CN101565595A - Adhesive compound, method for modifying adhesive and product made from the modified adhesive - Google Patents

Adhesive compound, method for modifying adhesive and product made from the modified adhesive Download PDF

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Publication number
CN101565595A
CN101565595A CNA2008100957031A CN200810095703A CN101565595A CN 101565595 A CN101565595 A CN 101565595A CN A2008100957031 A CNA2008100957031 A CN A2008100957031A CN 200810095703 A CN200810095703 A CN 200810095703A CN 101565595 A CN101565595 A CN 101565595A
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sensitive gel
boric acid
organic pressure
adhesive composition
ester
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Inventor
吴轩
熊海锟
华佳明
于文娟
陈力君
杰斯瑞·塞思
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3M Innovative Properties Co
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3M Innovative Properties Co
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Priority to CNA2008100957031A priority Critical patent/CN101565595A/en
Priority to PCT/US2009/039995 priority patent/WO2009131838A1/en
Publication of CN101565595A publication Critical patent/CN101565595A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention provides adhesive compound, a method for modifying adhesive and a product made from the modified adhesive. The organic silicon pressure-sensitive adhesive compound comprises organic silicon pressure-sensitive adhesive and compound containing boron-oxygen bonds.

Description

Adhesive compound, to the method and the goods thereof of tackiness agent modification
Technical field:
The present invention relates to a kind of adhesive compound, to the method and the goods thereof of tackiness agent modification.Specifically, the method and the goods thereof that relate to a kind of organic pressure-sensitive gel adhesive composition, the organic pressure-sensitive gel stick are carried out modification.
Background technology
At present, the organic pressure-sensitive gel stick is mainly by making poly-diorganosiloxane and having copolymerization units R 3SiO 1/2(abbreviating the M unit as) and another kind of copolymerization units SiO 4/2The copolymerized siloxanes resin reaction of (abbreviating the Q unit as) or mixed getting.The organic pressure-sensitive gel stick since its can bonding organosilicon etc. the characteristic of low-surface-energy material and good high temperature performance, be widely used in and make various Pressuresensitive Tapes.
But above-mentioned organic pressure-sensitive gel stick can produce some problems in some applications, for example, Pressuresensitive Tape made under the thin situation of organic pressure-sensitive gel stick coating thickness to the bonding strength of organosilicon material a little less than, do not satisfy the requirement of application.
Therefore, be badly in need of at present a kind of to organosilicon material bonding strength organic pressure-sensitive gel adhesive composition and Pressuresensitive Tape goods preferably.
Summary of the invention
According to an aspect of the present invention, provide a kind of organic pressure-sensitive gel adhesive composition, it comprises:
The organic pressure-sensitive gel stick; With
The compound that contains boron oxygen key.
According to another aspect of the present invention, provide a kind of method that the organic pressure-sensitive gel stick is carried out modification, it is included in the organic pressure-sensitive gel stick for the treatment of modification and sneaks into the compound that contains boron oxygen key.
According to a further aspect of the invention, provide a kind of Pressuresensitive Tape goods, it comprises organic pressure-sensitive gel adhesive composition of the present invention.
Under the thin situation of pressure-sensitive adhesive coating thickness, organosilicon material still had bonding strength preferably according to the organic pressure-sensitive gel adhesive composition and Pressuresensitive Tape goods of certain embodiments of the present invention.
Above summary of the present invention is not to be intended to describe each disclosed embodiment of the present invention or each manner of execution.Detailed description is used for the illustrative embodiment more specifically, and to do be any limitation of the invention and it should not recognized.
Embodiment
Unless specialize, term " organic pressure-sensitive gel stick " is meant a kind of composition, and except not comprising " compound that contains boron oxygen key ", it can comprise required any necessity of conventional organic pressure-sensitive gel stick and inessential component.
Unless specialize, term " MQ resin " is meant to have copolymerization units R 3SiO 1/2(abbreviating the M unit as) and another kind of copolymerization units SiO 4/2The copolymerized siloxanes resin of (abbreviating the Q unit as), wherein each R represents a monovalence alkyl that contains no more than 6 carbon atoms independently of one another.In certain embodiments, its also contain one or more following can with the functional group of siloxanes bonding: hydrogen; Can with the thiazolinyl of siloxanes bonding, be selected from the group of vinyl, allyl group, propenyl or more senior thiazolinyl as those.
Unless specialize, term " poly-diorganosiloxane " is meant a kind of poly-diorganosiloxane that contains in hydroxyl, alkenyl-functional groups or the hydride more than one, and each organic radical can be independently selected from the group in the group of being made up of alkyl group, kiki alkenyl group, group of naphthene base and aromatic yl group.For example hydroxy-end capped polydimethylsiloxane and polydimethyl diphenyl siloxane.
Unless specialize, all umbers, per-cent, ratio etc. are all by weight.
Unless specialize, think that all numerals modify by term " about ", and the repetition according to the digital scope of end points is included in this scope with interior all numerals that comprised (for example, 0.05 to 30 weight % comprises 0.05,0.08,0.1,0.15,0.2,0.25,0.3,0.35,0.4,0.425,1,2,5,10,15,18,20,25 and 30 weight %).
Organic pressure-sensitive gel adhesive composition of the present invention comprises: organic pressure-sensitive gel stick and the compound that contains boron oxygen key.
The organic pressure-sensitive gel stick of any routine all is applicable to the present invention.
Based on the total solid content of organic pressure-sensitive gel stick, comprise according to the organic pressure-sensitive gel stick that is suitable for of embodiments more of the present invention:
The MQ resin of (1) 30～70 weight %, the MQ resin is to have R 3SiO 1/2Unit (M unit) and SiO 4/2The copolymerized siloxanes resin of unit (Q unit), wherein each R represents the monovalence alkyl that contains no more than 6 carbon atoms independently of one another;
The poly-diorganosiloxane of (2) 30～70 weight %, poly-diorganosiloxane is a kind of poly-diorganosiloxane that contains in hydroxyl, alkenyl-functional groups or the hydride more than one, and each organic radical of poly-diorganosiloxane can be the group that is selected from the group of being made up of alkyl group, kiki alkenyl group, group of naphthene base and aryl independently.The example that can list is hydroxy-end capped polydimethylsiloxane and polydimethyl diphenyl siloxane; With
(3) optional curing catalysts for example, is selected from by catalysts for radical polymerization diaryl peroxide cross-linking agent for example, contains the silane of amino-functional group, and the organic acid metal-salt is the group formed of dibutyl tin acetate for example.Consumption according to some embodiment can be 0-10 weight %.
Based on the total solid content of organic pressure-sensitive gel stick, the organic pressure-sensitive gel stick suitable according to the another kind of some embodiments comprises:
The MQ resin of (1) 30～70 weight %.The MQ resin is to have R 3SiO 1/2Unit (M unit) and SiO 4/2The copolymerized siloxanes resin of unit (Q unit), wherein each R represents a monovalence alkyl that contains no more than 6 carbon atoms independently of one another, and have one or more can with the functional group of siloxanes bonding: hydrogen; Can with the thiazolinyl of siloxanes bonding, be selected from the group of vinyl, allyl group, propenyl or more senior thiazolinyl as those;
The poly-diorganosiloxane of (2) 30～70 weight % for example, contains the polydimethylsiloxane and the polydimethyl diphenyl siloxane of vinyl groups;
(3) Ren Xuan linking agent or chain extension agent for example contain the silicone oil of silicon hydrogen group or alkenyl group, can be 0.1 weight %-20 weight % according to the consumption of some embodiment; With
(4),, can be 0.1ppm at least according to the amount of some embodiment based on the gross weight of above component (1)-(3) as Pt or other precious metal of hydrosilylation catalysts.
These composition example can be referring to United States Patent (USP) 3,527, and 842,3,983,298,4,774,297, European patent 355,991 and 393,426.
The existence form of MQ tackifying resin and poly-diorganosiloxane for example can be the blend or the reaction product form of MQ tackifying resin and siloxane polymer.
Except that above-mentioned example, the solvent-free organic pressure-sensitive gel stick of other type and curing mode that waits is suitable for too.Example includes but not limited to the organic pressure-sensitive gel composition of the organic pressure-sensitive gel adhesive composition of ultra-violet curing, various modifications.
In some embodiments, the organic pressure-sensitive gel stick also can comprise various additives, as pigment and filler.
A large amount of commercially available organic pressure-sensitive gel sticks are suitable for.The example of these silicone pressure sensitive adhesives includes but not limited to 280A, 282,7355,7356,7358,7502,7657, Q2-7406, Q2-7566 and the Q2-7735 of Dow Corning; The PSA590 of Momentive, PSA600, PSA595, PSA610, PSA518, PSA6574, PSA529, PSA750-D1 and PSA800-C; And the KRT001 of ShinEtsu, KRT002, KRT003, KRT009, KR101-10, KR120 and KR3700.
The boracic oxygen key compound that is suitable among the present invention is not particularly limited, and the example includes but not limited to boric acid, boric acid ester (boric acid trimethylammonium ester, boric acid triethyl ester, boric acid tripropyl ester, tributyl borate, boric acid three monooctyl esters, triamyl borate, boric acid three dodecyl esters, boric acid three hexene glycol esters, boric acid triisobutyl methyl ester, boric acid three stearyl, triphenyl borate, boric acid trimethylphenyl ester) etc., boron trioxide and its derivative.In certain embodiments, boracic oxygen key compound consumption is the 0.05-30% of above-mentioned organic pressure-sensitive gel adhesive composition total solid content weight.
The organic pressure-sensitive gel alternate product that is made by organic pressure-sensitive gel adhesive composition of the present invention includes but not limited to, is single face, double-sided pressure-sensitive adhesive tape and the glued membrane of base material with various materials.
Organic pressure-sensitive gel stick according to some embodiment has very high bonding strength to organosilicon material, and can be widely used in the bonding of organosilicon material by the Pressuresensitive Tape of its production.For example, bonding between the organosilicon material, and bonding between organosilicon material and other materials.
Embodiment
The testing method of bonding force: testing used silicon rubber is that ShinEtsu KE-971TU is hot-forming, and thickness is about 2mm.With made width is that the adhesive tape of 12.7mm is attached on the silicon rubber of forming, with sample balance 72 hours under the conditions of 50% relative humidity and 22.2 degree, peels off with 300mm/min speed 180 degree directions more then.3 samples of test in each embodiment.The mean number of required power peeled off in record.
The polyethylene terephthalate that adopts among the embodiment (PET) film comprises the PET film of handling by chemistry and physical method.
Embodiment 1
By stirring trimethyl borate (3 weight part) and Degussa DCLBP-50-PSI (6 weight part) are evenly spread in the solution of the ShinEtsu KRT-002 polydimethylsiloxane pressure-sensitive adhesive that contains 100 weight parts.Be that 40% pressure sensitive adhesive compositions is coated on the PET film of 0.025mm then with the solids content that produces, then at once 70 ℃ of dryings 1 minute.Dried glue was solidified 2 minutes at 165 ℃.The thickness of the dried glue that obtains is 0.040mm.
Embodiment 2
Trimethyl borate (5 weight part) and CAT-PL-50T catalyzer (ShinEtsu) (0.83 weight part) are joined in the solution of the ShinEtsu KR3700 polydimethylsiloxane pressure-sensitive adhesive that contains 100 weight parts, and under agitation be uniformly dispersed.Be that 40% pressure sensitive adhesive compositions is coated on the PET film of 0.025mm then with the solids content that produces, then at once 70 ℃ of dryings 1 minute.Dried glue was solidified 2 minutes at 130 ℃.The thickness of the dried glue that obtains is 0.040mm.
Embodiment 3
With tributyl borate (28 weight part) and
Figure A20081009570300081
A75 (3 weight part) joins in the solution of the Momentive PSA610 polydimethylsiloxane pressure-sensitive adhesive that contains 100 weight parts, and under agitation is uniformly dispersed.Be that 40% pressure sensitive adhesive compositions is coated on the PET film of 0.025mm then with the solids content that produces, then at once 70 ℃ of dryings 1 minute.Dried glue was solidified 2 minutes at 177 ℃.The thickness of the dried glue that obtains is 0.040mm.
Embodiment 4
Boric acid (3 weight part) and Degussa DCLBP-50-PSI (3 weight part) are joined in the solution of the Dow Corning 280A polydimethylsiloxane pressure-sensitive adhesive that contains 100 weight parts, and under agitation be uniformly dispersed.Be that 40% pressure sensitive adhesive compositions is coated on the PET film of 0.025mm then with the solids content that produces, then at once 70 ℃ of dryings 1 minute.Dried glue was solidified 2 minutes at 165 ℃.The thickness of the dried glue that obtains is 0.040mm.
Embodiment 5
Tributyl borate (12 weight part) and Degussa DCLBP-50-PSI (2 weight part) are joined in the solution of the Dow Corning 7355 polydimethylsiloxane pressure-sensitive adhesives that contain 100 weight parts, and under agitation be uniformly dispersed.Be that 40% pressure sensitive adhesive compositions is coated on the PET film of 0.025mm then with the solids content that produces, then at once 70 ℃ of dryings 1 minute.Dried glue was solidified 2 minutes at 165 ℃.The thickness of the dried glue that obtains is 0.040mm.
Embodiment 6
Boron trioxide (3 weight part) and Degussa DCLBP-50-PSI (3 weight part) are joined in the solution of the Dow Corning Q2-7735 polydimethylsiloxane pressure-sensitive adhesive that contains 100 weight parts, and under agitation be uniformly dispersed.Be that 40% pressure sensitive adhesive compositions is coated on the PET film of 0.025mm then with the solids content that produces, then at once 70 ℃ of dryings 1 minute.Dried glue was solidified 2 minutes at 165 ℃.The thickness of the dried glue that obtains is 0.040mm.
Compare with corresponding embodiment, Comparative Examples is boracic oxygen key compound not, and all the other are identical.
Boron oxygen key compound title Boron oxygen key compound consumption, weight % Pressure sensitive adhesive Catalyzer/linking agent title Catalyzer/dosage of crosslinking agent, weight % Bonding strength (N/mm)
Embodiment 1 Trimethyl borate 3 KRT002 DCLBP-50-PSI 6 0.74
Comparative Examples 1 0 KRT002 DCLBP-50-PSI 6 0.27
Embodiment 2 Trimethyl borate 5 KR3700 CAT-PL-50T 0.83 0.36
Comparative Examples 2 0 KR3700 CAT-PL-50T 0.83 0.09
Embodiment 3 Tributyl borate 28 PSA610 A75 3 0.60
Comparative Examples 3 0 PSA610 A75 3 0.33
Embodiment 4 Boric acid 3 280A DCLBP-50-PSI 3 0.96
Comparative Examples 4 0 280A DCLBP-50-PSI 3 0.36
Embodiment 5 Tributyl borate 12 7355 DCLBP-50-PSI 2 0.81
Comparative Examples 5 0 7355 DCLBP-50-PSI 2 0.38
Embodiment 6 Boron trioxide 3 Q2-7735 DCLBP-50-PSI 3 1.31
Comparative Examples 6 0 Q2-7735 DCLBP-50-PSI 3 0.41
Embodiment 7
Divided by 20% but not 30% solid content prepares the silicone polyurea polymkeric substance, and use 75/25 but not beyond the solvent admixture of toluene/2-propyl alcohol of 70/30, according to US6,730, gather diorganosiloxane polyurea segmented copolymers (silicone polyurea) pressure-sensitive adhesive at title for the program preparation that is provided in the part of " preparation of silicone polyurea polymkeric substance " among the 397B.By with the 2-propyl alcohol blending of the toluene of the MQ resin J of the elastomer solution of 63 weight parts, 24.3 weight parts, 11.63 weight parts and 1.08 weight parts and fine mixing guaranteeing homogeneity, thereby with elastomerics preparation becoming silicone polyurea pressure-sensitive adhesive.MQ resin J is treated MQ resin in order to reduce silanol content, and by M, Q and T OHStructural unit is formed, and has 1.2 M/Q ratio, 0.8% SiOH content, 2820 number-average molecular weight (Mn), the solid content of 4600 weight-average molecular weight (Mw) and the 63.4wt% in dimethylbenzene.Generalized as following institute, the tributyl borate (TBB) of the various amounts of adding in this silicone polyurea pressure-sensitive adhesive.It is reported that the amount of TBB is the weight part in per 100 parts silicone polyurea tackiness agent.The pressure sensitive adhesive compositions cutter that produces is coated with, and 70 ℃ of dryings 10 minutes, with the dry coating of preparation 0.051mm on PET.
Embodiment 8
As described in for the embodiment in the U.S. Patent Publication 20,070,148,475 1, poly-diorganosiloxane polyoxamide multipolymer (silicone polyoxamide) tackiness agent of preparation.In the silicone polyoxamide tackiness agent of 100 weight parts, add tributyl borate (6 weight part).30% solid solution of this material that will be in toluene and the blending of 50% SR545 MQ resin (available from GE) are to form adhesive compound.The adhesive compound cutter is coated with, and 70 ℃ of dryings 10 minutes, with the dry coating of preparation 0.051mm on PET.
The PSA adhesive tape that is produced that has and do not have TBB by the test of following method is bonding for siloxanes: roll on silicon rubber once with 30.5cm/ minute by the roll with 2kg, described silicon rubber is from the thick orange-red silicon rubber of the 60A Durometer Plain 4.2mm of McMaster Carr (Part#8632K922).
In the IMASS trier, by with the peel angles of the speed of 30.5cm/ minute (12 inch per minute clock) and 90 degree from the silicon rubber release adhesive measure under 22 ℃ and 50% relative humidity condition maintenance 15 minutes and keep 24 hours later peel off bonding.With gram/inch record result, and be translated into newton/mm.Reported the average mean value of 3 measurements.
Figure A20081009570300111
*Tackiness agent is not peeled off from silicon rubber, and peels off from base material.

Claims (19)

1. organic pressure-sensitive gel adhesive composition, it comprises:
The organic pressure-sensitive gel stick; With
The compound that contains boron oxygen key.
2. the organic pressure-sensitive gel adhesive composition of claim 1, wherein in the total solid content of composition, the described consumption that contains the compound of boron oxygen key is 0.05-30wt%.
3. the organic pressure-sensitive gel adhesive composition of claim 1, organic pressure-sensitive gel stick wherein based on the total solid content of organic pressure-sensitive gel stick, comprises following component:
The copolymerized siloxanes resin of (1) 30～70wt%, it has copolymerization units R 3SiO 1/2With another kind of copolymerization units SiO 4/2, wherein each R represents a monovalence alkyl that contains no more than 6 carbon atoms independently of one another;
The poly-diorganosiloxane of (2) 30～70wt%; With
(3) Ren Xuan curing catalysts.
4. the organic pressure-sensitive gel adhesive composition of claim 3, wherein poly-diorganosiloxane is a kind of poly-diorganosiloxane that contains in hydroxyl, thiazolinyl or the hydride more than one, and each described organic radical is independently selected from free alkyl group, kiki alkenyl group, cyclic hydrocarbon radical group and aromatic yl group.
5. the organic pressure-sensitive gel adhesive composition of claim 3, wherein poly-diorganosiloxane is hydroxy-end capped polydimethylsiloxane and/or polydimethyl diphenyl siloxane.
6. the organic pressure-sensitive gel adhesive composition of claim 3, wherein said curing catalysts is selected from catalysts for radical polymerization, contains the silane and the organic acid metal-salt of amino-functional group.
7. the organic pressure-sensitive gel adhesive composition of claim 3, wherein based on the gross weight meter of three kinds of components (a)-(c) of organic pressure-sensitive gel stick, the consumption of described curing catalysts is 0-10wt%.
8. the organic pressure-sensitive gel adhesive composition of claim 1, organic pressure-sensitive gel stick wherein based on the total solid content of organic pressure-sensitive gel stick, comprises following component:
The copolymerized siloxanes resin of (1) 30～70wt%, it has copolymerization units R 3SiO 1/2With another kind of copolymerization units SiO 4/2, wherein each R represents a monovalence alkyl that contains no more than 6 carbon atoms independently, and this copolymerized siloxanes resin have one or more can with the functional group of siloxanes bonding;
The poly-diorganosiloxane of (2) 30～70wt%;
(3) hydrosilylation catalysts; With
(4) Ren Xuan linking agent and/or chain extension agent.
9. the organic pressure-sensitive gel adhesive composition of claim 8, wherein said can be hydrogen and/or thiazolinyl with the functional group of siloxanes bonding.
10. the organic pressure-sensitive gel adhesive composition of claim 9 wherein saidly can be selected from vinyl, allyl group and propenyl with the thiazolinyl of siloxanes bonding.
11. the organic pressure-sensitive gel adhesive composition of claim 1, wherein said organic pressure-sensitive gel stick comprise poly-diorganosiloxane polyurea segmented copolymers.
12. the organic pressure-sensitive gel adhesive composition of claim 1, wherein said organic pressure-sensitive gel stick comprise poly-diorganosiloxane polyoxamide multipolymer.
13. each organic pressure-sensitive gel adhesive composition among the claim 1-12, the wherein said compound that contains boron oxygen key is selected from boric acid, boric acid ester, boron trioxide and its derivative.
14. the organic pressure-sensitive gel adhesive composition of claim 13, wherein said boric acid ester are selected from boric acid trimethylammonium ester, boric acid triethyl ester, boric acid tripropyl ester, tributyl borate, boric acid three monooctyl esters, triamyl borate, boric acid three dodecyl esters, boric acid three hexene glycol esters, boric acid triisobutyl methyl ester, boric acid three stearyl, triphenyl borate, boric acid trimethylphenyl ester and their various mixtures.
15. the method that the organic pressure-sensitive gel stick is carried out modification, it is included in the organic pressure-sensitive gel stick for the treatment of modification and sneaks into the compound that contains boron oxygen key.
16. the method for claim 15 wherein contains the mixed volume of the compound of boron oxygen key, the total solid content in the organic pressure-sensitive gel adhesive composition of institute's modification is 0.05-30wt%.
17. the method for claim 15 or 16, the wherein said compound that contains boron oxygen key is selected from boric acid, boric acid ester, boron trioxide and its derivative.
18. the method for claim 17, wherein said boric acid ester are selected from boric acid trimethylammonium ester, boric acid triethyl ester, boric acid tripropyl ester, tributyl borate, boric acid three monooctyl esters, triamyl borate, boric acid three dodecyl esters, boric acid three hexene glycol esters, boric acid triisobutyl methyl ester, boric acid three stearyl, triphenyl borate, boric acid trimethylphenyl ester and their various mixtures.
19. Pressuresensitive Tape goods, it comprises among the claim 1-14 each organic pressure-sensitive gel adhesive composition.
CNA2008100957031A 2008-04-24 2008-04-24 Adhesive compound, method for modifying adhesive and product made from the modified adhesive Pending CN101565595A (en)

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