is formed among this interior ring.
11. wafer fixing apparatus according to claim 7 is characterized in that described adsorbent equipment comprises an annulus, described fastener is formed on the upper surface of annulus.
12. wafer fixing apparatus according to claim 1 is characterized in that described vacuum source comprises a vacuum pump.
13. a wafer fixing method is characterized in that, includes following steps:
Purchase an adsorbent equipment, it comprises an annulus, comprises a hollow space in annulus, and one first through hole is formed in this annulus, and this first through hole is connected to a vacuum source;
Place a wafer retainer ring on this adsorbent equipment to engage this wafer retainer ring and this adsorbent equipment by a clamping close device, this wafer retainer ring comprises ring in, an outer shroud and cyclic group bottom, ring and this outer ring are formed on this cyclic group bottom in being somebody's turn to do, form an adsorption space in being somebody's turn to do between ring and this outer shroud, this cyclic group bottom comprises one second through hole, in order to connect this first through hole and this adsorption space;
In this wafer retainer ring and this adsorbent equipment, form vacuum state; And
Placement stick together a wafer is arranged a blue film on this wafer retainer ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100961709A CN101577240B (en) | 2008-05-09 | 2008-05-09 | Wafer fixing device and wafer fixing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100961709A CN101577240B (en) | 2008-05-09 | 2008-05-09 | Wafer fixing device and wafer fixing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101577240A CN101577240A (en) | 2009-11-11 |
| CN101577240B true CN101577240B (en) | 2011-03-30 |
Family
ID=41272123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100961709A Expired - Fee Related CN101577240B (en) | 2008-05-09 | 2008-05-09 | Wafer fixing device and wafer fixing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101577240B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9227261B2 (en) | 2013-08-06 | 2016-01-05 | Globalfoundries Inc. | Vacuum carriers for substrate bonding |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102676997A (en) * | 2012-06-11 | 2012-09-19 | 上海宏力半导体制造有限公司 | Physical vapor deposition equipment |
| CN107538342A (en) * | 2016-06-24 | 2018-01-05 | 上海新昇半导体科技有限公司 | A kind of wafer supports board component, burnishing device and wafer precise polishing method |
| CN108074853A (en) * | 2017-04-27 | 2018-05-25 | 深圳市东飞凌科技有限公司 | Wafer alignment method and device |
| CN108872260B (en) * | 2017-05-11 | 2021-12-24 | 无锡华润安盛科技有限公司 | Wafer detection tool and wafer detection device |
| CN109244029B (en) * | 2018-09-28 | 2022-12-02 | 上海微松工业自动化有限公司 | Wafer flattening and fixing device |
| CN111370989B (en) * | 2018-12-25 | 2021-07-02 | 潍坊华光光电子有限公司 | Semiconductor laser bar cleavage epitaxial wafer chip mounting device and chip mounting method |
| CN116669354B (en) * | 2023-06-30 | 2023-11-21 | 昆山宝誉斯电源科技有限公司 | Seal head structure of voltage stabilizer |
-
2008
- 2008-05-09 CN CN2008100961709A patent/CN101577240B/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9227261B2 (en) | 2013-08-06 | 2016-01-05 | Globalfoundries Inc. | Vacuum carriers for substrate bonding |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101577240A (en) | 2009-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101577240B (en) | Wafer fixing device and wafer fixing method | |
| US20140043817A1 (en) | Method And Device For Constructing High-Power LED Lighting Fixture | |
| CN102439355A (en) | Light source device and display device | |
| CN101174612A (en) | High power light-emitting diode light source and lamp with the same | |
| CN100424559C (en) | Supporting structure and backlight mould with the same | |
| CN201373263Y (en) | LED illuminating lamp | |
| US20240072230A1 (en) | Electronic device | |
| CN109005662A (en) | Chip mounting system and chip mounting method | |
| US9335024B2 (en) | Lens and light source module incorporating the same | |
| US20130107537A1 (en) | Rotating device to change lighting angle | |
| CN102074624B (en) | Preparation method and device of LED epitaxial wafer | |
| TWI381480B (en) | Wafer anchoring device and method of the same | |
| WO2012110331A1 (en) | Lighting device | |
| CN201014275Y (en) | High power light-emitting diode light source device and lamp having light source device | |
| US20150118799A1 (en) | Mechanism to attach a die to a substrate | |
| CN107842739A (en) | Environment-friendly type LED desk lamp is used in a kind of easy-to-mount municipal administration | |
| CN211743119U (en) | Compression ring loading and unloading device for wafer carrying disc | |
| CN209116143U (en) | A kind of mounting structure and a kind of Ceiling light component of Ceiling light | |
| CN209116248U (en) | A kind of lens installation structure | |
| CN210179540U (en) | Anti-dismantling structure and lamp applying same | |
| US20190351449A1 (en) | Method for fabricating semiconductor chip by using multi-curing apparatus and multi-curing apparatus | |
| US7629993B2 (en) | Automated wafer defect inspection system using backside illumination | |
| CN207702227U (en) | A kind of pin-connected panel panel light | |
| CN205877740U (en) | LED lighting device | |
| CN215183867U (en) | Identification device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110330 Termination date: 20180509 |