CN101576210B - High power LED chip modularized flat lamp - Google Patents
High power LED chip modularized flat lamp Download PDFInfo
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- CN101576210B CN101576210B CN2009101079560A CN200910107956A CN101576210B CN 101576210 B CN101576210 B CN 101576210B CN 2009101079560 A CN2009101079560 A CN 2009101079560A CN 200910107956 A CN200910107956 A CN 200910107956A CN 101576210 B CN101576210 B CN 101576210B
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- power led
- led chip
- clad plate
- copper clad
- high power
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention relates to a high power LED chip modularized flat lamp. The current known high power LED lamp is designed by adopting traditional luminaire and the volume is large aiming at radiating problem. To overcome the disadvantages, high power LED chips are used for forming a modularized flat lamp, the substrate adopts a circuitron copper clad plate with double sides printed, the high power LED chip is directly welded on the copper clad plate, the area of a radiating fan is expanded as far as possible while meeting electric insulation to improve the radiating problem of the high power LED, each unit comprises four high power LED chips, the international 12V constant flow source is adopted, thin semitransparent lighting material coating or lighting material coating of the inner surfaceof a sealed transparent protective cover is used for improving color temperature of lighting and light pollution, and flatting is realized, thus being convenient for installation and reducing cost; the invention belongs to the field of high power LED chip modularized flat lamp.
Description
Technical field
Belong to the high power LED chip modularized flat lamp field.
Background technology
Present known high-power LED illumination all adopts conventional lamp formula illumination, is difficult for solving the great power LED cooling problem, and is too dazzling and light pollution is arranged, and popularizes and is subjected to certain limitation.
Summary of the invention
The purpose of this invention is to provide a kind of high power LED chip modularized flat formula illuminating lamp, design for solving above-mentioned deficiency.
Advantage is: adopt the characteristics of great power LED energy-saving and environmental protection, eliminate certain light pollution, improve colour temperature, and improve the great power LED cooling problem, make the unit block formula simultaneously, flat high-power LED illuminating lamp is convenient to produce in batches.
The technical scheme of high power LED chip modularized flat lamp of the present invention is: substrate adopts two-sided hard printed circuit copper clad plate, be shaped as circular or square, the partly most heat sink that keeps as led chip the two poles of the earth of the deposited copper of printed circuit board (PCB), the deposited copper of the printed circuit board (PCB) of the position of installation high-power LED chip is corroded, high-power LED chip is welded in to be corroded and applies on the printed circuit board (PCB) of copper, and keeps good electric insulation.
Basic structure of the present invention: copper clad plate comprises positive pole and negative pole, and the positive pole of copper clad plate is positioned at the outside of high-power LED chip, and the negative pole of copper clad plate is positioned at the inboard of high-power LED chip; The positive pole of high-power LED chip is welded on the copper clad plate positive pole radiating fin; At the intersection of the negative pole of the positive pole of copper clad plate and copper clad plate and in the outside of the negative pole of the positive pole of copper clad plate and copper clad plate is the substrate insulating layer that erodes after applying copper, and the positive pole of copper clad plate is provided with metal aperture as the positive and negative two-sided fin that is connected printed circuit board (PCB) with the negative pole of copper clad plate.Base printed circuit board is a dual platen, and two-sided sign is the same, and technology is the same, is convenient to better great power LED cooling.Switch on former luminously when the LED positive and negative electrode, form high power LED chip modularizedization flat head lamp.
The copper clad plate that does not promptly erode that keeps is as the high-power LED chip fin.
This is one group of assembly by international electricity consumption 12V, according to the position of customer requirements and illumination, and can one group, two groups or several groups of flat head lamps that combination of components formation needs by same principle.
Weld the antirust and reflective good thin metal layer of copper clad plate surface plating that high power LED chip modularized one side keeps, better to the LED illumination effect; Be better protection high-power LED chip flat head lamp, front surface plates the heat-resisting transparency protected thin layer of one deck again together with the led chip surface, or front surface seals the thin heat-resisting transparent protective shield of topped one deck.This transparent protective shield requires also can to make inside and outside different radians according to optically focused or astigmatic degree, like with concave mirror or convex lens shape.The protective cover inner surface sprays translucent different lighting material thin layer and can change the colour temperature of illuminating lamp and alleviate light pollution.
Prevent the safety that high-power LED chip opens circuit and causes, each chip compensating element, in parallel replaces the certain electric current of chip controls circuit when the chip short circuit.
Good effect of the present invention is: energy-saving and environmental protection, brightness height, life-span length, panelized are convenient to install, and alleviate light pollution, regulate colour temperature.
Description of drawings
Fig. 1 is the structural representation of high power LED chip modularized flat lamp key lighting lamp:
Among Fig. 1:
1), 1,2,3,4 is high-power LED chip;
The utmost point is welded on the copper clad plate positive pole radiating fin; At the intersection of the negative pole of the positive pole of copper clad plate and copper clad plate and in the outside of the negative pole of the positive pole of copper clad plate and copper clad plate is the substrate insulating layer that erodes after applying copper, and the positive pole of copper clad plate is provided with metal aperture as the positive and negative two-sided fin that is connected printed circuit board (PCB) with the negative pole of copper clad plate.Base printed circuit board is a dual platen, and two-sided sign is the same, and technology is the same, is convenient to better great power LED cooling.Switch on former luminously when the LED positive and negative electrode, form high power LED chip modularizedization flat head lamp.
The copper clad plate that does not promptly erode that keeps is as the high-power LED chip fin.
This is one group of assembly by international electricity consumption 12V, according to the position of customer requirements and illumination, and can one group, two groups or several groups of flat head lamps that combination of components formation needs by same principle.
Weld the antirust and reflective good thin metal layer of copper clad plate surface plating that high power LED chip modularized one side keeps, better to the LED illumination effect; Be better protection high-power LED chip flat head lamp, front surface plates the heat-resisting transparency protected thin layer of one deck again together with the led chip surface, or front surface seals the thin heat-resisting transparent protective shield of topped one deck.This transparent protective shield requires also can to make inside and outside different radians according to optically focused or astigmatic degree, like with concave mirror or convex lens shape.The protective cover inner surface sprays translucent different lighting material thin layer and can change the colour temperature of illuminating lamp and alleviate light pollution.
Prevent the safety that high-power LED chip opens circuit and causes, each chip compensating element, in parallel replaces the certain electric current of chip controls circuit when the chip short circuit.
Good effect of the present invention is: energy-saving and environmental protection, brightness height, life-span length, panelized are convenient to install, and alleviate light pollution, regulate colour temperature.
Description of drawings
Fig. 1 is the structural representation of high power LED chip modularized flat lamp key lighting lamp:
Among Fig. 1:
1), 1,2,3,4 is high-power LED chip.
Claims (5)
1. high power LED chip modularized flat lamp, it is characterized in that: substrate adopts two-sided hard printed circuit copper clad plate, be shaped as circular or square, the partly most heat sink that keeps as led chip the two poles of the earth of the deposited copper of printed circuit board (PCB), the deposited copper of the printed circuit board (PCB) of the position of installation high-power LED chip is corroded, high-power LED chip is welded in to be corroded and applies on the printed circuit board (PCB) of copper, and keeps good electric insulation.
2. high power LED chip modularized flat lamp according to claim 1 is characterized in that: copper clad plate comprises positive pole and negative pole, and the positive pole of copper clad plate is positioned at the outside of high-power LED chip, and the negative pole of copper clad plate is positioned at the inboard of high-power LED chip; The positive pole of high-power LED chip is welded on the copper clad plate positive pole radiating fin; At the intersection of the negative pole of the positive pole of copper clad plate and copper clad plate and in the outside of the negative pole of the positive pole of copper clad plate and copper clad plate is the substrate insulating layer that erodes after applying copper, and the positive pole of copper clad plate is provided with metal aperture as the positive and negative two-sided fin that is connected printed circuit board (PCB) with the negative pole of copper clad plate.
3. high power LED chip modularized flat lamp according to claim 1 and 2 is characterized in that: front surface plates the heat-resisting transparency protected thin layer of one deck again together with the led chip surface, or front surface seals the thin heat-resisting transparent protective shield of topped one deck.
4. high power LED chip modularized flat lamp according to claim 3 is characterized in that: for improving colour temperature and reducing the translucent lighting material layer of light pollution front surface sealed transparent protective cover spraying one deck.
5. high power LED chip modularized flat lamp according to claim 1 is characterized in that: be security, and each high-power chip compensating element, in parallel, its effect is: replace chip when chip opens circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101079560A CN101576210B (en) | 2009-06-15 | 2009-06-15 | High power LED chip modularized flat lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101079560A CN101576210B (en) | 2009-06-15 | 2009-06-15 | High power LED chip modularized flat lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101576210A CN101576210A (en) | 2009-11-11 |
| CN101576210B true CN101576210B (en) | 2011-06-08 |
Family
ID=41271219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101079560A Active CN101576210B (en) | 2009-06-15 | 2009-06-15 | High power LED chip modularized flat lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101576210B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2116944U (en) * | 1992-03-14 | 1992-09-23 | 汉颖电子股份有限公司 | Luminescent diode indicator based on printed circuit board |
| CN201038159Y (en) * | 2007-01-19 | 2008-03-19 | 瑞仪光电股份有限公司 | Light emitting diode module substrate with heat-conductive efficiency |
| CN101159300A (en) * | 2007-11-12 | 2008-04-09 | 西安立明电子科技有限责任公司 | Copper base high power LED packaging |
-
2009
- 2009-06-15 CN CN2009101079560A patent/CN101576210B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2116944U (en) * | 1992-03-14 | 1992-09-23 | 汉颖电子股份有限公司 | Luminescent diode indicator based on printed circuit board |
| CN201038159Y (en) * | 2007-01-19 | 2008-03-19 | 瑞仪光电股份有限公司 | Light emitting diode module substrate with heat-conductive efficiency |
| CN101159300A (en) * | 2007-11-12 | 2008-04-09 | 西安立明电子科技有限责任公司 | Copper base high power LED packaging |
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| Publication number | Publication date |
|---|---|
| CN101576210A (en) | 2009-11-11 |
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Owner name: SHENZHEN XINYANG LANGUANG ENERGY INVESTMENT CO., L Free format text: FORMER OWNER: JIN ZILI Effective date: 20120217 |
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Free format text: CORRECT: ADDRESS; FROM: 518067 SHENZHEN, GUANGDONG PROVINCE TO: 518040 SHENZHEN, GUANGDONG PROVINCE |
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Effective date of registration: 20120217 Address after: 518040 Shenzhen City nine road Futian District Tairan Tang building west block 2805 Patentee after: Shenzhen Xinyang blue light energy investment Co., Ltd. Address before: 518067, No. 6, No. 401, 62 flower road, Shekou, Guangdong, Shenzhen, Nanshan District Patentee before: Jin Zili |
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Owner name: SHENZHEN XINYANG LAN'GUANG ENERGY TECHNOLOGY DEVEL Free format text: FORMER NAME: SHENZHEN XINYANG LAN'GUANG ENERGY INVESTMENT CO., LTD. |
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Address after: Floor 4, 2 floor, St Joseph Industrial Park, Xin Yu Road, manhole street, manhole, Baoan District, Shenzhen Patentee after: Shenzhen Xinyanglanguang Energy Science Technology Development Co., Ltd. Address before: Shenzhen City, Futian District Tang building Tairan nine Road West 2805 Patentee before: Shenzhen Xinyang blue light energy investment Co., Ltd. |
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Address after: 518000 Guangdong City, Longgang Province, Buji street, Longgang Avenue, the city of integrated building, building No. 113, B Patentee after: Shenzhen new blue energy Polytron Technologies Inc Address before: 518040, Shenzhen, Baoan District, manhole street, Xin Yu Road, St George Industrial Park, 2 floor, east 4 Patentee before: Shenzhen Xinyanglanguang Energy Science Technology Development Co., Ltd. |
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Address after: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Peace Street Community Jiuyang Industrial Park 6 301B Patentee after: Shenzhen new blue energy Polytron Technologies Inc Address before: 518000 Guangdong City, Longgang Province, Buji street, Longgang Avenue, the city of integrated building, building No. 113, B Patentee before: Shenzhen new blue energy Polytron Technologies Inc |